CN109817594B

CN109817594B - Modular spray cooler

Info

Publication number: CN109817594B
Application number: CN201910040978.3A
Authority: CN
Inventors: 马挺; 俞兴飞; 李娜; 王秋旺
Original assignee: Xian Jiaotong University
Current assignee: Xian Jiaotong University
Priority date: 2019-01-16
Filing date: 2019-01-16
Publication date: 2020-07-28
Anticipated expiration: 2039-01-16
Also published as: CN109817594A

Abstract

The invention discloses a modular spray cooler, which is composed of a plurality of unit cooling modules. One side of the cooler is tightly attached to the heating unit, the refrigerating fluid on the other side is condensed and liquefied through cold air, the unit cooling module comprises a nozzle, a piezoelectric ceramic piece, a liquid phase channel fin, a gas phase channel fin, a copper sheet cold plate, a micro one-way valve and a structural channel, and the structural channel of the unit cooler comprises a cold air channel, a condensation channel, a liquid phase channel, a gas phase channel, a liquid supply channel, a liquid storage cavity, a power channel and a spraying cavity. The power channel is powered by the piezoelectric ceramic piece and is connected with the spraying cavity; the upper end of the spraying cavity is connected with the gas phase channel, and the lower end of the spraying cavity is connected with the liquid phase channel; the gas phase channel is connected with the condensing channel; the liquid phase channel is connected with the liquid supply channel, and the liquid supply channel is connected with the liquid storage cavity. The invention uses the piezoelectric ceramic as a power source, has the advantages of good heat exchange performance of spray cooling and uniform temperature, has high-efficiency cooling capacity and adaptability, and can be applied to cooling of microelectronic chips with high heat flow density.

Description

Modular spray cooler

Technical Field

The invention belongs to the technical field of refrigeration, and relates to a modularized cooling device based on a piezoelectric ceramic material as a power source and combined with spray cooling.

Background

With the development of the information age, the heat flux density generated by microelectronic chips is increasing. With the coming of the 5G era, thermal management becomes an important bottleneck restricting chip development, how to dissipate high heat flow generated by a microelectronic chip and control the temperature of the microelectronic chip becomes a key problem to be solved increasingly, and the heat management has gained wide attention.

Microelectronic cooling technology is becoming more important due to the proliferation of data processing, and traditional cooling techniques include air cooling and water cooling. The forced convection cooling is mainly carried out to microelectronic assembly to the forced cooling technique, but has the temperature uneven distribution, and the overheated problem of local temperature, because the compressor is as the power supply, the noise is big simultaneously, and operating environment is comparatively abominable. The water cooling technology is to take away the heat generated by the micro-electronics indirectly through a cold medium by using the inverse Carnot cycle principle. But the disadvantages are that the equipment is bulky, the layout is complex, and the manufacturing cost and maintenance are high.

In order to overcome the defects of the traditional technology, new technologies such as heat pipe cooling, thermoelectric cooling, jet cooling and the like appear in microelectronic cooling at the same time. The heat pipe cooling is based on the principle of heat pipes, one end of the heat pipe is condensed, the other end of the heat pipe is evaporated, and internal circulation is performed under the capillary action. Thermoelectric cooling is a refrigeration technology based on peltier, and has the advantages of no noise, small volume and the like, but also has the problems of low thermoelectric conversion efficiency and the like. The injection cooling is performed by injecting air or other refrigerant directly to the heat generating surface, but has a problem of uneven temperature cooling. These cooling techniques are in the research phase and have different disadvantages and are not put into production on a large scale.

Disclosure of Invention

In order to overcome the defects of the cooling technology, the invention aims to provide a modular spray cooler, which aims to improve the microelectronic cooling efficiency and has the characteristics of modularization and miniaturization.

The technical scheme of the invention is realized as follows:

a modular spray cooler is integrally composed of a plurality of unit cooling modules. One side of the unit cooling module is tightly attached to the heating unit, the heat conductivity of the copper sheet cold plate is good, the heat of the heating unit is conducted to the copper sheet cold plate, and the other side of the unit cooling module exchanges heat with cold air. The piezoelectric ceramic piece is used as power, and the high-frequency vibration of the piezoelectric ceramic piece is utilized to generate cold air. Each unit cooling module comprises a micro nozzle, a piezoelectric ceramic piece, a gas phase channel fin, a liquid phase channel fin, a copper sheet cold plate and a micro one-way valve. The structure channel of the cooler comprises a cold air channel, a condensation channel, a gas phase channel, a liquid supply channel, a liquid storage cavity, a power channel and a spraying cavity. The power channel is powered by the piezoelectric ceramic piece, and the micro nozzle is arranged at the tail end of the power channel; a copper sheet cold plate is arranged on one side of the spraying cavity, the upper end of the spraying cavity is connected with a gas phase channel, the lower end of the spraying cavity is connected with a liquid phase channel, heat exchange strengthening fins are uniformly distributed in the front middle parts of the gas phase channel and the liquid phase channel, and power is provided by a piezoelectric ceramic piece; the gas phase channel and the condensing channel are closely distributed adjacent to each other; the condensation channels and the cold air channels are closely distributed in a staggered manner, and the surfaces on the two sides of the channels are reinforced heat exchange surfaces; the liquid phase channel is connected with the liquid supply channel, and a micro one-way valve is arranged between the channels; the liquid supply channel is connected with the liquid storage cavity, and a micro one-way valve is arranged between the liquid supply channel and the liquid storage cavity.

The modularized spray cooler is vertically or obliquely arranged, the right side of the modularized spray cooler is tightly attached to the heating unit, and the left side of the modularized spray cooler is cooled by cold air heat exchange.

The internal channels of the modular spray cooler are integrally cast without pipe connections.

The unit cooling modules are mutually independent and cooled, can be welded, can be assembled and disassembled, and can also be integrally cast.

The liquid phase channel and the gas phase channel are clung to each other and distributed up and down, and liquid phase channel fins and gas phase channel fins are distributed in the channels.

The spraying side of the copper sheet cold plate is a strengthened heat exchange surface.

The condensation channel and the cold air channel are arranged closely and adjacently, the surfaces of the two sides of the condensation channel are reinforced heat exchange surfaces, and the heat exchange mode is cross-flow heat exchange.

The power channel is distributed with a plurality of piezoelectric ceramic pieces, and the uniformity of spraying is ensured by adjusting the frequency of different piezoelectric ceramic pieces.

The invention has the following advantages:

(1) the modular structure has the characteristics of high integration level and convenience in disassembly and assembly, is suitable for both integrated heating equipment and distributed heating equipment, and has wide application.

(2) Each unit cooling module of the invention operates independently, thus being convenient for installation and disassembly.

(3) The unit cooling module of the invention adopts a closed structure, the refrigerating fluid does not directly contact with the heating element, and the invention has the advantage of leakage prevention.

(4) The invention adopts the spray cooling technology and has the characteristics of strong spray cooling heat dissipation capability and uniform temperature distribution.

(5) The liquid phase channel fins and the gas phase channel fins can enhance the heat exchange between gas phase and liquid phase, increase the heat exchange surface and turbulence, reduce the temperature difference between the heat exchange surface and the turbulence, and are more beneficial to the mixing of the liquefied gas phase and the liquid phase.

(6) The surfaces of the condensation channel and the cold air channel are both enhanced heat exchange surfaces, and gas phase can be condensed more efficiently.

(7) The piezoelectric ceramic element is adopted as a power source, the piezoelectric ceramic element has the advantages of good frequency stability, high precision, wide applicable frequency range, small volume, no moisture absorption, long service life, low noise and the like, and different heat flux densities can be met by adjusting the frequency of the piezoelectric ceramic element.

Drawings

FIG. 1 is a top view of the modular cooling apparatus of the present invention.

Fig. 2 is a front view showing the structure of a unit cooling module according to the present invention.

The reference numbers in the figures illustrate: 1. the device comprises a micro nozzle, 2, a piezoelectric ceramic piece, 3, a gas phase channel fin, 4, a liquid phase channel fin, 5, a copper sheet cold plate, 6, a micro one-way valve, 7, a cold air channel, 8, a condensation channel, 9, a gas phase channel, 10, a liquid phase channel, 11, a liquid supply channel, 12, a liquid storage cavity, 13, a power channel, 14, a spraying cavity, 15, a heating unit, 16, a cold air inlet end, 17 and a cold air outlet end.

Detailed Description

In order to make the objects, summary, and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the detailed description and specific examples, while indicating the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.

Referring to fig. 1, the cooler is vertically or obliquely arranged, the heating unit 15 is tightly attached to the copper sheet cold plate 5, so that heat is conducted to the copper sheet cold plate 5, cold air is generated at the other end of the cooler by vibration of the piezoelectric ceramic piece in the piezoelectric ceramic piece 2, heat exchange is carried out between the cold air and the internal refrigerating fluid through the cold air channel 7, the cold air enters from the cold air inlet end 16, and the cold air exits from the cold air outlet section 17. The cooling end is composed of a piezoelectric ceramic piece 2, a cold air inlet end 16, a cold air channel 7 and a cold air outlet end 17.

Referring to fig. 2, each unit cooling module includes one micro nozzle 1, six piezoelectric ceramic pieces 2, a gas phase channel fin 3, a liquid phase channel fin 4, a copper sheet cold plate 5, and three micro check valves 6. The structural channels of the unit cooling module comprise a cold air channel 7, a condensation channel 8, a gas phase channel 9, a liquid phase channel 10, a liquid supply channel 11, a liquid storage cavity 12, a power channel 13 and a spraying cavity 14. The power channel 13 is powered by the piezoelectric ceramic piece 2, and the micro nozzle 1 is arranged at the right end of the power channel; the upper end of the liquid storage cavity 12 is connected with the gas phase channel 9, the lower end is connected with the liquid phase channel 10, fins are uniformly distributed in the front middle parts of the gas phase channel 9 and the liquid phase channel 10, and the conveying power is provided by the piezoelectric ceramic part 2; the gas phase channel 9 is connected with the condensation channel 8, and the two sides of the channel are provided with reinforced heat exchange surfaces; the liquid phase channel 10 is connected with a liquid supply channel 11, and the channels on the two sides are connected by a micro one-way valve 6; the liquid supply channel 11 is connected with the liquid storage cavity 12, and the liquid supply channel and the liquid storage cavity are connected through the micro one-way valve 6. The power channel 13, the spraying cavity 14, the gas phase channel 9, the condensing channel 8, the liquid supply channel 11, the liquid storage cavity 12 and the power channel 13 form a circulation loop. The power channel 13, the spraying cavity 14, the liquid phase channel 10, the liquid supply channel 11, the liquid storage cavity 12 and the power channel 13 form another circulation loop.

When the device works, the piezoelectric ceramic piece 2 conveys the refrigerating fluid to the micro-nozzle 1, the refrigerating fluid carries out spray cooling on the copper sheet cold plate 5 in the spray cavity 14, and spray liquid drops take away a large amount of heat through various heat exchange modes such as impact and phase change, so that the heating unit 15 is indirectly cooled. The refrigerant liquid vaporizes into a gas phase to move upwards, and the unvaporized liquid phase moves downwards under the action of gravity, so that the refrigerant liquid is prevented from being liquefied into a film to block heat exchange at the copper sheet cold plate 5, and heat is taken away at the same time. The vaporized refrigerant is conveyed by the piezoelectric ceramic piece 2 to perform forward heat exchange with the refrigerant liquid of the other unit cooling module above, and then enters the condensation channel 8 to perform cross-flow heat exchange with the cold air in the cold air channel 7, so that the refrigerant liquid is liquefied into a liquid phase. The liquid phase which is not gasified is conveyed under the action of the piezoelectric ceramic piece 2, and is subjected to the same forward heat exchange with the gas-phase refrigerating fluid of the other unit cooling module below, and then is mixed with the liquid phase which is liquefied from the gas phase, and enters the liquid supply channel 11 through the micro one-way valve 6 under the extrusion conveying action of the piezoelectric ceramic piece 2. As a buffer zone, the liquid first enters the reservoir 12 and then enters the power channel 13, thereby completing the entire spray cooling cycle.

The above embodiments are specific examples of the present invention, and any obvious modifications, substitutions and the like are within the scope of the present invention.

Claims

1. A modularized spray cooler is characterized in that the whole modularized spray cooler is composed of a plurality of unit cooling modules, each unit cooling module comprises a micro nozzle (1), a piezoelectric ceramic piece (2), a gas phase channel fin (3), a liquid phase channel fin (4), a copper sheet cold plate (5), a micro one-way valve (6), a cold air channel (7), a condensation channel (8), a gas phase channel (9), a liquid phase channel (10), a liquid supply channel (11), a liquid storage cavity (12), a power channel (13) and a spray cavity (14); the copper sheet cold plate (5) is tightly attached to the heating unit (15); the power channel (13) is powered by the piezoelectric ceramic piece (2), and the micro nozzle (1) is arranged at the tail end of the power channel (13); the upper end of the spraying cavity (14) is connected with the gas-phase channel (9), the lower end of the spraying cavity is connected with the liquid-phase channel (10), fins are uniformly distributed on the front middle ends of the gas-phase channel (9) and the liquid-phase channel (10), power transmission is provided by the piezoelectric ceramic piece (2), and the gas-phase channel (9) is connected with the condensing channel (8); the condensing channels (8) and the cold air channels (7) are closely distributed in a staggered way; the liquid phase channel (10) is connected with the liquid supply channel (11), and a micro one-way valve (6) is arranged between the channels; the liquid supply channel (11) is connected with the liquid storage cavity (12), and a micro one-way valve (6) is arranged between the liquid supply channel and the liquid storage cavity.

2. The modular spray cooler according to claim 1, characterized in that the cold air channel (7), the condensation channel (8), the gas phase channel (9), the liquid phase channel (10), the liquid supply channel (11), the liquid storage chamber (12), the power channel (13) and the spray chamber (14) are cast in one piece without a pipe connection.

3. The modular spray cooler of claim 1, wherein the unit cooling modules are cooled independently of each other, welded, removably combined, or integrally cast.

4. The modular spray cooler according to claim 1, characterized in that the liquid phase channel (10) of the previous module and the gas phase channel (9) of the next module are closely distributed in the two modules adjacent to each other, and the gas phase channel rib (3) and the liquid phase channel rib (4) are distributed in the channels.

5. The modular spray cooler according to claim 1, wherein the condensation channel (8) and the cold air channel (7) are arranged closely adjacent to each other, the copper sheet cold plate (5) is closely attached to the heating unit (15), and the side surfaces of the condensation channel (8), the cold air channel (7) and the copper sheet cold plate (5) are all reinforced heat exchange surfaces which are millimeter structures, micrometer structures, nanometer structures or micro-nanometer structures.

6. The modular spray cooler according to claim 1, characterized in that the power channel (13) is distributed with a plurality of piezo-ceramics (2), the homogeneity of the spray being ensured by adjusting the frequency of the different piezo-ceramics (2).