CN207320568U - New laser refrigeration is heat sink - Google Patents
New laser refrigeration is heat sink Download PDFInfo
- Publication number
- CN207320568U CN207320568U CN201720850606.3U CN201720850606U CN207320568U CN 207320568 U CN207320568 U CN 207320568U CN 201720850606 U CN201720850606 U CN 201720850606U CN 207320568 U CN207320568 U CN 207320568U
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- Prior art keywords
- heat sink
- plate
- bar
- shaped trough
- heat
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Abstract
Freeze the utility model discloses a kind of new laser heat sink, including at least the heat sink upper plate and heat sink lower plate overlapped；The bottom surface of the heat sink upper plate offers multiple upper bar-shaped troughs, and the top surface of the heat sink lower plate is provided with multiple lower bar-shaped troughs connected with the upper bar-shaped trough one-to-one corresponding, and single upper bar-shaped trough misplaces and connect to form single runner with corresponding lower bar-shaped trough；Coolant flow direction in two neighboring runner is on the contrary, the heat sink upper sheet top surface is the working face for radiating to large power laser diode array；Heat sink cooling effectiveness can be effectively improved, and improves heat into the uniformity of cooling, avoids large power laser diode array temperature uneven and causes work efficiency low, ensure that large power laser diode array normally and efficiently works；Structure precision is high at the same time and prepares conveniently.
Description
Technical field
It the utility model is related to laser cooling field, and in particular to a kind of new laser refrigeration is heat sink.
Background technology
Miniature throttling and evaporation chamber refrigeration (Micro miniature J-T Refrigerator:MMR) heat sink is a kind of profit
Refrigerating plant is miniaturized made of both vapor compression, throttling and evaporation, the principle of decalescence, comprising micro-compressor, air-cooled cold
The components such as condenser, restricting element, micro- evaporation cavity.The electronic component that heating area is small, heat flow density is high is exclusively used in, it is particularly big
Powered laser diodes (Laser Diode：LD) radiate.With traditional LD microchannels liquid it is cold and hot it is heavy compared with, utilize cooling agent
Latent heat of phase change, very big heat exchange amount can be realized under the quality of cooling agent very little and flow, possesses very high heat radiation density；It is cold
But agent temperature when decalescence remains unchanged, overcome the cold micro-channel heat sink of traditional liquid due to coolant in entrance, go out
LD arrays caused by mouth temperature difference cause light power change, wave length shift etc. in different luminous point refrigeration effect differences
Unfavorable factor.Have that cooling temperature is lower, cooling system structure is simpler, cooling system volume smaller, total energy consumption are lower concurrently at the same time
The advantages that.And as the development of high power laser technology, more high-power, heat flow density higher LD are developed, traditional liquid is cold
Microchannel single-phase heat transfer cooling cannot be met the requirements；And since the uniformity of heat sink cooling is poor, cause high-power sharp
Light diode array inhomogeneous cooling is even, is unfavorable for overall large power laser diode array and normally and efficiently works, and makes essence
Spend low, making difficulty that high accuracy is heat sink.
Therefore, for solve problem above, it is necessary to a kind of new laser refrigeration it is heat sink, heat sink cooling can be effectively improved
Efficiency, and heat is improved into the uniformity of cooling, avoid large power laser diode array temperature uneven and cause work efficiency
It is low, ensure that large power laser diode array normally and efficiently works；Structure precision is high at the same time and prepares conveniently.
Utility model content
In view of this, the purpose of the utility model is to overcome in the prior art the defects of, there is provided new laser refrigeration heat
It is heavy, heat sink cooling effectiveness can be effectively improved, and heat is improved into the uniformity of cooling, avoid high power laser diode battle array
Row temperature is uneven and causes work efficiency low, ensures that large power laser diode array normally and efficiently works；Structure precision at the same time
High and preparation is convenient.
The new laser refrigeration of the utility model is heat sink, including at least the heat sink upper plate and heat sink lower plate overlapped；
The bottom surface of the heat sink upper plate offers multiple upper bar-shaped troughs, and the top surface of the heat sink lower plate is provided with the multiple and upper bar shaped
Groove corresponds the lower bar-shaped trough of connection, and single upper bar-shaped trough misplaces and connect to form single runner with corresponding lower bar-shaped trough；Phase
Coolant flow direction in adjacent two runners is on the contrary, the heat sink upper sheet top surface is for radiating to large power laser diode array
Working face.
Further, it is parallel to each other between the lower bar-shaped trough and is semi-open slot, the aperture position of two neighboring bar-shaped trough
Conversely；It is parallel to each other between the upper bar-shaped trough and for the semi-open slot with corresponding time bar shaped channel opening homonymy, the upper bar shaped
The not opening end of groove or lower bar-shaped trough is provided with the link slot that runner is formed for being connected with corresponding lower bar-shaped trough or upper bar-shaped trough.
Further, upper cover plate, lower cover and the coaming plate being arranged between upper cover plate and lower cover are further included, the coaming plate
Thickness, which is equal among the sum of heat sink upper plate thickness and heat sink lower plate thickness and coaming plate, to be provided with for accommodating heat sink upper plate and heat sink
The utensil receiving opening of lower plate, the upper cover plate correspond to heat sink upper plate and are provided with opening；The heat sink upper plate and heat sink lower plate are rectangle, institute
State and two opposite partition plates are extended to form among the side wall of utensil receiving opening, the partition plate side is sealedly attached to heat sink upper plate and heat sink
Make to form the exhaust passage for being used for collecting runner discharge gas, partition plate between partition plate upper side and upper cover plate downside between lower plate
The inlet channel being used for runner injection cooling agent is formed between downside and lower cover upper side.
Further, the coaming plate upper wall is provided with radiating groove, and heat dissipation cavity is formed between the radiating groove and upper cover plate, described
Heat dissipation cavity is connected with exhaust passage and heat dissipation cavity is provided with exhaust outlet；The coaming plate is additionally provided with what outlet was connected with inlet channel
Jet pump, the heat dissipation cavity are connected with the suction room of jet pump.
Further, the upper cover plate is prepared for Heat Conduction Material.
Further, the radiating groove for rectangle and is arranged at the import and export of radiating groove and is located at the opposite both sides of radiating groove；Dissipate
The slot bottom of heat channel is provided with the refluxing opening connected with the suction room of jet pump, and the refluxing opening is set close to outlet.
Further, the heat sink upper plate and heat sink lower plate are the rectangular slab that relative superposition is set, and the runner is along rectangular
The length direction arrangement of shape plate, width parallel distribution of multiple runners along rectangular slab.
Further, the upper bar-shaped trough and lower bar-shaped trough are formed by laser ablation.
The beneficial effects of the utility model are：A kind of new laser refrigeration is heat sink disclosed in the utility model, pass through by
The interlaced setting in flow direction for the runner of cooling, beneficial to the cooling uniformity for ensureing heat sink upper plate, can effectively carry
High heat sink cooling effectiveness, and improve heat into the uniformity of cooling, avoid large power laser diode array temperature uneven and
Cause work efficiency low, ensure that large power laser diode array normally and efficiently works；Structure precision is high at the same time and prepares conveniently.
Brief description of the drawings
The utility model is further described with reference to the accompanying drawings and examples：
Fig. 1 is the structure diagram of the utility model；
Fig. 2 is the structure diagram of coaming plate in the utility model；
Fig. 3 is the structure diagram that partition plate is installed in the utility model；
Fig. 4 is the structure diagram of each runner flow direction of the utility model.
Embodiment
Fig. 1 is the structure diagram of the utility model, and Fig. 2 is the structure diagram of coaming plate in the utility model, and Fig. 3 is this
The structure diagram that partition plate is installed in utility model, Fig. 4 is the structure diagram of each runner flow direction of the utility model, as schemed institute
Show, the new laser refrigeration in the present embodiment is heat sink；Including at least the heat sink upper plate 1 and heat sink lower plate 2 overlapped；It is described
The bottom surface of heat sink upper plate 1 offers multiple upper bar-shaped troughs 3, and the top surface of the heat sink lower plate 2 is provided with the multiple and upper bar shaped
Groove 3 corresponds the lower bar-shaped trough 4 of connection, and single upper bar-shaped trough 3 misplaces and connect to form single stream with corresponding lower bar-shaped trough 4
Road；Coolant flow direction in two neighboring runner is on the contrary, 1 top surface of heat sink upper plate is for high power laser diode battle array
Arrange the working face 5 of heat dissipation；The coolant can be existing coolant, such as water or evaporative cooled liquid fluorine Lyons etc., pass through
, can be effective beneficial to the cooling uniformity for ensureing heat sink upper plate 1 by for the interlaced setting in the flow direction of the runner of cooling
Heat sink cooling effectiveness is improved, and improves heat into the uniformity of cooling, avoids large power laser diode array temperature uneven
And cause work efficiency low, ensure that large power laser diode array normally and efficiently works；Structure precision height and preparation side at the same time
Just.
In the present embodiment, it is parallel to each other between the lower bar-shaped trough 4 and is semi-open slot, the opening of two neighboring bar-shaped trough
Position is opposite；It is parallel to each other between the upper bar-shaped trough 3 and for the semi-open slot with the corresponding lower opening of bar-shaped trough 4 homonymy, it is described
The not opening end of upper bar-shaped trough 3 or lower bar-shaped trough 4 is provided with for forming stream with corresponding lower bar-shaped trough 4 or the connection of upper bar-shaped trough 3
The link slot in road；The side opening of the lower bar-shaped trough 4 and upper bar-shaped trough 3 (including the side opening 4a of lower bar-shaped trough 4 and upper bar
The side opening 3a of shape groove 3) respectively positioned at the side wall of heat sink lower plate 2 and heat sink upper plate 1, cooling agent is from the side of heat sink lower plate 2
Opening enters and is flowed out from the side opening of heat sink upper plate 1 and large power laser diode array is cooled down.
In the present embodiment, upper cover plate 6, lower cover 7 and the coaming plate 8 being arranged between upper cover plate 6 and lower cover 7 are further included,
The thickness of the coaming plate 8, which is equal among the sum of 2 thickness of heat sink 1 thickness of upper plate and heat sink lower plate and coaming plate 8, to be provided with for accommodating
The utensil receiving opening 9 of heat sink upper plate 1 and heat sink lower plate 2, the upper cover plate 6 correspond to heat sink upper plate 1 and are provided with opening；The heat sink upper plate
1 and heat sink lower plate 2 be rectangle, extended to form among the side wall of the utensil receiving opening 9 two opposite partition plates (including partition plate 9a and every
Plate 9b), the partition plate side, which is sealedly attached between heat sink upper plate 1 and heat sink lower plate 2, makes partition plate upper side and the downside of upper cover plate 6
The exhaust passage (heat sink upper plate both sides are both provided with exhaust passage) for being used for collecting runner discharge gas is formed between face, under partition plate
For the inlet channel to runner injection cooling agent, (heat sink lower plate both sides are respectively provided with for formation between 7 upper side of side and lower cover
There is inlet channel)；Partition plate is salable to be welded between heat sink upper plate 1 and heat sink lower plate 2, and (certainly, partition plate unsealing is positioned at heat sink
The side opening of 2 side wall of upper plate 1 and heat sink lower plate), single runner is being respectively enterd into inlet channel after cooling agent throttling is micro-,
And exhaust passage collects a high-temperature low-pressure gas of runner outflow, two inlet channels are respectively communicated with coolant source and carry out cooling agent
Circulation, i.e., cooling system is cooled down by two cooling circuits independently, and cooling effectiveness is high.
In the present embodiment, 8 upper wall of coaming plate is provided with radiating groove (including left radiating groove 11a and right radiating groove 11b), institute
State and heat dissipation cavity is formed between radiating groove and upper cover plate 6, the heat dissipation cavity is connected with exhaust passage and heat dissipation cavity is provided with exhaust outlet；
The coaming plate 8 is additionally provided with the jet pump 12 that outlet is connected with inlet channel, and the heat dissipation cavity and the suction room of jet pump 12 connect
It is logical；Reused by the cooling agent reflux after heat dissipation, greatly improve cooling effectiveness.
In the present embodiment, the upper cover plate 6 is prepared for Heat Conduction Material；Heat sink material can be the good material of existing thermal conductivity
Material, such as copper etc., can set wind-cooling heat dissipating or water-cooling on upper cover plate 6 certainly.
In the present embodiment, the radiating groove is rectangle and is arranged at the import and export of radiating groove and is located at opposite two of radiating groove
Side；The slot bottom of radiating groove is provided with the refluxing opening 13 connected with the suction room of jet pump 12, and the refluxing opening 13 is set close to outlet
Put；It is sufficiently cool beneficial to the cooling agent of reflux, ensure that radiating efficiency is high.
In the present embodiment, the heat sink upper plate 1 and the rectangular slab that heat sink lower plate 2 is relative superposition setting, the runner
Arranged along the length direction of rectangular slab, width parallel distribution of multiple runners along rectangular slab；3 He of upper bar-shaped trough
Lower bar-shaped trough 4 is formed by laser ablation；Easy to process, structure is fully absorbed heat beneficial to cooling agent.
Finally illustrate, above example is merely intended for describing the technical solutions of the present application, but not for limiting the present application, although ginseng
The utility model is described in detail according to preferred embodiment, it will be understood by those of ordinary skill in the art that, can be to this
The technical solution technical scheme is modified or replaced equivalently of utility model, without departing from the objective and model of technical solutions of the utility model
Enclose, it should all cover among the right of the utility model.
Claims (8)
1. a kind of new laser refrigeration is heat sink, it is characterised in that：Including at least the heat sink upper plate and heat sink lower plate overlapped；
The bottom surface of the heat sink upper plate offers multiple upper bar-shaped troughs, and the top surface of the heat sink lower plate is provided with the multiple and upper bar shaped
Groove corresponds the lower bar-shaped trough of connection, and single upper bar-shaped trough misplaces and connect to form single runner with corresponding lower bar-shaped trough；Phase
Coolant flow direction in adjacent two runners is on the contrary, the heat sink upper sheet top surface is for radiating to large power laser diode array
Working face.
2. new laser refrigeration according to claim 1 is heat sink, it is characterised in that：It is mutually flat between the lower bar-shaped trough
Row and be semi-open slot, the aperture position of two neighboring bar-shaped trough is opposite；Be parallel to each other between the upper bar-shaped trough and for it is right
Should descend the semi-open slot of bar shaped channel opening homonymy, the not opening end of the upper bar-shaped trough or lower bar-shaped trough be provided with for it is corresponding
Lower bar-shaped trough or upper bar-shaped trough connect the link slot to form runner.
3. new laser refrigeration according to claim 2 is heat sink, it is characterised in that：Further include upper cover plate, lower cover and
The coaming plate being arranged between upper cover plate and lower cover, the thickness of the coaming plate be equal to heat sink upper plate thickness and heat sink lower plate thickness it
With and coaming plate among be provided with utensil receiving opening for accommodating heat sink upper plate and heat sink lower plate, the upper cover plate corresponds to heat sink upper plate and sets
It is equipped with opening；The heat sink upper plate and heat sink lower plate are rectangle, extended to form among the side wall of the utensil receiving opening two it is opposite
Partition plate, the partition plate side be sealedly attached between heat sink upper plate and heat sink lower plate make partition plate upper side and upper cover plate downside it
Between form the exhaust passage for being used for collecting runner discharge gas, formed and be used for stream between partition plate downside and lower cover upper side
Road injects the inlet channel of cooling agent.
4. new laser refrigeration according to claim 3 is heat sink, it is characterised in that：The coaming plate upper wall is provided with heat dissipation
Groove, forms heat dissipation cavity between the radiating groove and upper cover plate, the heat dissipation cavity is connected with exhaust passage and heat dissipation cavity is provided with row
Gas port；The coaming plate is additionally provided with the suction room company of the jet pump that outlet is connected with inlet channel, the heat dissipation cavity and jet pump
It is logical.
5. new laser refrigeration according to claim 4 is heat sink, it is characterised in that：The upper cover plate is Heat Conduction Material system
It is standby to form.
6. new laser refrigeration according to claim 4 is heat sink, it is characterised in that：The radiating groove is rectangle and setting
It is located at the opposite both sides of radiating groove in the import and export of radiating groove；The slot bottom of radiating groove is provided with to be connected with the suction room of jet pump
Refluxing opening, the refluxing opening close to outlet set.
7. new laser refrigeration according to claim 1 is heat sink, it is characterised in that：The heat sink upper plate and heat sink lower plate
The rectangular slab set for relative superposition, the runner arrange that multiple runners are along rectangular slab along the length direction of rectangular slab
Width parallel distribution.
8. new laser refrigeration according to claim 1 is heat sink, it is characterised in that：The upper bar-shaped trough and lower bar-shaped trough
Formed by laser ablation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720850606.3U CN207320568U (en) | 2017-07-13 | 2017-07-13 | New laser refrigeration is heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720850606.3U CN207320568U (en) | 2017-07-13 | 2017-07-13 | New laser refrigeration is heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207320568U true CN207320568U (en) | 2018-05-04 |
Family
ID=62433598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720850606.3U Withdrawn - After Issue CN207320568U (en) | 2017-07-13 | 2017-07-13 | New laser refrigeration is heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207320568U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107104360A (en) * | 2017-07-13 | 2017-08-29 | 重庆师范大学 | The micro- sweat cooling of large power laser diode array throttling is heat sink |
-
2017
- 2017-07-13 CN CN201720850606.3U patent/CN207320568U/en not_active Withdrawn - After Issue
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107104360A (en) * | 2017-07-13 | 2017-08-29 | 重庆师范大学 | The micro- sweat cooling of large power laser diode array throttling is heat sink |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20180504 Effective date of abandoning: 20190607 |
|
| AV01 | Patent right actively abandoned |