CN114894020A - A dual-nozzle spray cooling cycle device and its control method - Google Patents

Abstract

The invention discloses a dual-nozzle spray cooling cycle device and a control method thereof, comprising a spray heat dissipation assembly, a working medium condensation assembly, a working medium heat dissipation assembly, a liquid cooling heat dissipation assembly, and a working medium circulation assembly. The spray cooling assembly is installed facing the first component to be radiated, and the liquid cooling cooling assembly is installed facing the second cooling component to be radiated. The cooling element and the working medium circulation assembly are connected in turn to form a heat dissipation circulation loop; the beneficial effects: the invention realizes the use of double nozzles to cool the heat dissipation element through the atomization nozzle and the jet nozzle, and the liquid cooling heat dissipation assembly can use the cooled liquid working medium. The cooling of other components to be radiated greatly improves the cooling efficiency of the overall device. At the same time, the heat dissipation loop is a closed circulation system, which avoids the risk of leakage of liquid working medium, ensures the safe operation of the components to be radiated, and improves the efficiency of the entire device. operating life.

Description

A dual-nozzle spray cooling cycle device and its control method

technical field

The invention relates to a cooling device and a control method thereof, in particular to a dual-nozzle spray cooling circulation device and a control method thereof, belonging to the technical field of cooling and heat dissipation devices.

Background technique

The digitalization and informatization of human society is inseparable from the development of chip technology. Today's chip process technology is becoming more and more advanced, and the integration of transistors is increasing by leaps and bounds, which leads to increasing local heat flux density. For every 10℃ increase in temperature of electronic components, the lifespan will be shortened by 50%. However, the current development speed of chip heat dissipation technology lags behind the growth rate of its performance, and the problem of chip heat dissipation has become a bottleneck restricting its development. Therefore, major electronic product manufacturers have used cooling technologies such as air cooling, water cooling, heat pipe, liquid cooling and micro-channels on the chips, in order to alleviate the heating problem of high-process chips. However, due to various shortcomings of traditional heat dissipation technology, it is difficult to achieve a better balance in terms of reducing equipment volume and enhancing heat exchange.

At present, the common cooling modes on the market are as follows: ①Natural cooling: mainly use heat sinks, namely fins, whose heat dissipation effect is stable and reliable, but the heat dissipation efficiency is low, so it is only suitable for chips with low heat flux density; ②Active air cooling : Even with a fan, heat convection is enhanced. At present, this method is the most common heat dissipation solution for low-end graphics cards on the market, but there are problems of easy accumulation of dust and difficulty in cleaning; ③ Forced water cooling: This method has been widely used in the cooling of electronic devices, with high heat dissipation efficiency, Low noise, but there are defects such as liquid leakage, high cost and short life; ④ Heat pipe cooling: The cooling liquid is continuously circulated at the high temperature heat source and the low temperature heat dissipation area in the heat pipe to improve the heat dissipation capacity of the chip. At present, this method is often combined with fins and other solutions Combined use; ⑤ Turbine heat dissipation: This method is similar to active air cooling, but its working principle is that the turbine enters the air, and the low-temperature gas flows through the vapor chamber and the heat sink, and the air flow is directly discharged from the tail, although it solves the problem of active air cooling. Dust problem, but there is the disadvantage of loud noise. In addition, for the heat dissipation problem of large-scale computing centers, air conditioning is still required after the above solutions are often combined, and the annual power consumption reaches an astonishing hundreds of thousands of kilowatt-hours. Therefore, under the current situation of tight electricity consumption, the problem of efficient heat dissipation of high-performance chips of computers needs to be solved urgently.

The emergence of refrigerant flash spray cooling technology is expected to solve the heat dissipation problem of high heat flux chips. Spray cooling is to strengthen the heat transfer by strengthening the droplet impact on the heated surface to form a strong disturbance, as well as the boiling heat transfer inside the liquid film of the heated surface and the phase change of the evaporation on the surface of the liquid film. Refrigerant flash evaporation technology means that the refrigerant with relatively high pressure and temperature is sprayed and broken into fine droplets, which impact the cooled surface at a high speed after entering the spray chamber. Unlike conventional spray cooling, flash spray cooling achieves superheat by spraying the working fluid into an environment where the pressure is less than the saturation pressure corresponding to its temperature. Refrigerant flash spray cooling technology has received extensive attention due to its high heat flux density and large space heat dissipation capability.

Chinese patent CN111540716B discloses an electrostatic flashing micro-spray circulating cooling system for heat dissipation of high-power chips. The invention can send the liquid cooling medium into the charging chamber through the cooling medium refrigeration cycle pipeline mechanism. The droplets are sprayed onto the surface of the heat sink to be cooled through the micro-channel nozzle, and the cooling medium cooled by the heat sink is returned to the cooling medium refrigeration cycle pipeline mechanism for circulation. However, when the surface temperature of the element to be cooled continues to be too high, the atomized liquid cooling medium contacts the element to be cooled and vaporizes, which not only produces a large number of bubbles, but also a vaporized film, which in turn produces the Frost effect, which makes the atomized liquid cooling medium and the The surfaces of the components to be cooled are isolated by the vapor layer, which cannot effectively take away heat, so the heat exchange effect is greatly reduced, and the overall heat dissipation efficiency is affected.

At the same time, in the existing heat dissipation and cooling technical solutions, only the heat dissipation problem of the high-performance chips of the computer is discussed. For some devices, there is not only one element to be dissipated with high heat flux density, but there may be multiple elements to dissipate at the same time. , how to use a set of heat dissipation system to solve the problem of cooling and heat dissipation of multiple components to be dissipated is also a new research direction.

SUMMARY OF THE INVENTION

Purpose of the invention: In view of the deficiencies in the prior art, the present invention provides a dual-nozzle spray cooling cycle device and a control method thereof. The present invention achieves the use of dual-nozzle by setting a spray chamber with atomizing nozzles and jet nozzles. To cool down the components to be radiated, and at the same time, there is a liquid cooling cooling assembly in the cooling cycle device, which can make the cooled liquid working medium cool down other components to be radiated, which greatly improves the cooling efficiency of the overall device.

Technical solution: a dual-nozzle spray cooling cycle device, including a spray heat dissipation assembly, a working medium condensation assembly, a working medium heat dissipation assembly, and a working medium circulation assembly, and the spray heat dissipation assembly is installed on the first component to be dissipated. The spray heat dissipation assembly, the working medium condensation assembly, the working medium heat dissipation assembly, and the working medium circulation assembly are sequentially connected to form a heat dissipation circulation loop; the spray heat dissipation assembly also includes a spray chamber, a heat conduction device, and an atomizing nozzle. , a jet nozzle, a first communication valve, a working medium return hole, the heat conduction device and the spray chamber form a sealed cavity, the spray chamber is installed facing the first element to be radiated, and the spray chamber is respectively provided with a mist The atomizing nozzle and the jet nozzle, the atomizing nozzle is communicated with the first communication valve port A, the jet nozzle is communicated with the first communication valve port B, and the first communication valve port C is communicated with the working fluid circulation assembly, so The spray chamber is communicated with the working medium condensation assembly through the working medium return hole at the bottom.

In the present invention, by arranging a spray chamber with atomizing nozzles and jet nozzles, the cooling element to be cooled is realized by using double nozzles. When the surface temperature of the element to be cooled continues to be too high, the atomized liquid cooling medium contacts the element to be cooled to vaporize. The generated vaporized film is sprayed by jet nozzles that are opened at intervals to impact the vaporized film, so as to avoid the Frost effect, and to promote the full reaction between the atomized liquid cooling medium and the surface of the element to be cooled, and the heat exchange effect is greatly improved. Lift and improve the overall heat dissipation efficiency of the spray heat dissipation assembly.

Preferably, in order to achieve simultaneous cooling of a plurality of components to be radiated, a liquid-cooled radiator assembly and a second communication valve are also included, the liquid-cooled radiator assembly is installed facing the second component to be radiated, and the working fluid radiator assembly is The outflowing liquid working medium flows to the second communication valve port A through the liquid cooling and heat dissipation assembly, the second communication valve port B communicates with the working medium heat dissipation assembly, and the second communication valve port C communicates with the working medium circulation assembly. .

In the present invention, the liquid-cooled heat-dissipating assembly installed above the second heat-dissipating element is used to cool the second heat-dissipating element by using the liquid working medium cooled by the working medium heat-dissipating assembly, and at the same time, the second communication valve monitors the liquid cooling. If the temperature of the liquid working medium flowing out of the heat dissipation assembly does not meet the set temperature threshold, it will flow into the working fluid heat dissipation assembly cycle again, and if it meets the set temperature threshold, it will flow into the working medium circulation assembly for overall circulation.

Preferably, in order to speed up the heat dissipation efficiency of the second element to be dissipated, the liquid-cooled heat dissipation assembly includes a liquid-cooled cavity, a heat-dissipation pipeline, a liquid-cooled heat-dissipating working fluid shunt device, a liquid-cooled heat-dissipating working fluid confluence device, and a liquid-cooled heat dissipation device. A fin group, the liquid cooling cavity is installed facing the second component to be radiated, the liquid cooling fin group is installed inside the liquid cooling cavity, and at least two sets of parallel penetrating liquid cooling fin groups are arranged in the heat dissipation pipeline. Connected with both ends of the liquid cooling chamber, the liquid cooling heat dissipation working medium shunt device, the heat dissipation pipeline, and the liquid cooling heat dissipation working medium confluence device are connected in sequence to form a liquid cooling heat dissipation passage, and the liquid outlet of the liquid cooling heat dissipation working medium confluence device is connected to the liquid cooling channel. The second communication valve port A communicates.

In the present invention, at least two sets of parallel heat dissipation pipelines are arranged in the liquid cooling cavity, so that the heat dissipation pipelines are matched with the liquid cooling heat dissipation fin groups, the liquid cooling heat dissipation area is enlarged, the heat loss of the second heat dissipation element is accelerated, and the heat dissipation of the second heat dissipation element is further accelerated. Improve the cooling efficiency of the overall device.

Preferably, in order to extract the atomized liquid working medium from the spray chamber and perform preliminary condensation, the working medium condensation assembly includes a working medium jet cavity and a working medium condensation cavity, and the working medium jet cavity includes a working medium jet cavity. The inlet nozzle and the outlet nozzle of the working medium jet cavity, the top of the working medium jet cavity is provided with a working medium channel, the working medium channel is communicated with the working medium return hole, and the inlet nozzle of the working medium jet cavity is connected with the working medium jet The cavity outlet nozzles are correspondingly installed at both ends of the working medium jet cavity, the inlet nozzles of the working medium jet cavity are connected with the working medium circulation assembly, and the outlet nozzles of the working medium jet cavity are connected with the inlet of the working medium condensation cavity, so The outlet of the working medium condensation chamber is communicated with the working medium cooling assembly.

The liquid working medium of the invention is sprayed from the inlet nozzle of the working medium jet cavity to the outlet nozzle of the working medium jet cavity, and a siphon process is generated in the working medium jet cavity, so that the working medium jet cavity is in a negative pressure state, and passes through the top of the working medium jet cavity. The working medium channel draws out the liquid working medium from the spray chamber and mixes it with the liquid working medium in the working medium jet chamber, and the mixed liquid working medium flows into the working medium condensation chamber for preliminary condensation to remove the bubbles in the liquid working medium.

Preferably, in order to cool and dissipate the liquid working medium in the circulation, the working medium heat dissipation assembly includes a heat dissipation working medium distribution device, a heat dissipation working medium circulation pipe, a working medium heat sink, a heat dissipation air cooling, and a heat dissipation working medium confluence device, The heat-dissipating working medium flow splitting device is respectively connected with the outlet of the working medium condensation chamber and the second communication valve port B, and the heat-dissipating working medium flow-distributing device, the heat-dissipating working medium circulation pipe, and the heat-dissipating working medium confluence device are sequentially connected to form a working medium heat-dissipating passage, The heat-dissipating working medium circulation pipes are installed through the working medium heat-dissipating fins, a heat-dissipating air-cooling device is installed above the working medium heat-dissipating fins, and the heat-dissipating working medium merging device is communicated with the liquid-cooling heat-dissipating working medium shunting device.

The invention increases the heat dissipation area of the liquid working medium after absorbing heat by arranging the working medium heat dissipation passage and the working medium heat sink, and at the same time cooperates with the heat dissipation air cooling to exchange heat with the external environment, thereby improving the heat dissipation efficiency of the entire liquid working medium.

Preferably, in order to provide circulating power for the liquid working medium in the heat dissipation circulation loop, the working medium circulation assembly includes a liquid storage tank and a micropump group, the liquid storage tank is communicated with the second communication valve port C, and the The micro-pump group is communicated with the liquid storage tank, and the working medium outlet of the micro-pump group is respectively communicated with the first communication valve port C and the working medium jet cavity inlet nozzle.

The invention provides power for the circulation of the liquid working medium in the heat dissipation circulation loop by arranging the micro-pump group, and at the same time cooperates with the first communication valve, so that the atomizing nozzle and the jet nozzle are atomized and jetted, and the circulation efficiency of the liquid working medium is improved.

Preferably, in order to improve the heat exchange efficiency between the heat-conducting device and the first element to be dissipated, the heat-conducting device is a fin sheet structure full of grooves.

Preferably, in order to control and coordinate the working states of the atomizing nozzle and the jet nozzle, the heat conducting device is provided with a first temperature sensor.

Preferably, in order to regulate the working state of the liquid-cooled heat dissipation assembly, the second communication valve is provided with a second temperature sensor.

A control method of a dual-nozzle spray cooling circulation device, comprising the following steps:

S1: Startup phase,

Connect the components through pipelines as required, start the micropump group, the liquid working medium is divided into two paths under the action of the micropump group, and one path moves to the first communication valve. At this time, the first communication valve is closed, and the other path passes through The inlet nozzle of the working medium jet cavity is sprayed into the working medium jet cavity, and then flows out from the outlet nozzle of the working medium jet cavity. At this time, the working medium jet cavity is in a negative pressure state;

S2: Atomization cooling stage,

When the first temperature sensor detects that the temperature of the heat-conducting device above the first element to be radiated exceeds the set threshold, the first communication valve port A is opened, and the liquid working medium is atomized by the atomizing nozzle and impacts the surface of the heat-conducting device. The atomized liquid working medium flows into the working medium jet chamber in negative pressure state through the working medium return hole. When the first temperature sensor monitors that the temperature of the heat conduction device returns to the set threshold value, the first communication valve port A is closed and stops. Cool and dissipate heat to the heat-conducting device;

S3: Jet, atomization composite cooling stage,

When the first temperature sensor detects that the temperature of the heat conduction device above the first element to be radiated exceeds the set threshold and lasts for more than the set time, the first communication valve port B is opened at intervals on the basis of step 2, and the liquid working medium passes through The jet nozzle impacts the surface of the heat-conducting device, and the reacted atomized liquid working medium flows into the working medium jet cavity in a negative pressure state through the working medium return hole. When the first temperature sensor monitors that the temperature of the heat-conducting device returns to the set threshold, the The first communication valve port A and port B are closed, and the cooling and heat dissipation of the heat conduction device are stopped;

S4: liquid working medium condensation heat dissipation stage,

The reacted atomized liquid working medium is mixed in the working medium jet cavity with the liquid working medium sprayed into the working medium jet cavity through the inlet nozzle of the working medium jet cavity, and enters the working medium condensation cavity for initial condensation, and then enters the working medium heat dissipation assembly for cooling. heat dissipation;

S5: liquid cooling stage,

The cooled liquid working medium flows into the liquid cooling heat dissipation assembly to continue to cool the second element to be radiated. The second temperature sensor monitors the temperature of the liquid working medium flowing out of the liquid cooling heat dissipation assembly. When the liquid working medium temperature exceeds When the threshold is set, port B of the second communication valve is opened and port C is closed, and the liquid working medium flows into the cooling medium inlet of the liquid cooling and heat dissipation assembly for cooling cycle. When the temperature of the liquid working medium is lower than the set threshold value , the port B of the second communication valve is closed and the port C is opened, the liquid working medium flows into the liquid storage tank, and the overall circulation is continued;

S6: silent loop stage,

When the first temperature sensor detects that the temperature of the heat conducting device above the first element to be dissipated is within the set threshold and the temperature of the liquid working medium monitored by the second temperature sensor is within the set threshold, the first communication valve port A, port B is closed, the port B of the second communication valve is closed, and the port C is open, and the liquid working medium is silently circulated among the working medium condensation assembly, the working medium heat dissipation assembly, the liquid cooling heat dissipation assembly, and the working medium circulation assembly.

Beneficial effects: The present invention realizes the use of dual nozzles to cool down the cooling element by setting a spray chamber with atomizing nozzles and jet nozzles. When the surface temperature of the cooling element continues to be too high, the atomized liquid cooling medium contacts the cooling medium. For the vaporized film produced by the vaporization of the cooling element, use the jet nozzles that are opened at intervals to spray the liquid working medium to impact the vaporized film, so as to avoid the Frost effect, and to promote the atomized liquid cooling medium to fully react with the surface of the element to be cooled. The thermal effect is greatly reduced, and the overall heat dissipation efficiency of the spray heat dissipation assembly is improved. At the same time, the liquid cooling and heat dissipation assembly can make the cooled liquid working medium cool down other components to be radiated, which greatly improves the cooling efficiency of the whole device; in addition, the heat dissipation circulation loop of the present invention is a closed circulation system, which avoids the leakage of the liquid working medium. It can not only ensure the safe operation of the components to be radiated, but also effectively reduce the evaporation escape speed of the liquid working medium and improve the operating life of the entire device.

Description of drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only It is an embodiment of the present invention. For those of ordinary skill in the art, other drawings can also be obtained according to the provided drawings without creative work.

FIG. 1 is a schematic diagram of the overall structure of the present invention.

FIG. 2 is a side view of the structure of the working fluid heat dissipation assembly of the present invention.

FIG. 3 is a side view of the structure of the liquid cooling heat dissipation assembly of the present invention.

FIG. 4 is a schematic structural diagram of the spray heat dissipation assembly of the present invention.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", The orientation or positional relationship indicated by "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the indicated device or Elements must have a particular orientation, be constructed and operate in a particular orientation and are therefore not to be construed as limitations of the invention.

In the present invention, unless otherwise expressly specified and limited, a first feature "on" or "under" a second feature may include the first and second features in direct contact, or may include the first and second features Not directly but through additional features between them. Also, the first feature being "above", "over" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature is "below", "below" and "below" the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.

As shown in Figures 1, 2, 3, and 4, a dual-nozzle spray cooling cycle device includes a spray cooling assembly 1, a working medium condensation assembly 2, a working medium heat dissipation assembly 3, and a working medium circulation assembly 4. The spray heat dissipation assembly 1 is installed facing the first element to be dissipated, and the spray heat dissipation assembly 1, the working fluid condensation assembly 2, the working fluid heat dissipation assembly 3, and the working fluid circulation assembly 4 are sequentially connected to form a heat dissipation circulation loop; The spray heat dissipation assembly 1 includes a spray chamber 11 , a heat conduction device 12 , an atomizing nozzle 13 , a jet nozzle 14 , a first communication valve 15 , and a working medium return hole 16 , and the heat conduction device 12 forms a seal with the spray chamber 11 . Cavity, the heat-conducting device 12 is a fin sheet structure filled with grooves, which increases the heat exchange efficiency between the heat-conducting device 12 and the first element to be radiated. The heat-conducting device 12 is provided with a first temperature sensor 121 for In order to monitor the surface temperature of the heat-conducting device 12, the spray chamber 11 is installed facing the first element to be radiated, and the spray chamber 11 is respectively provided with an atomizing nozzle 13 and a jet nozzle 14. The port A of the communication valve 15 is in communication, the jet nozzle 14 is in communication with the port B of the first communication valve 15, the port C of the first communication valve 15 is in communication with the working medium circulation assembly 4, and the spray chamber 11 passes through the working fluid at the bottom. The mass return hole 16 communicates with the working medium condensation assembly 2 .

In the present invention, by setting the spray chamber 11 with the atomizing nozzle 13 and the jet nozzle 14, the temperature of the heat-dissipating element is realized by using double nozzles. When the surface temperature of the element to be cooled continues to be too high, the atomized liquid cooling medium contacts the For the vaporized film produced by the vaporization of the cooling element, use the jet nozzles that are opened at intervals to spray the liquid working medium to impact the vaporized film, so as to avoid the Frost effect, and to promote the atomized liquid cooling medium to fully react with the surface of the element to be cooled. The thermal effect is greatly reduced, and the overall heat dissipation efficiency of the spray cooling assembly 1 is improved.

Example 1

的微细液滴，并以较大的喷雾锥角将导热装置12表面覆盖微细液滴，所述射流喷嘴14与第一连通阀15端口B连通，所述第一连通阀15端口C与工质循环总成4连通，所述喷雾腔室11通过底部的工质回流孔16与工质冷凝总成2连通，所述工质回流孔16为漏斗形回流孔，便于回收喷雾腔室11的液态工质。A dual-nozzle spray cooling cycle device, wherein the spray heat dissipation assembly 1, the working medium condensation assembly 2, the working medium heat dissipation assembly 3, and the working medium circulation assembly 4 are sequentially connected to form a heat dissipation circulation loop; the spray heat dissipation assembly 1 includes a spray chamber 11, a heat conduction device 12, an atomizing nozzle 13, a jet nozzle 14, a first communication valve 15, and a working medium return hole 16. The heat conduction device 12 and the spray chamber 11 form a sealed cavity, and the heat conduction device 12 forms a sealed cavity. The device 12 is a fin sheet structure filled with grooves. The gap between the heat conduction device 12 and the wall of the spray chamber 11 is sealed with a rubber gasket, and is filled and fixed with insulating sealant; the spray chamber 11 is facing the first element to be radiated. For installation, the spray chamber 11 is fixed with the first element to be radiated by bolts, and the surface of the first element to be radiated is coated with a layer of high-efficiency heat dissipation silicone grease and then attached to the heat conduction device 12 of the spray chamber 11; the spray chamber The chamber 11 is respectively provided with an atomizing nozzle 13 and a jet nozzle 14, the atomizing nozzle 13 communicates with the port A of the first communication valve 15, and the atomizing nozzle 13 can break the liquid working medium into 50

and cover the surface of the heat conduction device 12 with fine droplets with a larger spray cone angle, the jet nozzle 14 is communicated with the port B of the first communication valve 15, and the port C of the first communication valve 15 is connected with the working medium The circulation assembly 4 is connected, and the spray chamber 11 is communicated with the working medium condensation assembly 2 through the working medium return hole 16 at the bottom. The working medium return hole 16 is a funnel-shaped return hole, which is convenient for recovering the liquid in the spray chamber 11. Working quality.

In order to achieve simultaneous cooling of multiple elements to be radiated, a liquid-cooled radiator assembly 5 and a second communication valve 6 are also included. The liquid-cooled radiator assembly 5 is installed facing the second element to be radiated. The liquid working medium flowing out into 3 flows to the port A of the second communication valve 6 through the liquid cooling and heat dissipation assembly 5, the port B of the second communication valve 6 is communicated with the working medium heat dissipation assembly 3, and the port C of the second communication valve 6 It is communicated with the working fluid circulation assembly 4 .

In order to speed up the heat dissipation efficiency of the second element to be dissipated, the liquid-cooled heat dissipation assembly 5 includes a liquid-cooled cavity 51 , a heat-dissipation pipeline 52 , a liquid-cooled heat-dissipating working fluid distribution device 53 , a liquid-cooled heat-dissipating working fluid confluence device 54 , The cooling fin group 55, the liquid cooling cavity 51 is installed facing the second component to be radiated, the liquid cooling fin group 55 is installed inside the liquid cooling cavity 51, the liquid cooling fin group 55 is made of red copper The heat dissipation pipeline 52 is provided with at least two sets of parallel penetrating liquid cooling fin groups 55 connected to both ends of the liquid cooling cavity 51, and the heat dissipation pipeline 52 is For the spiral heat-dissipating copper tube, the galvanizing process is adopted for the contact between the heat-dissipating pipeline 52 and the liquid-cooling heat-dissipating fin group 55 to reduce the contact thermal resistance; It flows into the heat dissipation pipeline 52, and joins at the liquid-cooled heat dissipation working fluid confluence device 54 to flow to the port A of the second communication valve 6; the second communication valve 6 is provided with a second temperature sensor 61 for monitoring the cooling and cooling assembly. 5 The temperature of the liquid working medium flowing out.

In order to extract the atomized liquid working medium from the spray chamber and perform preliminary condensation, the working medium condensation assembly 2 includes a working medium jet cavity 21 and a working medium condensation cavity 22, and the working medium jet cavity 21 includes a working medium jet The cavity inlet nozzle 211, the working medium jet cavity outlet nozzle 212, the working medium jet cavity 21 is provided with a working medium channel at the top, the working medium channel is communicated with the working medium return hole 16, and the working medium jet cavity inlet sprays The pipes 211 are installed at both ends of the working medium jet cavity 21 corresponding to the outlet nozzles 212 of the working medium jet cavity. The inlet nozzles 211 of the working medium jet cavity are communicated with the working medium circulation assembly 4. The pipe 212 is communicated with the inlet of the working medium condensation cavity 22 , and the outlet of the working medium condensation cavity 22 is communicated with the working medium cooling assembly 3 .

The working fluid heat dissipation assembly 3 includes a heat dissipation working fluid distribution device 31, a heat dissipation working fluid circulation pipe 32, a working fluid heat sink 33, a heat dissipation air cooling 34, and a heat dissipation working fluid confluence device 35. The heat dissipation working fluid distribution device 31 is respectively. It is communicated with the outlet of the working medium condensation chamber 22 and the port B of the second communication valve 6, and the liquid working medium is divided into three streams by the heat dissipation working medium distribution device 31 and flows into the heat dissipation working medium circulation pipe 32, and the heat dissipation working medium circulation pipe 32 runs through the working medium to dissipate heat. The fins 33 are installed, the working medium fins 33 are zigzag fins, and are installed on both sides of the heat dissipation working medium circulation pipe 32. The installation distance between the working medium heat dissipation fins 33 and the heat dissipation working medium circulation pipe 32 is 2mm, Prevent extrusion caused by thermal expansion and contraction of the cooling medium circulation pipe 32, and ensure lower air thermal resistance, increase the heat exchange area, and speed up the cooling speed of the cooling medium; the cooling medium circulation pipe 32 has a cross section of ^The 10mm2 rectangular pipe can ensure the flow speed and heat exchange area of the liquid working medium in the heat dissipation working medium circulation pipe, and the liquid working medium merges at the heat dissipation working medium confluence device 35 and flows to the liquid-cooled heat dissipation working medium split device 53; the A cooling air cooler 34 is installed above the working fluid cooling fin 33, and the cooling air cooling 34 is composed of two sets of cooling fans.

The heat-dissipating working medium distribution device 31 , the heat-dissipating working medium circulation pipe 32 , and the heat-dissipating working medium confluence device 35 are sequentially connected to form a working medium heat-dissipating passage. A cooling air cooler 34 is installed above the heat sink 33 , and the cooling working fluid confluence device 35 communicates with the liquid cooling cooling working fluid shunt device 53 .

In order to provide circulating power for the liquid working medium in the heat dissipation circulation loop, the working medium circulation assembly 4 includes a liquid storage tank 41 and a micro pump group 42, and the liquid storage tank 41 is in communication with the port C of the second communication valve 6, The micro-pump group 42 is communicated with the liquid storage tank 41 , and the working medium outlet of the micro-pump group 42 is communicated with the port C of the first communication valve 15 and the working medium jet chamber inlet nozzle 211 respectively.

A control method of a dual-nozzle spray cooling circulation device, comprising the following steps:

S1: Startup phase,

The components are connected through pipelines as required, and the micropump group 42 is activated. The liquid working medium is divided into two paths under the action of the micropump group 42, and one path moves to the first communication valve 15. At this time, the first communication valve 15 is in a closed state. , the other is sprayed into the working medium jet cavity 21 through the inlet nozzle 211 of the working medium jet cavity, and then flows out through the outlet nozzle 212 of the working medium jet cavity, at this time, the working medium jet cavity 21 is in a negative pressure state;

S2: Atomization cooling stage,

When the first temperature sensor 121 detects that the temperature of the heat-conducting device 12 above the first element to be dissipated exceeds the set threshold, the port A of the first communication valve 15 is opened, and the liquid working medium is atomized by the atomizing nozzle 13 and then impacts the heat-conducting device. 12 surface, the reacted atomized liquid working medium flows into the working medium jet chamber 21 in a negative pressure state through the working medium return hole 16. When the first temperature sensor 121 monitors that the temperature of the heat conduction device 12 returns to the set threshold, the The port A of the first communication valve 15 is closed, and the cooling and heat dissipation of the heat conduction device 12 is stopped;

S3: Jet, atomization composite cooling stage,

When the first temperature sensor 121 detects that the temperature of the heat conduction device 12 above the first element to be dissipated exceeds the set threshold and lasts for more than the set time, on the basis of step 2, the port B of the first communication valve 15 is opened at intervals, and the liquid The working medium impinges on the surface of the heat conduction device 12 through the jet nozzle 14, and the reacted atomized liquid working medium flows into the working medium jet chamber 21 in a negative pressure state through the working medium return hole 16. When the first temperature sensor 121 monitors the temperature return of the heat conduction device 12. When the set threshold is reached, the ports A and B of the first communication valve 15 are closed, and the cooling and heat dissipation of the heat conduction device 12 is stopped;

S4: liquid working medium condensation heat dissipation stage,

The reacted atomized liquid working medium is mixed with the liquid working medium sprayed into the working medium jet cavity 21 through the working medium jet cavity inlet nozzle 211 in the working medium jet cavity 21 and enters the working medium condensation cavity 22 for preliminary condensation, and then enters the working medium to dissipate heat. Assembly 3 conducts cooling and heat dissipation;

S5: liquid cooling stage,

The cooled liquid working medium flows into the liquid cooling cooling assembly 5 to continue cooling the second element to be radiated. The second temperature sensor 61 monitors the temperature of the liquid working medium flowing out from the liquid cooling cooling assembly 5. When the refrigerant temperature exceeds the set threshold, port B of the second communication valve 6 is opened and port C is closed, and the liquid refrigerant flows into the cooling refrigerant inlet 31 of the liquid cooling assembly 5 for cooling cycle. When it is lower than the set threshold, the port B of the second communication valve 6 is closed and the port C is opened, and the liquid working medium flows into the liquid storage tank 41 to continue the overall circulation;

S6: silent loop stage,

When the first temperature sensor 121 detects that the temperature of the heat conducting device 12 above the first element to be dissipated is within the set threshold and the temperature of the liquid working medium monitored by the second temperature sensor 61 is within the set threshold, the first communication valve 15 Port A and port B are closed, port B of the second communication valve 6 is closed, and port C is open. Silent cycle between assembly 4.

The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same and similar parts between the various embodiments can be referred to each other. As for the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant part can be referred to the description of the method.

The above description of the disclosed embodiments enables any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A dual-nozzle spray cooling cycle device, comprising a spray heat dissipation assembly (1), a working fluid condensation assembly (2), a working fluid heat dissipation assembly (3), and a working fluid circulation assembly (4), the The spray heat dissipation assembly (1) is installed facing the first component to be dissipated, the spray heat dissipation assembly (1), the working fluid condensation assembly (2), the working fluid heat dissipation assembly (3), the working fluid circulation assembly ( 4) Connect in sequence to form a heat dissipation circulation loop; it is characterized in that: the spray heat dissipation assembly (1) includes a spray chamber (11), a heat conduction device (12), an atomizing nozzle (13), a jet nozzle (14), a A communication valve (15) and a working medium return hole (16), the heat conduction device (12) and the spray chamber (11) form a sealed cavity, and the spray chamber (11) is installed facing the first element to be radiated , the spray chamber (11) is respectively provided with an atomizing nozzle (13) and a jet nozzle (14), the atomizing nozzle (13) communicates with the port A of the first communication valve (15), and the jet nozzle ( 14) is communicated with the port B of the first communication valve (15), the port C of the first communication valve (15) is communicated with the working fluid circulation assembly (4), and the spray chamber (11) returns through the working fluid at the bottom The hole (16) is communicated with the working fluid condensation assembly (2). 2. The dual-nozzle spray cooling cycle device according to claim 1, characterized in that it further comprises a liquid-cooled heat-dissipating assembly (5), a second communication valve (6), and the liquid-cooled heat-dissipating assembly (5) It is installed facing the second component to be radiated, and the liquid working medium flowing out of the working fluid heat dissipation assembly (3) flows to the port A of the second communication valve (6) through the liquid cooling heat dissipation assembly (5). (6) The port B is communicated with the working fluid heat dissipation assembly (3), and the port C of the second communication valve (6) is communicated with the working fluid circulation assembly (4). 3. The dual-nozzle spray cooling cycle device according to claim 2, characterized in that: the liquid-cooled heat-dissipating assembly (5) comprises a liquid-cooling cavity (51), a heat-dissipating pipeline (52), a liquid-cooling heat-dissipating mechanism A mass split device (53), a liquid-cooled heat dissipation working medium confluence device (54), a liquid-cooled heat dissipation fin group (55), the liquid-cooled cavity (51) is installed facing the second element to be radiated, and the liquid-cooled heat dissipation The fin group (55) is installed inside the liquid cooling cavity (51), and at least two sets of parallel penetrating liquid cooling cooling fin groups (55) are arranged in the heat dissipation pipeline (52) to be connected to both ends of the liquid cooling cavity (51), The liquid-cooled heat-dissipating working fluid distribution device (53), the heat-dissipating pipeline (52), and the liquid-cooled heat-dissipating working fluid confluence device (54) are connected in sequence to form a liquid-cooled heat-dissipating passage, and the liquid-cooled heat-dissipating working fluid confluence device (54) The liquid outlet communicates with the port A of the second communication valve (6). 4. The dual-nozzle spray cooling cycle device according to claim 1, wherein the working fluid condensation assembly (2) comprises a working fluid jet cavity (21) and a working fluid condensation cavity (22). The working medium jet cavity (21) includes a working medium jet cavity inlet nozzle (211) and a working medium jet cavity outlet nozzle (212). The working medium jet cavity (21) is provided with a working medium channel at the top. The channel is communicated with the working medium return hole (16), and the working medium jet cavity inlet nozzle (211) is installed at both ends of the working medium jet cavity (21) corresponding to the working medium jet cavity outlet nozzle (212). The working medium jet cavity inlet nozzle (211) is communicated with the working medium circulation assembly (4), the working medium jet cavity outlet nozzle (212) is communicated with the working medium condensation cavity (22) inlet, and the working medium condensation cavity (22) The outlet is communicated with the working fluid cooling assembly (3). 5. The dual-nozzle spray cooling cycle device according to claim 1, characterized in that: the working medium heat dissipation assembly (3) comprises a heat dissipation working medium distribution device (31), a heat dissipation working medium circulation pipe (32), The working fluid cooling fin (33), the cooling air cooling (34), the cooling working fluid confluence device (35), the cooling working fluid dividing device (31) is respectively connected with the outlet of the working fluid condensation chamber (22) and the second communication valve ( 6) The port B is connected, and the heat dissipation working medium distribution device (31), the heat dissipation working medium circulation pipe (32), and the heat dissipation working medium confluence device (35) are connected in sequence to form a working medium heat dissipation passage, and the heat dissipation working medium circulation pipe ( 32) Installed through the working fluid heat sink (33), above the working fluid heat sink (33) is installed a cooling air cooler (34), the heat radiation working fluid confluence device (35) and the liquid cooling heat dissipation working fluid shunting device ( 53) Connectivity. 6 . The dual-nozzle spray cooling circulation device according to claim 1 , wherein the working fluid circulation assembly ( 4 ) comprises a liquid storage tank ( 41 ) and a micro-pump group ( 42 ). The tank (41) is in communication with the port C of the second communication valve (6), the micropump group (42) is in communication with the liquid storage tank (41), and the working medium outlet of the micropump group (42) is respectively connected with the first communication valve (15) Port C communicates with the inlet nozzle (211) of the working medium jet chamber. 7 . The dual-nozzle spray cooling circulation device according to claim 1 , wherein the heat conduction device ( 12 ) is a fin sheet structure full of grooves. 8 . 8. The dual-nozzle spray cooling cycle device according to claim 1, characterized in that: the heat conduction device (12) is provided with a first temperature sensor (121). 9 . The dual-nozzle spray cooling circulation device according to claim 2 , wherein the second communication valve ( 6 ) is provided with a second temperature sensor ( 61 ). 10 . 10. A control method of a dual-nozzle spray cooling circulation device, characterized in that, comprising the following steps: S1: Startup phase, The components are connected through pipelines as required, and the micropump group (42) is activated. The liquid working medium is divided into two paths under the action of the micropump group (42), and one path moves to the first communication valve (15). The communication valve (15) is in the closed state, and the other way is sprayed into the working medium jet chamber (21) through the inlet nozzle (211) of the working medium jet chamber, and then flows out through the outlet nozzle (212) of the working medium jet chamber. The jet chamber (21) is in a negative pressure state; S2: Atomization cooling stage, When the first temperature sensor (121) detects that the temperature of the heat conducting device (12) above the first element to be dissipated exceeds the set threshold, the port A of the first communication valve (15) is opened, and the liquid working medium passes through the atomizing nozzle ( 13) After atomization, it impacts the surface of the heat conduction device (12), and the reacted atomized liquid working medium flows into the working medium jet chamber (21) in a negative pressure state through the working medium return hole (16). When the first temperature sensor (121) When it is monitored that the temperature of the heat conduction device (12) returns to the set threshold, the port A of the first communication valve (15) is closed, and the cooling and heat dissipation of the heat conduction device (12) is stopped; S3: Jet, atomization composite cooling stage, When the first temperature sensor (121) detects that the temperature of the heat conducting device (12) above the first element to be dissipated exceeds the set threshold and lasts for more than the set time, the first communication valve (15) on the basis of step 2 Port B is opened at intervals, the liquid working medium impinges on the surface of the heat conduction device (12) through the jet nozzle (14), and the atomized liquid working medium after the reaction flows into the working medium jet cavity (21) in a negative pressure state through the working medium return hole (16). , when the first temperature sensor (121) monitors that the temperature of the heat conduction device (12) returns to the set threshold, the ports A and B of the first communication valve (15) are closed, and the cooling and heat dissipation of the heat conduction device (12) is stopped. ; S4: liquid working medium condensation heat dissipation stage, The reacted atomized liquid working medium is mixed with the liquid working medium sprayed into the working medium jet cavity (21) through the working medium jet cavity inlet nozzle (211) in the working medium jet cavity (21) and enters the working medium condensation cavity (22) Preliminary condensation, and then enter the working fluid cooling assembly (3) for cooling and cooling; S5: liquid cooling stage, The cooled liquid working medium flows into the liquid cooling heat dissipation assembly (5) to continue cooling the second element to be radiated, and the second temperature sensor (61) monitors the temperature of the liquid working medium flowing out of the liquid cooling heat dissipation assembly (5). , when the temperature of the liquid working medium exceeds the set threshold, the port B of the second communication valve (6) is opened and the port C is closed, and the liquid working medium flows into the cooling working medium inlet (31) of the liquid cooling and cooling assembly (5). ) to perform a cooling cycle, when the temperature of the liquid working medium is lower than the set threshold, the port B of the second communication valve (6) is closed and the port C is opened, the liquid working medium flows into the liquid storage tank (41), and the whole process continues. cycle; S6: silent loop stage, When the first temperature sensor (121) monitors that the temperature of the heat conducting device (12) above the first element to be dissipated is within the set threshold and the temperature of the liquid working medium monitored by the second temperature sensor (61) is within the set threshold, the The port A and port B of the first communication valve (15) are closed, the port B of the second communication valve (6) is closed, and the port C is open, and the liquid working medium is in the working fluid condensation assembly (2) and working fluid cooling assembly. (3) Quietly circulates between the liquid-cooled heat dissipation assembly (5) and the working fluid circulation assembly (4).

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