CN205784105U - Semiconductor refrigerating module and the cold closet including this module with solid-state fan - Google Patents
Semiconductor refrigerating module and the cold closet including this module with solid-state fan Download PDFInfo
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- CN205784105U CN205784105U CN201520904702.2U CN201520904702U CN205784105U CN 205784105 U CN205784105 U CN 205784105U CN 201520904702 U CN201520904702 U CN 201520904702U CN 205784105 U CN205784105 U CN 205784105U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 73
- 238000001816 cooling Methods 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims description 9
- 238000009826 distribution Methods 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 3
- 238000005457 optimization Methods 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 description 45
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 22
- 238000005057 refrigeration Methods 0.000 description 21
- 238000010521 absorption reaction Methods 0.000 description 11
- 229910021529 ammonia Inorganic materials 0.000 description 11
- 238000009792 diffusion process Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000002826 coolant Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
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- 230000005855 radiation Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000005265 energy consumption Methods 0.000 description 3
- 238000007710 freezing Methods 0.000 description 3
- 230000008014 freezing Effects 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
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- 230000007613 environmental effect Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000006200 vaporizer Substances 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000567 combustion gas Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Cold Air Circulating Systems And Constructional Details In Refrigerators (AREA)
Abstract
The utility model discloses a kind of semiconductor refrigerating module with solid-state fan, including semiconductor chilling plate and radiating subassembly, the face, hot junction of described semiconductor chilling plate and cold end face are separately installed with described radiating subassembly, and least one set radiating subassembly uses solid-state fan；The invention also discloses a kind of cold closet including above-mentioned semiconductor refrigerating module；Solid-state fan of the present utility model is based on principle of corona discharge, there is no mechanical moving element, avoid vibration and noise that mechanical fans is brought, solid-state fan work electric current low power consumption simultaneously is low, radiating fin sheet can be directly utilized as colelctor electrode, substantially reduce cooling system overall volume and weight；And the spacing between voltage, discharge electrode and polar plate spacing and the discharge electrode that its wind speed can be applied on discharge electrode by change realizes, there is structure compacter, light and handy, running friction, noiselessness, in hgher efficiency, wind speed is easily controllable, can be designed with bigger degree of freedom as required, the outstanding advantages such as optimization.
Description
Technical field
This utility model relates to refrigeration technology field, particularly to the semiconductor refrigerating module of solid-state fan with include the cold closet of this module.
Background technology
In order to reduce the vibration and noise that in process of refrigerastion, the structure such as mechanical pump, valve is brought, the refrigerating plant of valveless and mechanical pump is carried out increasing research.Ammonia diffusion absorbing cold closet is the Absorption Refrigerator of a kind of ternary working medium, and it utilizes liquid evaporation to realize continuously freezing.Ammonia diffusion absorption refrigerating machine uses ammonia as cold-producing medium, water is as absorbent, auxiliary noble gas is as diffusant, the partial pressure that it utilizes diffusant to reduce cold-producing medium in being diffused into cold-producing medium realizes the effect of the restricting element in compression refrigerating machine, make whole system need not arrange valve, utilize thermosiphon principle to make refrigeration system energy circular flow, it is not necessary to mechanical pump is set simultaneously, system compressor-free, noise when reducing operation and vibration.There is not the problem of the destruction to ozone layer and greenhouse effect in the refrigeration working medium of ammonia diffusion absorbing ice refrigeration case, these all make ammonia diffusion absorption refrigerator be widely used.
Notification number is that the Chinese patent literature of CN102168900A discloses a kind of diffusion absorption household freezer using combustion gas or electrically heated 100～300 liters, by goods-container, monoblock cold radiation plate is installed and increases cold scattering effect raising efficiency, use linear type vaporizer simultaneously instead and be easy to processing and improve efficiency.Making whole system be applicable to jumbo household freezer, simple in construction, cost reduces, and efficiency improves.But make box volume big owing to being provided with vaporizer, condenser, generator and absorber in ammonia diffusion absorption cold closet, weight is big, and refrigerating efficiency is the most relatively low, therefore, need refrigeration system to be optimized design to improve performance and to make heat transmission equipment more compact, condenser is bigger to the performance impact of refrigeration system simultaneously, use forced convertion fan that condenser is strengthened cooling and can be greatly improved refrigerating speed and the efficiency of refrigeration system, but forced convertion fan also can make ammonia diffusion absorption refrigerator can produce vibration and noise.
In order to solve the problems referred to above, researcher is had to propose semiconductor refrigerating technology, also known as thermoelectric cooling, it it is the technology utilizing pyroelectric effect to realize refrigeration, different from conventional refrigeration method, it both need not cold-producing medium does not has plant equipment and the pipe-line system of complexity yet, it is only necessary to logical upper unidirectional current just can realize refrigeration.Notification number is that the Chinese patent literature of CN2674370Y proposes a kind of efficient cold closet using semiconductor refrigerating technology, owing to it utilizes semi-conducting material to realize refrigeration, it is the least that overall dimensions can do, the weight of system alleviates significantly, reduce friction and noise, more accurately temperature can be controlled and regulate, there is not leakage of refrigerant and the environmental problem that causes.Can operation normally and efficiently but the cold and hot end of semiconductor refrigerating needs for that mechanical fans enhanced heat exchange comes, the problem that mechanical fans can bring vibration and noise, for improving efficiency and reducing noise, this cold closet uses coolant to carry out cooling down rather than traditional mechanical fans in cooling piece hot junction, by coolant, the heat taking away hot junction is made cooling piece stable and high effective operation.But using coolant cooling to bring a lot of other problem, owing to conveying and the circulation of coolant need pump, pump can produce noise the most also power consumption and add energy consumption, and system needs medium circulation pipeline to make structure become complicated.
For this, notification number is that CN 2229638Y discloses a kind of novel semiconductor refrigeration box, including casing, chamber door, storeroom, water storage tank, water pump, cooler, cooling mechanism, power supply and temperature control circuit, the sidepiece of described cold closet is provided with that more than a set of storage is cold equably, heat absorption conductive and cooling mechanism, has clamped semiconductor refrigerating assembly between cold accumulator and heat absorption conductive block.Above-mentioned semiconductor refrigeration box is adopted and is used water as coolant and carry out heat exchange, is provided with water pump, complicated integral structure, and water pump and also can produce noise, vibration and power consumption and increase power consumption.
Utility model content
This utility model provides a kind of semiconductor refrigerating module with solid-state fan, has that volume is little, noiselessness, friction and a refrigerating efficiency advantages of higher.
A kind of semiconductor refrigerating module with solid-state fan, including semiconductor chilling plate and radiating subassembly, the face, hot junction of described semiconductor chilling plate and cold end face are separately installed with described radiating subassembly, and least one set radiating subassembly uses solid-state fan.
Semiconductor chilling plate is based on pyroelectric effect thus to realize refrigeration, by changing the flow direction of generating positive and negative voltage, it is also possible to making the face, hot junction of semiconductor chilling plate and cold end face exchange, application realizes cold, hot two-purpose, and simple in construction in a device, and volume is little.Radiating subassembly is arranged at its cold and hot end in order to improve the performance of semiconductor refrigerating.Least one set radiating subassembly uses solid-state fan to refer to can all use solid-state fan with both ends of the surface, it is also possible to only one end uses solid-state fan, and the other end uses the heat abstractor of other structures.
The cold and hot end radiating subassembly of this utility model semiconductor chilling plate all uses solid-state fan heat sink.Solid-state fan is that the charged particle utilizing corona discharge to produce flows drive surrounding air flowing in the electric field, and the flowing of air forms the wind of macroscopic view and realizes the heat absorption of the scattered hot and cold end to hot junction.Different from traditional mechanical fan, the efficiency of solid-state fan and air quantity can be by structural parameters such as heat-transfer surfaces, spacing, and the impact of the heat flux of supply voltage and heat-transfer surface, the heat flux of radiating surface also can produce impact to the efficiency of semiconductor chilling plate simultaneously, therefore there is the parameter of optimum to make whole freezer case to run in the best condition, it is achieved reduce energy consumption and improve refrigerating efficiency and speed.
Manufacture for convenience and improve refrigeration, described solid-state fan includes power supply and the discharge electrode of the generation corona wind that cooperates and colelctor electrode, electrode framework is used for fixing discharge electrode, wire is used for connecting power supply, by being fixed on above colelctor electrode by discharge electrode or left and right sides position different realize the wind that difference flows to and dispel the heat the cold and hot end face of quasiconductor.Preferably, described solid-state fan includes power supply and the collector plate of the generation corona wind that cooperates and sparking electrode, described collector plate include the surface with semiconductor chilling plate recline install substrate and some fins being fixed on substrate backside semiconductor cooling piece side, fin extends with being substantially parallel to each other in the vertical, forming the ion wind passage extended longitudinally between adjacent fins, it is positioned opposite with ion wind passage that described sparking electrode is distributed in collector plate periphery and discharge end by fixed mount installation.
Preferably, each fin is made up of the fin post of longitudinally spaced arrangement, and the fin post one_to_one corresponding of adjacent fins makes the interval between fin post be formed at the ion wind passage transversely extended.If the most each fin post is placed equidistant, fin post array arrangement.Owing to using pin fin (fin post), outside surrounding air can enter passage from surrounding, preferably can cool down quasiconductor, and the coefficient of heat transfer is higher so that the heat exchange property of pin fin is more preferable.
Preferably, described sparking electrode is wire, is positioned at above ion wind passage and parallel with ion wind passage.The design of wire discharge electrode, processing simply, can reduce the electrode number needing to arrange simultaneously, it is easy to fixing, can save design time and cost.Top is with substrate as bottom surface, away from the position of substrate.
Preferably, described sparking electrode is needle-like.The sparking electrode of needle-like due to radius of curvature be prone to make less, discharge inception voltage can be lower, it is easier to realizes corona discharge, simultaneously needle electrode can by adjust pin towards preferably realizing control that the ion wind flow produced is flowed to.
In order to improve air quantity and radiating effect, preferably, described fin is made up of the fin post of longitudinally spaced arrangement, the interval one_to_one corresponding (i.e. the fin post one_to_one corresponding of adjacent fins) of adjacent fins, all relative intervals are formed at the ion wind passage transversely extended, the sparking electrode of needle-like is arranged in the top of the crossover location of vertical and horizontal ion wind passage, the i.e. sparking electrode of needle-like and is arranged on the cubical centrage that the fin post of surrounding is formed and syringe needle is towards ion wind passage.
Preferably, every ion wind passage is to there being multiple sparking electrode, these sparking electrodes are positioned at above ion wind passage, along the distribution of ion wind channel-length direction and syringe needle towards ion wind passage, all sparking electrodes are positioned at the same side of collector plate and syringe needle towards identical.Sparking electrode is positioned at above ion wind passage, and electrode is arranged can cover whole heat radiation plane, and the ion wind of generation will can be made wind speed everywhere uniform by blowing to required heat radiation plane on the upside of passage, can preferably realize the heat radiation to whole flat board.
Preferably, described sparking electrode is positioned at ion wind channel end and syringe needle towards ion wind passage.Sparking electrode is arranged in ion wind channel end, is possible not only to reduce the height of ion wind device, the most also reduces the interference of produced ion wind between adjacent electrode in passage, ion wind wind direction can be made to be controlled better.All sparking electrodes may be located at the same side of collector plate, it is also possible to is relative both sides.
Described semiconductor chilling plate can use single stage thermoelectric heap or Multi-stage heat pile.The cryogenic temperature that single stage thermoelectric heap can reach is higher, in order to meet the demand of freezing, and can be to use the form of Multi-stage heat pile.Preferably, described semiconductor chilling plate uses Multi-stage heat pile.
This utility model additionally provides a kind of cold closet, including casing and chamber door, also includes above-mentioned semiconductor refrigerating module.
In order to improve refrigeration, it is preferred that described semiconductor refrigerating module is arranged on casing just on the sidewall of chamber door or the top of casing.Semiconductor refrigerating module is arranged on top and is conducive to cold air to be full of whole casing, is arranged in just sidewall to chamber door and makes away from chamber door, prevents the cold air when chamber door is opened quickly to run off.
The beneficial effects of the utility model:
(1) solid-state fan couple semiconductor cooling piece is used to substitute existing ammonia diffusion absorption refrigeration ice structure, owing to solid-state fan couple semiconductor cooling piece uses semiconductor refrigerating technology, it utilizes semi-conducting material to form P-N junction, logical upper unidirectional current can be achieved with refrigeration, need not use cold-producing medium, as ammonia diffusion absorbing structure, overcome the environmental impact issues that the cold-producing medium of compression system use is caused, simultaneously semiconductor refrigerating due to use semi-conducting material can be with miniaturization, make whole semiconductor refrigerating piece volumes little, the most lightweight, overcome the shortcoming that ammonia diffusion absorption system bulk weight is excessive, the most also overcome the vibration of ammonia diffusion absorbing structure and noise and inefficient problem；
(2) use solid-state fan to substitute mechanical fans and realize the cold hot-side heat dissipation of semiconductor chilling plate, solid-state fan assembly uses ion wind technology, corona discharge is utilized to produce ion wind, need not mechanical gyro unit, make whole semiconductor refrigeration system without moving component thus there is no noise and vibration, and electric current produced by solid-state fan is the least, it is less that the power of fan consumption compares mechanical fans, more preferable heat transfer effect can be obtained under less power consumption, the energy consumption making whole solid-state fan couple semiconductor refrigerating plant reduces refrigeration simultaneously and strengthens, thus realize the raising of efficiency；
(3) spacing that the wind speed of solid-state fan can pass through between voltage, sparking electrode and collector plate spacing and electrode regulates simultaneously, and these degree of freedom making solid-state fan compare mechanical fans design are greatly improved, and the control of air quantity simultaneously is also more prone to；
(4) solid-state fan reduces the volume that fan takies, it is easy to the miniaturization of whole semiconductor cooling device.
Accompanying drawing explanation
Fig. 1 is the structural representation of the cold closet of embodiment 1.
Fig. 2 is the structural representation of the semiconductor refrigerating module of embodiment 1.
Fig. 3 is the perspective view of the collector plate of embodiment 1.
Fig. 4 is the structural representation of the semiconductor refrigerating module of embodiment 2.
Fig. 5 is the perspective view of the solid-state fan of embodiment 3.
Fig. 6 is the perspective view of the collector plate of embodiment 4.
Fig. 7 is the perspective view of the solid-state fan of embodiment 4.
Fig. 8 is the perspective view of the solid-state fan of embodiment 5.
Fig. 9 is the perspective view of the solid-state fan of embodiment 6.
Figure 10 is the structural representation of the cold closet of embodiment 7.
Figure 11 is the structural representation of the cold closet of embodiment 8.
1, casing, 2, chamber door, 3, cold end radiator, 4, hot-side heat dissipation device, 5, semiconductor chilling plate, 6, wire, 7, rectifier power source, 8, shroud, 9, the sparking electrode of wire, 10, electrode framework, 11, fin, 12, the sparking electrode of needle-like, 13, substrate, 14, tabular fin, 15, fin post, 16, ion wind passage.
Detailed description of the invention
Embodiment 1
As shown in Figures 1 to 3, the cold closet of the present embodiment includes: casing 1, chamber door 2, be arranged on casing 1 just to the semiconductor refrigerating module on the sidewall of chamber door 2, rectifier power source 7 and shroud 8.
Semiconductor refrigerating module includes: semiconductor chilling plate 5 and be separately mounted to the face, hot junction of semiconductor chilling plate 5 and the cold end radiator 3 of cold end face and hot-side heat dissipation device 4, and cold end radiator 3 and hot-side heat dissipation device 4 all use solid-state fan.Semiconductor chilling plate 5, cold end radiator 3 and hot-side heat dissipation device 4 are powered respectively by rectifier power source 7 by wire 6.The semiconductor chilling plate 5 of the present embodiment uses single stage thermoelectric pile structure.
Solid-state fan includes coordinating collector plate and the sparking electrode 9 of wire producing corona wind, collector plate include the surface with semiconductor chilling plate recline install substrate 13 and some fins 11 being fixed on substrate backside semiconductor cooling piece 5 side, the fin 11 that the present embodiment is adopted uses tabular fin 14, tabular fin 14 extends with being substantially parallel to each other in the vertical, forming the ion wind passage 16 extended longitudinally between adjacent flat plate-shaped fins 14, the sparking electrode 9 of wire is positioned at above ion wind passage 16 and parallel with ion wind passage 16.Electrode framework 10 is for fixing the two ends of the sparking electrode 9 of wire, and acrylic board assembles the electrode framework 10 formed.
Collector plate is fixed by welding in cold end and the hot junction of semiconductor chilling plate 5, obtains, by above-mentioned layout, the ion wind that in figure, the upper side inflow left and right sides shown in arrow flows out and dispels the heat the cold and hot end of semiconductor chilling plate 5.
Embodiment 2
As shown in Figure 4, the present embodiment is in addition to the structure of sparking electrode is different from embodiment 1, remaining structure is same as in Example 1, sparking electrode in the present embodiment uses the sparking electrode 12 of needle-like, and the sparking electrode 12 of needle-like is positioned at above ion wind passage 16, along the distribution of ion wind passage 16 length direction and syringe needle towards ion wind passage 16.The sparking electrode 12 of needle-like is metal needle or metal bur needle.
Embodiment 3
As shown in Figure 5, the present embodiment is in addition to the structure of sparking electrode, remaining structure is same as in Example 2, in the present embodiment, the sparking electrode 12 of needle-like is positioned at ion wind passage 16 end and syringe needle towards ion wind passage 16, and the sparking electrode 12 of all needle-likes is positioned at the same side of collector plate and syringe needle towards identical.Obtain, by above-mentioned layout, the ion wind that in figure, the side of metal wing sheet shown in arrow inflow opposite side flows out and carry out the cold hot-side heat dissipation to semiconductor chilling plate.
Embodiment 4
As shown in Figures 6 and 7, the present embodiment is in addition to the structure of collector plate, remaining structure is same as in Example 1, the fin post 13 that fin 11 in the present embodiment is arranged for consecutive intervals, ion wind passage 16 is all formed at vertical and horizontal, be arranged over the sparking electrode 9 of wire at longitudinal ion wind passage 16, the sparking electrode 9 of wire extends longitudinally to be fixed on electrode framework along ion wind passage.
Embodiment 5
As shown in Figure 8, the present embodiment is in addition to the structure of sparking electrode, remaining structure is the same as in Example 4, sparking electrode in the present embodiment uses the sparking electrode 12 of needle-like, and the sparking electrode 12 of needle-like is positioned at the top of the crossover location of vertical and horizontal ion wind passage, along the distribution of ion wind passage 16 length direction and syringe needle towards ion wind passage 16.The sparking electrode 12 of needle-like is metal needle or metal bur needle.
Embodiment 6
As shown in Figure 9, the present embodiment is in addition to the distribution mode of the sparking electrode of needle-like, remaining structure is same as in Example 3, in the present embodiment, the sparking electrode 12 of needle-like is positioned at ion wind passage 16 end and syringe needle towards ion wind passage 16, every ion wind passage 16 only one end is provided with the sparking electrode 12 of needle-like, and the sparking electrode 12 of the needle-like corresponding to adjacent ions wind passage 16 is arranged in collector plate both sides.Said structure makes collector plate both sides be designed with spaced apart sparking electrode 12, such that it is able to produce the ion wind that both direction is contrary, radiating effect is more preferable.
Embodiment 7
As shown in Figure 10, the present embodiment is in addition to the installation site of semiconductor refrigerating module, and remaining structure and embodiment 1,2,3,4,5 or 6 are identical, and the semiconductor refrigerating module in the present embodiment is arranged on the top of casing.
Embodiment 8
As shown in figure 11, the present embodiment is in addition to the structure of semiconductor chilling plate 5, and remaining structure and embodiment 1,2,3,4,5 or 6 are identical, and the semiconductor chilling plate 5 in the present embodiment uses two levels of thermal electric pile structure.The present embodiment uses two levels of thermal pile to realize refrigeration, can arrive lower temperature and meet freezing requirement in case, and if desired lower temperature can increase the progression of thermoelectric pile further to meet the demand of cryogenic temperature.
Claims (9)
1. with a semiconductor refrigerating module for solid-state fan, including semiconductor chilling plate and radiating subassembly, face, hot junction and the cold end face of described semiconductor chilling plate are separately installed with described radiating subassembly, it is characterised in that least one set radiating subassembly uses solid-state fan；Described solid-state fan includes power supply and the collector plate of the generation corona wind that cooperates and sparking electrode, described collector plate include the surface with semiconductor chilling plate recline install substrate and some fins being fixed on substrate backside semiconductor cooling piece side, fin extends with being substantially parallel to each other in the vertical, forming the ion wind passage extended longitudinally between adjacent fins, it is positioned opposite with ion wind passage that described sparking electrode is distributed in collector plate periphery and discharge end by fixed mount installation.
2. as claimed in claim 1 with the semiconductor refrigerating module of solid-state fan, it is characterized in that, each fin is made up of the fin post of longitudinally spaced arrangement, and the fin post one_to_one corresponding of adjacent fins makes the interval between fin post be formed at the ion wind passage transversely extended.
3., as claimed in claim 1 or 2 with the semiconductor refrigerating module of solid-state fan, it is characterised in that described sparking electrode is wire, it is positioned at above ion wind passage and parallel with ion wind passage.
4. as claimed in claim 1 or 2 with the semiconductor refrigerating module of solid-state fan, it is characterised in that described sparking electrode is needle-like.
5. as claimed in claim 4 with the semiconductor refrigerating module of solid-state fan, it is characterized in that, every ion wind passage is to there being multiple sparking electrode, and these sparking electrodes are positioned at above ion wind passage, along the distribution of ion wind channel-length direction and syringe needle towards ion wind passage.
6., as claimed in claim 4 with the semiconductor refrigerating module of solid-state fan, it is characterised in that described sparking electrode is positioned at ion wind channel end and syringe needle towards ion wind passage, all sparking electrodes are positioned at the same side of collector plate and syringe needle towards identical.
7. as claimed in claim 1 or 2 with the semiconductor refrigerating module of solid-state fan, it is characterised in that described semiconductor chilling plate uses Multi-stage heat pile.
8. a cold closet, including casing and chamber door, it is characterised in that also include the semiconductor refrigerating module as described in claim 1～7.
9. cold closet as claimed in claim 8, it is characterised in that described semiconductor refrigerating module is arranged on casing just on the sidewall of chamber door or the top of casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520904702.2U CN205784105U (en) | 2015-11-12 | 2015-11-12 | Semiconductor refrigerating module and the cold closet including this module with solid-state fan |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520904702.2U CN205784105U (en) | 2015-11-12 | 2015-11-12 | Semiconductor refrigerating module and the cold closet including this module with solid-state fan |
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| CN205784105U true CN205784105U (en) | 2016-12-07 |
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| CN201520904702.2U Active CN205784105U (en) | 2015-11-12 | 2015-11-12 | Semiconductor refrigerating module and the cold closet including this module with solid-state fan |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105276894A (en) * | 2015-11-12 | 2016-01-27 | 浙江大学 | Semiconductor refrigerating module provided with solid-state fans and refrigerating container comprising semiconductor refrigerating module |
| CN108626932A (en) * | 2017-03-21 | 2018-10-09 | Lg电子株式会社 | Refrigerator |
| US10731900B2 (en) | 2017-03-21 | 2020-08-04 | Lg Electronics Inc. | Refrigerator |
-
2015
- 2015-11-12 CN CN201520904702.2U patent/CN205784105U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105276894A (en) * | 2015-11-12 | 2016-01-27 | 浙江大学 | Semiconductor refrigerating module provided with solid-state fans and refrigerating container comprising semiconductor refrigerating module |
| CN108626932A (en) * | 2017-03-21 | 2018-10-09 | Lg电子株式会社 | Refrigerator |
| US10731900B2 (en) | 2017-03-21 | 2020-08-04 | Lg Electronics Inc. | Refrigerator |
| US10859294B2 (en) | 2017-03-21 | 2020-12-08 | Lg Electronics Inc. | Refrigerator with thermoelectric module |
| CN108626932B (en) * | 2017-03-21 | 2021-06-29 | Lg电子株式会社 | Refrigerator with a door |
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