US20080173023A1 - Refrigerator with thermal-electric semiconductor - Google Patents

Refrigerator with thermal-electric semiconductor Download PDF

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Publication number
US20080173023A1
US20080173023A1 US11/656,397 US65639707A US2008173023A1 US 20080173023 A1 US20080173023 A1 US 20080173023A1 US 65639707 A US65639707 A US 65639707A US 2008173023 A1 US2008173023 A1 US 2008173023A1
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United States
Prior art keywords
thermal
refrigerator
electric semiconductor
heat transfer
transfer unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/656,397
Inventor
Shao-Hung Wu
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Individual
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Individual
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Publication date
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Priority to US11/656,397 priority Critical patent/US20080173023A1/en
Publication of US20080173023A1 publication Critical patent/US20080173023A1/en
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021—Control thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
    • F25B25/005—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00 using primary and secondary systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
    • F25B2700/21—Temperatures

Definitions

  • the present invention relates to refrigerators, and in particular to a refrigerator with thermal-electric semiconductor.
  • No compressor, evaporator and condenser is used so that the cost is lowered and the volume is reduced. It can be assembled easily and no refrigerant is required.
  • the conventional refrigerator has a compressor, an evaporator and a condenser.
  • the compressor compresses refrigerant so as to transfer energy to the refrigerant to be as high temperature and high pressure gas.
  • the refrigerant flows to a condenser for condensing so as to be as a high pressure and low temperature liquid.
  • the refrigerant flows to an evaporator for expansion and evaporation to absorb heat so as to be as a low temperature and low pressure gas.
  • the refrigerant flows to the compressor.
  • the prior art is low efficiency, has a complicated structure and many parts are required and the cost is high. Thereby a greater volume is required, while it is heavy. However, this is not matched to the current requirement of compact size and light.
  • the primary object of the present invention is to provide a refrigerator with thermal-electric semiconductor. No compressor, evaporator and condenser is used so that the cost is lowered and the volume is reduced. It can be assembled easily and no refrigerant is required.
  • the present invention provides a refrigerator with thermal-electric semiconductor comprising: a power supply, a thermal-electric semiconductor, a cooling water box, a cyclic water box, and a low temperature heat transfer unit; the cooling water box being a hollow box with cooling water therein; the cooling water box having a water inlet tube and a water outlet tube; the water inlet tube and water outlet tube being connected to the cyclic water box; a fan can be used to blow the cyclic water box for reducing the temperature thereof; a cold surface of the thermal-electric semiconductor being adhered to one side of the low temperature heat transfer unit; another side of the low temperature heat transfer unit entering into a body of a refrigerator; the low temperature heat transfer unit separating the refrigerator into a freezer and a freezing compartment; the low temperature heat transfer unit being with a temperature sensor and a temperature control circuit for controlling temperature.
  • FIG. 1 is a structural schematic view of the present invention.
  • FIG. 2 shows another embodiment of the present invention.
  • FIG. 3 shows the application of the present invention.
  • the thermal-electric semiconductor refrigerator of the present invention comprises: a power supply 1 , a thermal-electric semiconductor 2 , a cooling water box 3 , a cyclic water box 4 , and a low temperature heat transfer unit 5 .
  • the power supply 1 has a switch 15 for selecting DC (direct current) input 13 or AC (alternative current) input 10 so that the refrigerator can be used at home or in a car.
  • An output end 11 of the power supply 1 is a 12 Volt DC output.
  • the output end 11 is connected to the thermal-electric semiconductor 2 .
  • One side of the thermal-electric semiconductor 2 is a cold surface 21 which is opposite to and face to a hot surface 23 .
  • the heat surface 23 is adhered to a cooling water box 3 .
  • the cooling water box 3 is a hollow box with cooling water therein.
  • the cooling water box 3 has a water inlet tube 31 and a water outlet tube 32 .
  • the water inlet tube 31 and water outlet tube 32 are connected to the cyclic water box 4 so as to have better effects.
  • a fan can be used to blow the cyclic water box 4 for reducing the temperature thereof.
  • the cold surface 21 of the thermal-electric semiconductor 2 is adhered to one side of the low temperature heat transfer unit 5 which is made of metal with preferred heat transfer, such as aluminum. Another side of the low temperature heat transfer unit 5 enters into a body of a refrigerator.
  • the low temperature heat transfer unit 5 separates a freezer and a freezing compartment which is smaller than the freezer. In the freezing compartment, the low temperature heat transfer unit 5 is curled as a hollow box so as to make the temperature of the low temperature heat transfer unit 5 being low.
  • the freezer is cooled by the low temperature of the freezing compartment.
  • the power supply 1 , cooling water box 3 and cyclic water box 4 have small volumes so that they are installed at the backside of the refrigerator.
  • the whole refrigerator has a small volume so that it can be carried conveniently.
  • the lateral side of the low temperature heat transfer unit 5 is further installed with a temperature sensor 61 so that the temperature can be transferred to a temperature control circuit to decide whether the thermal-electric semiconductor 2 is necessary to be operated continuously.
  • the cooling water box 3 and cyclic water box 4 can be replaced by other way, as illustrated in FIG. 2 , the hot surface 23 of the thermal-electric semiconductor 2 can be adhered with heat dissipating fin set for saving volume and cost.
  • the refrigerator body 8 has a freezing compartment 81 and a freezer 82 .
  • the lower temperature of the freezer 82 induced by cold air from the freezing compartment 81 .
  • the freezer 82 is installed with spacers 83 for placing objects.
  • the thermal-electric semiconductor 2 is a cooling chip.
  • the present invention has a smaller volume, high efficiency, lower cost and without refrigerant.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

A refrigerator with thermal-electric semiconductor comprises: a power supply, a thermal-electric semiconductor, a cooling water box, a cyclic water box, and a low temperature heat transfer unit; the cooling water box being a hollow box with cooling water therein; the water inlet tube and water outlet tube of the cooling water box being connected to the cyclic water box; a cold surface of the thermal-electric semiconductor being adhered to one side of the low temperature heat transfer unit; another side of the low temperature heat transfer unit entering into a body of a refrigerator; the low temperature heat transfer unit separating the refrigerator into a freezer and a freezing compartment; the low temperature heat transfer unit being with a temperature sensor and a temperature control circuit for controlling temperature.

Description

    FIELD OF THE INVENTION
  • The present invention relates to refrigerators, and in particular to a refrigerator with thermal-electric semiconductor. No compressor, evaporator and condenser is used so that the cost is lowered and the volume is reduced. It can be assembled easily and no refrigerant is required.
    • BACKGROUND OF THE INVENTION
  • The conventional refrigerator has a compressor, an evaporator and a condenser. The compressor compresses refrigerant so as to transfer energy to the refrigerant to be as high temperature and high pressure gas. Then the refrigerant flows to a condenser for condensing so as to be as a high pressure and low temperature liquid. Then the refrigerant flows to an evaporator for expansion and evaporation to absorb heat so as to be as a low temperature and low pressure gas. Then the refrigerant flows to the compressor. However, the prior art is low efficiency, has a complicated structure and many parts are required and the cost is high. Thereby a greater volume is required, while it is heavy. However, this is not matched to the current requirement of compact size and light.
    • SUMMARY OF THE INVENTION
  • Accordingly, the primary object of the present invention is to provide a refrigerator with thermal-electric semiconductor. No compressor, evaporator and condenser is used so that the cost is lowered and the volume is reduced. It can be assembled easily and no refrigerant is required.
  • To achieve above objects, the present invention provides a refrigerator with thermal-electric semiconductor comprising: a power supply, a thermal-electric semiconductor, a cooling water box, a cyclic water box, and a low temperature heat transfer unit; the cooling water box being a hollow box with cooling water therein; the cooling water box having a water inlet tube and a water outlet tube; the water inlet tube and water outlet tube being connected to the cyclic water box; a fan can be used to blow the cyclic water box for reducing the temperature thereof; a cold surface of the thermal-electric semiconductor being adhered to one side of the low temperature heat transfer unit; another side of the low temperature heat transfer unit entering into a body of a refrigerator; the low temperature heat transfer unit separating the refrigerator into a freezer and a freezing compartment; the low temperature heat transfer unit being with a temperature sensor and a temperature control circuit for controlling temperature.
  • The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawing.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a structural schematic view of the present invention.
  • FIG. 2 shows another embodiment of the present invention.
  • FIG. 3 shows the application of the present invention.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • In order that those skilled in the art can further understand the present invention, a description will be provided in the following in details. However, these descriptions and the appended drawings are only used to cause those skilled in the art to understand the objects, features, and characteristics of the present invention, but not to be used to confine the scope and spirit of the present invention defined in the appended claims.
  • Referring to FIG. 1, the thermal-electric semiconductor refrigerator of the present invention is illustrated. The present invention comprises: a power supply 1, a thermal-electric semiconductor 2, a cooling water box 3, a cyclic water box 4, and a low temperature heat transfer unit 5. The power supply 1 has a switch 15 for selecting DC (direct current) input 13 or AC (alternative current) input 10 so that the refrigerator can be used at home or in a car. An output end 11 of the power supply 1 is a 12 Volt DC output. The output end 11 is connected to the thermal-electric semiconductor 2. One side of the thermal-electric semiconductor 2 is a cold surface 21 which is opposite to and face to a hot surface 23. The heat surface 23 is adhered to a cooling water box 3. The cooling water box 3 is a hollow box with cooling water therein. The cooling water box 3 has a water inlet tube 31 and a water outlet tube 32. The water inlet tube 31 and water outlet tube 32 are connected to the cyclic water box 4 so as to have better effects. A fan can be used to blow the cyclic water box 4 for reducing the temperature thereof. The cold surface 21 of the thermal-electric semiconductor 2 is adhered to one side of the low temperature heat transfer unit 5 which is made of metal with preferred heat transfer, such as aluminum. Another side of the low temperature heat transfer unit 5 enters into a body of a refrigerator. The low temperature heat transfer unit 5 separates a freezer and a freezing compartment which is smaller than the freezer. In the freezing compartment, the low temperature heat transfer unit 5 is curled as a hollow box so as to make the temperature of the low temperature heat transfer unit 5 being low. The freezer is cooled by the low temperature of the freezing compartment.
  • In the present invention, the power supply 1, cooling water box 3 and cyclic water box 4 have small volumes so that they are installed at the backside of the refrigerator. The whole refrigerator has a small volume so that it can be carried conveniently.
  • In the present invention, the lateral side of the low temperature heat transfer unit 5 is further installed with a temperature sensor 61 so that the temperature can be transferred to a temperature control circuit to decide whether the thermal-electric semiconductor 2 is necessary to be operated continuously. In the present invention, the cooling water box 3 and cyclic water box 4 can be replaced by other way, as illustrated in FIG. 2, the hot surface 23 of the thermal-electric semiconductor 2 can be adhered with heat dissipating fin set for saving volume and cost.
  • Referring to FIG. 3, the application of the present invention is illustrated. In the present invention, the refrigerator body 8 has a freezing compartment 81 and a freezer 82. The lower temperature of the freezer 82 induced by cold air from the freezing compartment 81. The freezer 82 is installed with spacers 83 for placing objects.
  • In the present invention, the thermal-electric semiconductor 2 is a cooling chip.
  • Advantages of the present invention are that: the present invention has a smaller volume, high efficiency, lower cost and without refrigerant.
  • The present invention is thus described, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the present invention, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims.

Claims (5)

What is claimed is:
1. A refrigerator with thermal-electric semiconductor comprising: a power supply, a thermal-electric semiconductor, a cooling water box, a cyclic water box, and a low temperature heat transfer unit; the cooling water box being a hollow box with cooling water therein; the cooling water box having a water inlet tube and a water outlet tube; the water inlet tube and water outlet tube being connected to the cyclic water box; a cold surface of the thermal-electric semiconductor being adhered to one side of the low temperature heat transfer unit; another side of the low temperature heat transfer unit entering into a body of a refrigerator; the low temperature heat transfer unit separating the refrigerator into a freezer and a freezing compartment; the low temperature heat transfer unit being installed with a temperature sensor and a temperature control circuit for controlling temperature.
2. The refrigerator with thermal-electric semiconductor as claimed in claim 1, wherein thermal-electric semiconductor has a cold surface which is opposite to and face to a hot surface; the heat surface is adhered to a cooling water box.
3. The refrigerator with thermal-electric semiconductor as claimed in claim 1, wherein the power supply having a switch for selecting DC (direct current) input or AC (alternative current) input.
4. The refrigerator with thermal-electric semiconductor as claimed in claim 1, wherein a heat dissipating fin set is adhered to a hot surface of the thermal-electric semiconductor.
5. The refrigerator with thermal-electric semiconductor as claimed in claim 1, wherein a fan is used to blow the cyclic water box for reducing the temperature thereof.
US11/656,397 2007-01-23 2007-01-23 Refrigerator with thermal-electric semiconductor Abandoned US20080173023A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/656,397 US20080173023A1 (en) 2007-01-23 2007-01-23 Refrigerator with thermal-electric semiconductor

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Application Number Priority Date Filing Date Title
US11/656,397 US20080173023A1 (en) 2007-01-23 2007-01-23 Refrigerator with thermal-electric semiconductor

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US20080173023A1 true US20080173023A1 (en) 2008-07-24

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100071384A1 (en) * 2008-09-25 2010-03-25 B/E Aerospace, Inc. Refrigeration systems and methods for connection with a vehicle's liquid cooling system
US20140338366A1 (en) * 2013-03-15 2014-11-20 Gentherm Incorporated Thermally-conditioned beverage holders and bins
US20170242048A1 (en) * 2016-02-19 2017-08-24 Agjunction Llc Thermal stabilization of inertial measurement units
US9861006B2 (en) 2012-07-06 2018-01-02 Gentherm Incorporated Systems and methods for thermoelectrically cooling inductive charging stations
US20220332427A1 (en) * 2019-09-23 2022-10-20 Safran Cabin Germany Gmbh Aircraft-galley module with open/closed-loop cooling/heating

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US413136A (en) * 1889-10-15 dewey
US3172269A (en) * 1962-10-31 1965-03-09 Technical Operations Inc Thermoelectric refrigerator
US5269146A (en) * 1990-08-28 1993-12-14 Kerner James M Thermoelectric closed-loop heat exchange system
US6574967B1 (en) * 2002-01-31 2003-06-10 Samsung Electronics Co., Ltd. Cooling and heating apparatus using thermoelectric module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US413136A (en) * 1889-10-15 dewey
US3172269A (en) * 1962-10-31 1965-03-09 Technical Operations Inc Thermoelectric refrigerator
US5269146A (en) * 1990-08-28 1993-12-14 Kerner James M Thermoelectric closed-loop heat exchange system
US6574967B1 (en) * 2002-01-31 2003-06-10 Samsung Electronics Co., Ltd. Cooling and heating apparatus using thermoelectric module

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100071384A1 (en) * 2008-09-25 2010-03-25 B/E Aerospace, Inc. Refrigeration systems and methods for connection with a vehicle's liquid cooling system
US9238398B2 (en) * 2008-09-25 2016-01-19 B/E Aerospace, Inc. Refrigeration systems and methods for connection with a vehicle's liquid cooling system
US9861006B2 (en) 2012-07-06 2018-01-02 Gentherm Incorporated Systems and methods for thermoelectrically cooling inductive charging stations
US10219407B2 (en) 2012-07-06 2019-02-26 Gentherm Incorporated Systems and methods for cooling inductive charging assemblies
US10455728B2 (en) 2012-07-06 2019-10-22 Gentherm Incorporated Systems and methods for thermoelectrically cooling inductive charging stations
US20140338366A1 (en) * 2013-03-15 2014-11-20 Gentherm Incorporated Thermally-conditioned beverage holders and bins
US20170242048A1 (en) * 2016-02-19 2017-08-24 Agjunction Llc Thermal stabilization of inertial measurement units
US10845375B2 (en) * 2016-02-19 2020-11-24 Agjunction Llc Thermal stabilization of inertial measurement units
US20220332427A1 (en) * 2019-09-23 2022-10-20 Safran Cabin Germany Gmbh Aircraft-galley module with open/closed-loop cooling/heating

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