M351394 八、新型說明： 【新型所屬之技術領域】 本創作係一種多通道熱管式散熱器，尤指—種可採用 較多熱官增加傳熱通道而增進散熱效率的熱管式散熱器。 【先前技術】 由於電腦中央處理器的工作頻率愈來愈高，相對產生 的熱忐也愈來愈高，因而在散熱器的規模愈來愈大，對於 散熱效率的要求也日趨嚴格。為滿足前«熱需求， 人先珂提出獲准的新型專利權第M291559號「熱管式散 熱裝置」’請參閱第五圖所示，主要係由一金屬底座叫 、-熱管組及'鰭片組(72)等組成，其中，該金屬底座 (71)内形成有複數弧形通道，又熱管組係由複數分別以其 中一區段穿置於前述弧形通道内的熱管（73)所組成，各数 官「3)的兩端並分別穿過籍片組（72)的各籍片而構成 觸。 ’’ 〜如^1^熱s式散熱裝置係由金屬底座（71)底面與發孰 乂如中央處理器）表面構成熱接觸，使發熱體產 也 經由金屬底座（71}、埶普 *''' …g (73)傳導至鰭片組（72)， 組（72)t複數“提供的大散熱面積予以揮散。 “相熱管歧Μ置在散熱效率 當顯者’但面對未來仍將持續提一 = 式散熱裝置即有進— 的作-度，刖述熱f 式散執〗。如前揭所述，該熱管 ^置係依賴熱管（73)將金屬底座（71)上的廢熱傳導 3 M351394 至鰭片組(72) —㈣丄，观官（门、齡曰人 ^ y _ …、M73)數罝愈多，傳導熱能的 =將愈快述專利案係令熱管(73)中央的區段穿過 =屬底座（7D上的弧形通道，如是設計下，因金屬底座 ⑼上可供熱管（73)穿過的體積有限，連帶地限制了熱管 (73)的數量，從而影響了散熱效率的進—步提升。 【新型内容】 因此，本創作主要目的在提供一種多通道熱管式散熱 器，其可採用較多熱管以增加傳熱通道，&而大幅增進散 熱效率。 為達成前述目的採取的主要技術手段係令前述散熱器 包括有： …° 一均溫板，係呈長片狀而形成有一中空腔體，又均溫 板具有一表面及一底面，其表面形成一第一熱接觸部，又 底面分別形成有一第二熱接觸部及一導熱部； 複數傳熱管，分別具有一橫臂及兩直臂，其橫臂係呈 扁平狀，並以至少一面與均溫板上的第一或第二熱接觸部 構成熱接觸並結合其上； 一鰭片組’係由複數作疊層排列的鰭片所組成，各鮮 片分別相對應位置上形成有穿孔，以供各傳熱管的直臂貫 穿並構成熱接觸； 以前述的熱管式散熱器設計，係由均溫板以其導熱部 與發熱體接觸，並提供較大的熱接觸面積，藉以與較大數 量的傳熱管構成熱接觸，從而可透過較多的傳熱管將均溫 4 M351394 板上的熱能快速地傳導至鰭片組揮散，使散熱效率得以大 幅增進。 【實施方式】 二圖所示 一鰭片組 關於本創作之一較佳貫施例，請參閱第一、 ，主要係由一均溫板（1〇)、複數傳熱管（21)(22)及 (30)所組成；其中： 该均溫板（Vapor Chamber)(i〇)呈長片狀，其呈 中空腔體(圖中未示)，其間充填有熱超導介質，’又^ 内壁具有毛細結構’當熱能由熱源傳導至均溫板〇斤 腔體内的熱超導介質將迅速均勾散佈到低溫處冷凝，：由 腔體内的毛細結構回流至相對熱源處，並循環地進行前述 流程，此即為均溫板（10)的基本卫作原理q均溫板 其具有一表面及一底面，其中段部位略向凹陷，故其表面 於該凹陷位置上形成一第一熱接觸部⑴)，其底面則：相 對位置上呈突出狀而構成一導熱部（13)，再者，該均π板 ⑽的底面於導熱部。3)的相鄰兩端分別形成_第二：接 觸部（12);就均溫板（1〇)的工作特性，導熱部（13)等同於y 發區，第-、第二接觸部⑴)(12)則為相對低溫的冷凝： 各傳熱管（21)(22)主要係分別結合於均溫板（1Q)上並構 成熱接觸’另分別穿過鰭片組（30)，且亦構成熱接觸；又 各傳熱管（21)(22)分別具有一橫臂（211)(221)及兩直臂 (212)(222) ’其橫臂（211)(221)整段或部分呈扁平狀，並 M351394 =扁平狀的區段結合㈣温板⑽上且構成熱接觸，盆 結合手段的可行方式之-為錫膏焊黏。於本實施例中1 以稷數傳熱管（21)的橫臂（211)熱接觸並結合於均溫板（10) 的第-熱接觸部⑴），又以複數傳熱管（22)的橫臂（221)敎 接觸並結合於均溫板(10)上的第二熱接觸部(12)(請配合參 閱第三圖所示）； / 該鰭片組（30)係由複數作疊層排列的籍片（31)所組成 :各藉片（31)分別相對應位置上形成有穿孔，以供各傳熱 吕（21)(22)以其直臂（212)(222)貫穿並構成熱接觸（請配合 參閱第四圖所示）。 由上述說明配合圖 < 可看出，肖溫板（1〇)提供第一、 第二熱接觸部⑴叩）时別與傳辭（2彳）(22)構成熱接觸 並、σ σ在此狀況下，均溫板（1 〇)將發揮其高均溫性，將 透過導熱部（1 3)傳來的熱能快速地傳導至相對低溫的第一 第接觸# (1 1)(1 2)，又因本創作利用前述構造設計可 以採用較多數量的傳熱f (21 )(22)，使各傳熱管（21 )(22)可 由I曰片組(30)的不同部位穿過，藉以避免各傳熱管㈣ 傳入的熱能集中在鰭片組(3〇)的某—部位，可達到均勻導 政熱的目的。而前述散熱器使用時，係以均溫板。〇)的 導熱部（13)與發熱體（如中央處理器）表面構成熱接觸，因 此叙…、肢工作呀，在其表面產生的熱能將傳導至均溫板 (1〇)，再由均溫板（10)透過各傳熱管（21)(22)傳導至鰭片組 (30)，利用鰭片組（3〇)提供較大的散熱面積予以揮散，由 於本創作可提供較大數量的導熱通道，故可加速散熱而有 M351394 效提升散熱效率。 【圖式簡單說明M351394 VIII. New Description: [New Technology Field] This is a multi-channel heat pipe radiator, especially a heat pipe radiator that can increase heat dissipation by increasing heat transfer channels. [Prior Art] As the operating frequency of the computer's central processing unit is getting higher and higher, the relative enthusiasm is getting higher and higher. Therefore, the scale of the heat sink is getting larger and larger, and the requirements for heat dissipation efficiency are becoming stricter. In order to meet the former 'heat demand, people have proposed the new patent right M291559 "heat pipe heat sink". Please refer to the fifth figure, which is mainly composed of a metal base, a heat pipe group and a 'fin sheet group. (72) The composition, wherein the metal base (71) is formed with a plurality of curved passages, and the heat pipe group is composed of a plurality of heat pipes (73) respectively inserted into the arcuate passages by one of the sections. The ends of each of the plurality of "3) are respectively passed through the respective pieces of the film group (72) to form a touch. '' ~ ^^^^ The heat s type heat sink is composed of a metal base (71) and a hairpin For example, the surface of the central processing unit constitutes a thermal contact, so that the heating element is also transmitted to the fin group (72) via the metal base (71}, 埶普*'''...g (73), group (72)t plural The large heat dissipation area provided is dissipated. "The heat pipe is placed in the heat dissipation efficiency is obvious", but in the future, it will continue to raise one = the type of heat sink is in progress - the degree, the heat f type As described above, the heat pipe is dependent on the heat pipe (73) to conduct the waste heat on the metal base (71) 3 M351394 to the fin Group (72) - (d) 丄, Guan Guan (door, 曰人^ y _ ..., M73) more and more, the conduction of thermal energy = will be faster, the patent case is the section of the central section of the heat pipe (73) = is the base (arc channel on the 7D, if it is designed, because the volume of the heat pipe (73) on the metal base (9) is limited, the number of heat pipes (73) is limited, which affects the efficiency of heat dissipation. - Step up. [New content] Therefore, the main purpose of this creation is to provide a multi-channel heat pipe type heat sink, which can use more heat pipes to increase the heat transfer channel, and greatly improve the heat dissipation efficiency. The main technical means is that the heat sink comprises: a temperature equalizing plate, a long piece is formed into a hollow body, and the temperature equalizing plate has a surface and a bottom surface, and a first thermal contact portion is formed on the surface thereof. And a second thermal contact portion and a heat conducting portion are respectively formed on the bottom surface; the plurality of heat transfer tubes respectively have a cross arm and two straight arms, and the cross arm is flat, and is at least one side and the first on the temperature equalizing plate One or the second thermal contact constitutes a thermal contact a fin group is composed of a plurality of fins arranged in a stack, and each of the fresh chips is formed with a perforation at a corresponding position for the straight arms of the heat transfer tubes to penetrate and form a thermal contact; The heat pipe type heat sink design is designed by the temperature equalizing plate contacting the heat generating body with the heat conducting portion thereof, and providing a large thermal contact area, thereby forming a thermal contact with a large number of heat transfer tubes, thereby allowing more transparent The heat transfer tube quickly transfers the heat energy on the 4 M351394 board to the fin group, which greatly increases the heat dissipation efficiency. [Embodiment] A fin set shown in Fig. 2 is a preferred embodiment of the present invention. Please refer to the first, mainly consisting of a uniform temperature plate (1〇) and a plurality of heat transfer tubes (21) (22) and (30); wherein: the Vapor Chamber (i〇) It is in the form of a long piece, which is a hollow cavity (not shown) filled with a thermal superconducting medium, and 'the inner wall has a capillary structure'. When the heat is transferred from the heat source to the heat of the uniform temperature plate The guiding medium will quickly scatter to the low temperature to condense: the capillary knot in the cavity The structure is recirculated to the relative heat source, and the foregoing process is cyclically performed, which is the basic principle of the uniform temperature plate (10). The q-temperature plate has a surface and a bottom surface, wherein the segment is slightly concave, so the surface thereof A first thermal contact portion (1) is formed at the recessed position, and a bottom surface thereof is protruded from the opposite position to form a heat conducting portion (13). Further, the bottom surface of the π plate (10) is at the heat conducting portion. 3) adjacent ends are respectively formed _ second: contact portion (12); in terms of the working characteristics of the uniform temperature plate (1 〇), the heat conducting portion (13) is equivalent to the y emitting region, the first and second contact portions (1) (12) is a relatively low temperature condensation: each heat transfer tube (21) (22) is mainly bonded to the temperature equalizing plate (1Q) and constitutes a thermal contact 'furrowing through the fin group (30), respectively, and Also forming a thermal contact; each heat transfer tube (21) (22) has a cross arm (211) (221) and two straight arms (212) (222) 'the entire cross arm (211) (221) or Partially flat, and M351394 = flat section combined with (four) warm plate (10) and constitutes thermal contact, a possible way of basin bonding means - solder paste bonding. In the present embodiment, 1 is thermally contacted by the cross arm (211) of the number of heat transfer tubes (21) and coupled to the first thermal contact portion (1) of the temperature equalizing plate (10), and the plurality of heat transfer tubes (22) The cross arm (221) is in contact with and coupled to the second thermal contact portion (12) on the temperature equalizing plate (10) (please refer to the third figure); / the fin group (30) is made up of a plurality of The stacked sheets (31) are composed of: each of the borrowing sheets (31) is formed with a perforation at a corresponding position for the respective heat transfer Lu (21) (22) to pass through the straight arm (212) (222) And constitute a thermal contact (please refer to the fourth figure). It can be seen from the above description that the Schematic plate (1〇) provides the first and second thermal contact portions (1), and does not form a thermal contact with the utterance (2彳) (22), and σ σ In this case, the temperature equalizing plate (1 〇) will exert its high temperature uniformity, and the heat energy transmitted through the heat conducting portion (13) will be quickly transmitted to the relatively low temperature first contact # (1 1) (1 2 ), because the present design utilizes the aforementioned structural design, a larger number of heat transfer f (21 ) (22) can be used, so that each heat transfer tube (21) (22) can be passed through different parts of the I block group (30). In order to avoid the heat transfer of each heat transfer tube (4) concentrated in a certain part of the fin group (3〇), the purpose of uniform heat conduction can be achieved. When the aforementioned heat sink is used, it is a uniform temperature plate.导热) The heat-conducting part (13) is in thermal contact with the surface of the heating element (such as the central processing unit), so the heat generated on the surface of the heat-conducting part (13) is transmitted to the temperature equalizing plate (1〇), and then The temperature plate (10) is conducted to the fin group (30) through each heat transfer tube (21) (22), and the fin group (3〇) is provided with a large heat dissipation area to be volatilized, since the creation can provide a large number The heat conduction channel can accelerate the heat dissipation and the M351394 effect improves the heat dissipation efficiency. [Simple diagram
第一圖 第二圖 第三圖 苐四圖 第五圖 係本創作之局部分解圖。 係本創作之組合立體圖。 係本創作又一組合立體圖 係本創作之前視平面圖。 新型專利權第M291559號之立體圖 (仰視 角度 主要元件符號說明 (1〇)均溫板 (12)第二熱接觸部 (21)(22)傳熱管 (212)(222)直臂 (31)鰭片 (11)第一熱接觸部 (13)導熱部 (211)(221)橫臂 (30)鰭片組The first picture The second picture The third picture The fourth picture The fifth picture is a partial exploded view of the creation. A stereoscopic view of the combination of the creations. Another combination of stereoscopic drawings of this creation is based on the plan view. Three-dimensional diagram of the new patent No. M291559 (upward angle main component symbol description (1〇) uniform temperature plate (12) second thermal contact (21) (22) heat transfer tube (212) (222) straight arm (31) Fin (11) first thermal contact (13) heat transfer portion (211) (221) cross arm (30) fin group
(71)金屬底座 （72)鰭片組 (73)熱管(71) Metal base (72) Fin set (73) Heat pipe