TWM268652U - Heatsink plate structure of central heat accumulation type - Google Patents

Description

M268652 IV. Description of creation (1) [Technical field to which the new type belongs] This creation relates to a central heat-collecting heat sink structure, and particularly refers to a type of heat-collecting element that is prominently arranged or formed by using the end face of a heat-conducting element. The entire area corresponds to the heating end surface of the electronic component, so that the heat transfer can be concentrated and quickly dissipated. [Previous technology] A heat dissipation device that is conventionally used for attaching to electronic components and assembled on a base is shown in the first figure. The heat dissipation device 1 includes a heat conducting element 1 1 (also referred to as a heat sink). The end surface is assembled with a plurality of heat dissipation fins 14 to form a heat dissipation end, and another heat transfer transmission end surface which is opposed to the electronic component (CPU) 12 and the base 13, and has a heat transfer component with an area much larger than the surface area of the electronic component (CPU) 12 1 1. The thermal bonding is directly performed on the end surface. This kind of design will not allow the heat source to be quickly and concentratedly transferred to the heat sink 1, resulting in the disadvantage that the heat dissipation effect is not ideal. There are other patents for heat-conducting elements with different heat pipe configurations, such as the national new patent No. 24 39 1 8 before the patent. Its structure mainly includes a heat-conducting element with a bottom plate. The sides of the bottom plate respectively extend upwards with predetermined widths and heights. A groove is formed between the bottom plate and the two vertical walls, and at least one heat pipe is arranged with the bottom of the plurality of fins to straddle the groove. The two vertical walls extend outwardly with a wing portion. The central part of the bottom surface is provided with an upwardly recessed groove for directly thermally bonding and transferring a heat source with respect to an electronic component (cpu). The patented structure of the heat-conducting component disclosed in the aforementioned previous patent utilizes the groove to oppose the electronic component (CPU). Directly attach and transfer the heat source. Although the groove is thinner than the thickness of the heat-attached part of the electronic component, the groove

Page 5 M268652 IV. Creation Instructions (2) ^ ______ It is a relatively full-area cover set on the electronic component, so that the electronic component source cannot concentrate the heat transfer from the thinner part quickly, and the two sides of the generated heat groove Relative to the thermally bonded part of the electronic component, it is heated to the two sides and the heat transfer efficiency and heat dissipation efficiency still need to be improved. …, Diffusion, [new content] The main purpose of this creation is to solve the above-mentioned shortcomings. In this creation, the structure of the heat sink is redesigned, so that the age of the heat sink is eliminated. Heat transfer & rate: In order to achieve the above purpose, the structure of the central heat-dissipating heat sink of this creation includes a heat-conducting element, a structure above, a structure of the heat pipe, and a recess of the heat pipe assembly. And the groove of the heat-conducting element is provided with a heat sink or a heat source with a width smaller than or equal to that of the groove, forming a central heat-collecting transfer component. The heat is transferred to the tube; = [Embodiment]…, s is used for heat dissipation. The technical content and details of this creation are as follows: Now, please refer to the second picture with the illustration of the illustration. This creation is excited. Plate structure * lz It is composed of a central heat-collecting bulk part 22, which is used in the library, including the heat-conducting element 21, ..., the heat-generating element 3 (CPU), and the transmission function in the wood. Make the electron thermal unit 4.…, source It may be quickly transmitted to the above mentioned dispersion of the collector through the central member 2 of the thermally conductive heat radiating plate 21 of the structure

M268652 4. Creative instructions (3) ----- Made of thermally conductive material, such as highly thermally conductive metal, one end of the thermally conductive element 21 is provided with a groove 23 that can be arranged relative to the heat pipes 40 of the heat dissipation unit 4, and the groove On the other end face of 23, the body is provided with a molding-heat-collecting element L to provide a heat-concentrated central heat-collecting transfer relative to the electronic component 3 (CPU). The width of the aforementioned heat collecting element 22 is equal to or smaller than the width of the aforementioned groove 23, and is opened in cooperation with the groove 23, so that the relative position of the heat-conducting element 21 and the thickness of the recess 24 of the heat transfer element 22 relative to the heat collecting element 22 become thinner, that is, The heat collecting element 22, which is provided suddenly and has a full surface area that is thermally bonded to the heating end surface of the electronic component 3 (CPU), can be used to concentrate and quickly use the heat collecting element 22 for heat generated by the electronic component 3 (cpu) to transfer heat upward to As shown in the fourth figure, the heat pipe 40 of the heat dissipation unit 4 quickly transfers heat to each of the heat dissipation fins 41 for e-dissipation. Please refer to the third to fifth illustrations again. 'The heat sink module structure is further composed of the central heat sink plate structure of this creation. The heat sink module =' consists of a heat sink plate 2 and a heat sink unit 4, which are opposed to electronic components. 3 (cpu) The heating end face is assembled by thermal bonding. The heat-dissipating unit 4 mentioned above, as shown in the third and fourth figures, is composed of a plurality of heat pipes 40 and a plurality of heat-dissipating fins 41 arranged in series with the heat pipe. The heat pipe 40 has a curved heat-receiving end 42. In a specific embodiment, the heated end 42 further includes a flat tube wall 43, which is assembled with the groove 23 on the heat conducting element 21 of the heat dissipation plate structure 2 as shown in the fifth figure. The heat-dissipating plate 2 mentioned above utilizes the heat-conducting element 21-the groove 2 3 opened on the end surface to provide the heat-receiving ends 4 2 of the above-mentioned heat pipes 4 0, and the heat-dissipating module is shown in the third and fourth figures. The heat sink 2 is thermally bonded to the heat-generating end face of the electronic component 3 (CPU) by the heat-collecting element 2 2 and at the same time, the heat-collecting element is directly used.

M268652 3. Creation instructions (4) The width of the element 22 is less than or equal to the width of the groove 23, and the thinned heat transfer end face of the heat collecting element 22 relative to the groove 23 of the heat conducting element 21 makes the electronic component 3 produced. The heat source for heat generation is concentrated and quickly transferred to the heat pipe 40 and the heat radiating fin 41 of the heat radiating unit 4 by the heat collecting element 22 for heat radiation. As shown in the sixth figure, it is another heat dissipation module structure which is further composed of the central heat-dissipating plate structure of the new type. The heat dissipation module also includes a heat dissipation plate 2 and a heat dissipation unit 4, which are opposed to electronic components. 3 (cpu) The heating surface is assembled by thermal bonding. The heat-dissipating unit 4 mentioned above comprises at least one heat pipe 40 and two groups of several heat-dissipating fins 41. The two groups of most heat-dissipating fins 41 are connected in series to the cooling ends 44 and 45 of the two heat pipes 40 respectively. In the specific embodiment, 'system ^ is connected by a cooling end 44 or 45 as a heated end to the above-mentioned heat sink 2, as shown in the above; the original cooling end as the heated end "⑽, can be advanced: step, there is-like In the fifth picture, the flat tube wall 43 is integrated to dissipate heat. The mouth uses the heat conduction # uji21, a groove on the end face to open the history of the groove 23 κ, a total of the above-mentioned heat dissipation, and the heat and heat officer 40. The configuration was originally used as the cooling end 44 or 45 Formed by the groove 23 assembly: the body, as shown in the sixth figure, but with the heat conduction element; the other end face of the heat-collecting element 22 integrated with the electronic component 3 and heat source transmission divergence. 制 从 进 — The step is that the heat-collecting 70 pieces 22 and the heat-conducting element 21 can be formed into a single body, so that the width of the heat-collecting element 22 is less than or equal to the visibility of the heat-conducting element 21 so that the heat source generated by the electronic component 3 can be collected and used quickly. The thermal element 22 transfers heat to the heat sink and the heat sink 41

4. Heat dissipation on the creative instructions (5). Referring to the seventh figure, it is a composition structure of the central heat collector of the new type, which also includes a thermally conductive element 2 ′ and two. The structural design of the different embodiment described above includes the heat element 21 and the heat collection element 22 facing each other. Combined with the composition, the other end surface of the groove 23 opened by the component 21 is further widened or smaller than the recess 24 of the width of the foregoing groove 23 to provide j: the heat collecting elements 22 of the width of the groove 23 are assembled one another The plane 25 is thermally bonded to the electronic component 3 (cpu). The above is only a preferred embodiment of the present invention, and the scope of the new implementation is as follows. That is to say, in accordance with the application of this new model ^ /, 4 decoration, white is covered by the scope of the new model patent. The structure of the heat-dissipating plate and a heat-collecting element 22 'are mainly provided in the guide, that is, the heat-conducting element is provided with a body equal to or equal to the body, and can be used by the central heat-collection transfer to limit the equality of the work done. Variable M268652 Simple Description [Schematic Illustration] The first figure is a structural diagram of a conventional heat sink. The second figure is a three-dimensional structure diagram of a specific embodiment of the structure of the novel heat sink. The third figure is an exploded perspective view of the structure of an embodiment of a heat sink module of the novel heat sink structure. The fourth figure is a cross-sectional view of an embodiment of a heat sink module of the novel heat sink structure. The fifth figure is another cross-sectional view of a combination of an embodiment of a heat sink module of the novel heat sink structure. The sixth figure is a combined cross-sectional view of another embodiment of the heat sink module of the novel heat sink structure. The seventh figure is an exploded view of a specific embodiment of the structure of the novel heat sink. [Description of Symbols of Main Components] The symbols of the main components of this creation are: 2--heat sink 3--electronic components 4--heat dissipation unit 21-heat conducting element 22-heat collecting element 23-groove 24-recess 25-plane 31-one base Seat 40 — Number tube 41 — Radiating fin 42 — Donated end 43 — Flat tube wall 44 &45; 45 — Symbols for the main components of cooling: 1--Heat sink 11-Guiding element 12-Electronic component 13-Base

Page 10 M268652

Page 11

Claims (1)

M268652 5. Scope of patent application 1. A central heat-collecting heat sink structure, the structure includes: a heat-conducting element, a groove is formed on an upper end surface thereof, and a recess is formed corresponding to the other end surface of the groove; a width smaller than the above The concave part and the heat collecting element assembled with the concave part; the heat dissipation element and the heat collecting element are used to form a heat sink plate module, and the phase is used as the heating end face of the electronic component to form a central heat collecting heat source for rapid transmission and dissipation. 2. A central heat-collecting heat sink structure, the structure includes: a heat-conducting element, a groove is formed on an upper end surface thereof, and a concave portion is formed corresponding to the other end surface of the groove; The heat collecting element is connected; the heat dissipation element and the heat collecting element are used to form a heat sink plate module, and the phase is used as the heating end surface of the electronic component to form a central heat collecting heat source for rapid transmission and dissipation. 3. A central heat-collecting heat-dissipating plate structure, which includes: a heat-conducting element having a groove on an upper end surface thereof; a heat-dissipating element disposed on the other end surface of the groove of the heat-conducting element, and having a width equal to the collection of the grooves Thermal element: The above-mentioned heat-conducting element and heat-collecting element are used to form a heat-dissipating plate module, and the phase is used as the heat-generating end-face of the electronic component to form a central heat-collecting heat source for rapid transmission and divergence. 4. A central heat-collecting heat sink structure, which includes: a heat-conducting element having a groove on an upper end surface thereof; a groove disposed on the other end surface of the groove of the heat-conducting element and having a small width Page 12 M268652 5. The heat-collecting element whose patent scope is in the above-mentioned groove; The heat-dissipating element and heat-collecting element mentioned above are used to form a heat sink module, and the phase _ is used as the heating end surface of the electronic component to form a central heat-collecting heat source. Fast delivery divergence. 5. A central heat-collecting heat dissipation module structure, the structure includes: a heat dissipation plate having a heat conducting element thereon, one end face of the heat conducting element has a groove, and the other end face of the groove is provided with a width equal to A heat collecting element with a groove width; a heat dissipating unit comprising at least one heat pipe and a plurality of heat dissipating fins; the heat pipe is assembled with the groove of the heat conducting element. 6. The central heat-collecting heat sink structure described in item 5 of the scope of the patent application, wherein the heat pipe further includes a heat receiving end and a groove assembly of the heat conducting element. 7. A central heat-collecting heat-dissipating module structure, the structure includes: a heat-dissipating plate having a heat-conducting element thereon, one end surface of the heat-conducting element has a groove, and the other end of the groove is provided with a width A heat collecting element smaller than the width of the groove; a heat dissipating unit comprising at least one heat pipe and a plurality of heat dissipating fins; the heat pipe is assembled with the groove of the heat conducting element. Page 13