201124827 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種緊配結合的散熱模組設計，其特別 是適合筆記型電腦配置使用，為使導熱基座、導熱管與散 熱鰭片組，或包含附設的散熱風扇均可快速且穩固的完成 緊配結合。 【先前技術】 ' 習知筆記型電腦所使用的中央處理單元（CPU)或南北 售橋晶片或顯示晶片等電子元件，在運轉工作均會發出高熱 ，故必須匹配散熱模組或再附設結合散熱風扇以提供散熱 ’藉此確保其能穩定運作。 上述習知散熱模組，通常包含：導熱基座、導熱管及 散熱鰭片組或再附設結合散熱風扇，其主要是在導熱基座 開设一凹槽（或通孔），並將導熱管吸熱端嵌入（或貫穿）凹 槽（或通孔），再使導熱管的散熱端焊接或貫穿結合於散熱 鰭片組，前述習知散熱模組，導熱基座皆為一具有厚度的 ^形塊體’具有的體積重量，且該導熱基座的凹槽（ -或通孔），其槽面（或孔壁）的内面皆呈平滑狀，而導熱管 外，面亦為相對平滑狀，因此，導熱管吸熱端與導熱基座 1結合穩定性尚非理想，以致導熱管吸熱端常會發生位移 ’並造成接财良，亦無法將元件熱溫有效的傳遞至 散熱韓片組，故整體組成容易導致不良品或發生傳遞效能 不佳等情形。 【發明内容】 201124827 本發明之主要目的，乃在於提供一種緊配結合的散熱 模組設計，係包括一個以上的薄片型導熱基座、一個以上 的導熱管及一散熱鰭片組，該導熱基座係採薄片成型，以 供簡易形成一可容納導熱管吸熱端的凹槽，其不僅可縮簡 導熱基座的體積重量，亦具有容易成型及成本更低廉等優 點，且該薄片型導熱基座的凹槽於内面並設有卡止凸部， 使導熱官吸熱端於平貼嵌入後可與該卡止凸部形成相對匹 配變形的穩固卡合，因此能有效防止導熱管吸熱端與導熱 基座的凹槽發生位移鬆動，可獲良好接觸，且確保元件熱 溫有效傳遞至散熱鰭片組，提高整體散熱模組的組成良率 0 本發明之次要目的，乃在於提供一種緊配結合的散熱 模組设计，其中，該薄片型導熱基座凹槽内面的卡止凸部 ，其實施形態係包含但不限於可為規則狀或不規則狀的長 條狀卡止凸部，或可為規則狀或不規則狀且不連續的長條 狀卡止凸部，或亦可實施為規則狀或不規則狀分佈的複數 個凸點狀卡止凸部，使導熱管吸熱端於嵌入後均可獲得相 對的匹配變形，以形成穩固的卡止結合。 本發明之又一目的，乃在於提供一種緊配結合的散熱 模組設計’其中，該散熱鰭片組係由複數個鰭片呈相鄰排 列組合’各片於相同位置均開設_切槽，使複數個相鄰 =槽對應構成-鼓槽，並於散熱風扇的固定片出風口位置 没有一彎折片，使該彎折片係可整片嵌入散熱鰭片組的嵌 槽’以達到快速扣接結合’使散熱風扇亦能穩固扣合於散 熱模組，用以簡化散熱模組與散熱風扇的整體組合。 201124827 模組:二提供-種緊配結合的散熱 rr，_==== ==而加強散熱風扇與細片組的穩固結合： 絲鎖合而其固定依附顺 本發明之另一 模組設計，其中， 熱基座，利用單一 座的元件熱溫。201124827 VI. Description of the Invention: [Technical Field] The present invention relates to a tightly coupled heat dissipation module design, which is particularly suitable for notebook computer configuration, in order to make a heat conductive base, a heat pipe and a heat sink fin set , or with an attached cooling fan, can be quickly and firmly completed. [Prior Art] 'The central processing unit (CPU) used in the notebook computer or the electronic components such as the north-south bridge chip or the display chip will generate high heat during operation, so it must be matched with the heat dissipation module or combined with heat dissipation. The fan provides heat dissipation to ensure stable operation. The conventional heat dissipation module generally includes: a heat conducting base, a heat conducting tube and a heat dissipating fin set or a combined heat dissipating fan, which mainly defines a groove (or a through hole) in the heat conducting base, and the heat pipe is The heat-absorbing end is embedded (or penetrates) into the groove (or through hole), and then the heat-dissipating end of the heat-conducting tube is welded or penetrated to the heat-dissipating fin set. The conventional heat-dissipating module has a thickness of a heat-dissipating base. The block body has a volumetric weight, and the groove (or through hole) of the heat conducting base has a smooth inner surface of the groove surface (or the hole wall), and the outer surface of the heat pipe is relatively smooth. Therefore, the stability of the heat-absorbing tube heat-absorbing end and the heat-conducting base 1 is not ideal, so that the heat-absorbing tube heat-absorbing end often shifts and causes good money, and the component heat temperature can not be effectively transmitted to the heat-dissipating Korean group, so the whole The composition is liable to cause defective products or poor transfer performance. SUMMARY OF THE INVENTION The main purpose of the present invention is to provide a heat-dissipating module design that is tightly coupled, including more than one thin-plate heat-conductive base, one or more heat-conducting tubes, and a heat-dissipating fin set. The pedestal is formed by a sheet for simply forming a groove for accommodating the heat absorbing end of the heat pipe, which not only can reduce the volume and weight of the heat conductive base, but also has the advantages of easy molding and lower cost, and the sheet type heat conductive base The groove is on the inner surface and is provided with a locking protrusion, so that the heat-dissipating end of the heat-conducting member can be stably engaged with the locking protrusion after being embedded in the flat surface, thereby effectively preventing the heat-absorbing end and the heat-radiating base of the heat-transfer tube. The groove of the seat is loosely displaced, and good contact is obtained, and the heat temperature of the component is effectively transmitted to the heat dissipation fin group to improve the composition yield of the overall heat dissipation module. The second objective of the present invention is to provide a tight fit. The heat dissipation module design, wherein the locking protrusion on the inner surface of the sheet-type heat-conducting base groove includes, but is not limited to, a regular shape or an irregular shape. The long strip-shaped locking protrusions may be regular or irregular and discontinuous long-shaped locking protrusions, or may be implemented as a plurality of bump-shaped lockings distributed in a regular or irregular shape. The convex portion enables the opposite end of the heat absorbing end of the heat pipe to be relatively matched to form a stable locking bond. Another object of the present invention is to provide a heat-dissipating module design in which a heat-dissipating fin assembly is formed by arranging adjacent fins in a plurality of fins. The plurality of adjacent slots are configured to form a drum groove, and there is no bent piece at the air outlet of the fixing piece of the heat dissipation fan, so that the bending piece can be completely embedded in the groove of the heat dissipation fin group to achieve fast The combination of the buckles enables the cooling fan to be securely fastened to the heat dissipation module to simplify the overall combination of the heat dissipation module and the cooling fan. 201124827 Module: Two provides a kind of tightly coupled heat dissipation rr, _==== == and strengthens the stable combination of the cooling fan and the fine film group: the wire locks and the fixed attachment to the other module design of the invention , wherein the hot base is heated by a single component.
目的’乃在於提供一種緊配結合的散熱 «玄導熱管係可通過一個以上的薄片型導 導熱官同時傳遞一個以上薄片型導熱基 本發明之另-目的，乃在於提供—種緊配結合的散軌 模：設計，ί中’該薄片型導熱基座係設有一個以上可； 内導熱官吸熱端的凹槽，用以相對應於複數個導熱管 问時嵌入，均可匹配變形而穩固結合。 模二ίίΓ 乃在於提供一種緊配結合的散熱The purpose of the invention is to provide a tightly coupled heat dissipation. The mysterious heat transfer tube system can transmit more than one sheet-type heat conduction basic invention through more than one sheet-type conductive heat conductor. Rail mode: design, ί中' The thin-film heat-conducting base is provided with more than one; the groove of the inner heat-conducting heat-absorbing end is used for embedding corresponding to a plurality of heat-transfer pipes, and can be matched and deformed to be firmly combined. Modal ίίΓ is to provide a tightly coupled heat sink
其中’所㈣片型導熱基座係可呈不規則面的 狀，Λ於凹槽的相料—表面，可嵌插結合附屬散Among them, the (four) sheet type heat-conducting base can be in the shape of an irregular surface, which is placed on the surface-surface of the groove, and can be inserted and combined with the auxiliary
Li $在縣面成型设有複數個散熱凸粒，使薄片型 導熱基座亦具有較佳的自體散熱效果。 【實施方式】 目的 兹依附圖實施例將本發明結構特徵及其他作用 詳細說明如下： 如第-、二圖所示，係本發明所為「緊配結合的散熱 2的第—實施例，其係、包括：—薄片型導熱基座1、 一導熱管2及一散熱鰭片組3，兑中. 201124827 薄片型導熱基座1，係採薄片成型，以供簡易形成一 可匹配容納導熱管2吸熱端21的凹槽11(如第二圖），凹槽 11的内面並設有一個以上的卡止凸部丨丨i，如圖所示係實施 為複數個長條狀卡止凸部1 1 1 ; 導熱管2，其具有一吸熱端21及一散熱端22,該吸熱 端21係平貼嵌入導熱基座^的凹槽u，並與卡止凸部^ 形成相對匹配變形的穩固卡合（如第三圖），而另一散熱端 22則結合於散熱鰭片組3，如實施圖所示，散熱端22係呈 緊配貫穿而結合於散熱鰭片組3丨 ' 散熱鰭片組3 ,係由複數個鰭片31相鄰排列組合，並 與導熱管2的散熱端22形成結合； 依上述薄片型導熱基座丄、導熱管2及散熱鰭片組3 組成的散熱模組，各構件均為整體緊配結合，該導熱基座 1具有薄片成型特徵，故不僅可縮簡導熱基座i的體積重 量，且具有容易成型製造及成本更低廉等優點，特別是導 熱管2的吸熱端21與導熱基座1的凹槽丨丨可呈匹配變形， 因此獲得穩固的卡合固定，使吸熱端21與凹槽丨丨絕不會發 生位移鬆動，從而令導熱管2的吸熱端21與發熱元件（如 中央處理單元或南北橋晶片或顯示晶片等電子元件）具有 良好的接觸，確保元件的熱溫可完全傳遞至散熱鰭片組3 ，以提高整體散熱模組的組成良率。 上述薄片型導熱基座1’其係可通過沖壓成型或壓鑄 成型等各種手段而形成所述的凹槽U及卡止凸部1U。 上述薄片型導熱基座1的凹槽11，所述設於内面的卡 止凸部111，其實施形態係包含但不限於可為規則狀或不規 201124827 則狀的長條狀（如第二圖為規則狀的長條狀卡止凸部ηι) ’或亦可實施為朗狀或不規職且不連續的長條狀卡止 凸部（如第四圖為規則狀且不連續的長條狀卡止凸部1Ua) ，或亦可實施為規則狀或不規則狀分佈的複數個凸點狀卡 ^凸部lllb(如第五圖），其目的均在於使導熱管2的吸熱 端21嵌入後可獲匹配變形，並形成穩固的卡止結合。 如第八、七圖所示，係本發明的第二實施例，其係於 〜散熱鯖片組3再結合-組散熱風扇4，其中，所述散熱韓 .鲁片組3係於各鰭片31的相同位置均開設一切槽3n，使複數 •個，鄰切槽3U可對應構成一嵌槽·，並在散熱風扇4的 固定片41出風口位置設有一彎折片411，利用彎折片々η可 f片嵌人而扣設於散熱鰭片組3的嵌槽卿，使散熱風扇4 能快速的扣接結合於冑熱模組3，簡化散熱模組與散熱風 扇4的整體組合。又前述的彎折片411，其係可在末端形成 一倒勾部412’且所述切槽311亦於相對末端設有倒勾槽312 ，因此使嵌槽300亦具有相對的倒勾凹槽，而於彎折片4ιι φ嵌=嵌槽300後立即形成嵌扣結合，故能防止散熱風扇4的 固定片41發生上下鬆動或脫出嵌槽3〇〇的情形。 如上述散熱風扇4的固定片41，並於兩側分別設有連 接耳片42，將兩侧連接耳片42固定依附於散熱鰭片組3的 兩邊側，故能加強散熱風扇4與散熱鰭片組3的穩固結合 ，防止固定片41發生左右鬆動。至於連接耳片42所欲達到 固定依附的目的，其係可通過螺絲鎖合或以鉚釘鉚合等各 種手段而達成。 σ 如第八、九圖所示，係本發明的第三實施例，其係包 201124827 含兩個薄片型導熱基座la、lb、兩個導熱管2a、2b、 一散熱續片組3 ’並結合一組散熱風扇4，其中的第一薄 片型導熱基座1 a係設有一個以上可匹配通過或容納導熱 官2a、2b的凹槽π，並相對匹配嵌入導熱管2a、2b， 而第二薄片型導熱基座1 b係呈不規則面的形狀，第一導熱 皆2a係依序通過兩個薄片型導熱基座la、lb，能同時傳 ，兩個薄片型導熱基座la、lb的元件熱溫，而第二導熱 管2 b則僅通過第二薄片型導熱基座i b，且兩個導熱管 、2b的散熱端22a、22b均結合於散熱鰭片組3，該散熱鰭 片組3則再結合一組散熱風扇4。 同理，如第十圖所示，為本發明的第四實施例，其係 大致相同於上述第三實施例，但省略了散熱風扇裝置。 如第十一、十一圖所示，係本發明的第五實施例，其 係包含兩個不規則面形狀的薄片型導熱基座1(；、ld、三 個導熱管2a、2b、2c及-散熱鰭片組3，其結構特徵係 相同於前述實施例，但其中的薄片型導熱基座le、ld， 除了呈現不㈣面的延伸形狀外’並於薄片型導熱基座lc 的相對另表φ 12e(如第十二圖），再後插結合附屬散熱鰭 片13c使薄片型導熱基座丄c可具有較佳的自體散熱效果 如第十三、十四圖所示，係本發明的第六實施例，其 係大致相同於上述第五實施例’但針對其中的薄片型導熱 基座le略施改變，主要是在該薄片型導熱基座^的相對 另表面12e(如第十四圖）成型設有複數個散熱凸粒 ’因此使薄片型導熱基座le具有較佳的自體散熱效果。 201124827 於上述各種實施例中，所述的薄片型導熱基座丄、ia 、lb、lc、Id或le’均另附設—組腳座5，用以搭配 鎖固於電路板上，惟腳座5係習知元件，不另贅述。 前述的導熱管2、2a、2b或2c，亦為習知元件，而 其管體通常是採用銅金屬所製成，材質相對較軟，故可輕 易的平貼嵌人凹槽1卜並與卡止凸部⑴、llu或⑽職 匹配變形的卡止結合，確保導熱f 2、2a、2b^c與薄 片型導熱基座l、la、lb、lc、1da^i 丁乂々 1 或le不會發生位移Li $ is formed in the county surface with a plurality of heat-dissipating bumps, so that the thin-film heat-conducting base also has a better self-heating effect. [Embodiment] The structural features and other functions of the present invention will be described in detail below with reference to the accompanying drawings. As shown in the first and second figures, the present invention is a "close-coupled heat sink 2" embodiment. The method includes: a thin-plate heat-conductive base 1, a heat-transfer tube 2 and a heat-dissipating fin set 3, which is redeemed. 201124827 The thin-film heat-conductive base 1 is formed by thin-film forming for easy formation of a matching heat-receiving tube 2 The groove 11 of the heat absorbing end 21 (as shown in the second figure), the inner surface of the groove 11 is provided with one or more locking protrusions 丨丨i, which are implemented as a plurality of elongated strip-shaped convex portions 1 as shown in the drawing. 1 1 ; The heat pipe 2 has a heat absorbing end 21 and a heat radiating end 22, and the heat absorbing end 21 is flatly embedded in the groove u of the heat conducting base ^, and forms a stable matching deformation with the locking protrusion ^ The other heat-dissipating end 22 is coupled to the heat-dissipating fin group 3, and as shown in the embodiment, the heat-dissipating end 22 is tightly coupled to the heat-dissipating fin group 3'' Group 3 is formed by combining a plurality of fins 31 adjacent to each other and forming a combination with the heat dissipation end 22 of the heat pipe 2; The heat-dissipating module composed of the thin-film heat-conducting base 丄, the heat-conducting tube 2 and the heat-dissipating fin set 3, the components are integrally tightly coupled, and the heat-conductive pedestal 1 has a sheet forming feature, so that the heat-conductive pedestal can be reduced The volumetric weight of i has the advantages of easy molding and low cost, and in particular, the heat absorbing end 21 of the heat pipe 2 and the groove 丨丨 of the heat conducting base 1 can be matched and deformed, thereby obtaining a stable snap fixing. The endothermic end 21 and the groove 丨丨 will never be displaced loosely, so that the heat absorbing end 21 of the heat transfer tube 2 has good contact with the heat generating component (such as a central processing unit or an electronic component such as a north-south bridge wafer or a display wafer), and the component is ensured. The thermal temperature can be completely transmitted to the heat dissipation fin group 3 to improve the composition yield of the overall heat dissipation module. The above-mentioned sheet type heat conduction base 1' can be formed by various means such as press forming or die casting molding. The groove U and the locking protrusion 1U. The groove 11 of the sheet-type heat-conducting base 1 and the locking protrusion 111 provided on the inner surface include, but are not limited to, regular or irregular 201124827 a long strip shape (as shown in the second figure is a regular strip-shaped locking protrusion ηι) or may be implemented as a long or irregular and non-continuous strip-shaped locking protrusion (such as The four figures are regular and discontinuous long strip-shaped locking protrusions 1Ua), or may be implemented as a plurality of convex-like card-shaped convex portions 111b (as shown in FIG. 5) distributed in a regular or irregular shape. The purpose is to make the heat-absorbing end 21 of the heat-conducting tube 2 to be matched and deformed, and to form a stable locking bond. As shown in the eighth and seventh figures, the second embodiment of the present invention is tied to the heat sink. The chip group 3 is further combined with the group of heat dissipating fans 4, wherein the heat dissipating Han Lu piece group 3 is provided with all the grooves 3n at the same positions of the fins 31, so that the plural number and the adjacent groove 3U can be correspondingly formed. a slotted piece 411 is disposed at a position of the air outlet of the fixing piece 41 of the heat dissipation fan 4, and the bent piece 411 can be embedded in the heat sink fin group 3 by using the bent piece 々η. The fan 4 can be quickly fastened and coupled to the heat-receiving module 3, simplifying the overall combination of the heat-dissipating module and the cooling fan 4. The above-mentioned bent piece 411 is formed with a barb portion 412' at the end, and the slit 311 is also provided with an undercut groove 312 at the opposite end, so that the groove 300 also has an opposite barb groove. On the other hand, when the bent piece 4 ι φ is inserted into the groove 300, the snap-fit combination is formed, so that the fixing piece 41 of the heat-dissipating fan 4 can be prevented from being loosened up and down or the groove 3 is removed. For example, the fixing piece 41 of the cooling fan 4 is provided with connecting ears 42 on both sides, and the two connecting tabs 42 are fixedly attached to the two sides of the heat dissipating fin group 3, so that the cooling fan 4 and the heat dissipating fin can be strengthened. The stable combination of the sheet group 3 prevents the fixing piece 41 from being loosened left and right. As for the purpose of attaching the tab 42 to a fixed attachment, it can be achieved by various means such as screwing or riveting. σ, as shown in the eighth and ninth figures, is a third embodiment of the present invention, the package 201124827 includes two thin-plate type heat-conducting bases la, lb, two heat-conducting tubes 2a, 2b, and a heat-dissipating group 3' And a set of heat dissipating fans 4, wherein the first sheet-type heat-conducting base 1a is provided with more than one groove π which can match or accommodate the heat-conducting members 2a, 2b, and is matched with the embedded heat-conducting tubes 2a, 2b, and The second sheet-type heat-conducting base 1 b is in the shape of an irregular surface, and the first heat-conducting 2a is sequentially passed through two sheet-type heat-conducting bases la, lb, which can be simultaneously transmitted, and two sheet-type heat-conducting bases la, The components of the lb are heated to a temperature, and the second heat pipe 2b is only passed through the second sheet-type heat-conducting base ib, and the heat-dissipating ends 22a, 22b of the two heat-conducting tubes 2b are combined with the heat-dissipating fin group 3, the heat-dissipating fin The chip set 3 is combined with a set of cooling fans 4. Similarly, as shown in the tenth embodiment, the fourth embodiment of the present invention is substantially the same as the above-described third embodiment, but the heat dissipating fan device is omitted. As shown in the eleventh and eleventh figures, the fifth embodiment of the present invention comprises two sheet-shaped heat-conductive pedestals 1 having irregular surface shapes (;, ld, three heat-conducting tubes 2a, 2b, 2c And the heat-dissipating fin group 3 has the same structural features as the foregoing embodiment, but the sheet-type heat-conducting pedestals le, ld, except for the extended shape of the (four-sided) surface, are opposite to the sheet-type heat-conductive pedestal lc In addition, φ 12e (such as the twelfth figure), and then inserting and attaching the auxiliary heat dissipation fins 13c, the sheet type heat conduction base 丄c can have better self-heat dissipation effect, as shown in the thirteenth and fourteenth figures. A sixth embodiment of the present invention is substantially the same as the fifth embodiment described above, but with a slight change to the sheet-type thermally conductive pedestal in which the opposite surface 12e of the sheet-type thermally conductive pedestal is Figure 14) Forming a plurality of heat-dissipating bumps' so that the sheet-type heat-conducting pedestal has a better self-heating effect. 201124827 In the above various embodiments, the sheet-type heat-conductive pedestal 丄, ia , lb, lc, Id or le' are attached separately - set foot 5 for locking On the circuit board, the foot 5 is a conventional component, and will not be further described. The above-mentioned heat pipe 2, 2a, 2b or 2c is also a conventional component, and the pipe body is usually made of copper metal. It is relatively soft, so it can be easily flattened into the recessed groove 1 and combined with the locking deformation of the locking protrusion (1), llu or (10) to ensure the heat conduction f 2, 2a, 2b ^ c and the sheet type heat conduction base Block l, la, lb, lc, 1da^i Ding 乂々 1 or le will not be displaced
鬆動，緊配效果更佳。 上述各種實施例’僅揭示說明本案的主要技術特徵 並非用以限定本案技術範圍，其他實施組合或等效改變， 當然仍不脫本案主要技術範疇，始謂合理。 综上所述’本發明所為 整體結構特徵及手段運用， 故符合新穎性與進步性要件 予審查並賜准專利為禱。 緊配結合的散熱模組設計，其 已明顯不同於習知散熱模組， ’謹此依法提出申請，敬祈詳 201124827 【圖式簡單說明】 第一圖為本發明第一實施例的組合立體圖。 第二圖為第一圖呈局部分解狀態的立體圖。 第二圖為本發明導熱管平貼嵌入導熱基座凹槽而呈匹 配變形狀態的結合示意圖。 第四圖為本發明於導熱基座凹槽設有呈規則狀但不連 續的長條狀卡止凸部之示意圖。 第五圖為本發明於導熱基座凹槽設有複數個呈巴點狀 卡止凸部的示意圖。 第〃、圖為本發明中增加一組散熱風扇的第二實施例組 合立體圖。 第七圖為第六圖呈局部分解狀態的立體圖。 第八圖為本發明第三實施例的組合立體圖。 ^九圖為第八圖呈局部分解狀態的立體圖。 苐十圖為本發明第四實施例的組合立體圖。 第十一圖為本發明第五實施例的組合立體圖。 第十=圖為第十一圖呈倒置狀態的示意圖。 第十三圖為本發明第六實施例的組合立體圖。 第十四圖為第十三圖呈倒置狀態的示意圖。 201124827 【主要元件符號說明】 薄片型導熱基座 1、 la、lb、lc、Id、le 2、 2a、2b、2c 導熱管 3 散熱鰭片組 4 散熱風扇 5 腳座 11 凹槽 111、111a、111b 卡止凸部 12c、12e 表面 121e 散熱凸粒 13c 附屬散熱鰭片 21、21a、21b 吸熱端 22 散熱端 31 鰭片 311 切槽 300 嵌槽 41 固定片 411彎折片 42 連接耳片 412 倒勾部 312 倒勾槽Loose, tight fit effect is better. The various embodiments described above merely disclose the main technical features of the present invention and are not intended to limit the technical scope of the present invention. Other implementation combinations or equivalent changes, of course, do not depart from the main technical scope of the present invention. In summary, the present invention is used for the overall structural features and means, so that the novelty and progressiveness requirements are reviewed and patented as a prayer. The design of the heat-dissipating module with tight fit is obviously different from the conventional heat-dissipating module. 'Please apply in accordance with the law, please pray 201124827. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a combined perspective view of the first embodiment of the present invention. . The second figure is a perspective view of the first figure in a partially exploded state. The second figure is a combined schematic view of the heat-conducting tube of the present invention being flatly embedded in the groove of the heat-conducting base to be in a deformed state. The fourth figure is a schematic view of the present invention in which a regular but discontinuous elongated locking projection is provided in the groove of the thermally conductive base. The fifth figure is a schematic view of the present invention in which a plurality of bar-shaped locking projections are provided in the groove of the heat-conducting base. The third embodiment is a perspective view of a second embodiment in which a group of cooling fans is added to the present invention. The seventh figure is a perspective view of the sixth figure in a partially exploded state. The eighth figure is a combined perspective view of a third embodiment of the present invention. ^ Nine diagram is a perspective view of the eighth diagram in a partially exploded state. Figure 10 is a combined perspective view of a fourth embodiment of the present invention. The eleventh diagram is a combined perspective view of a fifth embodiment of the present invention. Tenth = the figure is a schematic diagram of the eleventh figure in an inverted state. Figure 13 is a combined perspective view of a sixth embodiment of the present invention. Figure 14 is a schematic view showing the inverted state of the thirteenth image. 201124827 [Description of main component symbols] Thin-film thermal base 1, la, lb, lc, Id, le 2, 2a, 2b, 2c Heat pipe 3 Heat sink fins 4 Cooling fan 5 Foot 11 Grooves 111, 111a, 111b locking projections 12c, 12e surface 121e heat dissipation projection 13c auxiliary heat dissipation fins 21, 21a, 21b heat absorption end 22 heat dissipation end 31 fin 311 slot 300 recess 41 fixing piece 411 bending piece 42 connecting ear piece 412 Hook portion 312 barb groove