CN106455452B - Single plate radiator and communication equipment - Google Patents
Single plate radiator and communication equipment Download PDFInfo
- Publication number
- CN106455452B CN106455452B CN201611066927.0A CN201611066927A CN106455452B CN 106455452 B CN106455452 B CN 106455452B CN 201611066927 A CN201611066927 A CN 201611066927A CN 106455452 B CN106455452 B CN 106455452B
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- China
- Prior art keywords
- substrate
- cover board
- single plate
- exchanging segment
- veneer
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Domestic Hot-Water Supply Systems And Details Of Heating Systems (AREA)
Abstract
The application discloses a kind of single plate radiator, for the veneer heat dissipation for communication equipment, comprising: cover board, the cover board are at least partly shell of the communication equipment；Radiating fin；Substrate, including the first side being oppositely arranged and second side, first side is oppositely arranged with the cover board, the radiating fin is set between first side and the cover board, described second side is located at side of the substrate far from the cover board, described second side is used to connect the heater element on the veneer, and the substrate is fixedly installed to the cover board；And heat pipe, the heat pipe section connect the cover board, partially connect the substrate.The good heat dissipation effect of herein described single plate radiator.A kind of communication equipment is also disclosed in the application.
Description
Technical field
This application involves veneer technical field of heat dissipation more particularly to a kind of single plate radiators and a kind of communication equipment.
Background technique
In the thermal design of electronic equipment, the veneer of many big power consumptions is often related to, and in general, these big function
This some biggish chip of heat consumption is laid out on the veneer of consumption, the heat dissipation of the biggish chip of these heat consumptions then becomes the bottle of veneer heat dissipation
Neck.And existing veneer heat-sinking capability, by limited space, heat sink size not can increase, and radiator heat-dissipation ability is caused to be difficult to mention
It rises, heat dissipation effect is poor.
Summary of the invention
The embodiment of the present application technical problem to be solved is to provide a kind of single plate radiator of good heat dissipation effect.
In addition, the embodiment of the present application also provides a kind of communication equipment using the single plate radiator.
To achieve the goals above, the application embodiment adopts the following technical scheme that
In a first aspect, the embodiment of the present application provides a kind of single plate radiator, for the veneer heat dissipation for communication equipment, packet
It includes:
Cover board, the cover board are at least partly shell of the communication equipment；
Radiating fin；
Substrate, including the first side being oppositely arranged and second side, first side is oppositely arranged with the cover board, described to dissipate
Hot fin is set between first side and the cover board, and described second side is located at side of the substrate far from the cover board,
Described second side is used to connect the heater element on the veneer, and the substrate is fixedly installed to the cover board；And
Heat pipe, the heat pipe section connect the cover board, partially connect the substrate.
In the present embodiment, since described second side of the substrate connects the heater element, the heat pipe section connects
It connects the cover board, partially connect the substrate, therefore the heat that the heater element issues can pass through the substrate and the heat
Pipe is transferred to the cover board, to be radiated by the cover board.Since the cover board is at least partly outer of the communication equipment
Shell, therefore the single plate radiator does not need to increase additional structure on the communication equipment, but can directly by
At least partly shell of the communication equipment radiates, and in the case where being not take up redundant space, increases heat dissipation area, mentions
High radiating efficiency.In short, the single plate radiator had both saved the space of the communication equipment, it may have good heat dissipation effect
Fruit.
The radiating fin is located between first side and the cover board of the substrate, therefore the heat on the substrate
Amount can pass to the radiating fin by first side, to be distributed by the radiating fin.So the list
Plate radiator can be radiated by the cover board and the radiating fin simultaneously, good heat dissipation effect.Since the substrate is fixed
Installation to the cover board, the radiating fin is set between first side and the cover board, therefore is dissipated installing the veneer
When hot device, disposably, conveniently and efficiently the single plate radiator can be installed to the veneer.
Optionally, chill bar or coated with thermally conductive silicone grease are added between described second side and the heater element, for subtracting
Interface resistance between the small substrate and the heater element.
Optionally, the extending direction of the radiating fin is perpendicular or parallel to the substrate.
In one embodiment, the heat pipe includes first part, and the first part includes sequentially connected first
Heat exchanging segment, the first linkage section and the second heat exchanging segment, first heat exchanging segment at least partly contact the cover board, and described second changes
Hot arc at least partly contacts the substrate.
The first part of the heat pipe is connected directly between the cover board and the substrate, can be rapidly by institute
The heat transfer on substrate is stated to the cover board, to radiate.First heat exchanging segment at least partly contacts the cover board,
Namely first heat exchanging segment and the cover board keep certain heat exchange area, for guaranteeing that the first part can quickly and institute
State cover board heat exchange.Second heat exchanging segment at least partly contacts the substrate namely second heat exchanging segment and the substrate is protected
Certain heat exchange area is held, for guaranteeing that the second part can quickly exchange heat with the substrate.
Optionally, the extending direction of first heat exchanging segment is different from the extending direction of second heat exchanging segment, and described
One linkage section is twist section or bending segment, for being smoothly connected first heat exchanging segment and second heat exchanging segment, so that
The layout of first heat exchanging segment and second heat exchanging segment can be more flexible, can according to the heater element position into
The specific arrangement of row, has saved the occupied space of the single plate radiator.
In one embodiment, first heat exchanging segment contacts the cover board that is partially submerged into of the cover board, and described
What two heat exchanging segments contacted the substrate is partially submerged into the substrate.
First heat exchanging segment is connect by the way of insertion with the cover board, can both be saved space, can also be ensured institute
That states the first heat exchanging segment and the cover board has enough heat exchange areas, to make changing for first heat exchanging segment and the cover board
Thermal effect is good.Second heat exchanging segment is connect by the way of insertion with the substrate, can both be saved space, can also be ensured institute
That states the second heat exchanging segment and the substrate has enough heat exchange areas, to make changing for second heat exchanging segment and the substrate
Thermal effect is good.
In one embodiment, the first heat exchanging segment fitting contacts the cover board.The second heat exchanging segment fitting connects
Touch the substrate.
In one embodiment, second heat exchanging segment is located at described second side of the substrate, described for contacting
Heater element then passes through described the so that the heat that the heater element issues can be transferred directly to second heat exchanging segment
One linkage section, first heat exchanging segment are transferred to the cover board and radiate, and radiating efficiency is high.
In one embodiment, second heat exchanging segment is embedded in the middle part of the substrate.
In one embodiment, second heat exchanging segment is located at first side of the substrate, described for contacting
Radiating fin, so that the heat in second heat exchanging segment can also be radiated by the radiating fin.
In one embodiment, the single plate radiator further includes auxiliary heat dissipation fin, and the auxiliary heat dissipation fin is set
Be placed in the cover board towards the substrate side and be spaced each other with the radiating fin.
The heater element as described in the radiating fin face, the auxiliary heat dissipation fin and the radiating fin are to each other
Every, therefore the auxiliary heat dissipation fin avoids the heater element on the veneer.The auxiliary heat dissipation fin can be complete
Each element height in the layout and the veneer of the veneer is matched, the layout to the veneer, parts selection are weakened
Limitation requirement, relative reduction hardware design difficulty.In short, the auxiliary heat dissipation fin visible seam contact pin be arranged in it is described
In each idle space of veneer, the volume for increasing the communication equipment is avoided.The auxiliary heat dissipation fin connects the cover board,
The heat dissipation area for increasing the cover board improves the radiating efficiency of the single plate radiator.
In one embodiment, first heat exchanging segment is at least partially disposed at the auxiliary heat dissipation fin and the cover board
Between, so that there is certain heat exchange area between first heat exchanging segment and the auxiliary heat dissipation fin, first heat exchange
The heat of section directly can carry out rapid cooling by the auxiliary heat dissipation fin.
In one embodiment, the quantity of the radiating fin be at least two, at least two radiating fins that
This interval, the quantity of the substrate are at least two, and at least two substrates are respectively connected to the different radiating fins,
It is heater element heat dissipation different on the veneer to form at least two groups heat-sink unit independent of one another.
It is different on the veneer since the single plate radiator is formed at least two groups heat-sink unit independent of one another
Heater element heat dissipation, therefore the single plate radiator can realize the heat dissipation work of all heater elements on the veneer
Make.The single plate radiator is installed to the veneer, that is, completes the erector of all radiating elements needed for the veneer
Make, installation procedure is convenient, fast, improves the production efficiency of the communication equipment.
In one embodiment, the heat pipe further includes second part, and the second part includes be smoothly connected
Three heat exchanging segments, the second linkage section and the 4th heat exchanging segment；The third heat exchanging segment at least partly contacts the substrate, described
4th heat exchanging segment at least partly contacts another substrate.It can be realized between multiple substrates by the second part
Samming improves the heat dissipation effect of the single plate radiator.
In one embodiment, second heat exchanging segment and the third heat exchanging segment of the same substrate are contacted
Quantity be it is multiple, second heat exchanging segment is arranged alternately with the third heat exchanging segment, so that second heat exchanging segment can be with institute
It states third heat exchanging segment to exchange heat, the different substrates can be radiated by the same auxiliary heat dissipation fin, be improved
The radiating efficiency of the single plate radiator.
In one embodiment, the substrate thermal coefficient is higher than 180W/ (mK).The substrate is evaporation cavity or pure
Copper sheet material.
Optionally, the thermal coefficient of the cover board is higher than 180W/ (mK).The cover board uses copper sheet or aluminium sheet.
In one embodiment, the single plate radiator further includes the first fastener, and first fastener is connected to
Between the cover board and the substrate, for fixing the relatively described cover board of the substrate.By first fastener by institute
It states single plate radiator and is assembled into an entirety, the single plate radiator disposably, is easily installed to the list
Plate.
In one embodiment, the substrate includes fastening frame, bottom wall and the lug boss being formed on the bottom wall,
The bottom wall includes first side, and the lug boss includes described second side, and the fastening frame is disposed around the lug boss week
Side and the abutting bottom wall, pass through first fastener and connect the fastening frame and the cover board.At this point, the fastening frame will
The bottom wall is limited between the fastening frame and the cover board, and the position for being formed in the lug boss on the bottom wall is same
It is limited, the substrate can be prevented to be detached from the cover board during single plate radiator is installed to the veneer.
Optionally, the lug boss is integrally formed with the bottom wall or is fixed to one another by assembling realization.
In one embodiment, the single plate radiator further includes connection component, will be described by the connection component
Bottom wall is installed to the veneer, for making the lug boss contact the heater element.
In one embodiment, the connection component includes the second fastener and is set on the outside of second fastener
Elastic component, second fastener connects the bottom wall and the veneer, the elastic component are compressed in the remote of the bottom wall
Side from the veneer, for generating the elastic force that the bottom wall is pushed to the veneer, to make to be formed in the bottom wall
On the lug boss be in close contact the heater element.
Optionally, second fastener uses bolt, the elastic component be compressed in the head of the bolt with it is described
Between bottom wall.Since the relatively described veneer in the head of the bolt is fixed, the bottom wall is pushed in the elastic component generation to
The elastic force of the veneer.The elastic component uses spring.
Optionally, the quantity of the connection component is multiple, and multiple connection components are uniformly distributed in the bottom wall
Surrounding, to equably fix the substrate and the cover board.
In one embodiment, the substrate is integrated.The substrate is installed to described by fastener
Veneer, to complete the installation of the single plate radiator.
In one embodiment, the single plate radiator further includes locating piece, and the locating piece is used for the cover board
It positions to the veneer.The single plate radiator during installation, first passes through the locating piece and the cover board is enabled to position to the list
The printed circuit board of plate is then installed the substrate to the veneer by connection component.
Second aspect, the embodiment of the present application also provide a kind of communication equipment, including described in veneer and any one as above
Single plate radiator, the veneer are equipped with heater element, and the single plate radiator is installed to the veneer.The single plate radiator
For radiating for the heater element.
Detailed description of the invention
In order to illustrate more clearly of the technical solution of the application, attached drawing needed in embodiment will be made below
Simply introduce, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the application, general for this field
For logical technical staff, without creative efforts, other attached drawings can also be obtained such as these attached drawings.
Fig. 1 is a kind of structural schematic diagram of communication equipment provided by the embodiments of the present application.
Fig. 2 is a kind of structural schematic diagram of single plate radiator provided by the embodiments of the present application.
Fig. 3 is the structural schematic diagram of another communication equipment provided by the embodiments of the present application.
Fig. 4 be IV in Fig. 2 at structure enlarged drawing.
Fig. 5 be V in Fig. 2 at structure enlarged drawing.
Fig. 6 is the cross-sectional view of the part-structure of single plate radiator shown in Fig. 2.
Fig. 7 is the explosive view of another part structure of single plate radiator shown in Fig. 2.
Specific embodiment
With reference to the accompanying drawing, embodiments herein is described.
Referring to Fig. 1, the embodiment of the present application provides a kind of communication equipment 100, including veneer 1 and single plate radiator 2.It is described
Veneer 1 is equipped with heater element 11, the installation of single plate radiator 2 to the veneer 1.The single plate radiator 2 is used for as institute
State the heat dissipation of heater element 11.
Also referring to Fig. 1 and Fig. 2, the single plate radiator 2 includes cover board 21, radiating fin 22, substrate 23 and heat
Pipe 24.The cover board 21 is at least partly shell of the communication equipment 100.The substrate 23 includes the first side being oppositely arranged
231 and second side 232.First side 231 is oppositely arranged with the cover board 21, and the radiating fin 22 is set to first side
Between 231 and the cover board 21.Described second side 232 is located at side of the substrate 23 far from the cover board 21, and described second
Side 232 is used to connect the heater element 11 on the veneer 1.The substrate 23 is fixedly installed to the cover board 21.The heat pipe
24 parts connect the cover board 21, partially connect the substrate 23.
In the present embodiment, since described second side 232 of the substrate 23 connects the heater element 11, the heat pipe
24 parts connect the cover board 21, partially connect the substrate 23, therefore the heat that the heater element 11 issues can pass through institute
It states substrate 23 and the heat pipe 24 is transferred to the cover board 21, to be radiated by the cover board 21.Since the cover board 21 is
At least partly shell of the communication equipment 100, therefore the single plate radiator 2 does not need on the communication equipment 100
Increase additional structure, but can directly radiate by at least partly shell of the communication equipment 100, is being not take up
In the case where redundant space, heat dissipation area is increased, improves radiating efficiency.In short, the single plate radiator 2 had both saved institute
State the space of communication equipment 100, it may have good heat dissipation effect.
It should be understood that the radiating fin 22 be located at the substrate 23 first side 231 and the cover board 21 it
Between, therefore the heat on the substrate 23 can pass to the radiating fin 22 by first side 231, thus by described
Radiating fin 22 distributes.So the single plate radiator 2 can simultaneously by the cover board 21 and the radiating fin 22 into
Row heat dissipation, good heat dissipation effect.Since the substrate 23 is fixedly installed to the cover board 21, the radiating fin 22 is set to described the
Between side 231 and the cover board 21, therefore when installing the single plate radiator 2, can disposably, conveniently and efficiently by institute
The installation of single plate radiator 2 is stated to the veneer 1.
Optionally, described second side 232 of the substrate 23 and the connection type of the heater element 11 can be directly
Contact, is also possible to mediate contact.When using mediate contact mode, can described second side 232 and the heater element 11 it
Between add chill bar or coated with thermally conductive silicone grease, for reducing the heat of the interface between the substrate 23 and the heater element 11
Resistance.
Optionally, the substrate 23 is using the material that quick samming, heat dissipation effect can be achieved.The thermally conductive system of the substrate 23
Number is higher than 180W/ (mK).For example, the substrate 23 can be evaporation cavity (Vapor chamber, VC) or fine copper plate.
Optionally, the cover board 21 is using the material that quick samming, heat dissipation effect can be achieved.The thermally conductive system of the cover board 21
Number is higher than 180W/ (mK).For example, copper sheet or aluminium sheet can be used in the cover board 21.
The veneer 1 can be all kinds of printed circuit boards equipped with electronic component, or for carrying other components
Substrate is also possible to any type of fuel plate that has heat source region and need to radiate.For example, the veneer 1 includes
Printed circuit board 12 and the heater element 11 being located on the printed circuit board 12.The heater element 11 can be various power consumptions
Chip, such as processor (Central Processing Unit, CPU), controller, memory etc..
The heat pipe 24 (is dived using the evaporation of liquid after the evaporation of hot end in the phase transition process of cold end condensation using medium
Heat and the latent heat of condensation), conduct heat quickly.For example, the heat pipe 24 includes shell, liquid-sucking core and end cap, by the heat pipe
It is filled with suitable working fluid after being pumped into negative pressure in 24, makes to be close in the liquid-sucking core (being made of capillary-porous material) of inner wall of tube shell
It is sealed after hydraulically full.One end of the heat pipe 24 is evaporator section (bringing-up section), and the other end is condensation segment (cooling section), root
It needs to arrange adiabatic section two sections of centres according to application.Liquid evaporation vapour when one end of the heat pipe 24 is heated in liquid-sucking core
Change, steam flows under a slight pressure difference to other end releasing heat and condenses into liquid, and liquid leans on the work of capillary force along liquid-sucking core again
With flowing back to evaporator section.So circulation not oneself, heat reaches the other end by one end of the heat pipe 24.
The radiating fin 22 includes spaced multiple first fins, and air can band by the multiple first fin
The heat on the multiple first fin is walked, so that the radiating fin 22 be made to realize heat dissipation.The radiating fin 22 with it is described
Connection type between first side 231 of substrate 23 can be direct contact, be also possible to mediate contact.Using connecing indirectly
When touching mode, chill bar or coated with thermally conductive silicone grease can be added between first side 231 and the radiating fin 22, is used for
Reduce the interface resistance between the substrate 23 and the radiating fin 22.The substrate 23 is by the warm on the heater element 11
Amount passes to the radiating fin 22, and the radiating fin 22 is dissipated the heat to the air by the multiple first fin,
To realize heat dissipation.
Optionally, the extending direction of the radiating fin 22 can be perpendicular or parallel to the substrate 23.Such as Fig. 1 and Fig. 2 institute
Show, for the radiating fin 22 in vertical, the radiating fin 22 extends perpendicularly to the substrate 23.As indicated at 3, described
Radiating fin 22 is tower in being laminated, and the extending direction of the radiating fin 22 is parallel to the substrate 23.When the radiating fin
When 22 use stacking tower structure, the settable supporting element good with heat-transfer effect, to support the radiating fin 22.
Also referring to Fig. 1, Fig. 2 and Fig. 4, as a kind of alternative embodiment, the heat pipe 24 includes first part
241.The first part 241 includes sequentially connected first heat exchanging segment 2411, the first linkage section 2412 and the second heat exchanging segment
2413, first heat exchanging segment 2411 at least partly contacts the cover board 21, and second heat exchanging segment 2413 at least partly contacts
The substrate 23.
In the present embodiment, the first part 241 of the heat pipe 24 is connected directly between the cover board 21 and the base
It, can be rapidly by the heat transfer on the substrate 23 to the cover board 21, to radiate between plate 23.Described first
Heat exchanging segment 2411 at least partly contacts the cover board 21 namely first heat exchanging segment 2411 and the cover board 21 keeps certain
Heat exchange area, for guaranteeing that the first part 241 can quickly exchange heat with the cover board 21.Second heat exchanging segment 2413 is at least
Part contacts the substrate 23 namely second heat exchanging segment 2413 and the substrate 23 keeps certain heat exchange area, is used for
Guarantee that the second part 242 can quickly exchange heat with the substrate 23.
It should be understood that the contact cover board 21 as much as possible of the first heat exchanging segment 2411, to increase described first
The heat exchange area of heat exchanging segment 2411 and the cover board 21 improves heat exchange efficiency.For example, the 70% of first heat exchanging segment 2411 with
On part can contact the cover board 21.Second heat exchanging segment 2413 contacts the substrate 23 as much as possible, to increase
The heat exchange area for stating the second heat exchanging segment 2413 and the substrate 23, improves heat exchange efficiency.For example, second heat exchanging segment 2413
50% or more part can contact the substrate 23.Optionally, 30% or more the portion of described second side 232 of the substrate 23
Divide and is contacted with second heat exchanging segment 2413.
Optionally, the extending direction of the extending direction of first heat exchanging segment 2411 and second heat exchanging segment 2413 is not
Together, first linkage section 2412 is twist section or bending segment, for being smoothly connected first heat exchanging segment 2411 and described the
Two heat exchanging segments 2413.
In the present embodiment, the setting of first linkage section 2412, so that first heat exchanging segment 2411 and described
The layout of two heat exchanging segments 2413 can be more flexible, can specifically be arranged according to the position of the heater element 11, also be saved
The about single plate radiator 2 occupied space.
Also referring to Fig. 1, Fig. 2 and Fig. 4, as a kind of alternative embodiment, first heat exchanging segment 2411 contacts institute
State the cover board 21 that is partially submerged into of cover board 21, what second heat exchanging segment 2413 contacted the substrate 23 is partially submerged into the base
Plate 23.
In the present embodiment, first heat exchanging segment 2411 is connect by the way of insertion with the cover board 21, can both be saved
About space, can also ensure first heat exchanging segment 2411 and the cover board 21 has enough heat exchange areas, to make institute
State the good effect of heat exchange of the first heat exchanging segment 2411 and the cover board 21.Second heat exchanging segment 2413 is with the substrate 23 using embedding
The mode entered connects, and can both save space, can also ensure that second heat exchanging segment 2413 and having for the substrate 23 are enough
Heat exchange area, to make the good effect of heat exchange of second heat exchanging segment 2413 with the substrate 23.
Certainly, in other embodiments, the mode that fitting contact can also be used in first heat exchanging segment 2411 connects institute
State cover board 21.The mode that fitting contact can also be used in second heat exchanging segment 2413 connects the substrate 23.
Also referring to Fig. 1, Fig. 2 and Fig. 4, as a kind of alternative embodiment, second heat exchanging segment 2413 is located at institute
Described second side 232 for stating substrate 23, for contacting the heater element 11.Since second heat exchanging segment 2413 can directly connect
Touch the heater element 11 (can also be by heater element 11 described in heat-conducting medium mediate contact), therefore the heater element 11
The heat of sending can be transferred directly to second heat exchanging segment 2413, then pass through first linkage section 2412, described first
Heat exchanging segment 2411 is transferred to the cover board 21 and radiates, and radiating efficiency is high.At this point, the heater element 11 into the base
The heat of plate 23 can still be transferred to second heat exchanging segment 2413.
Certainly, in other embodiments, the middle part of the second heat exchanging segment 2413 also embeddable substrate 23.Or
Person, second heat exchanging segment 2413 may be alternatively located at first side 231 of the substrate 23, for contacting the radiating fin
22, so that the heat in second heat exchanging segment 2413 can also be radiated by the radiating fin 22.
Also referring to Fig. 1 and Fig. 2, as a kind of alternative embodiment, the single plate radiator 2 further includes auxiliary heat dissipation wing
Piece 25.The auxiliary heat dissipation fin 25 be set to the cover board 21 towards the substrate 23 side and with the radiating fin
22 are spaced each other.
In the present embodiment, heater element 11, the auxiliary heat dissipation fin 25 and institute described in 22 face of radiating fin
It states radiating fin 22 to be spaced each other, therefore the auxiliary heat dissipation fin 25 avoids the heater element 11 on the veneer 1.
The auxiliary heat dissipation fin 25 can exactly match each element height in the layout and the veneer 1 of the veneer 1, weaken
Limitation requirement to the layout, parts selection of the veneer 1, relative reduction hardware design difficulty.In short, the auxiliary heat dissipation
It is arranged in each idle space of the veneer 1 to 25 visible seam contact pin of fin, avoids the body for increasing the communication equipment 100
Product.The auxiliary heat dissipation fin 25 connects the cover board 21, increases the heat dissipation area of the cover board 21, improves the veneer
The radiating efficiency of radiator 2.
Optionally, the auxiliary heat dissipation fin 25 includes spaced multiple second wings extended from the cover board 21
Piece.By the heat exchange of the multiple second fin and air, the auxiliary heat dissipation fin 25 is made to realize heat dissipation.
Also referring to Fig. 1, Fig. 2 and Fig. 4, as a kind of alternative embodiment, first heat exchanging segment 2411 at least portion
Quartile is between the auxiliary heat dissipation fin 25 and the cover board 21.At this point, first heat exchanging segment 2411 is dissipated with the auxiliary
There is certain heat exchange area, the heat of first heat exchanging segment 2411 can directly pass through the auxiliary heat dissipation between hot fin 25
The heat of the progress rapid cooling of fin 25 namely the heater element 11 can be transferred to described auxiliary by the first part 241
Radiating fin 25 is helped to radiate.
Optionally, the quantity of the auxiliary heat dissipation fin 25 is at least two.At least two auxiliary heat dissipation fins 25
Interval setting.The heat pipe 24 further includes Part III, and the Part III contacts the cover board 21 and at least two institutes of connection
State auxiliary heat dissipation fin 25.
In the present embodiment, the cover board 21 and institute can be passed through between at least two auxiliary heat dissipation fins 25 simultaneously
The Part III for stating heat pipe 24 carries out heat transfer, so that the cover board 21 is able to maintain preferable equal temperature state.
Also referring to Fig. 1 and Fig. 2, as a kind of alternative embodiment, the quantity of the radiating fin 22 is at least two,
At least two radiating fins 22 are spaced each other.The quantity of the substrate 23 is at least two, at least two substrates 23
It is respectively connected to the different radiating fins 22, is on the veneer 1 to form at least two groups heat-sink unit 26 independent of one another
The different heater elements 11 radiates.
In the present embodiment, it since the single plate radiator 2 is formed at least two groups heat-sink unit 26 independent of one another, is used for
Different heater element 11 radiates on the veneer 1, thus the single plate radiator 2 can realize it is all on the veneer 1
The heat dissipation work of the heater element 11.The single plate radiator 2 is installed to the veneer 1, that is, completes 1 institute of veneer
The installment work of all radiating elements needed, installation procedure is convenient, fast, improves the production efficiency of the communication equipment 100.
It should be understood that position of the heat-sink unit 26 on the cover board 21 and the heater element 11 are in the list
Position on the printed circuit board 12 of plate 1 corresponds.
Also referring to Fig. 1, Fig. 2, Fig. 4 and Fig. 5, optionally, the heat pipe 24 further includes second part 242, described
Second part 242 includes third heat exchanging segment 2421, the second linkage section 2422 and the 4th heat exchanging segment 2423 being smoothly connected.It is described
Third heat exchanging segment 2421 at least partly contacts the substrate 23, and the 4th heat exchanging segment 2423 at least partly contacts another
The substrate 23.The samming between multiple substrates 23 can be realized by the second part 242, improve the veneer heat dissipation
The heat dissipation effect of device 2.
Optionally, second heat exchanging segment 2413 and the third heat exchanging segment 2421 of the same substrate 23 are contacted
Quantity be it is multiple, second heat exchanging segment 2413 is arranged alternately with the third heat exchanging segment 2421.Second heat exchanging segment
2413 can contact with the third heat exchanging segment 2421, can also be contacted by the substrate 23 with the third heat exchanging segment 2421.Institute
Stating the second heat exchanging segment 2413 can exchange heat with the third heat exchanging segment 2421, so that the different substrates 23 can be by same
A auxiliary heat dissipation fin 25 radiates, and improves the radiating efficiency of the single plate radiator 2.Second heat exchanging segment
2413 are arranged alternately the even temperature effect for being also beneficial to realize the substrate 23 with the third heat exchanging segment 2421.
Optionally, the quantity of the radiating fin 22 is multiple, and the quantity of the auxiliary heat dissipation fin 25 is more than or equal to institute
The quantity for stating radiating fin 22 is connected to multiple radiating fins 22 correspondingly not by the first part 241
The same auxiliary heat dissipation fin 25.The substrate 23 is at least equipped with a radiating fin 22 and an auxiliary heat dissipation
Fin 25 has enough heat dissipation areas, good heat dissipation effect.
It should be understood that as shown in Fig. 2, in one embodiment, the single plate radiator 2 further includes the second substrate
27, the second substrate 27 is mainly used for radiating for the lesser heater element of power consumption on the veneer 1.The heat pipe 24 can
Be not directly connected the second substrate 27, but connects the second substrate 27 by radiating fin 28.
Also referring to Fig. 1, Fig. 2, Fig. 4, Fig. 6 and Fig. 7, as a kind of alternative embodiment, the single plate radiator 2 is also
Including the first fastener 201, first fastener 201 is connected between the cover board 21 and the substrate 23, for making
It is fixed to state the relatively described cover board 21 of substrate 23.
In the present embodiment, the single plate radiator 2 is assembled by an entirety by first fastener 201, made
Obtaining the single plate radiator 2 can disposably, easily install to the veneer 1.
For example, the substrate 23 includes fastening frame 233, bottom wall 234 and the protrusion being formed on the bottom wall 234
Portion 235.The bottom wall 234 includes that first side 231 namely the bottom wall 234 are oppositely arranged with the cover board 21, and described the
Side 231 is formed in the side far from the lug boss 235 of the bottom wall 234.The lug boss 235 includes described second side
232 namely the lug boss 235 be located at the side far from the cover board 21 of the substrate 23, described second side 232 is formed in
The side far from the bottom wall 234 of the lug boss 235.The fastening frame 233 is disposed around 235 periphery of lug boss and supports
The bottom wall 234 is connect, the fastening frame 233 and the cover board 21 are connected by first fastener 201.At this point, described tight
Gu the bottom wall 234 is limited between the fastening frame 233 and the cover board 21 by frame 233, it is formed on the bottom wall 234
The position of the lug boss 235 is equally limited, can be anti-during the single plate radiator 2 installation to veneer 1
Only the substrate 23 is detached from the cover board 21.
It should be understood that the lug boss 235 is integrally formed with the bottom wall 234 or is fixed to one another by assembling realization.
The fastening frame 233 and the bottom wall 234, the lug boss 235 are separable.The bottom wall 234 can be used for carrying the heat dissipation
Fin 22.The lug boss 235 is equipped with multiple slots, for accommodating the heat pipe 24.
Optionally, the quantity of first fastener 201 is multiple, and multiple first fasteners 201 are equably or greatly
The surrounding for being uniformly distributed in the fastening frame 233 is caused, to equably fix the fastening frame 233 and the cover board 21.Institute
Stating the first fastener 201 can be used bolt.
Optionally, the single plate radiator 2 further includes connection component 202, by the connection component 202 by the bottom wall
234 installations are to the veneer 1, for making the lug boss 235 contact the heater element 11.
For example, the connection component 202 including the second fastener 2021 and is set in second fastener 2021
The elastic component 2022 in outside.Second fastener 2021 connects the bottom wall 234 and the veneer 1, for preventing the bottom
Wall 234 is detached from the veneer 1.The elastic component 2022 is compressed in the side far from the veneer 1 of the bottom wall 234, uses
In generating the elastic force that the bottom wall 234 is pushed to the veneer 1, to make the protrusion being formed on the bottom wall 234
Portion 235 is in close contact the heater element 11.
Bolt can be used in second fastener 2021, and the elastic component 2022 is compressed in head and the institute of the bolt
It states between bottom wall 234.Since the relatively described veneer 1 in the head of the bolt is fixed, the elastic component 2022 is generated institute
State the elastic force that bottom wall 234 pushes the veneer 1 to.Spring can be used in the elastic component 2022.
Optionally, the quantity of the connection component 202 is multiple, and multiple connection components 202 are equably or substantially equal
It is arranged in the surrounding of the bottom wall 234 evenly, to equably fix the substrate 23 and the cover board 21.
Certainly, in other embodiments, the substrate 23 can be integrated.By fastener by the substrate 23
Installation is to the veneer 1, to complete the installation of the single plate radiator 2.
Optionally, the single plate radiator 2 further includes locating piece 203, and the locating piece 203 is for determining the cover board 21
Position is to the veneer 1.The single plate radiator 2 during installation, can first pass through the locating piece 203 and enable the positioning of cover board 21 extremely
The printed circuit board 12 of the veneer 1 is then installed the substrate 23 to the veneer 1 by connection component 202.Such as
Shown in Fig. 1, the veneer 1 further includes pedestal 13, and the pedestal 13 accommodates the heater element 11, and the connection component 202 can
The substrate 23 is installed to the pedestal 13, so that the substrate 23 be made to contact the heater element 11.
The embodiment of the present application is described in detail above, specific case used herein to the principle of the application and
Embodiment is expounded, the description of the example is only used to help understand the method for the present application and its core ideas；
At the same time, for those skilled in the art can in specific embodiments and applications according to the thought of the application
There is change place, in conclusion the contents of this specification should not be construed as limiting the present application.
Claims (14)
1. a kind of single plate radiator, for the veneer heat dissipation for communication equipment characterized by comprising
Cover board, the cover board are at least partly shell of the communication equipment；
Radiating fin；
Substrate, including the first side being oppositely arranged and second side, first side is oppositely arranged with the cover board, the radiating fin
Piece is set between first side and the cover board, and described second side is located at side of the substrate far from the cover board, described
Second side is used to connect the heater element on the veneer, and the substrate is fixedly installed to the cover board；And
Heat pipe, the heat pipe include first part and second part, the first part include sequentially connected first heat exchanging segment,
First linkage section and the second heat exchanging segment, first heat exchanging segment at least partly contact the cover board, and second heat exchanging segment is extremely
Small part contacts the substrate；
The second part includes sequentially connected third heat exchanging segment, the second linkage section and the 4th heat exchanging segment, the substrate
Quantity is at least two, and the third heat exchanging segment at least partly contacts the substrate, and the 4th heat exchanging segment is at least partly
Contact another substrate.
2. single plate radiator as described in claim 1, which is characterized in that first heat exchanging segment contacts the part of the cover board
It is embedded in the cover board, what second heat exchanging segment contacted the substrate is partially submerged into the substrate.
3. single plate radiator as claimed in claim 1 or 2, which is characterized in that second heat exchanging segment is located at the substrate
Described second side, for contacting the heater element.
4. single plate radiator as described in claim 1, which is characterized in that the single plate radiator further includes auxiliary heat dissipation wing
Piece, the auxiliary heat dissipation fin be set to the cover board towards the substrate side and with the radiating fin to each other
Every.
5. single plate radiator as claimed in claim 4, which is characterized in that first heat exchanging segment is at least partially disposed at described auxiliary
It helps between radiating fin and the cover board.
6. single plate radiator as described in claim 1, which is characterized in that the quantity of the radiating fin is at least two, until
Few two radiating fins are spaced each other, and at least two substrates are respectively connected to the different radiating fins, with shape
It is heater element heat dissipation different on the veneer at least two groups heat-sink unit independent of one another.
7. single plate radiator as claimed in claim 6, which is characterized in that second heat exchange of the same substrate of contact
Section and the third heat exchanging segment quantity be it is multiple, second heat exchanging segment is arranged alternately with the third heat exchanging segment.
8. single plate radiator as described in claim 1, which is characterized in that the substrate thermal coefficient is higher than 180W/ (mK).
9. single plate radiator as described in claim 1, which is characterized in that the single plate radiator further includes the first fastener,
First fastener is connected between the cover board and the substrate, for fixing the relatively described cover board of the substrate.
10. single plate radiator as claimed in claim 9, which is characterized in that the substrate includes fastening frame, bottom wall and formation
Lug boss on the bottom wall, the bottom wall include first side, and the lug boss includes described second side, the fastening
Frame is disposed around the lug boss periphery and abuts the bottom wall, connects the fastening frame and the lid by first fastener
Plate.
11. single plate radiator as claimed in claim 10, which is characterized in that the single plate radiator further includes connection component,
The bottom wall is installed to the veneer by the connection component, for making the lug boss contact the heater element.
12. single plate radiator as claimed in claim 11, which is characterized in that the connection component includes the second fastener and set
The elastic component being located on the outside of second fastener, second fastener connect the bottom wall and the veneer, the elasticity
Part is compressed in the side far from the veneer of the bottom wall, for generating the elasticity that the bottom wall is pushed to the veneer
Power.
13. such as the described in any item single plate radiators of claim 9~12, which is characterized in that the single plate radiator further includes
Locating piece, the locating piece is for positioning the cover board to the veneer.
14. a kind of communication equipment, which is characterized in that including veneer and such as the described in any item veneer heat dissipations of claim 1~13
Device, the veneer are equipped with heater element, and the single plate radiator is installed to the veneer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611066927.0A CN106455452B (en) | 2016-11-25 | 2016-11-25 | Single plate radiator and communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611066927.0A CN106455452B (en) | 2016-11-25 | 2016-11-25 | Single plate radiator and communication equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106455452A CN106455452A (en) | 2017-02-22 |
| CN106455452B true CN106455452B (en) | 2019-02-26 |
Family
ID=58219128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611066927.0A Active CN106455452B (en) | 2016-11-25 | 2016-11-25 | Single plate radiator and communication equipment |
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| Country | Link |
|---|---|
| CN (1) | CN106455452B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2850216Y (en) * | 2005-11-08 | 2006-12-20 | 佛山市顺德区汉达精密电子科技有限公司 | Radiator |
| CN1925735A (en) * | 2005-09-02 | 2007-03-07 | 富准精密工业(深圳)有限公司 | Heat pipe radiator |
| CN2930226Y (en) * | 2006-06-20 | 2007-08-01 | 中兴通讯股份有限公司 | Combined heat sink |
| CN101094579A (en) * | 2006-06-21 | 2007-12-26 | 富准精密工业(深圳)有限公司 | Heat sink for heat pipe |
| CN104039115A (en) * | 2014-05-14 | 2014-09-10 | 中山伟强科技有限公司 | Mobile phone heat dissipation module |
-
2016
- 2016-11-25 CN CN201611066927.0A patent/CN106455452B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1925735A (en) * | 2005-09-02 | 2007-03-07 | 富准精密工业(深圳)有限公司 | Heat pipe radiator |
| CN2850216Y (en) * | 2005-11-08 | 2006-12-20 | 佛山市顺德区汉达精密电子科技有限公司 | Radiator |
| CN2930226Y (en) * | 2006-06-20 | 2007-08-01 | 中兴通讯股份有限公司 | Combined heat sink |
| CN101094579A (en) * | 2006-06-21 | 2007-12-26 | 富准精密工业(深圳)有限公司 | Heat sink for heat pipe |
| CN104039115A (en) * | 2014-05-14 | 2014-09-10 | 中山伟强科技有限公司 | Mobile phone heat dissipation module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106455452A (en) | 2017-02-22 |
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Effective date of registration: 20211228 Address after: 450046 Floor 9, building 1, Zhengshang Boya Plaza, Longzihu wisdom Island, Zhengdong New Area, Zhengzhou City, Henan Province Patentee after: Super fusion Digital Technology Co.,Ltd. Address before: 518129 Bantian HUAWEI headquarters office building, Longgang District, Guangdong, Shenzhen Patentee before: HUAWEI TECHNOLOGIES Co.,Ltd. |
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