CN106455452A - Single board radiator and communication equipment - Google Patents
Single board radiator and communication equipment Download PDFInfo
- Publication number
- CN106455452A CN106455452A CN201611066927.0A CN201611066927A CN106455452A CN 106455452 A CN106455452 A CN 106455452A CN 201611066927 A CN201611066927 A CN 201611066927A CN 106455452 A CN106455452 A CN 106455452A
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- China
- Prior art keywords
- cover plate
- substrate
- heat exchanging
- exchanging segment
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004891 communication Methods 0.000 title claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 134
- 230000017525 heat dissipation Effects 0.000 claims description 38
- 230000008878 coupling Effects 0.000 claims description 16
- 238000010168 coupling process Methods 0.000 claims description 16
- 238000005859 coupling reaction Methods 0.000 claims description 16
- 238000009499 grossing Methods 0.000 claims 1
- 238000001816 cooling Methods 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract 1
- 230000000191 radiation effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 16
- 238000001704 evaporation Methods 0.000 description 5
- 230000008020 evaporation Effects 0.000 description 5
- 238000009434 installation Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Domestic Hot-Water Supply Systems And Details Of Heating Systems (AREA)
Abstract
The application discloses a single board radiator for cooling a single board of communication equipment. The single board radiator comprises a cover plate, cooling fins, a substrate, and a thermal tube. The cover plate is at least partial shell of the communication equipment. The substrate includes a first side and a second side opposite to the first side; the first side is opposite to the cover plate; the cooling fins are arranged between the first side and the cover plate; the second side which is located at one side, far away from the cover plate, of the substrate is used for connecting a heating element arranged on a single board; and the substrate is fixedly installed at the cover plate. The thermal tube is connected to the cover plate partially and is connected with the substrate partially. The provided single board radiator has a good heat radiation effect. In addition, the application also discloses communication equipment.
Description
Technical field
The application is related to veneer technical field of heat dissipation, more particularly, to a kind of single plate radiator and a kind of communication equipment.
Background technology
In the thermal design of electronic equipment, often relate to the veneer of much big power consumptions, and in general, these big work(
The larger chip of this some heat consumption of layout on the veneer of consumption, the radiating of the larger chip of these heat consumptions then becomes the bottle of veneer radiating
Neck.And existing veneer heat-sinking capability is subject to limited space, heat sink size can not increase, and leads to radiator heat-dissipation ability to be difficult to carry
Rise, radiating effect is poor.
Content of the invention
The embodiment of the present application technical problem to be solved is to provide a kind of single plate radiator of good heat dissipation effect.
Additionally, the embodiment of the present application also provides a kind of communication equipment applying described single plate radiator.
To achieve these goals, the application embodiment adopts the following technical scheme that：
In a first aspect, the embodiment of the present application provides a kind of single plate radiator, for the veneer radiating for communication equipment, bag
Include：
Cover plate, described cover plate is at least part of shell of described communication equipment；
Radiating fin；
Substrate, including the first side being oppositely arranged and the second side, described first side and described cover plate are oppositely arranged, described scattered
Located between described first side and described cover plate, described second side is located at the side away from described cover plate for the described substrate to hot fin,
Described second side is used for connecting the heater element on described veneer, and described substrate is fixedly installed to described cover plate；And
Heat pipe, described heat pipe section connects described cover plate, partly connects described substrate.
In the present embodiment, because described second side of described substrate connects described heater element, described heat pipe section is even
Connect described cover plate, partly connect described substrate, the heat that therefore described heater element sends can be by described substrate and described warm
Pipe is transferred to described cover plate, thus being radiated by described cover plate.Because described cover plate is at least partly outer of described communication equipment
Shell, therefore described single plate radiator does not need to increase extra structure on described communication equipment, but can directly by
At least part of shell of described communication equipment is radiated, and in the case of being not take up redundant space, increased area of dissipation, carries
High radiating efficiency.In short, described single plate radiator had both saved the space of described communication equipment, it may have good radiating effect
Really.
Described radiating fin is located at the heat between described first side and the described cover plate of described substrate, on therefore described substrate
Amount can pass to described radiating fin by described first side, thus being distributed by described radiating fin.So, described list
Plate radiator can be radiated by described cover plate and described radiating fin simultaneously, good heat dissipation effect.Because described substrate is fixed
It is attached to described cover plate, described radiating fin, located between described first side and described cover plate, therefore dissipates in the described veneer of installation
During hot device, disposably, conveniently and efficiently by described single plate radiator can be attached to described veneer.
Optionally, add chill bar or coated with thermally conductive silicone grease between described second side and described heater element, be used for subtracting
Interface resistance between little described substrate and described heater element.
Optionally, the bearing of trend of described radiating fin is perpendicular or parallel to described substrate.
In one embodiment, described heat pipe includes Part I, and described Part I includes first being sequentially connected
Heat exchanging segment, the first linkage section and the second heat exchanging segment, described first heat exchanging segment at least partly contacts described cover plate, and described second changes
Hot arc at least partly contacts described substrate.
The described Part I of described heat pipe is connected directly between described cover plate and described substrate, can be rapidly by institute
State the heat transfer extremely described cover plate on substrate, thus being radiated.Described first heat exchanging segment at least partly contacts described cover plate,
Namely described first heat exchanging segment keeps certain heat exchange area with described cover plate, for ensureing that described Part I can quickly and institute
State cover plate heat exchange.Described second heat exchanging segment at least partly contacts described substrate, namely described second heat exchanging segment is protected with described substrate
Hold certain heat exchange area, for ensure described Part II can quickly with described substrate heat exchange.
Optionally, the bearing of trend of described first heat exchanging segment is different from the bearing of trend of described second heat exchanging segment, and described
One linkage section is twist section or bending segment, for described first heat exchanging segment of smooth connection and described second heat exchanging segment, so that
The layout of described first heat exchanging segment and described second heat exchanging segment can be more flexible, can enter according to the position of described heater element
Row is concrete to be arranged, has saved the space shared by described single plate radiator.
In one embodiment, what described first heat exchanging segment contacted described cover plate is partially submerged into described cover plate, and described the
Two heat exchanging segments contact described substrates be partially submerged into described substrate.
Described first heat exchanging segment is connected by the way of embedded with described cover plate, both can save space it is also possible to ensure institute
That states the first heat exchanging segment and described cover plate has enough heat exchange areas, so that the changing of described first heat exchanging segment and described cover plate
Thermal effect is good.Described second heat exchanging segment is connected by the way of embedded with described substrate, both can save space it is also possible to ensure institute
That states the second heat exchanging segment and described substrate has enough heat exchange areas, so that the changing of described second heat exchanging segment and described substrate
Thermal effect is good.
In one embodiment, described first heat exchanging segment laminating contacts described cover plate.Described second heat exchanging segment laminating connects
Touch described substrate.
In one embodiment, described second heat exchanging segment is located at described second side of described substrate, described for contacting
Heater element, so that the heat that described heater element sends can be transferred directly to described second heat exchanging segment, then passes through described the
One linkage section, described first heat exchanging segment are transferred to described cover plate and are radiated, and radiating efficiency is high.
In one embodiment, described second heat exchanging segment embeds the middle part of described substrate.
In one embodiment, described second heat exchanging segment is located at described first side of described substrate, described for contacting
Radiating fin is so that the heat in described second heat exchanging segment also can be radiated by described radiating fin.
In one embodiment, described single plate radiator also includes auxiliary heat dissipation fin, and described auxiliary heat dissipation fin sets
It is placed in the side towards described substrate of described cover plate and be spaced with described radiating fin.
Because described radiating fin is just to described heater element, described auxiliary heat dissipation fin is with described radiating fin to each other
Every therefore described auxiliary heat dissipation fin avoids the described heater element on described veneer.Described auxiliary heat dissipation fin can be complete
Mate each element height in the layout and described veneer of described veneer, weaken layout to described veneer, parts selection
Restriction require, relative reduction hardware designs difficulty.In short, described auxiliary heat dissipation fin visible seam contact pin be arranged in described
In each idle space of veneer, it is to avoid increase the volume of described communication equipment.Described auxiliary heat dissipation fin connects described cover plate,
Increased the area of dissipation of described cover plate, improve the radiating efficiency of described single plate radiator.
In one embodiment, described first heat exchanging segment is at least partially disposed at described auxiliary heat dissipation fin and described cover plate
Between so that having certain heat exchange area, described first heat exchange between described first heat exchanging segment and described auxiliary heat dissipation fin
The heat of section directly can carry out quick heat radiating by described auxiliary heat dissipation fin.
In one embodiment, the quantity of described radiating fin be at least two, radiating fin described at least two that
This interval, the quantity of described substrate is at least two, and substrate described at least two is respectively connecting to different described radiating fins,
To form at least two groups heat-sink units independent of one another, it is different described heater element radiatings on described veneer.
Because described single plate radiator is formed with least two groups heat-sink units independent of one another, for different on described veneer
Heater element radiates, and therefore described single plate radiator can achieve the radiating work of all of described heater element on described veneer
Make.Described single plate radiator is attached to described veneer, that is, completes the erector of all radiating elements needed for described veneer
Make, installation procedure is convenient, fast, improves the production efficiency of described communication equipment.
In one embodiment, described heat pipe also includes Part II, and described Part II includes the of smooth connection
Three heat exchanging segments, the second linkage section and the 4th heat exchanging segment；Described 3rd heat exchanging segment at least partly contacts a described substrate, described
4th heat exchanging segment at least partly contacts another described substrate.Be can achieve between multiple described substrates by described Part II
Samming, improves the radiating effect of described single plate radiator.
In one embodiment, described second heat exchanging segment of same described substrate and described 3rd heat exchanging segment are contacted
Quantity is multiple, and described second heat exchanging segment and described 3rd heat exchanging segment are arranged alternately so that described second heat exchanging segment can be with institute
State the 3rd heat exchanging segment and carry out heat exchange, different described substrates can be radiated by same described auxiliary heat dissipation fin, improve
The radiating efficiency of described single plate radiator.
In one embodiment, described substrate heat conductivity is higher than 180W/ (m K).Described substrate is evaporation cavity or pure
Copper coin material.
Optionally, the heat conductivity of described cover plate is higher than 180W/ (m K).Described cover plate adopts copper coin or aluminium sheet.
In one embodiment, described single plate radiator also includes the first securing member, and described first securing member is connected to
Between described cover plate and described substrate, it is used for making the relatively described cover plate of described substrate fix.By described first securing member by institute
State single plate radiator and be assembled into an entirety so that described single plate radiator can disposably, easily be attached to described list
Plate.
In one embodiment, described substrate includes fastening frame, diapire and is formed at lobe on described diapire,
Described diapire includes described first side, and described lobe includes described second side, and described fastening frame encloses and is located at described lobe week
Side and the described diapire of abutting, connect described fastening frame and described cover plate by described first securing member.Now, described fastening frame will
Described diapire is limited between described fastening frame and described cover plate, and the position being formed at described lobe on described diapire is same
Limited, can prevent described substrate from departing from described cover plate during described single plate radiator is attached to described veneer.
Optionally, described lobe is integrally formed with described diapire or is fixed to one another by assembling realization.
In one embodiment, described single plate radiator also includes coupling assembly, will be described by described coupling assembly
Diapire is attached to described veneer, is used for making described lobe contact described heater element.
In one embodiment, described coupling assembly includes the second securing member and is set in outside described second securing member
Elastic component, described second securing member connects described diapire and described veneer, and described elastic component is compressed in the remote of described diapire
From the side of described veneer, for producing the elastic force that described diapire is pushed to described veneer, so that being formed at described diapire
On described lobe be in close contact described heater element.
Optionally, described second securing member adopts bolt, described elastic component be compressed in the head of described bolt with described
Between diapire.Because the relatively described veneer of the head of described bolt is fixed, therefore described elastic component produces to be pushed to described diapire
The elastic force of described veneer.Described elastic component adopts spring.
Optionally, the quantity of described coupling assembly is multiple, and multiple described coupling assemblies are uniformly distributed in described diapire
Surrounding, thus equably fixing described substrate and described cover plate.
In one embodiment, described substrate is integrated.By securing member, described substrate is attached to described
Veneer, thus complete the installation of described single plate radiator.
In one embodiment, described single plate radiator also includes keeper, and described keeper is used for described cover plate
Position to described veneer.Described single plate radiator when mounted, first passes through described keeper and makes described cover plate position to described list
Described substrate is then attached to described veneer by coupling assembly by the printed circuit board (PCB) of plate.
Second aspect, the embodiment of the present application also provides a kind of communication equipment, including veneer with as above described in any one
Single plate radiator, described veneer is provided with heater element, and described single plate radiator is attached to described veneer.Described single plate radiator
For radiating for described heater element.
Brief description
In order to be illustrated more clearly that the technical scheme of the application, below by the accompanying drawing work to use required in embodiment
Simply introduce it should be apparent that, drawings in the following description be only the application some embodiments, general for this area
For logical technical staff, on the premise of not paying creative work, other accompanying drawings can also be obtained as these accompanying drawings.
Fig. 1 is a kind of structural representation of communication equipment that the embodiment of the present application provides.
Fig. 2 is a kind of structural representation of single plate radiator that the embodiment of the present application provides.
Fig. 3 is the structural representation of another kind of communication equipment that the embodiment of the present application provides.
Fig. 4 be IV in Fig. 2 at structure enlarged drawing.
Fig. 5 be V in Fig. 2 at structure enlarged drawing.
Fig. 6 is the sectional view of the part-structure of single plate radiator shown in Fig. 2.
Fig. 7 is the explosive view of another part structure of single plate radiator shown in Fig. 2.
Specific embodiment
Below in conjunction with the accompanying drawings, embodiments herein is described.
Refer to Fig. 1, the embodiment of the present application provides a kind of communication equipment 100, including veneer 1 and single plate radiator 2.Described
Veneer 1 is provided with heater element 11, and described single plate radiator 2 is attached to described veneer 1.Described single plate radiator 2 is used for as institute
State heater element 11 to radiate.
See also Fig. 1 and Fig. 2, described single plate radiator 2 includes cover plate 21, radiating fin 22, substrate 23 and heat
Pipe 24.Described cover plate 21 is at least part of shell of described communication equipment 100.Described substrate 23 includes the first side being oppositely arranged
231 and second side 232.Described first side 231 and described cover plate 21 are oppositely arranged, and described radiating fin 22 is located at described first side
Between 231 and described cover plate 21.Described second side 232 is located at the side away from described cover plate 21 for the described substrate 23, and described second
Side 232 is used for connecting the heater element 11 on described veneer 1.Described substrate 23 is fixedly installed to described cover plate 21.Described heat pipe
24 parts connect described cover plate 21, partly connect described substrate 23.
In the present embodiment, because described second side 232 of described substrate 23 connects described heater element 11, described heat pipe
24 parts connect described cover plate 21, partly connect described substrate 23, and the heat that therefore described heater element 11 sends can pass through institute
State substrate 23 and described heat pipe 24 is transferred to described cover plate 21, thus being radiated by described cover plate 21.Because described cover plate 21 is
At least part of shell of described communication equipment 100, therefore described single plate radiator 2 does not need on described communication equipment 100
Increase extra structure, but can directly be radiated by least part of shell of described communication equipment 100, be not take up
In the case of redundant space, increased area of dissipation, improve radiating efficiency.In short, described single plate radiator 2 had both saved institute
State the space of communication equipment 100, it may have good radiating effect.
It should be understood that described radiating fin 22 be located at described substrate 23 described first side 231 and described cover plate 21 it
Between, the heat on therefore described substrate 23 can pass to described radiating fin 22 by described first side 231, thus by described
Radiating fin 22 distributes.So, described single plate radiator 2 can pass through described cover plate 21 simultaneously and described radiating fin 22 enters
Row radiating, good heat dissipation effect.Because described substrate 23 is fixedly installed to described cover plate 21, described radiating fin 22 is located at described
Between side 231 and described cover plate 21, therefore install described single plate radiator 2 when, can disposably, conveniently and efficiently by institute
State single plate radiator 2 and be attached to described veneer 1.
Optionally, described second side 232 of described substrate 23 and the connected mode of described heater element 11 can be direct
Contact or mediate contact.During using mediate contact mode, can described second side 232 and described heater element 11 it
Between add chill bar or coated with thermally conductive silicone grease, for reducing the heat of the interface between described substrate 23 and described heater element 11
Resistance.
Optionally, described substrate 23 is using achievable quick samming, the material of radiating effect.The heat conduction system of described substrate 23
Number is higher than 180W/ (m K).For example, described substrate 23 can be evaporation cavity (Vapor chamber, VC) or fine copper sheet material.
Optionally, described cover plate 21 is using achievable quick samming, the material of radiating effect.The heat conduction system of described cover plate 21
Number is higher than 180W/ (m K).For example, described cover plate 21 can adopt copper coin or aluminium sheet.
Described veneer 1 can be all kinds of printed circuit board (PCB) being provided with electronic devices and components, or for carrying other components and parts
Substrate or any type of fuel plate that there is heat source region and need to radiate.For example, described veneer 1 includes
Printed circuit board (PCB) 12 and the heater element 11 being located on described printed circuit board (PCB) 12.Described heater element 11 can be various power consumptions
Chip, such as processor (Central Processing Unit, CPU), controller, memorizer etc..
Described heat pipe 24 utilizes medium (to utilize the evaporation of liquid to dive in the phase transition process of cold end condensation after the evaporation of hot junction
Heat and the latent heat of condensation), so that heat is quickly conducted.For example, described heat pipe 24 includes shell, wick and end cap, by described heat pipe
It is filled with appropriate hydraulic fluid after being pumped into negative pressure in 24, make in the wick (being made up of capillary-porous material) be close to inner wall of tube shell
Sealed after hydraulically full.One end of described heat pipe 24 is evaporator section (bringing-up section), and the other end is condensation segment (cooling section), root
Need to arrange adiabatic section two sections of centres according to application.Liquid evaporation vapour in wick when being heated when one end of described heat pipe 24
Change, steam flows to other end releasing heat under small pressure reduction and condenses into liquid, and liquid leans on the work of capillary force again along wick
With flowing back to evaporator section.So circulation is not own, and heat reaches the other end by one end of described heat pipe 24.
Described radiating fin 22 includes spaced multiple first fin, and air can carry through the plurality of first fin
Walk the heat on the plurality of first fin, so that described radiating fin 22 realizes radiating.Described radiating fin 22 with described
Connected mode between described first side 231 of substrate 23 can be directly contact or mediate contact.Using indirectly connecing
During tactile mode, chill bar or coated with thermally conductive silicone grease can be added between described first side 231 and described radiating fin 22, be used for
Reduce the interface resistance between described substrate 23 and described radiating fin 22.Described substrate 23 is by the warm on described heater element 11
Amount passes to described radiating fin 22, and described radiating fin 22 distributes heat in the air by the plurality of first fin,
Thus realizing radiating.
Optionally, the bearing of trend of described radiating fin 22 can be perpendicular or parallel to described substrate 23.As Fig. 1 and Fig. 2 institute
Show, described radiating fin 22 be in vertical, described radiating fin 22 extend perpendicularly to described substrate 23.As indicated at 3, described
Radiating fin 22 is in that stacking is tower, and the bearing of trend of described radiating fin 22 is parallel to described substrate 23.When described radiating fin
During 22 employing stacking tower structure, can arrange and there is the good support member of heat-transfer effect, to support described radiating fin 22.
See also Fig. 1, Fig. 2 and Fig. 4, as a kind of alternative embodiment, described heat pipe 24 includes Part I
241.Described Part I 241 includes the first heat exchanging segment 2411, the first linkage section 2412 and the second heat exchanging segment being sequentially connected
2413, described first heat exchanging segment 2411 at least partly contacts described cover plate 21, and described second heat exchanging segment 2413 at least partly contacts
Described substrate 23.
In the present embodiment, the described Part I 241 of described heat pipe 24 is connected directly between described cover plate 21 and described base
Between plate 23, can be rapidly by the heat transfer on described substrate 23 to described cover plate 21, thus being radiated.Described first
Heat exchanging segment 2411 at least partly contacts described cover plate 21, namely described first heat exchanging segment 2411 keeps certain with described cover plate 21
Heat exchange area, for ensure described Part I 241 can quickly with the heat exchange of described cover plate 21.Described second heat exchanging segment 2413 is at least
Substrate 23 described in part contact, namely described second heat exchanging segment 2413 keeps certain heat exchange area with described substrate 23, is used for
Ensure described Part II 242 can quickly with the heat exchange of described substrate 23.
It should be understood that the described first heat exchanging segment 2411 described cover plate 21 of contact as much as possible, to increase described first
Heat exchanging segment 2411 and the heat exchange area of described cover plate 21, improve heat exchange efficiency.For example, the 70% of described first heat exchanging segment 2411 with
On partly can contact described cover plate 21.Described second heat exchanging segment 2413 contacts described substrate 23, as much as possible to increase
State the heat exchange area of the second heat exchanging segment 2413 and described substrate 23, improve heat exchange efficiency.For example, described second heat exchanging segment 2413
More than 50% partly accessible described substrate 23.Optionally, the portion of more than the 30% of described second side 232 of described substrate 23
Divide and contact with described second heat exchanging segment 2413.
Optionally, the bearing of trend of the bearing of trend of described first heat exchanging segment 2411 and described second heat exchanging segment 2413 is not
With described first linkage section 2412 is twist section or bending segment, for described first heat exchanging segment 2411 of smooth connection and described the
Two heat exchanging segments 2413.
In the present embodiment, the setting of described first linkage section 2412 is so that described first heat exchanging segment 2411 and described
The layout of two heat exchanging segments 2413 can be more flexible, can specifically be arranged according to the position of described heater element 11, also save
About space shared by described single plate radiator 2.
See also Fig. 1, Fig. 2 and Fig. 4, as a kind of alternative embodiment, described first heat exchanging segment 2411 contacts institute
State the described cover plate 21 that is partially submerged into of cover plate 21, what described second heat exchanging segment 2413 contacted described substrate 23 is partially submerged into described base
Plate 23.
In the present embodiment, described first heat exchanging segment 2411 is connected by the way of embedded with described cover plate 21, both can save
About space is it is also possible to ensure described first heat exchanging segment 2411 and described cover plate 21 has enough heat exchange areas, so that institute
State the good effect of heat exchange of the first heat exchanging segment 2411 and described cover plate 21.Described second heat exchanging segment 2413 and described substrate 23 adopt embedding
The mode entering connects, and both can save space it is also possible to ensure that described second heat exchanging segment 2413 is enough with having of described substrate 23
Heat exchange area so that the good effect of heat exchange of described second heat exchanging segment 2413 and described substrate 23.
Certainly, in other embodiments, described first heat exchanging segment 2411 may also be employed fit contact mode connect institute
State cover plate 21.The mode that described second heat exchanging segment 2413 may also be employed laminating contact connects described substrate 23.
See also Fig. 1, Fig. 2 and Fig. 4, as a kind of alternative embodiment, described second heat exchanging segment 2413 is located at institute
State described second side 232 of substrate 23, for contacting described heater element 11.Because described second heat exchanging segment 2413 can directly connect
Touch described heater element 11 (heater element 11 described in heat-conducting medium mediate contact can also be passed through), therefore described heater element 11
The heat sending can be transferred directly to described second heat exchanging segment 2413, then pass through described first linkage section 2412, described first
Heat exchanging segment 2411 is transferred to described cover plate 21 and is radiated, and radiating efficiency is high.Now, the described base of entrance of described heater element 11
The heat of plate 23 still can be transferred to described second heat exchanging segment 2413.
Certainly, in other embodiments, described second heat exchanging segment 2413 also can embed the middle part of described substrate 23.Or
Person, described second heat exchanging segment 2413 may be alternatively located at described first side 231 of described substrate 23, for contacting described radiating fin
22 so that the heat in described second heat exchanging segment 2413 also can be radiated by described radiating fin 22.
See also Fig. 1 and Fig. 2, as a kind of alternative embodiment, described single plate radiator 2 also includes auxiliary heat dissipation wing
Piece 25.Described auxiliary heat dissipation fin 25 be arranged at described cover plate 21 the side towards described substrate 23 and with described radiating fin
22 are spaced.
In the present embodiment, described radiating fin 22 is just to described heater element 11, described auxiliary heat dissipation fin 25 and institute
State radiating fin 22 to be spaced, therefore described auxiliary heat dissipation fin 25 avoids the described heater element 11 on described veneer 1.
Described auxiliary heat dissipation fin 25 can mate each element height in the layout and described veneer 1 of described veneer 1 completely, weakens
Restriction to the layout of described veneer 1, parts selection requires, relative reduction hardware designs difficulty.In short, described auxiliary heat dissipation
It is arranged in each idle space of described veneer 1, it is to avoid increase the body of described communication equipment 100 fin 25 visible seam contact pin
Long-pending.Described auxiliary heat dissipation fin 25 connects described cover plate 21, increased the area of dissipation of described cover plate 21, improves described veneer
The radiating efficiency of radiator 2.
Optionally, described auxiliary heat dissipation fin 25 includes spaced multiple second wings extending from described cover plate 21
Piece.By the heat exchange of the plurality of second fin and air, described auxiliary heat dissipation fin 25 is made to realize radiating.
See also Fig. 1, Fig. 2 and Fig. 4, as a kind of alternative embodiment, described first heat exchanging segment 2411 at least portion
Divide and be located between described auxiliary heat dissipation fin 25 and described cover plate 21.Now, described first heat exchanging segment 2411 and described auxiliary dissipate
There is between hot fin 25 certain heat exchange area, the heat of described first heat exchanging segment 2411 can directly pass through described auxiliary heat dissipation
Fin 25 carries out quick heat radiating, namely the heat of described heater element 11 can be transferred to by described Part I 241 described auxiliary
Radiating fin 25 is helped to be radiated.
Optionally, the quantity of described auxiliary heat dissipation fin 25 is at least two.Auxiliary heat dissipation fin 25 described at least two
Interval setting.Described heat pipe 24 also includes Part III, and described Part III contacts described cover plate 21 and connects at least two institutes
State auxiliary heat dissipation fin 25.
In the present embodiment, described cover plate 21 and institute can be passed through described at least two between auxiliary heat dissipation fin 25 simultaneously
The described Part III stating heat pipe 24 carries out heat transfer so that described cover plate 21 can keep preferably equal temperature state.
See also Fig. 1 and Fig. 2, as a kind of alternative embodiment, the quantity of described radiating fin 22 is at least two,
Described at least two, radiating fin 22 is spaced.The quantity of described substrate 23 is at least two, substrate 23 described at least two
It is respectively connecting to different described radiating fins 22, to form at least two groups heat-sink units 26 independent of one another, be on described veneer 1
Different described heater elements 11 radiates.
In the present embodiment, because described single plate radiator 2 is formed with least two groups heat-sink units 26 independent of one another, it is used for
On described veneer 1, different heater elements 11 radiates, and therefore described single plate radiator 2 can achieve all of on described veneer 1
The radiating work of described heater element 11.Described single plate radiator 2 is attached to described veneer 1, that is, completes described veneer 1 institute
The installment work of all radiating elements needing, installation procedure is convenient, fast, improves the production efficiency of described communication equipment 100.
It should be understood that position on described cover plate 21 for the described heat-sink unit 26 and described heater element 11 are in described list
Position on the printed circuit board (PCB) 12 of plate 1 corresponds.
See also Fig. 1, Fig. 2, Fig. 4 and Fig. 5, optionally, described heat pipe 24 also includes Part II 242, described
Part II 242 includes the 3rd heat exchanging segment 2421, the second linkage section 2422 and the 4th heat exchanging segment 2423 of smooth connection.Described
3rd heat exchanging segment 2421 at least partly contacts a described substrate 23, and described 4th heat exchanging segment 2423 at least partly contacts another
Described substrate 23.Samming between multiple described substrates 23 be can achieve by described Part II 242, improve described veneer radiating
The radiating effect of device 2.
Optionally, described second heat exchanging segment 2413 of same described substrate 23 and described 3rd heat exchanging segment 2421 are contacted
Quantity is multiple, and described second heat exchanging segment 2413 and described 3rd heat exchanging segment 2421 are arranged alternately.Described second heat exchanging segment
2413 can be contacted with described 3rd heat exchanging segment 2421, also can be contacted with described 3rd heat exchanging segment 2421 by described substrate 23.Institute
State the second heat exchanging segment 2413 can carry out heat exchange from described 3rd heat exchanging segment 2421 so that different described substrates 23 can pass through same
Individual described auxiliary heat dissipation fin 25 is radiated, and improves the radiating efficiency of described single plate radiator 2.Described second heat exchanging segment
2413 are arranged alternately, with described 3rd heat exchanging segment 2421, the even temperature effect being also beneficial to realize described substrate 23.
Optionally, the quantity of described radiating fin 22 is multiple, and the quantity of described auxiliary heat dissipation fin 25 is more than or equal to institute
State the quantity of radiating fin 22, so that multiple described radiating fins 22 is connected correspondingly to not by described Part I 241
Same described auxiliary heat dissipation fin 25.Described substrate 23 is at least equipped with a described radiating fin 22 and a described auxiliary heat dissipation
Fin 25, has enough area of dissipations, good heat dissipation effect.
It should be understood that as shown in Fig. 2 in one embodiment, described single plate radiator 2 also includes second substrate
27, described second substrate 27 is mainly used in being radiated for the less heater element of power consumption on described veneer 1.Described heat pipe 24 can
Be not directly connected described second substrate 27, but connects described second substrate 27 by radiating fin 28.
See also Fig. 1, Fig. 2, Fig. 4, Fig. 6 and Fig. 7, as a kind of alternative embodiment, described single plate radiator 2 is also
Including the first securing member 201, described first securing member 201 is connected between described cover plate 21 and described substrate 23, is used for making institute
State the relatively described cover plate 21 of substrate 23 fixing.
In the present embodiment, described single plate radiator 2 is assembled into by an entirety by described first securing member 201, makes
Obtain described single plate radiator 2 and can disposably, easily be attached to described veneer 1.
For example, described substrate 23 includes fastening frame 233, diapire 234 and is formed at the projection on described diapire 234
Portion 235.Described diapire 234 includes described first side 231, namely described diapire 234 is oppositely arranged with described cover plate 21, and described
Side 231 is formed at the side away from described lobe 235 of described diapire 234.Described lobe 235 includes described second side
232, namely described lobe 235 be located at described substrate 23 the side away from described cover plate 21, described second side 232 is formed at
The side away from described diapire 234 of described lobe 235.Described fastening frame 233 encloses and is located at described lobe 235 periphery and supports
Connect described diapire 234, described fastening frame 233 and described cover plate 21 are connected by described first securing member 201.Now, described tight
Gu described diapire 234 is limited between described fastening frame 233 and described cover plate 21 frame 233, it is formed on described diapire 234
The position of described lobe 235 is equally limited, and can prevent during described single plate radiator 2 is attached to described veneer 1
Only described substrate 23 departs from described cover plate 21.
It should be understood that described lobe 235 is integrally formed with described diapire 234 or is fixed to one another by assembling realization.
Described fastening frame 233 is separable with described diapire 234, described lobe 235.Described diapire 234 can be used for carrying described radiating
Fin 22.Described lobe 235 is provided with multiple grooves, for housing described heat pipe 24.
Optionally, the quantity of described first securing member 201 is multiple, and multiple described first securing members 201 are equably or greatly
Cause to be uniformly distributed in the surrounding of described fastening frame 233, thus equably fixing described fastening frame 233 and described cover plate 21.Institute
State the first securing member 201 and can adopt bolt.
Optionally, described single plate radiator 2 also includes coupling assembly 202, by described coupling assembly 202 by described diapire
234 are attached to described veneer 1, are used for making described lobe 235 contact described heater element 11.
For example, described coupling assembly 202 includes the second securing member 2021 and is set in described second securing member 2021
The elastic component 2022 in outside.Described second securing member 2021 connects described diapire 234 and described veneer 1, is used for preventing described bottom
Wall 234 departs from described veneer 1.Described elastic component 2022 is compressed in the side away from described veneer 1 of described diapire 234, uses
In generation, described diapire 234 is pushed to the elastic force of described veneer 1, so that the described projection being formed on described diapire 234
Portion 235 is in close contact described heater element 11.
Described second securing member 2021 can adopt bolt, and described elastic component 2022 is compressed in head and the institute of described bolt
State between diapire 234.Because the relatively described veneer 1 of the head of described bolt is fixing, therefore described elastic component 2022 produces institute
State the elastic force that diapire 234 pushes described veneer 1 to.Described elastic component 2022 can adopt spring.
Optionally, the quantity of described coupling assembly 202 is multiple, and multiple described coupling assemblies 202 are equably or substantially equal
It is arranged in the surrounding of described diapire 234, thus equably fixing described substrate 23 and described cover plate 21 evenly.
Certainly, in other embodiments, described substrate 23 can be integrated.By securing member by described substrate 23
It is attached to described veneer 1, thus completing the installation of described single plate radiator 2.
Optionally, described single plate radiator 2 also includes keeper 203, and described keeper 203 is used for described cover plate 21 is fixed
Position is to described veneer 1.Described single plate radiator 2 when mounted, can first pass through described keeper 203 make described cover plate 21 position to
Described substrate 23 is then attached to described veneer 1 by coupling assembly 202 by the described printed circuit board (PCB) 12 of described veneer 1.As
Shown in Fig. 1, described veneer 1 also includes pedestal 13, and described pedestal 13 houses described heater element 11, and described coupling assembly 202 can
Described substrate 23 is attached to described pedestal 13, so that described substrate 23 contacts described heater element 11.
Above the embodiment of the present application is described in detail, specific case used herein to the principle of the application and
Embodiment is set forth, and the explanation of above example is only intended to help and understands the present processes and its core concept；
Simultaneously for one of ordinary skill in the art, according to the thought of the application, all can in specific embodiments and applications
In place of having change, in sum, this specification content should not be construed as the restriction to the application.
Claims (16)
1. a kind of single plate radiator, for the veneer radiating for communication equipment it is characterised in that including：
Cover plate, described cover plate is at least part of shell of described communication equipment；
Radiating fin；
Substrate, including the first side being oppositely arranged and the second side, described first side and described cover plate are oppositely arranged, described radiating fin
Located between described first side and described cover plate, described second side is located at the side away from described cover plate for the described substrate to piece, described
Second side is used for connecting the heater element on described veneer, and described substrate is fixedly installed to described cover plate；And
Heat pipe, described heat pipe section connects described cover plate, partly connects described substrate.
2. single plate radiator as claimed in claim 1 is it is characterised in that described heat pipe includes Part I, described first
Divide the first heat exchanging segment, the first linkage section and the second heat exchanging segment including being sequentially connected, described first heat exchanging segment at least partly connects
Touch described cover plate, described second heat exchanging segment at least partly contacts described substrate.
3. single plate radiator as claimed in claim 2 is it is characterised in that described first heat exchanging segment contacts the part of described cover plate
Embed described cover plate, described second heat exchanging segment contact described substrate be partially submerged into described substrate.
4. single plate radiator as claimed in claim 2 or claim 3 is it is characterised in that described second heat exchanging segment is located at described substrate
Described second side, for contacting described heater element.
5. single plate radiator as claimed in claim 2 is it is characterised in that described single plate radiator also includes auxiliary heat dissipation wing
Piece, described auxiliary heat dissipation fin is arranged at the side towards described substrate and with described radiating fin to each other of described cover plate
Every.
6. single plate radiator as claimed in claim 5 it is characterised in that described first heat exchanging segment be at least partially disposed at described auxiliary
Help between radiating fin and described cover plate.
7. single plate radiator as claimed in claim 2 is it is characterised in that the quantity of described radiating fin is at least two, extremely
Few two described radiating fins are spaced, and the quantity of described substrate is at least two, and described at least two, substrate connects respectively
To different described radiating fins, to form at least two groups heat-sink units independent of one another, it is different on described veneer described
Thermal element radiates.
8. single plate radiator as claimed in claim 7 is it is characterised in that described heat pipe also includes Part II, and described second
Part includes the 3rd heat exchanging segment in smoothing junction, the second linkage section and the 4th heat exchanging segment；
Described 3rd heat exchanging segment at least partly contacts a described substrate, and described 4th heat exchanging segment at least partly contacts another institute
State substrate.
9. single plate radiator as claimed in claim 8 is it is characterised in that contact described second heat exchange of same described substrate
The quantity of section and described 3rd heat exchanging segment is multiple, and described second heat exchanging segment is arranged alternately with described 3rd heat exchanging segment.
10. single plate radiator as claimed in claim 1 is it is characterised in that described substrate heat conductivity is higher than 180W/ (m
K).
11. single plate radiators as claimed in claim 1 it is characterised in that described single plate radiator also includes the first securing member,
Described first securing member is connected between described cover plate and described substrate, is used for making the relatively described cover plate of described substrate fix.
12. single plate radiators as claimed in claim 11 are it is characterised in that described substrate includes fastening frame, diapire and shape
Become the lobe on described diapire, described diapire includes described first side, described lobe includes described second side, described tight
Gu frame enclose be located at described lobe periphery and abut described diapire, by described first securing member connect described fastening frame with described
Cover plate.
13. single plate radiators as claimed in claim 12 it is characterised in that described single plate radiator also includes coupling assembly,
Described diapire is attached to by described veneer by described coupling assembly, is used for making described lobe contact described heater element.
14. single plate radiators as claimed in claim 13 are it is characterised in that described coupling assembly includes the second securing member and set
It is located at the elastic component outside described second securing member, described second securing member connects described diapire and described veneer, described elasticity
Part is compressed in the side away from described veneer of described diapire, for producing the elasticity that described diapire is pushed to described veneer
Power.
15. single plate radiators as described in any one of claim 11～14 are it is characterised in that described single plate radiator also includes
Keeper, described keeper is used for positioning described cover plate to described veneer.
A kind of 16. communication equipments are it is characterised in that include veneer and the radiating of the veneer as described in any one of claim 1～15
Device, described veneer is provided with heater element, and described single plate radiator is attached to described veneer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611066927.0A CN106455452B (en) | 2016-11-25 | 2016-11-25 | Single plate radiator and communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611066927.0A CN106455452B (en) | 2016-11-25 | 2016-11-25 | Single plate radiator and communication equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106455452A true CN106455452A (en) | 2017-02-22 |
| CN106455452B CN106455452B (en) | 2019-02-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611066927.0A Active CN106455452B (en) | 2016-11-25 | 2016-11-25 | Single plate radiator and communication equipment |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2850216Y (en) * | 2005-11-08 | 2006-12-20 | 佛山市顺德区汉达精密电子科技有限公司 | Radiator |
| CN1925735A (en) * | 2005-09-02 | 2007-03-07 | 富准精密工业(深圳)有限公司 | Heat pipe radiator |
| CN2930226Y (en) * | 2006-06-20 | 2007-08-01 | 中兴通讯股份有限公司 | Combined heat sink |
| CN101094579A (en) * | 2006-06-21 | 2007-12-26 | 富准精密工业(深圳)有限公司 | Heat sink for heat pipe |
| CN104039115A (en) * | 2014-05-14 | 2014-09-10 | 中山伟强科技有限公司 | Mobile phone heat dissipation module |
-
2016
- 2016-11-25 CN CN201611066927.0A patent/CN106455452B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1925735A (en) * | 2005-09-02 | 2007-03-07 | 富准精密工业(深圳)有限公司 | Heat pipe radiator |
| CN2850216Y (en) * | 2005-11-08 | 2006-12-20 | 佛山市顺德区汉达精密电子科技有限公司 | Radiator |
| CN2930226Y (en) * | 2006-06-20 | 2007-08-01 | 中兴通讯股份有限公司 | Combined heat sink |
| CN101094579A (en) * | 2006-06-21 | 2007-12-26 | 富准精密工业(深圳)有限公司 | Heat sink for heat pipe |
| CN104039115A (en) * | 2014-05-14 | 2014-09-10 | 中山伟强科技有限公司 | Mobile phone heat dissipation module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106455452B (en) | 2019-02-26 |
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Effective date of registration: 20211228 Address after: 450046 Floor 9, building 1, Zhengshang Boya Plaza, Longzihu wisdom Island, Zhengdong New Area, Zhengzhou City, Henan Province Patentee after: xFusion Digital Technologies Co., Ltd. Address before: 518129 Bantian HUAWEI headquarters office building, Longgang District, Guangdong, Shenzhen Patentee before: HUAWEI TECHNOLOGIES Co.,Ltd. |
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