CN220307639U - Heat conduction device for micro-autonomous navigation equipment - Google Patents
Heat conduction device for micro-autonomous navigation equipment Download PDFInfo
- Publication number
- CN220307639U CN220307639U CN202321524566.5U CN202321524566U CN220307639U CN 220307639 U CN220307639 U CN 220307639U CN 202321524566 U CN202321524566 U CN 202321524566U CN 220307639 U CN220307639 U CN 220307639U
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- heat
- heat conduction
- shell
- circuit assembly
- micro
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- 239000000463 material Substances 0.000 claims abstract description 18
- 238000002791 soaking Methods 0.000 claims abstract description 16
- 239000004519 grease Substances 0.000 claims abstract description 11
- 230000017525 heat dissipation Effects 0.000 claims abstract description 5
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 239000011248 coating agent Substances 0.000 claims abstract description 3
- 238000000576 coating method Methods 0.000 claims abstract description 3
- 239000004020 conductor Substances 0.000 description 8
- 238000009434 installation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat conduction device for micro-autonomous navigation equipment, wherein a heat conduction interface material part (43) comprises a heat conduction pad (431) and heat conduction grease (432); the circuit assembly (1) is arranged on a mounting point of the shell (2), and a heat conduction interface material (43) is arranged between a heating module on the circuit assembly (1) and the shell (2) for flexible auxiliary heat conduction; a soaking plate (42) is arranged in the soaking surface (31) of the cover plate (3), and a heat conducting pad (431) or a coating heat conducting grease (432) is arranged on an upper circuit after the circuit assembly (1) is assembled; one side of the cover plate (3) is the upper side; the heat pipe (41) is arranged on the inner side of the shell (2), and the heat pipe heat conduction loop is formed by the external mounting point of the shell (2) and the high-heat device on the inner lower side of the circuit assembly (1). The utility model can well solve the heat dissipation problem of the micro-autonomous navigation equipment.
Description
Technical Field
The utility model relates to a heat conduction device, in particular to a heat conduction device of micro-autonomous navigation equipment.
Background
The existing micro-autonomous navigation equipment mainly dissipates heat through the heat conduction pad/glue system shell so as to achieve the heat conduction effect. However, the conventional micro-system often has the problems that the heat with larger device power cannot be conducted in time, so that the temperature rise of the conventional micro-autonomous navigation equipment is larger and the heat transfer efficiency is lower.
Disclosure of Invention
The utility model provides a heat conduction device of micro-autonomous navigation equipment, which is used for solving the heat dissipation problem of the micro-autonomous navigation equipment.
A heat conduction device for micro-autonomous navigation equipment comprises a shell 2, a circuit assembly 1, a cover plate 3 and a heat conduction material part 4; the shell 2 comprises a heat conducting surface 21 and an external mounting point 22, and the cover plate 3 comprises a heat equalizing surface 31; the heat conducting material part 4 comprises a heat pipe 41, a soaking plate 42 and a heat conducting interface material part 43, and is arranged on the heat conducting surface 21 and the soaking surface 31; the thermally conductive interface material part 43 includes a thermally conductive pad 431 and a thermally conductive grease 432;
the circuit assembly 1 is arranged on the mounting point of the shell 2, wherein a heat conduction interface material 43 is arranged between the heating module on the circuit assembly 1 and the shell 2 for flexible auxiliary heat conduction; a soaking plate 42 is arranged in the soaking surface 31 of the cover plate 3, and a heat conducting pad 431 or a coating heat conducting grease 432 is arranged on an upper circuit after the circuit assembly 1 is assembled; one side of the cover plate 3 is the upper side;
the heat pipe 41 is arranged on the inner side of the shell 2, and the shell 2 forms a phase-change heat pipe heat conduction loop with the external mounting point and the high-heat device on the inner lower side of the circuit assembly 1.
Further, a toothed heat sink is provided on the outer side of the housing 2.
The micro-autonomous navigation device is characterized in that various functional modules of the micro-autonomous navigation device are combined on the shell, and high-power-consumption devices are interconnected with the shell through the heat conducting pad. The heat pipe with a specific path is buried in the shell, and the heat of the high-power consumption device is transferred to the external installation area to release the internal heat.
Drawings
FIG. 1 is a front view of a micro-autonomous navigation device of the present utility model;
FIG. 2 is a rear view of the micro-autonomous navigation device of the present utility model;
FIG. 3 is a schematic cross-sectional view of a corresponding front view;
FIG. 4 is a schematic view of a housing portion heat transfer device;
FIGS. 5 and 6 are schematic views of the outer shape of the shell;
fig. 7 is a schematic view of a cover plate portion heat conduction device.
Detailed Description
The heat conducting device comprises a circuit, a shell and a heat conducting material component.
The main circuit is mounted on a support provided by the housing, and the high power device is arranged on the lower side of the circuit. The high power device and the inner side of the shell together define a heat conducting surface. The thermally conductive surface presents a stepped feature in the housing.
The heat conducting material part is arranged in the heat conducting surface and used for filling the gap between the circuit and the shell to enhance the heat conducting performance, and the side edge of the heat conducting surface of the shell is limited by the heat conducting material part.
The heat pipe is buried in the shell to quickly transfer the heat transferred into the shell by the heat conducting material component. The heat pipe plans the route according to inside high heater position for heat conduction material part heat transmits to the casing and installs the point outward fast, and lets the heat that main circuit produced obtain more slow temperature rise.
The cover plate is mounted on the housing. The secondary circuit is inserted on the primary circuit, and the thermally conductive material member is attached to the cover plate at the secondary circuit high power device location. The heat-equalizing plate is arranged in the cover plate to rapidly and uniformly distribute heat of the high-power device on the cover plate, and the heat is transferred to the shell and the external environment.
The utility model is described in further detail below with reference to the accompanying drawings.
Referring to fig. 1 to 5, an embodiment of the present utility model is shown. First, directional terms of what is described herein are defined. In fig. 1, the definition above the picture is the front side, and the definition below it is the rear side; in fig. 3, the definition on the left side of the picture is the lower side, and the definition on the right side is the upper side. As shown in fig. 3, the system includes a housing 2, a circuit assembly 1, a cover plate 3, and a thermally conductive material member 4. The housing 2 defines a heat conducting surface 21 and an external mounting point 22, and the cover plate 3 defines a heat equalizing surface 31. The heat conducting material part 4 is provided with heat pipes 41, a soaking plate 42, and heat conducting interface materials 43, heat conducting pads 431, heat conducting grease 432 and other components which are not labeled in the drawings, and is arranged on the heat conducting surface 21 and the soaking surface 31 for conducting heat energy. In this embodiment, the heat conduction device for the micro-autonomous navigation device is exemplified by the circuit component 1, the heat generated by the circuit component 1 is exemplified by one of the devices, the circuit components 1 are connected by metal for conducting heat, and materials including the heat conduction pad 431, the heat conduction grease 432 and the like are attached for conducting auxiliary heat. However, the mounting height of the heat conducting surface 21 is not limited, and may be any other height and size, and the implementation of the heat conducting scheme may also be changed according to the implementation of the circuit assembly 1, and is not limited to a specific form.
The following is one embodiment:
the circuit assembly 1 is mounted on a mounting point of the housing 2, wherein a heat-conducting interface material 43 is arranged between the heating module on the circuit assembly 1 and the housing 2 for flexible auxiliary heat conduction. The soaking surface 31 defined by the cover plate 3 is internally provided with a soaking plate 42, after the circuit assembly 1 is assembled, an upper circuit can be provided with a heat conducting pad 431 or coated heat conducting grease 432, and after the cover plate 3 is assembled, the upper heat is further assisted to be transferred out.
The heat pipe 41 arranged on the inner side of the shell 2 forms a phase change heat pipe heat conduction loop with the heat conduction coefficient ranging from 10000 to 100000W/Mm.k with the external installation point of the shell 2 and the high-heat device on the inner lower side of the circuit component 1 according to the scheme shown in fig. 4, and heat released by the high-power device in the circuit component 1 reaches the heat conduction surface 21 after being conducted by the heat conduction interface materials such as the heat conduction pad 431 or the heat conduction grease 432, so that the series heat conduction of two circuits in the circuit component 1 can be realized in the same heat conduction loop, and further heat generated by the device is conducted to the external installation point 22 of the shell 2 to be released to the outside.
The heat generated by the upper circuit of the vapor chamber circuit component 1 is conducted by the heat conducting interface materials 43 such as the heat conducting pad 431 or the heat conducting grease 432 and then conducted to the vapor chamber 42 through the vapor chamber 31, and the performance is improved by 20% -30% compared with that of a heat pipe. The soaking plate 42 is uniformly distributed with heat distribution and the surface of the cover plate 3, and heat conduction is further realized to the external mounting point 22 through environmental convection and conduction to the shell 2.
In summary, the heat pipe 41 and the soaking board 42 can avoid the defect that the double-layer circuit and the circuits cannot dissipate heat effectively, and the core board and the IMU board in the circuit assembly 1 are connected in series effectively to guide out heat energy to the mounting point through the heat pipe path planning. In addition, the gap between the heating device and the housing 2 can be filled by the heat conduction interface material 43, so that the heat conduction effect is improved. In addition, by the tooth-shaped heat dissipation groove-shaped appearance outside the shell 2, the convection heat dissipation area can be further increased while the system identification is displayed.
The above embodiments are only limited to the explanation and description of the technical solutions of the present utility model, but should not be construed as limiting the scope of the claims. It should be clear to those skilled in the art that any simple modification or substitution of the technical solution of the present utility model results in a new technical solution that falls within the scope of the present utility model.
Claims (2)
1. The heat conduction device for the micro-autonomous navigation equipment is characterized by comprising a shell (2), a circuit assembly (1), a cover plate (3) and a heat conduction material component (4); the shell (2) comprises a heat conducting surface (21) and an opposite external mounting point (22), and the cover plate (3) comprises a heat balancing surface (31); the heat conduction material component (4) comprises a heat pipe (41), a soaking plate (42) and a heat conduction interface material component (43), and is arranged on the heat conduction surface (21) and the soaking surface (31); the thermally conductive interface material component (43) includes a thermally conductive pad (431) and a thermally conductive grease (432);
the circuit assembly (1) is arranged on a mounting point of the shell (2), and a heat conduction interface material part (43) is arranged between a heating module on the circuit assembly (1) and the shell (2) for flexible auxiliary heat conduction; a soaking plate (42) is arranged in the soaking surface (31) of the cover plate (3), and a heat conducting pad (431) or a coating heat conducting grease (432) is arranged on an upper circuit after the circuit assembly (1) is assembled; one side of the cover plate (3) is the upper side;
the heat pipe (41) is arranged on the inner side of the shell (2), and the heat pipe heat conduction loop is formed by the external mounting point of the shell (2) and the high-heat device on the inner lower side of the circuit assembly (1).
2. The heat conducting device for micro-autonomous navigation equipment according to claim 1, wherein the outer side of the shell (2) is provided with tooth-shaped heat dissipation grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321524566.5U CN220307639U (en) | 2023-06-14 | 2023-06-14 | Heat conduction device for micro-autonomous navigation equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321524566.5U CN220307639U (en) | 2023-06-14 | 2023-06-14 | Heat conduction device for micro-autonomous navigation equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220307639U true CN220307639U (en) | 2024-01-05 |
Family
ID=89350463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321524566.5U Active CN220307639U (en) | 2023-06-14 | 2023-06-14 | Heat conduction device for micro-autonomous navigation equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220307639U (en) |
-
2023
- 2023-06-14 CN CN202321524566.5U patent/CN220307639U/en active Active
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