CN220307639U - Heat conduction device for micro-autonomous navigation equipment - Google Patents

Abstract

The utility model discloses a thermal conductive device for micro-autonomous navigation equipment. The thermal interface material component (43) includes a thermal conductive pad (431) and thermal conductive grease (432); the circuit component (1) is installed at the installation point of the housing (2). On the circuit assembly (1), a thermal interface material (43) is provided between the heating module and the casing (2) for flexible auxiliary heat conduction; a uniform heating plate (31) is provided in the uniform heat surface (31) of the cover plate (3). 42), after the circuit component (1) is assembled, a thermal pad (431) or thermal grease (432) is applied to the upper circuit; one side of the cover (3) is the upper side; a heat pipe (2) is installed inside the casing (2) 41), the external mounting point of the housing (2) and the high-heat device on the inner and lower side of the circuit component (1) form a phase change heat pipe heat conduction circuit. The invention can well solve the heat dissipation problem of micro-autonomous navigation equipment.

Description

A heat conduction device for micro-autonomous navigation equipment

Technical field

The utility model relates to a heat conduction device, in particular to a heat conduction device of micro-autonomous navigation equipment.

Background technique

Existing micro-autonomous navigation equipment mainly dissipates heat through the thermal pad/glue system casing to achieve the heat conduction effect. However, in existing microsystems, there are often situations where the heat of the device with high power cannot be conducted in time, which leads to the problems of large temperature rise and low heat transfer efficiency of the existing microautonomous navigation equipment.

Utility model content

The utility model provides a heat conduction device for micro-autonomous navigation equipment, which is used to solve the heat dissipation problem of micro-autonomous navigation equipment.

A thermal conductive device for micro-autonomous navigation equipment, including a shell 2, a circuit component 1, a cover plate 3 and a thermal conductive material component 4; the shell 2 includes a thermal conductive surface 21 and an external mounting point 22, and the cover plate 3 includes a uniform heat surface 31; The thermally conductive material component 4 includes a heat pipe 41, a vapor chamber 42, and a thermally conductive interface material component 43, and is installed on the thermally conductive surface 21 and the thermally uniform surface 31; the thermally conductive interface material component 43 includes a thermally conductive pad 431 and a thermally conductive grease 432;

The circuit component 1 is installed on the mounting point of the casing 2, and a thermal interface material 43 is provided between the heating module on the circuit component 1 and the casing 2 for flexible auxiliary heat conduction; the uniform heat surface 31 of the cover plate 3 is provided with For the vapor chamber 42, after the assembly of the circuit component 1 is completed, a thermal pad 431 or thermal grease 432 is applied to the upper circuit; the side of the cover plate 3 is the upper side;

A heat pipe 41 is provided inside the housing 2. The external mounting point of the housing 2 and the high-heat device on the lower side of the circuit assembly 1 form a phase change heat pipe heat conduction circuit.

Furthermore, a toothed heat dissipation groove is provided on the outside of the housing 2 .

The utility model combines various functional modules of the micro-autonomous navigation equipment on the casing, and high-power consumption devices are interconnected with the casing through thermal pads. There are heat pipes with specific paths embedded inside the casing, which transfer the heat from high-power devices to the external installation area to release the internal heat.

Description of drawings

Figure 1 is a front view of the micro-autonomous navigation device of the present invention;

Figure 2 is a rear view of the micro-autonomous navigation device of the present invention;

Figure 3 is a schematic cross-sectional view corresponding to the front view;

Figure 4 is a schematic diagram of the heat conduction device of the housing part;

Figures 5 and 6 are schematic diagrams of the shell appearance;

Figure 7 is a schematic diagram of the heat conduction device of the cover plate.

Detailed ways

The heat conduction device of the utility model includes a circuit, a casing and heat conduction material components.

The main circuit is installed on the support provided by the casing, and its high-power devices are set on the lower side of the circuit. The high-power device and the inside of the housing jointly define a thermal conductive surface. The heat-conducting surface has a stepped feature in the housing.

The thermally conductive material component is disposed in the thermally conductive surface to fill the gap between the circuit and the housing to enhance thermal conductivity, and the side edges of the thermally conductive surface of the housing limit the thermally conductive material component.

A heat pipe is embedded inside the casing to quickly transfer the heat transferred into the casing from the thermally conductive material components. The heat pipe plans a path according to the position of the internal high-heater, so that the heat of the thermally conductive material components can be quickly transferred to the external installation point of the shell, so that the heat generated by the main circuit can gain a slower temperature rise.

The cover plate is installed on the housing. The auxiliary circuit is inserted into the main circuit, and the thermal conductive material component is attached to the cover plate at the position of the high-power device of the auxiliary circuit. A vapor chamber is installed inside the cover to quickly and evenly distribute the heat of high-power devices across the cover and transfer it to the housing and the external environment.

The utility model will be further described in detail below in conjunction with the accompanying drawings.

Refer to Figures 1 to 5, which are embodiments of the present utility model. First define the directional terms for what is being described here. In Figure 1, what is located above the picture is defined as the front side, and what is located below it is defined as the back side; in Figure 3, what is located on the left side of the picture is defined as the lower side, and what is located on the right is defined as the upper side. As shown in Figure 3, the system includes a housing 2, a circuit component 1, a cover 3 and a thermally conductive material component 4. The housing 2 defines a heat conduction surface 21 and an external mounting point 22 , and the cover plate 3 defines a uniform heat surface 31 . The thermally conductive material component 4 is provided with a heat pipe 41, a vapor chamber 42, a thermally conductive interface material 43, a thermally conductive pad 431, a thermally conductive grease 432 and other components not shown in the figure, and are installed on the thermally conductive surface 21 and the thermally uniform surface 31 to conduct heat. energy. In this embodiment, the thermal conductive device for micro-autonomous navigation equipment is exemplified by circuit component 1, and the heat generated by circuit component 1 is exemplified by one of the types of devices that generate heat, and metal connections are used between circuit components 1 for heat conduction, and thermal pads are attached to them. 431, thermal grease 432 and other materials to assist heat transfer. However, the installation height of the heat conduction surface 21 is not limited, and it can also be a device of other heights and sizes. The implementation of the heat conduction solution can also be changed corresponding to the implementation of the circuit component 1 and is not limited to a specific form.

The following is a specific embodiment:

The circuit component 1 is installed on the mounting point of the housing 2. A thermal interface material 43 is provided between the heating module on the circuit component 1 and the housing 2 for flexible auxiliary heat conduction. There is a heating plate 42 in the uniform heat surface 31 defined by the cover plate 3. After the assembly of the circuit component 1 is completed, the upper circuit can be provided with a thermal pad 431 or coated with thermal conductive grease 432, which will further assist after the installation of the cover plate 3 is completed. Heat is transferred from the upper part.

The heat pipe 41 provided inside the casing 2 forms a phase change heat pipe thermal conduction circuit according to the external mounting point of the casing 2 and the high-heat device on the lower side of the circuit component 1 as shown in Figure 4. Its thermal conductivity range is 10000-100000W/Mm·k. The circuit component 1 The heat released in the medium and high power devices is conducted through thermal interface materials such as thermal pad 431 or thermal grease 432 and then reaches the thermal conductive surface 21. Through this path planning, series heat conduction of two circuits in circuit component 1 can be achieved in the same thermal conductive loop, further enabling The heat generated by the device is conducted to the housing 2 and released to the outside through the external mounting point 22 .

A vapor chamber is provided on the inside of the cover 3. The heat generated by the upper circuit of the circuit assembly 1 is conducted through the thermal conductive interface material 43 such as the thermal pad 431 or thermal grease 432, and then is conducted to the vapor chamber 42 through the vapor chamber surface 31. The performance is 20% higher than that of the heat pipe. -30%. The heat distribution is evenly distributed on the surface of the cover plate 3 by the vapor chamber 42, and is further conducted to the housing 2 through environmental convection and conduction, and then to the external installation point 22 to achieve heat conduction.

In summary, the heat pipe 41 and the vapor chamber 42 can avoid the defects of double-layer circuits and multiple circuits that cannot effectively dissipate heat. Through heat pipe path planning, the core board and the IMU board in the circuit component 1 can be effectively connected in series to export heat energy to the installation. point. In addition, the thermal conductive interface material 43 can fill the gap between the heating device and the housing 2 to improve the thermal conductivity effect. In addition, through the toothed heat dissipation groove shape on the outside of the housing 2, the convection heat dissipation area can be further increased while displaying the system logo.

The above-mentioned specific embodiments are limited to explaining and describing the technical solution of the present invention, but do not constitute a limitation on the scope of protection of the claims. It should be clear to those skilled in the art that any new technical solution obtained by simply deforming or replacing the technical solution of the present utility model will fall within the protection scope of the present utility model.

Claims (2)

1. The heat conduction device for the micro-autonomous navigation equipment is characterized by comprising a shell (2), a circuit assembly (1), a cover plate (3) and a heat conduction material component (4); the shell (2) comprises a heat conducting surface (21) and an opposite external mounting point (22), and the cover plate (3) comprises a heat balancing surface (31); the heat conduction material component (4) comprises a heat pipe (41), a soaking plate (42) and a heat conduction interface material component (43), and is arranged on the heat conduction surface (21) and the soaking surface (31); the thermally conductive interface material component (43) includes a thermally conductive pad (431) and a thermally conductive grease (432);

the circuit assembly (1) is arranged on a mounting point of the shell (2), and a heat conduction interface material part (43) is arranged between a heating module on the circuit assembly (1) and the shell (2) for flexible auxiliary heat conduction; a soaking plate (42) is arranged in the soaking surface (31) of the cover plate (3), and a heat conducting pad (431) or a coating heat conducting grease (432) is arranged on an upper circuit after the circuit assembly (1) is assembled; one side of the cover plate (3) is the upper side;

the heat pipe (41) is arranged on the inner side of the shell (2), and the heat pipe heat conduction loop is formed by the external mounting point of the shell (2) and the high-heat device on the inner lower side of the circuit assembly (1).

2. The heat conducting device for micro-autonomous navigation equipment according to claim 1, wherein the outer side of the shell (2) is provided with tooth-shaped heat dissipation grooves.