US20120205084A1 - Heat sink module - Google Patents
Heat sink module Download PDFInfo
- Publication number
- US20120205084A1 US20120205084A1 US13/025,160 US201113025160A US2012205084A1 US 20120205084 A1 US20120205084 A1 US 20120205084A1 US 201113025160 A US201113025160 A US 201113025160A US 2012205084 A1 US2012205084 A1 US 2012205084A1
- Authority
- US
- United States
- Prior art keywords
- heat
- heat sink
- heat conduction
- fin
- sink module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/30—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/001—Particular heat conductive materials, e.g. superconductive elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A heat sink module includes at least one heat conduction base, at least one heat conduction pipe and a fin heat sink. The heat conduction base has a recess and at least one engaging protrusion on the recess. The heat conduction pipe has a heat absorption end and a heat dissipation end. The heat absorption end is attached to the recess of the heat conduction base and engaged with the engaging protrusion. The heat dissipation end is coupled to the fin heat sink. The fin heat sink is composed of a plurality of fins which are disposed side by side and connected by the heat dissipation end of the heat conduction pipe. The fin heat sink has an engaging groove for engagement of a curved section of a fixing plate of a heat dissipation fan. The heat dissipation fan can be quickly coupled to the fin heat sink, simplifying the assembly of the heat sink module.
Description
- (a) Field of the Invention
- The present invention relates to a heat sink module, and more particularly to a heat sink module for a notebook computer. The heat sink module includes a heat conduction base, a heat conduction pipe and a fin heat sink or further includes a heat dissipation fan, which can be assembled quickly and securely.
- (b) Description of the Prior Art
- A notebook computer has a CPU, a north bridge chip, a south bridge chip, a display chip, or the like therein. These electronic elements will generate heat when running. It is required to couple the notebook computer with a heat sink and a fan to dissipate the heat for providing a stable running.
- A conventional heat sink module comprises a heat conduction base, a heat conduction pipe, a fin heat sink and a fan. The heat conduction base has a recess (or a through hole) for insertion of a heat absorption end of the heat conduction pipe. A heat dissipation end of the heat conduction pipe is welded or coupled to the fin heat sink. The heat conduction base of the conventional heat sink module is a thick rectangular block. The inner surface of the recess (or the through hole) of the heat conduction base is smooth and the outer surface of the heat conduction pipe is also smooth, so the connection of the heat absorption end of the heat conduction pipe is not stable. The heat absorption end of the heat conduction pipe may become loose, thus causing a bad contact and the heat of the heating element cannot be transmitted to the fin heat sink. Accordingly, the inventor of the present invention has devoted himself with his many years of practical experiences to solving this problem.
- The primary object of the present invention is to provide a heat sink module which solves the aforementioned problem. The heat sink module comprises a heat conduction base, a heat conduction pipe and a fin heat sink. The heat conduction base is in the form of a thin plate. The heat conduction base has a recess for insertion of a heat absorption end of the heat conduction pipe. The heat conduction base has a reduced weight and can be produced with ease and cost-effectively. The heat conduction base further has an engaging protrusion on an inner surface of the recess. In particular, the heat absorption end of the heat conduction pipe is matched with the recess of the heat conduction base, providing a stable connection. Thus, the heat absorption end and the recess won't be loosened easily. The heat absorption end of the heat conduction pipe has a better contact with a heating element to ensure that the heat of the heating element can be transmitted to the fin heat sink.
- Preferably, the engaging protrusion on the inner surface of the recess of the heat conduction base is in the form of a strip, in the form of a non-continuous strip, or in the form of a plurality of convex dots. The purpose of the engaging protrusion is to firmly engage the inner surface of the recess with the heat absorption end of the heat conduction pipe.
- Preferably, the fin heat sink comprises a plurality of fins which are disposed side by side and connected by the heat dissipation end of the heat conduction pipe. Each fin of the fin heat sink has a notch to form an engaging groove when the fins are connected. The heat dissipation fan has a fixing plate with a curved section. The curved section is inserted in the engaging groove of the fin heat sink, so that the heat dissipation fan can be connected to the fin heat sink quickly to simplify the connection of the heat sink module and the heat dissipation fan.
- Preferably, the fixing plate of the heat dissipation fan has a pair of connection lugs at two sides thereof. The connection lugs are fixed to two sides of the fin heat sink to strengthen the connection of the heat dissipation fan and the fin heat sink, preventing the fixing plate from becoming loose. The connection lugs are fixed to the two sides of the fin heat sink by screws or rivets.
- Preferably, the heat conduction pipe is connected to more than one heat conduction base. The single heat conduction pipe is used to transmit the heat of a heating element disposed on the more than one heat conduction base.
- Preferably, the heat conduction base has more than one recess to accommodate a plurality of heat conduction pipes.
- Preferably, the heat conduction base is in an irregular shape. Another surface of the heat conduction base is provided with auxiliary fins or heat dissipation protrusions, such that the heat conduction base provides a better heat dissipation effect.
-
FIG. 1 is a perspective view according to a first embodiment of the present invention; -
FIG. 2 is a partially exploded view according to the first embodiment of the present invention; -
FIG. 3 is a sectional view showing the heat conduction pipe attached to the recess of the heat conduction base according to the first embodiment of the present invention; -
FIG. 4 is a top view showing the engaging protrusion in the form of a non-continuous strip according to the first embodiment of the present invention; -
FIG. 5 is a top view showing the engaging protrusion in the form of a plurality of convex dots according to the first embodiment of the present invention; -
FIG. 6 is a perspective view according to a second embodiment of the present invention connected with a heat dissipation fan; -
FIG. 7 is an exploded view according to the second embodiment of the present invention; -
FIG. 8 is a perspective view according to a third embodiment of the present invention; -
FIG. 9 is an exploded view according to the third embodiment of the present invention; -
FIG. 10 is a perspective view according to a fourth embodiment of the present invention; -
FIG. 11 is a perspective view according to a fifth embodiment of the present invention; -
FIG. 12 is a bottom view according to the fifth embodiment of the present invention; -
FIG. 13 is a perspective view according to a sixth embodiment of the present invention; and -
FIG. 14 is a bottom view according to the sixth embodiment of the present invention. - Embodiments of the present invention will now be described, by way of example only, with reference to the accompanying drawings.
- As shown in
FIG. 1 andFIG. 2 , a heat sink module according to a first embodiment of the present invention comprises aheat conduction base 1, aheat conduction pipe 2, and afin heat sink 3. - The
heat conduction base 1 is in the form of a thin plate. As shown inFIG. 2 , theheat conduction base 1 has arecess 11 and at least oneengaging protrusion 111 on an inner surface of therecess 11. In this embodiment, theengaging protrusion 111 is in the form of a plurality of strips. - The
heat conduction pipe 2 has aheat absorption end 21 and aheat dissipation end 22. Theheat absorption end 21 is attached to therecess 11 of theheat conduction base 1 and engaged with theengaging protrusion 111, as shown inFIG. 3 . Theheat dissipation end 22 is coupled to thefin heat sink 3. As shown in the drawings of this embodiment, theheat dissipation end 22 is tightly inserted in thefin heat sink 3. - The
fin heat sink 3 comprises a plurality offins 31 which are disposed side by side and connected by theheat dissipation end 22 of theheat conduction pipe 2. - The
heat conduction base 1, theheat conduction pipe 2 and thefin heat sink 3 of the heat sink module are tightly connected into an integral one. Theheat conduction base 1 is in the form of a thin plate, which has a reduced weight and can be produced with ease and cost-effectively. In particular, theheat absorption end 21 of theheat conduction pipe 2 is matched with therecess 11 of theheat conduction base 1, providing a stable connection. Thus, theheat absorption end 21 and therecess 11 won't be loosened easily, so that theheat absorption end 21 of theheat conduction pipe 2 has a good contact with a heating element, such as a CPU, a north bridge chip, a south bridge chip, a display chip, or the like, to ensure that the heat of the heating element can be transmitted to thefin heat sink 3. - The
recess 11 and the engagingprotrusion 111 of theheat conduction base 1 are formed by stamping or die-casting. - The shape of the engaging
protrusion 111 on the inner surface of therecess 11 of theheat conduction base 1 is not limited to the strip form as shown inFIG. 2 . The engagingprotrusion 111 a can be in the form of a non-continuous strip as shown inFIG. 4 , or the engagingprotrusion 111 b is in the form of a plurality of convex dots as shown inFIG. 5 . The purpose of the engagingprotrusion recess 11 with theheat absorption end 21 of theheat conduction pipe 2. -
FIG. 6 andFIG. 7 show a second embodiment of the present invention, which is substantially similar to the first embodiment with the exceptions described hereinafter. Thefin heat sink 3 is connected with aheat dissipation fan 4. Eachfin 31 of thefin heat sink 3 has anotch 311 to form an engaginggroove 300 when thefins 31 are connected. Theheat dissipation fan 4 has a fixingplate 41 with acurved section 411. Thecurved section 411 is inserted in the engaginggroove 300 of thefin heat sink 3, so that theheat dissipation fan 4 can be quickly connected to thefin heat sink 3 to simplify the connection of the heat sink module and theheat dissipation fan 4. Thecurved section 411 has abarb portion 412 at a distal end thereof and thenotch 311 has acorresponding barb portion 312 at a distal end thereof to engage with each other when thecurved section 411 is inserted in the engaginggroove 300, preventing the fixingplate 41 of theheat dissipation fan 4 from becoming loose or disengaged. - The fixing
plate 41 of theheat dissipation fan 4 has a pair of connection lugs 42 at two sides thereof. The connection lugs 42 are fixed to two sides of thefin heat sink 3 to strengthen the connection of theheat dissipation fan 4 and thefin heat sink 3, preventing the fixingplate 4 from becoming loose. The connection lugs 42 are fixed to the two sides of thefin heat sink 3 by screws or rivets. -
FIG. 8 andFIG. 9 show a third embodiment of the present invention, which is substantially similar to the second embodiment with the exceptions described hereinafter. The third embodiment comprises twoheat conduction bases 1 a, 1 b, twoheat conduction pipes fin heat sink 3, and aheat dissipation fan 4. The first heat conduction base 1 a has tworecesses 11 to accommodate theheat conduction pipes heat conduction base 1 b has an irregular shape. The firstheat conduction pipe 2 a is connected to the twoheat conduction bases 1 a, 1 b in sequence to dissipate the heat from theheat conduction bases 1 a, 1 b. The secondheat conduction pipe 2 b is only connected to the first heat conduction base 1 a. The heat dissipation ends 22 a, 22 b of the twoheat conduction pipes fin heat sink 3. which is connected with theheat dissipation fan 4. -
FIG. 10 shows a fourth embodiment of the present invention, which is substantially similar to the third embodiment without the heat dissipation fan. -
FIG. 11 andFIG. 12 show a fifth embodiment of the present invention, which is substantially similar to the aforesaid embodiments with the exceptions described hereinafter. The fifth embodiment comprises twoheat conduction bases heat conduction pipes fin heat sink 3. The twoheat conduction bases FIG. 12 , anothersurface 12 c of theheat conduction base 1 c is provided withauxiliary fins 13 c, such that theheat conduction base 1 c provides a better heat dissipation effect. -
FIG. 13 andFIG. 14 show a sixth embodiment of the present invention, which is substantially similar to the fifth embodiment with the exceptions described hereinafter. As shown inFIG. 14 , anothersurface 12 e of the heat conduction base 1 e is provided withheat dissipation protrusions 121 e, such that the heat conduction base 1 e provides a better heat dissipation effect. - In the aforesaid embodiments, the
heat conduction base foot seat 5 which is fixed to a circuit board. Thefoot seat 5 is a traditional element, and won't be described herein. - The
heat conduction pipe recess 11 and engaged with the engagingprotrusion heat conduction pipe heat conduction base - Although particular embodiments of the present invention have been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the present invention. Accordingly, the present invention is not to be limited except as by the appended claims.
Claims (15)
1. A heat sink module, comprising at least one heat conduction base, at least one heat conduction pipe and a fin heat sink;
the heat conduction base being in the form of a thin plate, the heat conduction base having a recess and at least one engaging protrusion on an inner surface of the recess;
the heat conduction pipe having a heat absorption end and a heat dissipation end, the heat absorption end being attached to the recess of the heat conduction base and engaged with the engaging protrusion, the heat dissipation end being coupled to the fin heat sink;
the fin heat sink being composed of a plurality of fins which are disposed side by side and connected by the heat dissipation end of the heat conduction pipe.
2. The heat sink module as claimed in claim 1 , wherein the recess and the engaging protrusion of the heat conduction base are formed by stamping.
3. The heat sink module as claimed in claim 1 , wherein the recess and the engaging protrusion of the heat conduction base are formed by die-casting.
4. The heat sink module as claimed in claim 1 , wherein the engaging protrusion is in the form of a strip.
5. The heat sink module as claimed in claim 1 , wherein the engaging protrusion is in the form of a non-continuous strip.
6. The heat sink module as claimed in claim 1 , wherein the engaging protrusion is in the form of a plurality of convex dots.
7. The heat sink module as claimed in claim 1 , further comprising a heat dissipation fan connected to the fin heat sink, the fins of the fin heat sink each having a notch to form an engaging groove when the fins are connected, the heat dissipation fan having a fixing plate with a curved section, the curved section being inserted in the engaging groove of the fin heat sink.
8. The heat sink module as claimed in claim 7 , wherein the curved section has a barb portion at a distal end thereof and the notch has a corresponding barb portion at a distal end thereof to engage with each other.
9. The heat sink module as claimed in claim 7 , wherein the fixing plate of the heat dissipation fan has a pair of connection lugs at two sides thereof.
10. The heat sink module as claimed in claim 9 , wherein the connection lugs are fixed to two sides of the fin heat sink by screws.
11. The heat sink module as claimed in claim 9 , wherein the connection lugs are fixed to two sides of the fin heat sink by rivets.
12. The heat sink module as claimed in claim 1 , wherein the heat conduction pipe is connected to more than one heat conduction plate.
13. The heat sink module as claimed in claim 1 , wherein the heat conduction base has more than one recess.
14. The heat sink module as claimed in claim 1 , wherein another surface of the heat conduction base is provided with auxiliary fins.
15. The heat sink module as claimed in claim 1 , wherein another surface of the heat conduction base is provided with heat dissipation protrusions.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/025,160 US20120205084A1 (en) | 2011-02-11 | 2011-02-11 | Heat sink module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/025,160 US20120205084A1 (en) | 2011-02-11 | 2011-02-11 | Heat sink module |
Publications (1)
Publication Number | Publication Date |
---|---|
US20120205084A1 true US20120205084A1 (en) | 2012-08-16 |
Family
ID=46636014
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/025,160 Abandoned US20120205084A1 (en) | 2011-02-11 | 2011-02-11 | Heat sink module |
Country Status (1)
Country | Link |
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US (1) | US20120205084A1 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120241132A1 (en) * | 2011-03-22 | 2012-09-27 | Tsung-Hsien Huang | Non-base block heat sink |
US20130143079A1 (en) * | 2011-12-02 | 2013-06-06 | Golden Crown New Energy (Hk) Limited | Battery system with heat-dissipation improvement and connecting circuit arrangement |
US20140131014A1 (en) * | 2012-11-14 | 2014-05-15 | Cooler Master Development Corporation | Heat dissipating device |
US20150062818A1 (en) * | 2013-08-30 | 2015-03-05 | Kabushiki Kaisha Toshiba | Electronic apparatus |
US20150330715A1 (en) * | 2014-05-14 | 2015-11-19 | Asia Vital Components Co., Ltd. | Manufacturing method of thermal module |
EP2985555A1 (en) * | 2014-08-10 | 2016-02-17 | Lutz Zamecki | Mounting adapter for heat pipes |
CN106535559A (en) * | 2015-09-15 | 2017-03-22 | 奇鋐科技股份有限公司 | Combined heat dissipation unit |
US20170097195A1 (en) * | 2015-10-06 | 2017-04-06 | Asia Vital Components Co., Ltd. | Knockdown heat dissipation unit |
US20180168069A1 (en) * | 2016-12-09 | 2018-06-14 | Cooler Master Technology Inc. | Parallel heat-pipes type heat sink and manufacturing method thereof |
US20230228498A1 (en) * | 2022-01-14 | 2023-07-20 | Dongguan Hanxu Hardware Plastic Technology Co., Ltd. | Tight-fit riveting structure for heat dissipation aluminum base and heat pipe |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5829516A (en) * | 1993-12-15 | 1998-11-03 | Aavid Thermal Products, Inc. | Liquid cooled heat sink for cooling electronic components |
US6853555B2 (en) * | 2002-04-11 | 2005-02-08 | Lytron, Inc. | Tube-in-plate cooling or heating plate |
US6883594B2 (en) * | 2001-11-30 | 2005-04-26 | Thermal Corp. | Cooling system for electronics with improved thermal interface |
US7606036B2 (en) * | 2006-05-25 | 2009-10-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20110042042A1 (en) * | 2009-08-24 | 2011-02-24 | Kim Jong Man | Radiating package module for exothermic element |
-
2011
- 2011-02-11 US US13/025,160 patent/US20120205084A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5829516A (en) * | 1993-12-15 | 1998-11-03 | Aavid Thermal Products, Inc. | Liquid cooled heat sink for cooling electronic components |
US6883594B2 (en) * | 2001-11-30 | 2005-04-26 | Thermal Corp. | Cooling system for electronics with improved thermal interface |
US6853555B2 (en) * | 2002-04-11 | 2005-02-08 | Lytron, Inc. | Tube-in-plate cooling or heating plate |
US7606036B2 (en) * | 2006-05-25 | 2009-10-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20110042042A1 (en) * | 2009-08-24 | 2011-02-24 | Kim Jong Man | Radiating package module for exothermic element |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8746325B2 (en) * | 2011-03-22 | 2014-06-10 | Tsung-Hsien Huang | Non-base block heat sink |
US20120241132A1 (en) * | 2011-03-22 | 2012-09-27 | Tsung-Hsien Huang | Non-base block heat sink |
US20130143079A1 (en) * | 2011-12-02 | 2013-06-06 | Golden Crown New Energy (Hk) Limited | Battery system with heat-dissipation improvement and connecting circuit arrangement |
US9347712B2 (en) * | 2012-11-14 | 2016-05-24 | Cooler Master Development Corporation | Heat dissipating device |
US20140131014A1 (en) * | 2012-11-14 | 2014-05-15 | Cooler Master Development Corporation | Heat dissipating device |
US20150062818A1 (en) * | 2013-08-30 | 2015-03-05 | Kabushiki Kaisha Toshiba | Electronic apparatus |
US9304558B2 (en) * | 2013-08-30 | 2016-04-05 | Kabushiki Kaisha Toshiba | Electronic apparatus |
US20150330715A1 (en) * | 2014-05-14 | 2015-11-19 | Asia Vital Components Co., Ltd. | Manufacturing method of thermal module |
EP2985555A1 (en) * | 2014-08-10 | 2016-02-17 | Lutz Zamecki | Mounting adapter for heat pipes |
CN106535559A (en) * | 2015-09-15 | 2017-03-22 | 奇鋐科技股份有限公司 | Combined heat dissipation unit |
US20170097195A1 (en) * | 2015-10-06 | 2017-04-06 | Asia Vital Components Co., Ltd. | Knockdown heat dissipation unit |
US10132571B2 (en) * | 2015-10-06 | 2018-11-20 | Asia Vital Components Co., Ltd. | Knockdown heat dissipation unit |
US20180168069A1 (en) * | 2016-12-09 | 2018-06-14 | Cooler Master Technology Inc. | Parallel heat-pipes type heat sink and manufacturing method thereof |
US10772235B2 (en) * | 2016-12-09 | 2020-09-08 | Cooler Master Technology Inc. | Heat sink and manufacturing method thereof |
US20230228498A1 (en) * | 2022-01-14 | 2023-07-20 | Dongguan Hanxu Hardware Plastic Technology Co., Ltd. | Tight-fit riveting structure for heat dissipation aluminum base and heat pipe |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |