US20120205084A1 - Heat sink module - Google Patents

Heat sink module Download PDF

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Publication number
US20120205084A1
US20120205084A1 US13/025,160 US201113025160A US2012205084A1 US 20120205084 A1 US20120205084 A1 US 20120205084A1 US 201113025160 A US201113025160 A US 201113025160A US 2012205084 A1 US2012205084 A1 US 2012205084A1
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US
United States
Prior art keywords
heat
heat sink
heat conduction
fin
sink module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
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US13/025,160
Inventor
Tsung-Hsien Huang
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Individual
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Individual
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Publication date
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Priority to US13/025,160 priority Critical patent/US20120205084A1/en
Publication of US20120205084A1 publication Critical patent/US20120205084A1/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/203Cooling means for portable computers, e.g. for laptops
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/30Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/001Particular heat conductive materials, e.g. superconductive elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat sink module includes at least one heat conduction base, at least one heat conduction pipe and a fin heat sink. The heat conduction base has a recess and at least one engaging protrusion on the recess. The heat conduction pipe has a heat absorption end and a heat dissipation end. The heat absorption end is attached to the recess of the heat conduction base and engaged with the engaging protrusion. The heat dissipation end is coupled to the fin heat sink. The fin heat sink is composed of a plurality of fins which are disposed side by side and connected by the heat dissipation end of the heat conduction pipe. The fin heat sink has an engaging groove for engagement of a curved section of a fixing plate of a heat dissipation fan. The heat dissipation fan can be quickly coupled to the fin heat sink, simplifying the assembly of the heat sink module.

Description

    BACKGROUND OF THE INVENTION
  • (a) Field of the Invention
  • The present invention relates to a heat sink module, and more particularly to a heat sink module for a notebook computer. The heat sink module includes a heat conduction base, a heat conduction pipe and a fin heat sink or further includes a heat dissipation fan, which can be assembled quickly and securely.
  • (b) Description of the Prior Art
  • A notebook computer has a CPU, a north bridge chip, a south bridge chip, a display chip, or the like therein. These electronic elements will generate heat when running. It is required to couple the notebook computer with a heat sink and a fan to dissipate the heat for providing a stable running.
  • A conventional heat sink module comprises a heat conduction base, a heat conduction pipe, a fin heat sink and a fan. The heat conduction base has a recess (or a through hole) for insertion of a heat absorption end of the heat conduction pipe. A heat dissipation end of the heat conduction pipe is welded or coupled to the fin heat sink. The heat conduction base of the conventional heat sink module is a thick rectangular block. The inner surface of the recess (or the through hole) of the heat conduction base is smooth and the outer surface of the heat conduction pipe is also smooth, so the connection of the heat absorption end of the heat conduction pipe is not stable. The heat absorption end of the heat conduction pipe may become loose, thus causing a bad contact and the heat of the heating element cannot be transmitted to the fin heat sink. Accordingly, the inventor of the present invention has devoted himself with his many years of practical experiences to solving this problem.
  • SUMMARY OF THE INVENTION
  • The primary object of the present invention is to provide a heat sink module which solves the aforementioned problem. The heat sink module comprises a heat conduction base, a heat conduction pipe and a fin heat sink. The heat conduction base is in the form of a thin plate. The heat conduction base has a recess for insertion of a heat absorption end of the heat conduction pipe. The heat conduction base has a reduced weight and can be produced with ease and cost-effectively. The heat conduction base further has an engaging protrusion on an inner surface of the recess. In particular, the heat absorption end of the heat conduction pipe is matched with the recess of the heat conduction base, providing a stable connection. Thus, the heat absorption end and the recess won't be loosened easily. The heat absorption end of the heat conduction pipe has a better contact with a heating element to ensure that the heat of the heating element can be transmitted to the fin heat sink.
  • Preferably, the engaging protrusion on the inner surface of the recess of the heat conduction base is in the form of a strip, in the form of a non-continuous strip, or in the form of a plurality of convex dots. The purpose of the engaging protrusion is to firmly engage the inner surface of the recess with the heat absorption end of the heat conduction pipe.
  • Preferably, the fin heat sink comprises a plurality of fins which are disposed side by side and connected by the heat dissipation end of the heat conduction pipe. Each fin of the fin heat sink has a notch to form an engaging groove when the fins are connected. The heat dissipation fan has a fixing plate with a curved section. The curved section is inserted in the engaging groove of the fin heat sink, so that the heat dissipation fan can be connected to the fin heat sink quickly to simplify the connection of the heat sink module and the heat dissipation fan.
  • Preferably, the fixing plate of the heat dissipation fan has a pair of connection lugs at two sides thereof. The connection lugs are fixed to two sides of the fin heat sink to strengthen the connection of the heat dissipation fan and the fin heat sink, preventing the fixing plate from becoming loose. The connection lugs are fixed to the two sides of the fin heat sink by screws or rivets.
  • Preferably, the heat conduction pipe is connected to more than one heat conduction base. The single heat conduction pipe is used to transmit the heat of a heating element disposed on the more than one heat conduction base.
  • Preferably, the heat conduction base has more than one recess to accommodate a plurality of heat conduction pipes.
  • Preferably, the heat conduction base is in an irregular shape. Another surface of the heat conduction base is provided with auxiliary fins or heat dissipation protrusions, such that the heat conduction base provides a better heat dissipation effect.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective view according to a first embodiment of the present invention;
  • FIG. 2 is a partially exploded view according to the first embodiment of the present invention;
  • FIG. 3 is a sectional view showing the heat conduction pipe attached to the recess of the heat conduction base according to the first embodiment of the present invention;
  • FIG. 4 is a top view showing the engaging protrusion in the form of a non-continuous strip according to the first embodiment of the present invention;
  • FIG. 5 is a top view showing the engaging protrusion in the form of a plurality of convex dots according to the first embodiment of the present invention;
  • FIG. 6 is a perspective view according to a second embodiment of the present invention connected with a heat dissipation fan;
  • FIG. 7 is an exploded view according to the second embodiment of the present invention;
  • FIG. 8 is a perspective view according to a third embodiment of the present invention;
  • FIG. 9 is an exploded view according to the third embodiment of the present invention;
  • FIG. 10 is a perspective view according to a fourth embodiment of the present invention;
  • FIG. 11 is a perspective view according to a fifth embodiment of the present invention;
  • FIG. 12 is a bottom view according to the fifth embodiment of the present invention;
  • FIG. 13 is a perspective view according to a sixth embodiment of the present invention; and
  • FIG. 14 is a bottom view according to the sixth embodiment of the present invention.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Embodiments of the present invention will now be described, by way of example only, with reference to the accompanying drawings.
  • As shown in FIG. 1 and FIG. 2, a heat sink module according to a first embodiment of the present invention comprises a heat conduction base 1, a heat conduction pipe 2, and a fin heat sink 3.
  • The heat conduction base 1 is in the form of a thin plate. As shown in FIG. 2, the heat conduction base 1 has a recess 11 and at least one engaging protrusion 111 on an inner surface of the recess 11. In this embodiment, the engaging protrusion 111 is in the form of a plurality of strips.
  • The heat conduction pipe 2 has a heat absorption end 21 and a heat dissipation end 22. The heat absorption end 21 is attached to the recess 11 of the heat conduction base 1 and engaged with the engaging protrusion 111, as shown in FIG. 3. The heat dissipation end 22 is coupled to the fin heat sink 3. As shown in the drawings of this embodiment, the heat dissipation end 22 is tightly inserted in the fin heat sink 3.
  • The fin heat sink 3 comprises a plurality of fins 31 which are disposed side by side and connected by the heat dissipation end 22 of the heat conduction pipe 2.
  • The heat conduction base 1, the heat conduction pipe 2 and the fin heat sink 3 of the heat sink module are tightly connected into an integral one. The heat conduction base 1 is in the form of a thin plate, which has a reduced weight and can be produced with ease and cost-effectively. In particular, the heat absorption end 21 of the heat conduction pipe 2 is matched with the recess 11 of the heat conduction base 1, providing a stable connection. Thus, the heat absorption end 21 and the recess 11 won't be loosened easily, so that the heat absorption end 21 of the heat conduction pipe 2 has a good contact with a heating element, such as a CPU, a north bridge chip, a south bridge chip, a display chip, or the like, to ensure that the heat of the heating element can be transmitted to the fin heat sink 3.
  • The recess 11 and the engaging protrusion 111 of the heat conduction base 1 are formed by stamping or die-casting.
  • The shape of the engaging protrusion 111 on the inner surface of the recess 11 of the heat conduction base 1 is not limited to the strip form as shown in FIG. 2. The engaging protrusion 111 a can be in the form of a non-continuous strip as shown in FIG. 4, or the engaging protrusion 111 b is in the form of a plurality of convex dots as shown in FIG. 5. The purpose of the engaging protrusion 111, 111 a, 111 b is to firmly engage the inner surface of the recess 11 with the heat absorption end 21 of the heat conduction pipe 2.
  • FIG. 6 and FIG. 7 show a second embodiment of the present invention, which is substantially similar to the first embodiment with the exceptions described hereinafter. The fin heat sink 3 is connected with a heat dissipation fan 4. Each fin 31 of the fin heat sink 3 has a notch 311 to form an engaging groove 300 when the fins 31 are connected. The heat dissipation fan 4 has a fixing plate 41 with a curved section 411. The curved section 411 is inserted in the engaging groove 300 of the fin heat sink 3, so that the heat dissipation fan 4 can be quickly connected to the fin heat sink 3 to simplify the connection of the heat sink module and the heat dissipation fan 4. The curved section 411 has a barb portion 412 at a distal end thereof and the notch 311 has a corresponding barb portion 312 at a distal end thereof to engage with each other when the curved section 411 is inserted in the engaging groove 300, preventing the fixing plate 41 of the heat dissipation fan 4 from becoming loose or disengaged.
  • The fixing plate 41 of the heat dissipation fan 4 has a pair of connection lugs 42 at two sides thereof. The connection lugs 42 are fixed to two sides of the fin heat sink 3 to strengthen the connection of the heat dissipation fan 4 and the fin heat sink 3, preventing the fixing plate 4 from becoming loose. The connection lugs 42 are fixed to the two sides of the fin heat sink 3 by screws or rivets.
  • FIG. 8 and FIG. 9 show a third embodiment of the present invention, which is substantially similar to the second embodiment with the exceptions described hereinafter. The third embodiment comprises two heat conduction bases 1 a, 1 b, two heat conduction pipes 2 a, 2 b, a fin heat sink 3, and a heat dissipation fan 4. The first heat conduction base 1 a has two recesses 11 to accommodate the heat conduction pipes 2 a, 2 b. The second heat conduction base 1 b has an irregular shape. The first heat conduction pipe 2 a is connected to the two heat conduction bases 1 a, 1 b in sequence to dissipate the heat from the heat conduction bases 1 a, 1 b. The second heat conduction pipe 2 b is only connected to the first heat conduction base 1 a. The heat dissipation ends 22 a, 22 b of the two heat conduction pipes 2 a, 2 b are coupled to the fin heat sink 3. which is connected with the heat dissipation fan 4.
  • FIG. 10 shows a fourth embodiment of the present invention, which is substantially similar to the third embodiment without the heat dissipation fan.
  • FIG. 11 and FIG. 12 show a fifth embodiment of the present invention, which is substantially similar to the aforesaid embodiments with the exceptions described hereinafter. The fifth embodiment comprises two heat conduction bases 1 c, 1 d, three heat conduction pipes 2 a, 2 b, 2 c and the fin heat sink 3. The two heat conduction bases 1 c, 1 d are in an irregular shape. As shown in FIG. 12, another surface 12 c of the heat conduction base 1 c is provided with auxiliary fins 13 c, such that the heat conduction base 1 c provides a better heat dissipation effect.
  • FIG. 13 and FIG. 14 show a sixth embodiment of the present invention, which is substantially similar to the fifth embodiment with the exceptions described hereinafter. As shown in FIG. 14, another surface 12 e of the heat conduction base 1 e is provided with heat dissipation protrusions 121 e, such that the heat conduction base 1 e provides a better heat dissipation effect.
  • In the aforesaid embodiments, the heat conduction base 1, 1 a, 1 b, 1 c, 1 d, 1 e can be connected with a foot seat 5 which is fixed to a circuit board. The foot seat 5 is a traditional element, and won't be described herein.
  • The heat conduction pipe 2, 2 a, 2 b, 2 c is also a traditional element. In general, it is made of copper which is a soft material, so it can be attached to the recess 11 and engaged with the engaging protrusion 111, 111 a, 111 b. Accordingly, the heat conduction pipe 2, 2 a, 2 b, 2 c and the heat conduction base 1, 1 a, 1 b, 1 c, 1 d, 1 e can be tightly connected.
  • Although particular embodiments of the present invention have been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the present invention. Accordingly, the present invention is not to be limited except as by the appended claims.

Claims (15)

1. A heat sink module, comprising at least one heat conduction base, at least one heat conduction pipe and a fin heat sink;
the heat conduction base being in the form of a thin plate, the heat conduction base having a recess and at least one engaging protrusion on an inner surface of the recess;
the heat conduction pipe having a heat absorption end and a heat dissipation end, the heat absorption end being attached to the recess of the heat conduction base and engaged with the engaging protrusion, the heat dissipation end being coupled to the fin heat sink;
the fin heat sink being composed of a plurality of fins which are disposed side by side and connected by the heat dissipation end of the heat conduction pipe.
2. The heat sink module as claimed in claim 1, wherein the recess and the engaging protrusion of the heat conduction base are formed by stamping.
3. The heat sink module as claimed in claim 1, wherein the recess and the engaging protrusion of the heat conduction base are formed by die-casting.
4. The heat sink module as claimed in claim 1, wherein the engaging protrusion is in the form of a strip.
5. The heat sink module as claimed in claim 1, wherein the engaging protrusion is in the form of a non-continuous strip.
6. The heat sink module as claimed in claim 1, wherein the engaging protrusion is in the form of a plurality of convex dots.
7. The heat sink module as claimed in claim 1, further comprising a heat dissipation fan connected to the fin heat sink, the fins of the fin heat sink each having a notch to form an engaging groove when the fins are connected, the heat dissipation fan having a fixing plate with a curved section, the curved section being inserted in the engaging groove of the fin heat sink.
8. The heat sink module as claimed in claim 7, wherein the curved section has a barb portion at a distal end thereof and the notch has a corresponding barb portion at a distal end thereof to engage with each other.
9. The heat sink module as claimed in claim 7, wherein the fixing plate of the heat dissipation fan has a pair of connection lugs at two sides thereof.
10. The heat sink module as claimed in claim 9, wherein the connection lugs are fixed to two sides of the fin heat sink by screws.
11. The heat sink module as claimed in claim 9, wherein the connection lugs are fixed to two sides of the fin heat sink by rivets.
12. The heat sink module as claimed in claim 1, wherein the heat conduction pipe is connected to more than one heat conduction plate.
13. The heat sink module as claimed in claim 1, wherein the heat conduction base has more than one recess.
14. The heat sink module as claimed in claim 1, wherein another surface of the heat conduction base is provided with auxiliary fins.
15. The heat sink module as claimed in claim 1, wherein another surface of the heat conduction base is provided with heat dissipation protrusions.
US13/025,160 2011-02-11 2011-02-11 Heat sink module Abandoned US20120205084A1 (en)

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120241132A1 (en) * 2011-03-22 2012-09-27 Tsung-Hsien Huang Non-base block heat sink
US20130143079A1 (en) * 2011-12-02 2013-06-06 Golden Crown New Energy (Hk) Limited Battery system with heat-dissipation improvement and connecting circuit arrangement
US20140131014A1 (en) * 2012-11-14 2014-05-15 Cooler Master Development Corporation Heat dissipating device
US20150062818A1 (en) * 2013-08-30 2015-03-05 Kabushiki Kaisha Toshiba Electronic apparatus
US20150330715A1 (en) * 2014-05-14 2015-11-19 Asia Vital Components Co., Ltd. Manufacturing method of thermal module
EP2985555A1 (en) * 2014-08-10 2016-02-17 Lutz Zamecki Mounting adapter for heat pipes
CN106535559A (en) * 2015-09-15 2017-03-22 奇鋐科技股份有限公司 Combined heat dissipation unit
US20170097195A1 (en) * 2015-10-06 2017-04-06 Asia Vital Components Co., Ltd. Knockdown heat dissipation unit
US20180168069A1 (en) * 2016-12-09 2018-06-14 Cooler Master Technology Inc. Parallel heat-pipes type heat sink and manufacturing method thereof
US20230228498A1 (en) * 2022-01-14 2023-07-20 Dongguan Hanxu Hardware Plastic Technology Co., Ltd. Tight-fit riveting structure for heat dissipation aluminum base and heat pipe

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5829516A (en) * 1993-12-15 1998-11-03 Aavid Thermal Products, Inc. Liquid cooled heat sink for cooling electronic components
US6853555B2 (en) * 2002-04-11 2005-02-08 Lytron, Inc. Tube-in-plate cooling or heating plate
US6883594B2 (en) * 2001-11-30 2005-04-26 Thermal Corp. Cooling system for electronics with improved thermal interface
US7606036B2 (en) * 2006-05-25 2009-10-20 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20110042042A1 (en) * 2009-08-24 2011-02-24 Kim Jong Man Radiating package module for exothermic element

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5829516A (en) * 1993-12-15 1998-11-03 Aavid Thermal Products, Inc. Liquid cooled heat sink for cooling electronic components
US6883594B2 (en) * 2001-11-30 2005-04-26 Thermal Corp. Cooling system for electronics with improved thermal interface
US6853555B2 (en) * 2002-04-11 2005-02-08 Lytron, Inc. Tube-in-plate cooling or heating plate
US7606036B2 (en) * 2006-05-25 2009-10-20 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20110042042A1 (en) * 2009-08-24 2011-02-24 Kim Jong Man Radiating package module for exothermic element

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8746325B2 (en) * 2011-03-22 2014-06-10 Tsung-Hsien Huang Non-base block heat sink
US20120241132A1 (en) * 2011-03-22 2012-09-27 Tsung-Hsien Huang Non-base block heat sink
US20130143079A1 (en) * 2011-12-02 2013-06-06 Golden Crown New Energy (Hk) Limited Battery system with heat-dissipation improvement and connecting circuit arrangement
US9347712B2 (en) * 2012-11-14 2016-05-24 Cooler Master Development Corporation Heat dissipating device
US20140131014A1 (en) * 2012-11-14 2014-05-15 Cooler Master Development Corporation Heat dissipating device
US20150062818A1 (en) * 2013-08-30 2015-03-05 Kabushiki Kaisha Toshiba Electronic apparatus
US9304558B2 (en) * 2013-08-30 2016-04-05 Kabushiki Kaisha Toshiba Electronic apparatus
US20150330715A1 (en) * 2014-05-14 2015-11-19 Asia Vital Components Co., Ltd. Manufacturing method of thermal module
EP2985555A1 (en) * 2014-08-10 2016-02-17 Lutz Zamecki Mounting adapter for heat pipes
CN106535559A (en) * 2015-09-15 2017-03-22 奇鋐科技股份有限公司 Combined heat dissipation unit
US20170097195A1 (en) * 2015-10-06 2017-04-06 Asia Vital Components Co., Ltd. Knockdown heat dissipation unit
US10132571B2 (en) * 2015-10-06 2018-11-20 Asia Vital Components Co., Ltd. Knockdown heat dissipation unit
US20180168069A1 (en) * 2016-12-09 2018-06-14 Cooler Master Technology Inc. Parallel heat-pipes type heat sink and manufacturing method thereof
US10772235B2 (en) * 2016-12-09 2020-09-08 Cooler Master Technology Inc. Heat sink and manufacturing method thereof
US20230228498A1 (en) * 2022-01-14 2023-07-20 Dongguan Hanxu Hardware Plastic Technology Co., Ltd. Tight-fit riveting structure for heat dissipation aluminum base and heat pipe

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