US20130105112A1 - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- US20130105112A1 US20130105112A1 US13/285,876 US201113285876A US2013105112A1 US 20130105112 A1 US20130105112 A1 US 20130105112A1 US 201113285876 A US201113285876 A US 201113285876A US 2013105112 A1 US2013105112 A1 US 2013105112A1
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- US
- United States
- Prior art keywords
- heat
- base
- heat sink
- fixing section
- engaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a heat sink, and in particular to a heat sink having a linear fastener.
- a heat sink is provided for dissipating the heat generated by the electronic elements, thereby controlling the working temperature and maintaining the normal operation of the electronic elements.
- the connection between a heat sink and an electronic element is achieved by a fastener.
- the fastener is used to maintain a good heat conduction between the heat sink and the electronic element.
- linear fastener has a simple structure for easy installation. In use, a groove is provided on the heat sink. Then, the linear fastener having a hook is tightly fitted in the groove. Since the linear fastener is formed by bending a metal wire, the inherent elasticity of the metal wire allows the linear fastener to generate an elastic deformation, so that the hook of the linear fastener can be hooked to a circuit board of the electronic element. In this way, the heat sink can be tightly connected onto the electronic element.
- Taiwan Patent No. M379978 discloses a heat-dissipating module, in which heat-dissipating fins are integrally formed on a heat-dissipating plate. A groove is provided on the heat-dissipating plate and the linear fastener is fitted into the groove. In this way, the heat sink can be fixed onto the electronic element in a convenient manner.
- FIG. 1 shows a conventional heat sink having stamped fins.
- the heat sink 100 comprises a plurality of stamped fins 101 arranged in parallel to each other. These stamped fins 101 are engaged with each other and then combined with the heat-dissipating plate 102 . Since the heat sink having stamped fins possesses a larger heat-dissipating area, it exhibits a higher heat-dissipating efficiency and thus is widely used in various heat sinks
- the stamped fins are not integrally formed on the heat-dissipating plate.
- the present Inventor proposes a reasonable and practicable structure to solve the above-mentioned problems based on his expert knowledge and deliberate researches.
- the present invention is to provide a heat sink, in which a linear fastener is used to combine heat-dissipating fins with the circuit board to enhance the heat-dissipating efficiency of the heat sink for a heat-dissipating element.
- the present invention provides a heat sink, configured for heat dissipation of a heat-dissipating element on a circuit boards and including a base, a linear fastener and a heat-dissipating fin set.
- a surface of the base is provided with a groove.
- the linear fastener comprises a fixing section and engaging sections bent to extend from the fixing section respectively.
- the fixing section is disposed in the groove.
- the engaging section protrudes out of the base to be fixed onto the circuit board.
- the heat-dissipating fin set is constituted of a plurality of stamped fins engaged with each other.
- the heat-dissipating fin set is combined on the base to press the fixing section, thereby clamping the fixing section between the heat-dissipating fin set and the base.
- the present invention provides a heat sink, configured for heat dissipation of a heat-dissipating element on a circuit boards and including a base, a pair of linear fasteners and a heat-dissipating fin set.
- a surface of the base is provided with a plurality of grooves.
- Each of the linear fasteners comprises a fixing section and engaging sections bent to extend from the fixing section respectively.
- the fixing sections of the pair of linear fasteners are disposed in the grooves symmetrically, so that each of the engaging sections protrudes out of the base to be fixed onto the circuit board.
- the heat-dissipating fin set is constituted of a plurality of stamped fins engaged with each other.
- the heat-dissipating fin set is combined on the base to press the fixing sections, thereby clamping the fixing sections between the heat-dissipating fin set and the base.
- the heat-dissipating fin set is constituted of a plurality of stamped fins and is separated from the base.
- a surface of the base is provided with the groove and the linear fastener is disposed in the groove.
- the heat-dissipating fin set having the fins engaged with each other is combined with the base, whereby the linear fastener can be clamped and positioned between the heat-dissipating fin set and the base.
- the heat-dissipating fin set having stamped fins according to the present invention can be used to replace the conventional aluminum-extruded heat sink directly, thereby improving the heat-dissipating efficiency of the heat sink. Therefore, the practicability of the present invention is increased greatly.
- FIG. 1 shows a heat sink having stamped fins according to prior art
- FIG. 2 is an exploded perspective view showing the heat sink of the present invention
- FIG. 3 is a perspective view showing the external appearance of the heat sink of the present invention.
- FIG. 4 is a schematic view showing that the heat sink of the present invention is to be combined with a heat-dissipating element
- FIG. 5 is an assembled perspective view showing that the heat sink of the present invention is combined with the heat-dissipating element
- FIG. 6 is a schematic view showing another aspect of the linear fastener of the present invention.
- FIG. 7 is a schematic view showing another embodiment of the heat sink of the present invention.
- FIG. 8 is a perspective view showing that the heat sink of another embodiment of the present invention is to be combined with the heat-dissipating element.
- FIG. 2 is an exploded perspective view showing the heat sink of the present invention
- FIG. 3 is a schematic view showing the external appearance of the heat sink of the present invention.
- the heat sink 1 of the present invention includes a base 10 , a linear fastener 20 , and a heat-dissipating fin set 30 .
- a surface of the base 10 is provided with at least one groove 11 .
- the base 10 is provided with a plurality of grooves 11 that are arranged on the surface of the base 10 longitudinally and transversely.
- the linear fastener 20 is made by bending a metal wire.
- the linear fastener 20 comprises a fixing section 21 and an engaging section 22 bent to extend from the fixing section 21 .
- the fixing section 21 is disposed in the groove 11 .
- the engaging section 22 protrudes out of the base 10 .
- the linear fastener 20 has two engaging sections 22 bent to extend from both ends of the fixing section 21 respectively.
- the fixing section 21 comprises a connecting portion 211 and two abutting portions 212 extending from both ends of the connecting portion 211 in opposite directions respectively.
- Each of the engaging sections 22 comprises a locking arm 221 and a hook 222 formed on the distal end of the locking arm 221 .
- the locking arm 221 extends obliquely and upwards from the distal end of the fixing section 21 .
- the hook 222 is bent toward the inner side of the linear fastener 20 .
- the heat-dissipating fin set 30 is constituted of a plurality of stamped fins 31 engaged with each other.
- the heat-dissipating fin set 30 is combined on the base 10 to press the fixing section 21 , thereby clamping the fixing section 21 between the heat-dissipating fin set 30 and the base 10 .
- Each of the stamped fins 31 has an abutting piece 311 adhered to the base 10 and a plurality of engaging pieces 312 engaged with each other.
- the abutting pieces 311 of adjacent two stamped fins 31 abut against each other to form a heat-dissipating channel 310 therebetween.
- the linear fastener 20 is disposed in the groove 11 of the base 10 . Then, the heat-dissipating fin set 30 is fixed onto the base 10 by means of a welding process or the like. At this time, the connecting portion 211 of the linear fastener 20 is located between the engaging portions 312 of the stamped fins 31 . The two abutting portions 212 of the linear fastener 20 extend outside the engaging portions 312 respectively. In this way, the linear fastener 20 can be firmly clamped between the heat-dissipating fin set 30 and the base 10 .
- FIG. 4 is a schematic view showing that the heat sink of the present invention is to be combined with the heat-dissipating element.
- FIG. 5 is a perspective view showing that the heat sink of the present invention is combined with the heat-dissipating element.
- the heat sink 1 of the present invention is configured for heat dissipation of a heat-dissipating element 2 on a circuit board 3 .
- the circuit board 3 is provided at least one locking ring 4 near the heat-dissipating element 2 .
- the heat sink 1 is disposed on the heat-dissipating element 2 .
- the locking arm 221 of the linear fastener is subjected to a force, so that the engaging section 22 can be fixed on the circuit board 3 .
- the locking hook 222 of the linear fastener 20 is hooked into the locking ring of the circuit board 3 , so that the base 10 and the heat-dissipating fin set 30 can be firmly combined onto the circuit board 3 and the base 10 can be tightly adhered to the electronic element 2 .
- the heat sink 1 a includes a base 10 a , a pair of linear fasteners 20 a , 20 a ′, and a heat-dissipating fin set 30 a.
- the surface of the base 10 a is provided with a plurality of grooves 11 a .
- Each of the linear fasteners 20 a , 20 a ′ comprises a fixing section 21 a , 21 a ′ and two engaging sections 22 a , 22 a ′ bent to extend from both sides of the fixing section 21 a , 21 a ′ respectively.
- the fixing sections 21 a , 21 a ′ of the pair of linear fasteners 20 a , 20 a ′ are disposed in the grooves 11 a .
- Each of the engaging sections 22 a , 22 a ′ protrudes out of the base 10 a.
- the heat sink 1 a is configured for heat dissipation of a heat-dissipating element 2 a on a circuit board 3 a .
- the opposite sides of the circuit board 3 a are provided with a plurality of locking rings 4 a .
- the engaging sections 22 a , 22 a ′ of the two linear fasteners 20 a , 20 a ′ are hooked into the locking rings 4 a respectively.
- the linear fastener 20 a is used as an example.
- the difference between the second embodiment and the first embodiment lies in that the fixing sections 21 a of the linear fastener 20 a comprises a U-shaped connecting portion 211 a and two abutting portions 212 a extending from two ends of the U-shaped connecting portions 211 a in opposite directions respectively.
- the two engaging sections 22 a of the linear fastener 20 a are bent to extend from both ends of the fixing section 21 a toward the same direction..
- the two linear fasteners 20 a , 20 a ′ are disposed in the grooves 11 a . Then, the heat-dissipating fin set 30 a is combined with the base 10 a , so that the two linear fasteners 20 a , 20 a ′ can be firmly clamped between the heat-dissipating fin set 30 and the base 10 a . Finally, the two linear fasteners 20 a , 20 a ′ are hooked onto the locking rings 4 a , so that the base 10 a and the heat-dissipating fin set 30 a can be combined onto the heat-dissipating element 2 a.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat sink configured for heat dissipation of a heat-dissipating element on a circuit boards includes a base, a linear fastener and a heat-dissipating fin set. A surface of the base is provided with a groove. The linear fastener includes a fixing section and an engaging section bent to extend from the fixing section. The fixing section is disposed in the groove. The engaging section protrudes out of the base to be fixed onto the circuit board. The heat-dissipating fin set is constituted of a plurality of stamped fins engaged with each other. The heat-dissipating fin set is combined on the base to press the fixing section, thereby clamping the fixing section between the heat-dissipating fin set and the base. The linear fastener makes the heat-dissipating fin set to be combined on the circuit board, thereby increasing the heat-dissipating efficiency of the heat sink.
Description
- 1. Field of the Invention
- The present invention relates to a heat sink, and in particular to a heat sink having a linear fastener.
- 2. Description of Prior Art
- With the advancement of science and technology, the function and performance of electronic products are improved. Accordingly, the heat generated by the electronic elements in such an electronic product is increased greatly. Thus, a heat sink is provided for dissipating the heat generated by the electronic elements, thereby controlling the working temperature and maintaining the normal operation of the electronic elements.
- Traditionally, the connection between a heat sink and an electronic element is achieved by a fastener. The fastener is used to maintain a good heat conduction between the heat sink and the electronic element. Among the fasteners, linear fastener has a simple structure for easy installation. In use, a groove is provided on the heat sink. Then, the linear fastener having a hook is tightly fitted in the groove. Since the linear fastener is formed by bending a metal wire, the inherent elasticity of the metal wire allows the linear fastener to generate an elastic deformation, so that the hook of the linear fastener can be hooked to a circuit board of the electronic element. In this way, the heat sink can be tightly connected onto the electronic element.
- The current linear fastener is often applied to an aluminum-extruded heat sink. Taiwan Patent No. M379978 discloses a heat-dissipating module, in which heat-dissipating fins are integrally formed on a heat-dissipating plate. A groove is provided on the heat-dissipating plate and the linear fastener is fitted into the groove. In this way, the heat sink can be fixed onto the electronic element in a convenient manner.
- However, the increase in the heat generated by the electronic element requires the heat sink to have a higher heat-dissipating efficiency. Thus, another kind of heat sink having stamped fins is gradually used to replace the traditional aluminum-extruded heat sink.
FIG. 1 shows a conventional heat sink having stamped fins. Theheat sink 100 comprises a plurality of stampedfins 101 arranged in parallel to each other. These stampedfins 101 are engaged with each other and then combined with the heat-dissipating plate 102. Since the heat sink having stamped fins possesses a larger heat-dissipating area, it exhibits a higher heat-dissipating efficiency and thus is widely used in various heat sinks - However, unlike the aluminum-extruded heat-dissipating fins, the stamped fins are not integrally formed on the heat-dissipating plate. Thus, without changing the design of electronic elements and the circuit board, it is an important issued to combine the linear fastener with the heat sink having stamped fins, and to combine the
heat sink 100 with a heat-dissipating element. - In view of the above, the present Inventor proposes a reasonable and practicable structure to solve the above-mentioned problems based on his expert knowledge and deliberate researches.
- The present invention is to provide a heat sink, in which a linear fastener is used to combine heat-dissipating fins with the circuit board to enhance the heat-dissipating efficiency of the heat sink for a heat-dissipating element.
- The present invention provides a heat sink, configured for heat dissipation of a heat-dissipating element on a circuit boards and including a base, a linear fastener and a heat-dissipating fin set. A surface of the base is provided with a groove. The linear fastener comprises a fixing section and engaging sections bent to extend from the fixing section respectively. The fixing section is disposed in the groove. The engaging section protrudes out of the base to be fixed onto the circuit board. The heat-dissipating fin set is constituted of a plurality of stamped fins engaged with each other. The heat-dissipating fin set is combined on the base to press the fixing section, thereby clamping the fixing section between the heat-dissipating fin set and the base.
- The present invention provides a heat sink, configured for heat dissipation of a heat-dissipating element on a circuit boards and including a base, a pair of linear fasteners and a heat-dissipating fin set. A surface of the base is provided with a plurality of grooves. Each of the linear fasteners comprises a fixing section and engaging sections bent to extend from the fixing section respectively. The fixing sections of the pair of linear fasteners are disposed in the grooves symmetrically, so that each of the engaging sections protrudes out of the base to be fixed onto the circuit board. The heat-dissipating fin set is constituted of a plurality of stamped fins engaged with each other. The heat-dissipating fin set is combined on the base to press the fixing sections, thereby clamping the fixing sections between the heat-dissipating fin set and the base.
- In comparison with prior art, the present invention has advantageous features as follows. The heat-dissipating fin set is constituted of a plurality of stamped fins and is separated from the base. In order to combine the base and the heat-dissipating fin set with the heat-dissipating element by means of the linear fastener, a surface of the base is provided with the groove and the linear fastener is disposed in the groove. Then, the heat-dissipating fin set having the fins engaged with each other is combined with the base, whereby the linear fastener can be clamped and positioned between the heat-dissipating fin set and the base. Without changing the design of the electronic elements of the circuit board, the heat-dissipating fin set having stamped fins according to the present invention can be used to replace the conventional aluminum-extruded heat sink directly, thereby improving the heat-dissipating efficiency of the heat sink. Therefore, the practicability of the present invention is increased greatly.
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FIG. 1 shows a heat sink having stamped fins according to prior art; -
FIG. 2 is an exploded perspective view showing the heat sink of the present invention; -
FIG. 3 is a perspective view showing the external appearance of the heat sink of the present invention; -
FIG. 4 is a schematic view showing that the heat sink of the present invention is to be combined with a heat-dissipating element; -
FIG. 5 is an assembled perspective view showing that the heat sink of the present invention is combined with the heat-dissipating element; -
FIG. 6 is a schematic view showing another aspect of the linear fastener of the present invention; -
FIG. 7 is a schematic view showing another embodiment of the heat sink of the present invention; and -
FIG. 8 is a perspective view showing that the heat sink of another embodiment of the present invention is to be combined with the heat-dissipating element. - The detailed description and technical contents of the present invention will become apparent with the following detailed description accompanied with related drawings. It is noteworthy to point out that the drawings is provided for the illustration purpose only, but not intended for limiting the scope of the present invention.
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FIG. 2 is an exploded perspective view showing the heat sink of the present invention, andFIG. 3 is a schematic view showing the external appearance of the heat sink of the present invention. Theheat sink 1 of the present invention includes abase 10, alinear fastener 20, and a heat-dissipating fin set 30. - A surface of the
base 10 is provided with at least onegroove 11. In the present embodiment, thebase 10 is provided with a plurality ofgrooves 11 that are arranged on the surface of thebase 10 longitudinally and transversely. - The
linear fastener 20 is made by bending a metal wire. Thelinear fastener 20 comprises a fixingsection 21 and an engagingsection 22 bent to extend from the fixingsection 21. The fixingsection 21 is disposed in thegroove 11. The engagingsection 22 protrudes out of thebase 10. - In the present embodiment, the
linear fastener 20 has twoengaging sections 22 bent to extend from both ends of the fixingsection 21 respectively. Further, the fixingsection 21 comprises a connectingportion 211 and two abuttingportions 212 extending from both ends of the connectingportion 211 in opposite directions respectively. Each of the engagingsections 22 comprises alocking arm 221 and ahook 222 formed on the distal end of thelocking arm 221. The lockingarm 221 extends obliquely and upwards from the distal end of the fixingsection 21. Thehook 222 is bent toward the inner side of thelinear fastener 20. - The heat-dissipating fin set 30 is constituted of a plurality of stamped
fins 31 engaged with each other. The heat-dissipating fin set 30 is combined on the base 10 to press the fixingsection 21, thereby clamping the fixingsection 21 between the heat-dissipating fin set 30 and thebase 10. Each of the stampedfins 31 has anabutting piece 311 adhered to thebase 10 and a plurality of engagingpieces 312 engaged with each other. The abuttingpieces 311 of adjacent two stampedfins 31 abut against each other to form a heat-dissipatingchannel 310 therebetween. - More specifically, in assembling the
heat sink 1, thelinear fastener 20 is disposed in thegroove 11 of thebase 10. Then, the heat-dissipating fin set 30 is fixed onto the base 10 by means of a welding process or the like. At this time, the connectingportion 211 of thelinear fastener 20 is located between the engagingportions 312 of the stampedfins 31. The two abuttingportions 212 of thelinear fastener 20 extend outside the engagingportions 312 respectively. In this way, thelinear fastener 20 can be firmly clamped between the heat-dissipating fin set 30 and thebase 10. -
FIG. 4 is a schematic view showing that the heat sink of the present invention is to be combined with the heat-dissipating element.FIG. 5 is a perspective view showing that the heat sink of the present invention is combined with the heat-dissipating element. Theheat sink 1 of the present invention is configured for heat dissipation of a heat-dissipatingelement 2 on acircuit board 3. Thecircuit board 3 is provided at least onelocking ring 4 near the heat-dissipatingelement 2. - In use, the
heat sink 1 is disposed on the heat-dissipatingelement 2. Then, the lockingarm 221 of the linear fastener is subjected to a force, so that the engagingsection 22 can be fixed on thecircuit board 3. In the present embodiment, the lockinghook 222 of thelinear fastener 20 is hooked into the locking ring of thecircuit board 3, so that thebase 10 and the heat-dissipating fin set 30 can be firmly combined onto thecircuit board 3 and the base 10 can be tightly adhered to theelectronic element 2. - Please refer to
FIGS. 6 to 8 , which show another embodiment of the heat sink of the present invention and the use thereof. In the present embodiment, theheat sink 1 a includes a base 10 a, a pair oflinear fasteners - The surface of the base 10 a is provided with a plurality of
grooves 11 a. Each of thelinear fasteners section engaging sections section sections linear fasteners grooves 11 a. Each of the engagingsections - Similarly, the
heat sink 1 a is configured for heat dissipation of a heat-dissipatingelement 2 a on acircuit board 3 a. The opposite sides of thecircuit board 3 a are provided with a plurality of lockingrings 4 a. The engagingsections linear fasteners - In the present embodiment, the
linear fastener 20 a is used as an example. The difference between the second embodiment and the first embodiment lies in that the fixingsections 21 a of thelinear fastener 20 a comprises a U-shaped connectingportion 211 a and two abuttingportions 212 a extending from two ends of the U-shaped connectingportions 211 a in opposite directions respectively. The twoengaging sections 22 a of thelinear fastener 20 a are bent to extend from both ends of the fixingsection 21 a toward the same direction.. - Like the previous embodiment, the two
linear fasteners grooves 11 a. Then, the heat-dissipating fin set 30 a is combined with the base 10 a, so that the twolinear fasteners linear fasteners element 2 a. - Although the present invention has been described with reference to the foregoing preferred embodiments, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.
Claims (13)
1. A heat sink, configured for heat dissipation of a heat-dissipating element on a circuit board and including:
a base having at least one groove on its one surface;
a linear fastener comprising a fixing section and an engaging section bent to extend from the fixing section, the fixing section being disposed in the groove, the engaging section protruding out of the base to be fixed on the circuit board; and
a heat-dissipating fin set having a plurality of stamped fins engaged with each other, the heat-dissipating fin set being combined on the base to press the fixing section, thereby clamping the fixing section between the heat-dissipating fin set and the base.
2. The heat sink according to claim 1 , wherein the base is provided with a plurality of grooves, and the grooves are arranged on the surface of the base longitudinally and transversely.
3. The heat sink according to claim 2 , wherein the linear fastener has two engaging sections bent to extend from two ends of the fixing section in opposite directions respectively.
4. The heat sink according to claim 3 , wherein the fixing section comprises a connecting portion and two abutting portions extending from the connecting portions in opposite directions respectively
5. The heat sink according to claim 4 , wherein each of the stamped fins has an abutting piece adhered to the base and a plurality of engaging pieces engaged with each other, and the abutting pieces of adjacent two stamped fins abut against each other to form a heat-dissipating channel there between.
6. The heat sink according to claim 5 , wherein the connecting portion is located between the engaging portions, and the two abutting portions extend outside the engaging portions respectively.
7. The heat sink according to claim 3 , wherein each of the engaging sections comprises a locking arm and a hook formed on a distal end of the locking arm, the locking arm extends obliquely and upwards from the distal end of the fixing section, and the hook is bent toward an inner side of the linear fastener.
8. The heat sink according to claim 1 , wherein the circuit board has at least one locking ring, and the engaging section is hooked into the locking ring of the circuit board.
9. A heat sink, configured for heat dissipation of a heat-dissipating element on a circuit board and including:
a base having a plurality of grooves on its one surface;
a pair of linear fasteners each comprising a fixing section and an engaging section bent to extend from the fixing section, the fixing sections of the pair of linear fastener being disposed in the grooves symmetrically, each of the engaging sections protruding out of the base; and
a heat-dissipating fin set having a plurality of stamped fins engaged with each other, the heat-dissipating fin set being combined on the base to press the fixing sections, thereby clamping the fixing sections between the heat-dissipating fin set and the base.
10. The heat sink according to claim 9 , wherein the fixing section of the linear fastener comprises a U-shaped connecting portion and two abutting portions extending vertically from two ends of the U-shaped connecting portion in opposite directions respectively.
11. The heat sink according to claim 10 , wherein the two engaging sections of each of the linear fasteners are bent to extend toward two ends of the fixing section in the same direction respectively.
12. The heat sink according to claim 11 , wherein each of the engaging sections comprises a locking arm and a hook formed on a distal end of the locking arm, the locking arm extends obliquely and upwards from the distal end of the fixing section, and the hook is bent toward an inner side of the linear fastener.
13. The heat sink according to claim 11 , wherein opposite sides of the circuit board are provided with a plurality of locking rings, and the engaging sections of the pair of linear fastener are hooked into the locking rings respectively.
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US13/285,876 US20130105112A1 (en) | 2011-10-31 | 2011-10-31 | Heat sink |
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US13/285,876 US20130105112A1 (en) | 2011-10-31 | 2011-10-31 | Heat sink |
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Cited By (3)
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USD918160S1 (en) * | 2020-01-14 | 2021-05-04 | All Best Precision Technology Co., Ltd. | Heat sink |
US11324142B2 (en) * | 2018-05-07 | 2022-05-03 | Rolls-Royce Deutschland Ltd & Co Kg | Arrangement of electrical modules, converter and aircraft with such an arrangement, and method for producing the arrangement |
US20220256684A1 (en) * | 2021-02-08 | 2022-08-11 | Baidu Usa Llc | Cooling packages for heterogenous chips |
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