US20130105112A1

US20130105112A1 - Heat sink

Info

Publication number: US20130105112A1
Application number: US13/285,876
Authority: US
Inventors: Xue-Hui GAN
Original assignee: Cooler Master Co Ltd
Current assignee: Cooler Master Development Corp
Priority date: 2011-10-31
Filing date: 2011-10-31
Publication date: 2013-05-02

Abstract

A heat sink configured for heat dissipation of a heat-dissipating element on a circuit boards includes a base, a linear fastener and a heat-dissipating fin set. A surface of the base is provided with a groove. The linear fastener includes a fixing section and an engaging section bent to extend from the fixing section. The fixing section is disposed in the groove. The engaging section protrudes out of the base to be fixed onto the circuit board. The heat-dissipating fin set is constituted of a plurality of stamped fins engaged with each other. The heat-dissipating fin set is combined on the base to press the fixing section, thereby clamping the fixing section between the heat-dissipating fin set and the base. The linear fastener makes the heat-dissipating fin set to be combined on the circuit board, thereby increasing the heat-dissipating efficiency of the heat sink.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention
The present invention relates to a heat sink, and in particular to a heat sink having a linear fastener.
2. Description of Prior Art
With the advancement of science and technology, the function and performance of electronic products are improved. Accordingly, the heat generated by the electronic elements in such an electronic product is increased greatly. Thus, a heat sink is provided for dissipating the heat generated by the electronic elements, thereby controlling the working temperature and maintaining the normal operation of the electronic elements.
Traditionally, the connection between a heat sink and an electronic element is achieved by a fastener. The fastener is used to maintain a good heat conduction between the heat sink and the electronic element. Among the fasteners, linear fastener has a simple structure for easy installation. In use, a groove is provided on the heat sink. Then, the linear fastener having a hook is tightly fitted in the groove. Since the linear fastener is formed by bending a metal wire, the inherent elasticity of the metal wire allows the linear fastener to generate an elastic deformation, so that the hook of the linear fastener can be hooked to a circuit board of the electronic element. In this way, the heat sink can be tightly connected onto the electronic element.
The current linear fastener is often applied to an aluminum-extruded heat sink. Taiwan Patent No. M379978 discloses a heat-dissipating module, in which heat-dissipating fins are integrally formed on a heat-dissipating plate. A groove is provided on the heat-dissipating plate and the linear fastener is fitted into the groove. In this way, the heat sink can be fixed onto the electronic element in a convenient manner.
However, the increase in the heat generated by the electronic element requires the heat sink to have a higher heat-dissipating efficiency. Thus, another kind of heat sink having stamped fins is gradually used to replace the traditional aluminum-extruded heat sink. FIG. 1 shows a conventional heat sink having stamped fins. The heat sink 100 comprises a plurality of stamped fins 101 arranged in parallel to each other. These stamped fins 101 are engaged with each other and then combined with the heat-dissipating plate 102. Since the heat sink having stamped fins possesses a larger heat-dissipating area, it exhibits a higher heat-dissipating efficiency and thus is widely used in various heat sinks
However, unlike the aluminum-extruded heat-dissipating fins, the stamped fins are not integrally formed on the heat-dissipating plate. Thus, without changing the design of electronic elements and the circuit board, it is an important issued to combine the linear fastener with the heat sink having stamped fins, and to combine the heat sink 100 with a heat-dissipating element.
In view of the above, the present Inventor proposes a reasonable and practicable structure to solve the above-mentioned problems based on his expert knowledge and deliberate researches.

SUMMARY OF THE INVENTION

The present invention is to provide a heat sink, in which a linear fastener is used to combine heat-dissipating fins with the circuit board to enhance the heat-dissipating efficiency of the heat sink for a heat-dissipating element.
The present invention provides a heat sink, configured for heat dissipation of a heat-dissipating element on a circuit boards and including a base, a linear fastener and a heat-dissipating fin set. A surface of the base is provided with a groove. The linear fastener comprises a fixing section and engaging sections bent to extend from the fixing section respectively. The fixing section is disposed in the groove. The engaging section protrudes out of the base to be fixed onto the circuit board. The heat-dissipating fin set is constituted of a plurality of stamped fins engaged with each other. The heat-dissipating fin set is combined on the base to press the fixing section, thereby clamping the fixing section between the heat-dissipating fin set and the base.
The present invention provides a heat sink, configured for heat dissipation of a heat-dissipating element on a circuit boards and including a base, a pair of linear fasteners and a heat-dissipating fin set. A surface of the base is provided with a plurality of grooves. Each of the linear fasteners comprises a fixing section and engaging sections bent to extend from the fixing section respectively. The fixing sections of the pair of linear fasteners are disposed in the grooves symmetrically, so that each of the engaging sections protrudes out of the base to be fixed onto the circuit board. The heat-dissipating fin set is constituted of a plurality of stamped fins engaged with each other. The heat-dissipating fin set is combined on the base to press the fixing sections, thereby clamping the fixing sections between the heat-dissipating fin set and the base.
In comparison with prior art, the present invention has advantageous features as follows. The heat-dissipating fin set is constituted of a plurality of stamped fins and is separated from the base. In order to combine the base and the heat-dissipating fin set with the heat-dissipating element by means of the linear fastener, a surface of the base is provided with the groove and the linear fastener is disposed in the groove. Then, the heat-dissipating fin set having the fins engaged with each other is combined with the base, whereby the linear fastener can be clamped and positioned between the heat-dissipating fin set and the base. Without changing the design of the electronic elements of the circuit board, the heat-dissipating fin set having stamped fins according to the present invention can be used to replace the conventional aluminum-extruded heat sink directly, thereby improving the heat-dissipating efficiency of the heat sink. Therefore, the practicability of the present invention is increased greatly.

BRIEF DESCRIPTION OF DRAWING

FIG. 1 shows a heat sink having stamped fins according to prior art;

FIG. 2 is an exploded perspective view showing the heat sink of the present invention;

FIG. 3 is a perspective view showing the external appearance of the heat sink of the present invention;

FIG. 4 is a schematic view showing that the heat sink of the present invention is to be combined with a heat-dissipating element;

FIG. 5 is an assembled perspective view showing that the heat sink of the present invention is combined with the heat-dissipating element;

FIG. 6 is a schematic view showing another aspect of the linear fastener of the present invention;

FIG. 7 is a schematic view showing another embodiment of the heat sink of the present invention; and

FIG. 8 is a perspective view showing that the heat sink of another embodiment of the present invention is to be combined with the heat-dissipating element.

DETAILED DESCRIPTION OF THE INVENTION

The detailed description and technical contents of the present invention will become apparent with the following detailed description accompanied with related drawings. It is noteworthy to point out that the drawings is provided for the illustration purpose only, but not intended for limiting the scope of the present invention.
FIG. 2 is an exploded perspective view showing the heat sink of the present invention, and FIG. 3 is a schematic view showing the external appearance of the heat sink of the present invention. The heat sink 1 of the present invention includes a base 10, a linear fastener 20, and a heat-dissipating fin set 30.
A surface of the base 10 is provided with at least one groove 11. In the present embodiment, the base 10 is provided with a plurality of grooves 11 that are arranged on the surface of the base 10 longitudinally and transversely.
The linear fastener 20 is made by bending a metal wire. The linear fastener 20 comprises a fixing section 21 and an engaging section 22 bent to extend from the fixing section 21. The fixing section 21 is disposed in the groove 11. The engaging section 22 protrudes out of the base 10.
In the present embodiment, the linear fastener 20 has two engaging sections 22 bent to extend from both ends of the fixing section 21 respectively. Further, the fixing section 21 comprises a connecting portion 211 and two abutting portions 212 extending from both ends of the connecting portion 211 in opposite directions respectively. Each of the engaging sections 22 comprises a locking arm 221 and a hook 222 formed on the distal end of the locking arm 221. The locking arm 221 extends obliquely and upwards from the distal end of the fixing section 21. The hook 222 is bent toward the inner side of the linear fastener 20.
The heat-dissipating fin set 30 is constituted of a plurality of stamped fins 31 engaged with each other. The heat-dissipating fin set 30 is combined on the base 10 to press the fixing section 21, thereby clamping the fixing section 21 between the heat-dissipating fin set 30 and the base 10. Each of the stamped fins 31 has an abutting piece 311 adhered to the base 10 and a plurality of engaging pieces 312 engaged with each other. The abutting pieces 311 of adjacent two stamped fins 31 abut against each other to form a heat-dissipating channel 310 therebetween.
More specifically, in assembling the heat sink 1, the linear fastener 20 is disposed in the groove 11 of the base 10. Then, the heat-dissipating fin set 30 is fixed onto the base 10 by means of a welding process or the like. At this time, the connecting portion 211 of the linear fastener 20 is located between the engaging portions 312 of the stamped fins 31. The two abutting portions 212 of the linear fastener 20 extend outside the engaging portions 312 respectively. In this way, the linear fastener 20 can be firmly clamped between the heat-dissipating fin set 30 and the base 10.
FIG. 4 is a schematic view showing that the heat sink of the present invention is to be combined with the heat-dissipating element. FIG. 5 is a perspective view showing that the heat sink of the present invention is combined with the heat-dissipating element. The heat sink 1 of the present invention is configured for heat dissipation of a heat-dissipating element 2 on a circuit board 3. The circuit board 3 is provided at least one locking ring 4 near the heat-dissipating element 2.
In use, the heat sink 1 is disposed on the heat-dissipating element 2. Then, the locking arm 221 of the linear fastener is subjected to a force, so that the engaging section 22 can be fixed on the circuit board 3. In the present embodiment, the locking hook 222 of the linear fastener 20 is hooked into the locking ring of the circuit board 3, so that the base 10 and the heat-dissipating fin set 30 can be firmly combined onto the circuit board 3 and the base 10 can be tightly adhered to the electronic element 2.
Please refer to FIGS. 6 to 8, which show another embodiment of the heat sink of the present invention and the use thereof. In the present embodiment, the heat sink 1 a includes a base 10 a, a pair of linear fasteners 20 a, 20 a′, and a heat-dissipating fin set 30 a.
The surface of the base 10 a is provided with a plurality of grooves 11 a. Each of the linear fasteners 20 a, 20 a′ comprises a fixing section 21 a, 21 a′ and two engaging sections 22 a, 22 a′ bent to extend from both sides of the fixing section 21 a, 21 a′ respectively. The fixing sections 21 a, 21 a′ of the pair of linear fasteners 20 a, 20 a′ are disposed in the grooves 11 a. Each of the engaging sections 22 a, 22 a′ protrudes out of the base 10 a.
Similarly, the heat sink 1 a is configured for heat dissipation of a heat-dissipating element 2 a on a circuit board 3 a. The opposite sides of the circuit board 3 a are provided with a plurality of locking rings 4 a. The engaging sections 22 a, 22 a′ of the two linear fasteners 20 a, 20 a′ are hooked into the locking rings 4 a respectively.
In the present embodiment, the linear fastener 20 a is used as an example. The difference between the second embodiment and the first embodiment lies in that the fixing sections 21 a of the linear fastener 20 a comprises a U-shaped connecting portion 211 a and two abutting portions 212 a extending from two ends of the U-shaped connecting portions 211 a in opposite directions respectively. The two engaging sections 22 a of the linear fastener 20 a are bent to extend from both ends of the fixing section 21 a toward the same direction..
Like the previous embodiment, the two linear fasteners 20 a, 20 a′ are disposed in the grooves 11 a. Then, the heat-dissipating fin set 30 a is combined with the base 10 a, so that the two linear fasteners 20 a, 20 a′ can be firmly clamped between the heat-dissipating fin set 30 and the base 10 a. Finally, the two linear fasteners 20 a, 20 a′ are hooked onto the locking rings 4 a, so that the base 10 a and the heat-dissipating fin set 30 a can be combined onto the heat-dissipating element 2 a.
Although the present invention has been described with reference to the foregoing preferred embodiments, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.

Claims

What is claimed is:

1. A heat sink, configured for heat dissipation of a heat-dissipating element on a circuit board and including:

a base having at least one groove on its one surface;

a linear fastener comprising a fixing section and an engaging section bent to extend from the fixing section, the fixing section being disposed in the groove, the engaging section protruding out of the base to be fixed on the circuit board; and

a heat-dissipating fin set having a plurality of stamped fins engaged with each other, the heat-dissipating fin set being combined on the base to press the fixing section, thereby clamping the fixing section between the heat-dissipating fin set and the base.

2. The heat sink according to claim 1, wherein the base is provided with a plurality of grooves, and the grooves are arranged on the surface of the base longitudinally and transversely.

3. The heat sink according to claim 2, wherein the linear fastener has two engaging sections bent to extend from two ends of the fixing section in opposite directions respectively.

4. The heat sink according to claim 3, wherein the fixing section comprises a connecting portion and two abutting portions extending from the connecting portions in opposite directions respectively

5. The heat sink according to claim 4, wherein each of the stamped fins has an abutting piece adhered to the base and a plurality of engaging pieces engaged with each other, and the abutting pieces of adjacent two stamped fins abut against each other to form a heat-dissipating channel there between.

6. The heat sink according to claim 5, wherein the connecting portion is located between the engaging portions, and the two abutting portions extend outside the engaging portions respectively.

7. The heat sink according to claim 3, wherein each of the engaging sections comprises a locking arm and a hook formed on a distal end of the locking arm, the locking arm extends obliquely and upwards from the distal end of the fixing section, and the hook is bent toward an inner side of the linear fastener.

8. The heat sink according to claim 1, wherein the circuit board has at least one locking ring, and the engaging section is hooked into the locking ring of the circuit board.

9. A heat sink, configured for heat dissipation of a heat-dissipating element on a circuit board and including:

a base having a plurality of grooves on its one surface;

a pair of linear fasteners each comprising a fixing section and an engaging section bent to extend from the fixing section, the fixing sections of the pair of linear fastener being disposed in the grooves symmetrically, each of the engaging sections protruding out of the base; and

a heat-dissipating fin set having a plurality of stamped fins engaged with each other, the heat-dissipating fin set being combined on the base to press the fixing sections, thereby clamping the fixing sections between the heat-dissipating fin set and the base.

10. The heat sink according to claim 9, wherein the fixing section of the linear fastener comprises a U-shaped connecting portion and two abutting portions extending vertically from two ends of the U-shaped connecting portion in opposite directions respectively.

11. The heat sink according to claim 10, wherein the two engaging sections of each of the linear fasteners are bent to extend toward two ends of the fixing section in the same direction respectively.

12. The heat sink according to claim 11, wherein each of the engaging sections comprises a locking arm and a hook formed on a distal end of the locking arm, the locking arm extends obliquely and upwards from the distal end of the fixing section, and the hook is bent toward an inner side of the linear fastener.

13. The heat sink according to claim 11, wherein opposite sides of the circuit board are provided with a plurality of locking rings, and the engaging sections of the pair of linear fastener are hooked into the locking rings respectively.