US20030209342A1 - Cooler assembly - Google Patents

Cooler assembly Download PDF

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Publication number
US20030209342A1
US20030209342A1 US10424076 US42407603A US2003209342A1 US 20030209342 A1 US20030209342 A1 US 20030209342A1 US 10424076 US10424076 US 10424076 US 42407603 A US42407603 A US 42407603A US 2003209342 A1 US2003209342 A1 US 2003209342A1
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US
Grant status
Application
Patent type
Prior art keywords
heat
cooler
sink
fins
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10424076
Inventor
Lu Hsin
Lin Lung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
POLO TECH Co Ltd
Original Assignee
POLO TECH Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A cooler assembly having cross-directional ventilation effect and increased heat conducting surface area is disclosed. The cooler assembly has a heat sink and a plurality of fins. The heat sink has an air circulating channel open therethrough, and each of the fins has a slot allowing the fin mounted across the heat sink, and a contact pair that separate the neighboring fins with spaces.

Description

    BACKGROUND OF THE INVENTION
  • [0001]
    The present invention relates in general to a cooler assembly and, more particularly, to a cooler assembly which does not provide the enhanced heat dissipation, but also provide the fastening function.
  • [0002]
    Various kinds of cooler structures for electronic products have been developed. Among the currently available types of coolers, the fin-type cooler provides better heat dissipation effect.
  • [0003]
    Referring to FIG. 1, a perspective exploded view of a prior art fin-type cooler is illustrated. The fin-type cooler includes a plurality of fins 11 fastened together to form a set of fins 1 which is then installed on the heat sink 2. Each of the fins 11 includes a pair of symmetric opposing side walls 111. Each of the side walls 111 includes two fastening slots 113 and two protrusions 112, such that the neighboring fins 11 can be connected together by engaging the protrusions 112 with the slots 113; and thereby, the set of fins 1 is assembled, and the side walls 111 are joined together to form a pair of opposing planar side walls, and one of which is attached to the surface of the heat sink 2.
  • [0004]
    However, the heat conduction of this type of cooler is not fast enough. The heat dissipation area is not sufficient since though the spaces 12 provide lateral air circulation, the joined side walls 111 block longitudinal air circulation. Therefore, the heat efficiency has to be improved. Further, while applying the prior art to a heat generating device, an additional metal shield is required to cover the cooler 2 when the bottom surface thereof is adhered to the heat generating device. The metal shield is then soldered on the printed circuit board to cause additional inconvenience and drawbacks. Therefore, this kind of cooler is less convenient and effective compared to those using fastening device such as snap-on latch (for example, using a latch spring to mount a cooler on a CPU socket).
  • [0005]
    Accordingly, the Applicant has developed a reasonably designed structure that has resolved the problems occurring to the prior art structure as mentioned above.
  • BRIEF SUMMARY OF THE INVENTION
  • [0006]
    The present invention provides a cooler assembly to enhance the heat dissipation efficiency.
  • [0007]
    The present invention further provides a cooler that can be directly installed on a device slot such as a CPU slot by a latch spring.
  • [0008]
    The cooler assembly provided by the present invention comprises a heat sink and a plurality of fins. An air circulating channel is formed through the heat sink. Each fin includes a slot allowing the fin mounted across the heat sink, and at least one contact part protruding therefrom, such that the neighboring fins are separated from each other by a space.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • [0009]
    These as well as other features of the present invention will become more apparent upon reference to the drawings wherein:
  • [0010]
    [0010]FIG. 1 shows the perspective exploded view of a prior art cooler;
  • [0011]
    [0011]FIG. 2 shows the perspective exploded view of the present invention;
  • [0012]
    [0012]FIG. 3 shows the perspective assembly of the present invention;
  • [0013]
    [0013]FIG. 4 shows a side view of FIG. 3;
  • [0014]
    [0014]FIG. 5 shows a top view of FIG. 3; and
  • [0015]
    [0015]FIG. 6 shows a local cross sectional view of a cooler.
  • DETAILED DESCRIPTION OF THE INVENTION
  • [0016]
    Referring to FIGS. 2 and 3, the present invention provides a cooler assembly including a three-dimensional structure of heat sink 4 and a plurality of fins 31 stacked together to form a set of fins 3.
  • [0017]
    Referring to FIG. 4, the heat sink 4 has a substantially trapezoid cross sectional profile and an air circulating channel 41 recessed from a top surface of the heat sink 4 and extending from a front surface through a rear surface thereof. Each of the fins 31 has a substantially inverse trapezoid profile and a slot 312 recessed from a bottom edge thereof. The shape of the slot 312 corresponds with the substantially trapezoid profile of the heat sink 4. Two sides of the slot 312 each has a flange 3121 protruding substantially perpendicular to the fin 31, and two top edges of each fin 31 further comprise contact parts 311 protruding substantially perpendicularly and preferably backwardly from the fin 31.
  • [0018]
    Each of the fins 31 is mounted across the heat sink 4 via the slot 312. The flanges 3121 protruding from two sides of each fin 31 provide the means for soldering the fin 31 on two side surfaces of the heat sink 4. When the fins 31 are stacked together to form the set of fins 3, spaces 32 are formed between the fins 31 due to protrusions of the contact parts 311 (as shown in FIGS. 2 and 5). Therefore, the side surfaces of the heat sink 4 are enlarged to consequently increase the overall heat conducting surface of the cooler assembly. Further, the air circulating channel 41 formed in the heat sink 4 further enhances the heat dissipation efficiency.
  • [0019]
    As shown in FIG. 2, a latch spring 5 can be installed in the air circulating channel 41 and assembled with the cooler as shown in FIGS. 3, 4 and 5. As shown in FIG. 6, the cooler is mounted to a device socket 6 via the latch spring 5. As shown, the device socket 6 is a CPU socket in which a heat generating device 7 such as a CPU is plugged, and the cooler provided by the present invention is placed over the heat generating device 7 and mounted to the device socket 6 via the latch spring 5. The heat generating device 7 is placed between the heat sink 4 and the device socket 6, such that the heat generated by the heat generating device 7 can be easily conducted to the heat sink 4, and then dissipated via the fins 31, the spaces 32 and the air circulating channel 41. In addition, a fan (not shown) may also be placed over the set of fins 3 to reinforce heat circulation.
  • [0020]
    The profiles and shapes of the heat sink 4, the fins 31 and the slot 312 are not limited to trapezoid or inverse trapezoid. It is appreciated that other shapes such as rectangle or polygonal can also be applied to achieve the same effect without exceeding the spirit and scope of the present invention.
  • [0021]
    The heat sink 4 provided by the present invention, instead of being a two-dimensional plate, includes a three-dimensional structure of which the surface area is greatly increased. Further, the formation of an air circulating channel 41 provides an elongate path of air circulation. Therefore, the cooler provided by the present invention provides a cross-directional ventilation effect and a latch spring 5 that directly mount the cooler to the heat generating device 7. In this embodiment, the cross-directional ventilation includes the longitudinal air circulation through the spaces 12 and the lateral air circulation along an elongate direction of the heat sink 4. This disclosure provides exemplary embodiments of the present invention. The scope of the present invention is not limited by these exemplary embodiments. Numerous variations, whether explicitly provided for by the specification or implied by the specification, such as variations in structure, dimension, type of material and manufacturing process may be implemented by one of skill in the art in view of this disclosure.

Claims (11)

    What is claimed:
  1. 1. A cooler assembly, comprising:
    a heat sink, having an air circulating channel formed therethrough; and
    a plurality of fins, each having a slot recessed from a bottom edge thereof and at least one contact part protruding therefrom, wherein the fins are stacked together and mounted across the heat sink via the slot, and the neighboring fins are separated from each other by the contact parts.
  2. 2. The cooler assembly of claim 1, wherein the air circulating channel is recessed from a top surface of the heat sink and penetrating through the heat sink along an elongate direction of the heat sink.
  3. 3. The cooler assembly of claim 2, wherein each fin is mounted across two side surfaces of the heat sink.
  4. 4. The cooler assembly of claim 1, wherein each slot opens downwardly.
  5. 5. The cooler assembly of claim 4, wherein two side surfaces of each slot comprise a pair of flanges for soldering or adhering the fins to the heat sink.
  6. 6. The cooler assembly of claim 1, further comprising a fastening device in the air circulating channel.
  7. 7. The cooler assembly of claim 6, wherein two ends of the fastening device are latched with a device socket in which a heat generating device is plugged, and the heat generating device is disposed between the heat sink and the device socket.
  8. 8. The cooler assembly of claim 1, wherein the heat sink has a substantially trapezoid cross sectional profile, and each of the fins has a substantially inverse trapezoid profile.
  9. 9. The cooler assembly of claim 1, wherein the air circulating channel opens upwardly and penetrate through the heat sink, and the fins are mounted across the side surfaces of the heat sink, and the slot of each fin opens downward and has a geometry mating the cross sectional profile of the heat sink.
  10. 10. The cooler assembly of claim 1, wherein the slot is corresponsive with the air circulating channel.
  11. 11. A cooler assembly, including a plurality of stacked fins mounted across a heat sink, each of the fins having a slot opening downwardly, and the heat sink comprising a through air circulating channel open upwardly.
US10424076 2002-05-07 2003-04-28 Cooler assembly Abandoned US20030209342A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW91206424 2002-05-07
TW91206424 2002-05-07

Publications (1)

Publication Number Publication Date
US20030209342A1 true true US20030209342A1 (en) 2003-11-13

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Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6842342B1 (en) * 2003-09-12 2005-01-11 Leohab Enterprise Co., Ltd. Heat sink
US20050051296A1 (en) * 2002-09-30 2005-03-10 Ching-Fa Shiao Heat sink
US20050061479A1 (en) * 2003-09-19 2005-03-24 Lee Hsieh Kun Radiator with streamline airflow guiding structure
US20050103474A1 (en) * 2003-10-28 2005-05-19 Lee Hsieh K. Heat dissipation device
US20050103471A1 (en) * 2003-11-14 2005-05-19 Chun-Chi Chen Heat sink
US20050103476A1 (en) * 2003-11-17 2005-05-19 Chun-Chi Chen Heat dissipating assembly with heat pipes
US20050109488A1 (en) * 2003-11-21 2005-05-26 Jack Wang Fastening structure of heat sink
WO2005059465A1 (en) * 2003-12-11 2005-06-30 Molex Incorporated Heat conduction device
US20050252650A1 (en) * 2004-05-12 2005-11-17 Hul-Chun Hsu Integrated heat dissipation apparatus
KR100790790B1 (en) 2006-09-14 2008-01-02 (주)셀시아테크놀러지스한국 Heat sink and cooler for integrated circuit
US20090165998A1 (en) * 2007-12-27 2009-07-02 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US20100284142A1 (en) * 2009-05-06 2010-11-11 HONG FU JIN PRECISION INDUSTRY (ShenZhen ) CO.LTD. Heat dissipating assembly
US20110013392A1 (en) * 2009-07-15 2011-01-20 Little Jr William D Lighting apparatus
US20110013402A1 (en) * 2009-07-15 2011-01-20 Aphos Lighting Llc Light Feature
US20120024806A1 (en) * 2010-07-02 2012-02-02 Sabrie Soloman Segmented Slat
US20130105112A1 (en) * 2011-10-31 2013-05-02 Cooler Master Co., Ltd. Heat sink
US20130114213A1 (en) * 2011-11-09 2013-05-09 Silicon Intergrated Systems Corp. Electronic device
US9409264B2 (en) * 2013-03-25 2016-08-09 International Business Machines Corporation Interleaved heat sink and fan assembly

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2023739A (en) * 1935-02-14 1935-12-10 Bush Mfg Company Radiator
US5509465A (en) * 1995-03-10 1996-04-23 Bioli Corporation Heat-dissipating device for a central processing unit chip
US6269003B1 (en) * 1999-12-27 2001-07-31 Wei Wen-Chen Heat dissipater structure
US6382306B1 (en) * 2000-08-15 2002-05-07 Hul Chun Hsu Geometrical streamline flow guiding and heat-dissipating structure
US6396697B1 (en) * 2000-12-07 2002-05-28 Foxconn Precision Components Co., Ltd. Heat dissipation assembly
US6415853B1 (en) * 2002-01-22 2002-07-09 Chaun-Choung Technology Corp. Wind cover locking element structure of heat radiator
US20020117295A1 (en) * 2001-02-26 2002-08-29 Ching-Hang Shen Heat dissipating structure

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2023739A (en) * 1935-02-14 1935-12-10 Bush Mfg Company Radiator
US5509465A (en) * 1995-03-10 1996-04-23 Bioli Corporation Heat-dissipating device for a central processing unit chip
US6269003B1 (en) * 1999-12-27 2001-07-31 Wei Wen-Chen Heat dissipater structure
US6382306B1 (en) * 2000-08-15 2002-05-07 Hul Chun Hsu Geometrical streamline flow guiding and heat-dissipating structure
US6396697B1 (en) * 2000-12-07 2002-05-28 Foxconn Precision Components Co., Ltd. Heat dissipation assembly
US20020117295A1 (en) * 2001-02-26 2002-08-29 Ching-Hang Shen Heat dissipating structure
US6415853B1 (en) * 2002-01-22 2002-07-09 Chaun-Choung Technology Corp. Wind cover locking element structure of heat radiator

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050051296A1 (en) * 2002-09-30 2005-03-10 Ching-Fa Shiao Heat sink
US6842342B1 (en) * 2003-09-12 2005-01-11 Leohab Enterprise Co., Ltd. Heat sink
US20050061479A1 (en) * 2003-09-19 2005-03-24 Lee Hsieh Kun Radiator with streamline airflow guiding structure
US7243708B2 (en) * 2003-09-19 2007-07-17 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Radiator with streamline airflow guiding structure
US20050103474A1 (en) * 2003-10-28 2005-05-19 Lee Hsieh K. Heat dissipation device
US7051792B2 (en) * 2003-10-28 2006-05-30 Hon Hai Precision Ind. Co., Ltd. Heat dissipation device
US20050103471A1 (en) * 2003-11-14 2005-05-19 Chun-Chi Chen Heat sink
US7152666B2 (en) * 2003-11-14 2006-12-26 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat sink
US20050103476A1 (en) * 2003-11-17 2005-05-19 Chun-Chi Chen Heat dissipating assembly with heat pipes
US6968889B2 (en) * 2003-11-21 2005-11-29 Waffer Technology Corp. Fastening structure of heat sink
US20050109488A1 (en) * 2003-11-21 2005-05-26 Jack Wang Fastening structure of heat sink
US8042605B2 (en) 2003-12-11 2011-10-25 Molex Incorporated Heat conduction device
WO2005059465A1 (en) * 2003-12-11 2005-06-30 Molex Incorporated Heat conduction device
US20070272390A1 (en) * 2003-12-11 2007-11-29 Jun-Liang Hu Heat Conduction Device
US20050252650A1 (en) * 2004-05-12 2005-11-17 Hul-Chun Hsu Integrated heat dissipation apparatus
US7040389B2 (en) * 2004-05-12 2006-05-09 Hul-Chun Hsu Integrated heat dissipation apparatus
KR100790790B1 (en) 2006-09-14 2008-01-02 (주)셀시아테크놀러지스한국 Heat sink and cooler for integrated circuit
US20090165998A1 (en) * 2007-12-27 2009-07-02 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US20100284142A1 (en) * 2009-05-06 2010-11-11 HONG FU JIN PRECISION INDUSTRY (ShenZhen ) CO.LTD. Heat dissipating assembly
US7929293B2 (en) * 2009-05-06 2011-04-19 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipating assembly
US20110013392A1 (en) * 2009-07-15 2011-01-20 Little Jr William D Lighting apparatus
US20110013402A1 (en) * 2009-07-15 2011-01-20 Aphos Lighting Llc Light Feature
US8360613B2 (en) 2009-07-15 2013-01-29 Aphos Lighting Llc Light feature
US20120024806A1 (en) * 2010-07-02 2012-02-02 Sabrie Soloman Segmented Slat
US8413797B2 (en) * 2010-07-02 2013-04-09 Sabrie Soloman Segmented slat
US20130105112A1 (en) * 2011-10-31 2013-05-02 Cooler Master Co., Ltd. Heat sink
US20130114213A1 (en) * 2011-11-09 2013-05-09 Silicon Intergrated Systems Corp. Electronic device
US9409264B2 (en) * 2013-03-25 2016-08-09 International Business Machines Corporation Interleaved heat sink and fan assembly

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Legal Events

Date Code Title Description
AS Assignment

Owner name: POLO TECH CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HSIN, LU CHUN;LUNG, LIN PAO;REEL/FRAME:014013/0221

Effective date: 20030330