US20030209342A1 - Cooler assembly - Google Patents
Cooler assembly Download PDFInfo
- Publication number
- US20030209342A1 US20030209342A1 US10/424,076 US42407603A US2003209342A1 US 20030209342 A1 US20030209342 A1 US 20030209342A1 US 42407603 A US42407603 A US 42407603A US 2003209342 A1 US2003209342 A1 US 2003209342A1
- Authority
- US
- United States
- Prior art keywords
- heat sink
- fins
- cooler assembly
- slot
- air circulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000005476 soldering Methods 0.000 claims description 2
- 230000013011 mating Effects 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 4
- 238000009423 ventilation Methods 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates in general to a cooler assembly and, more particularly, to a cooler assembly which does not provide the enhanced heat dissipation, but also provide the fastening function.
- the fin-type cooler includes a plurality of fins 11 fastened together to form a set of fins 1 which is then installed on the heat sink 2 .
- Each of the fins 11 includes a pair of symmetric opposing side walls 111 .
- Each of the side walls 111 includes two fastening slots 113 and two protrusions 112 , such that the neighboring fins 11 can be connected together by engaging the protrusions 112 with the slots 113 ; and thereby, the set of fins 1 is assembled, and the side walls 111 are joined together to form a pair of opposing planar side walls, and one of which is attached to the surface of the heat sink 2 .
- the present invention provides a cooler assembly to enhance the heat dissipation efficiency.
- the present invention further provides a cooler that can be directly installed on a device slot such as a CPU slot by a latch spring.
- An air circulating channel is formed through the heat sink.
- Each fin includes a slot allowing the fin mounted across the heat sink, and at least one contact part protruding therefrom, such that the neighboring fins are separated from each other by a space.
- FIG. 1 shows the perspective exploded view of a prior art cooler
- FIG. 2 shows the perspective exploded view of the present invention
- FIG. 3 shows the perspective assembly of the present invention
- FIG. 4 shows a side view of FIG. 3
- FIG. 5 shows a top view of FIG. 3
- FIG. 6 shows a local cross sectional view of a cooler.
- the present invention provides a cooler assembly including a three-dimensional structure of heat sink 4 and a plurality of fins 31 stacked together to form a set of fins 3 .
- the heat sink 4 has a substantially trapezoid cross sectional profile and an air circulating channel 41 recessed from a top surface of the heat sink 4 and extending from a front surface through a rear surface thereof.
- Each of the fins 31 has a substantially inverse trapezoid profile and a slot 312 recessed from a bottom edge thereof.
- the shape of the slot 312 corresponds with the substantially trapezoid profile of the heat sink 4 .
- Two sides of the slot 312 each has a flange 3121 protruding substantially perpendicular to the fin 31 , and two top edges of each fin 31 further comprise contact parts 311 protruding substantially perpendicularly and preferably backwardly from the fin 31 .
- Each of the fins 31 is mounted across the heat sink 4 via the slot 312 .
- the flanges 3121 protruding from two sides of each fin 31 provide the means for soldering the fin 31 on two side surfaces of the heat sink 4 .
- spaces 32 are formed between the fins 31 due to protrusions of the contact parts 311 (as shown in FIGS. 2 and 5). Therefore, the side surfaces of the heat sink 4 are enlarged to consequently increase the overall heat conducting surface of the cooler assembly. Further, the air circulating channel 41 formed in the heat sink 4 further enhances the heat dissipation efficiency.
- a latch spring 5 can be installed in the air circulating channel 41 and assembled with the cooler as shown in FIGS. 3, 4 and 5 .
- the cooler is mounted to a device socket 6 via the latch spring 5 .
- the device socket 6 is a CPU socket in which a heat generating device 7 such as a CPU is plugged, and the cooler provided by the present invention is placed over the heat generating device 7 and mounted to the device socket 6 via the latch spring 5 .
- the heat generating device 7 is placed between the heat sink 4 and the device socket 6 , such that the heat generated by the heat generating device 7 can be easily conducted to the heat sink 4 , and then dissipated via the fins 31 , the spaces 32 and the air circulating channel 41 .
- a fan (not shown) may also be placed over the set of fins 3 to reinforce heat circulation.
- the profiles and shapes of the heat sink 4 , the fins 31 and the slot 312 are not limited to trapezoid or inverse trapezoid. It is appreciated that other shapes such as rectangle or polygonal can also be applied to achieve the same effect without exceeding the spirit and scope of the present invention.
- the heat sink 4 provided by the present invention instead of being a two-dimensional plate, includes a three-dimensional structure of which the surface area is greatly increased. Further, the formation of an air circulating channel 41 provides an elongate path of air circulation. Therefore, the cooler provided by the present invention provides a cross-directional ventilation effect and a latch spring 5 that directly mount the cooler to the heat generating device 7 . In this embodiment, the cross-directional ventilation includes the longitudinal air circulation through the spaces 12 and the lateral air circulation along an elongate direction of the heat sink 4 .
- This disclosure provides exemplary embodiments of the present invention. The scope of the present invention is not limited by these exemplary embodiments. Numerous variations, whether explicitly provided for by the specification or implied by the specification, such as variations in structure, dimension, type of material and manufacturing process may be implemented by one of skill in the art in view of this disclosure.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A cooler assembly having cross-directional ventilation effect and increased heat conducting surface area is disclosed. The cooler assembly has a heat sink and a plurality of fins. The heat sink has an air circulating channel open therethrough, and each of the fins has a slot allowing the fin mounted across the heat sink, and a contact pair that separate the neighboring fins with spaces.
Description
- The present invention relates in general to a cooler assembly and, more particularly, to a cooler assembly which does not provide the enhanced heat dissipation, but also provide the fastening function.
- Various kinds of cooler structures for electronic products have been developed. Among the currently available types of coolers, the fin-type cooler provides better heat dissipation effect.
- Referring to FIG. 1, a perspective exploded view of a prior art fin-type cooler is illustrated. The fin-type cooler includes a plurality of
fins 11 fastened together to form a set offins 1 which is then installed on theheat sink 2. Each of thefins 11 includes a pair of symmetricopposing side walls 111. Each of theside walls 111 includes twofastening slots 113 and twoprotrusions 112, such that the neighboringfins 11 can be connected together by engaging theprotrusions 112 with theslots 113; and thereby, the set offins 1 is assembled, and theside walls 111 are joined together to form a pair of opposing planar side walls, and one of which is attached to the surface of theheat sink 2. - However, the heat conduction of this type of cooler is not fast enough. The heat dissipation area is not sufficient since though the
spaces 12 provide lateral air circulation, the joinedside walls 111 block longitudinal air circulation. Therefore, the heat efficiency has to be improved. Further, while applying the prior art to a heat generating device, an additional metal shield is required to cover thecooler 2 when the bottom surface thereof is adhered to the heat generating device. The metal shield is then soldered on the printed circuit board to cause additional inconvenience and drawbacks. Therefore, this kind of cooler is less convenient and effective compared to those using fastening device such as snap-on latch (for example, using a latch spring to mount a cooler on a CPU socket). - Accordingly, the Applicant has developed a reasonably designed structure that has resolved the problems occurring to the prior art structure as mentioned above.
- The present invention provides a cooler assembly to enhance the heat dissipation efficiency.
- The present invention further provides a cooler that can be directly installed on a device slot such as a CPU slot by a latch spring.
- The cooler assembly provided by the present invention comprises a heat sink and a plurality of fins. An air circulating channel is formed through the heat sink. Each fin includes a slot allowing the fin mounted across the heat sink, and at least one contact part protruding therefrom, such that the neighboring fins are separated from each other by a space.
- These as well as other features of the present invention will become more apparent upon reference to the drawings wherein:
- FIG. 1 shows the perspective exploded view of a prior art cooler;
- FIG. 2 shows the perspective exploded view of the present invention;
- FIG. 3 shows the perspective assembly of the present invention;
- FIG. 4 shows a side view of FIG. 3;
- FIG. 5 shows a top view of FIG. 3; and
- FIG. 6 shows a local cross sectional view of a cooler.
- Referring to FIGS. 2 and 3, the present invention provides a cooler assembly including a three-dimensional structure of
heat sink 4 and a plurality offins 31 stacked together to form a set offins 3. - Referring to FIG. 4, the
heat sink 4 has a substantially trapezoid cross sectional profile and anair circulating channel 41 recessed from a top surface of theheat sink 4 and extending from a front surface through a rear surface thereof. Each of thefins 31 has a substantially inverse trapezoid profile and aslot 312 recessed from a bottom edge thereof. The shape of theslot 312 corresponds with the substantially trapezoid profile of theheat sink 4. Two sides of theslot 312 each has aflange 3121 protruding substantially perpendicular to thefin 31, and two top edges of eachfin 31 further comprisecontact parts 311 protruding substantially perpendicularly and preferably backwardly from thefin 31. - Each of the
fins 31 is mounted across theheat sink 4 via theslot 312. Theflanges 3121 protruding from two sides of eachfin 31 provide the means for soldering thefin 31 on two side surfaces of theheat sink 4. When thefins 31 are stacked together to form the set offins 3,spaces 32 are formed between thefins 31 due to protrusions of the contact parts 311 (as shown in FIGS. 2 and 5). Therefore, the side surfaces of theheat sink 4 are enlarged to consequently increase the overall heat conducting surface of the cooler assembly. Further, theair circulating channel 41 formed in theheat sink 4 further enhances the heat dissipation efficiency. - As shown in FIG. 2, a
latch spring 5 can be installed in theair circulating channel 41 and assembled with the cooler as shown in FIGS. 3, 4 and 5. As shown in FIG. 6, the cooler is mounted to a device socket 6 via thelatch spring 5. As shown, the device socket 6 is a CPU socket in which aheat generating device 7 such as a CPU is plugged, and the cooler provided by the present invention is placed over the heat generatingdevice 7 and mounted to the device socket 6 via thelatch spring 5. Theheat generating device 7 is placed between theheat sink 4 and the device socket 6, such that the heat generated by theheat generating device 7 can be easily conducted to theheat sink 4, and then dissipated via thefins 31, thespaces 32 and theair circulating channel 41. In addition, a fan (not shown) may also be placed over the set offins 3 to reinforce heat circulation. - The profiles and shapes of the
heat sink 4, thefins 31 and theslot 312 are not limited to trapezoid or inverse trapezoid. It is appreciated that other shapes such as rectangle or polygonal can also be applied to achieve the same effect without exceeding the spirit and scope of the present invention. - The
heat sink 4 provided by the present invention, instead of being a two-dimensional plate, includes a three-dimensional structure of which the surface area is greatly increased. Further, the formation of anair circulating channel 41 provides an elongate path of air circulation. Therefore, the cooler provided by the present invention provides a cross-directional ventilation effect and alatch spring 5 that directly mount the cooler to theheat generating device 7. In this embodiment, the cross-directional ventilation includes the longitudinal air circulation through thespaces 12 and the lateral air circulation along an elongate direction of theheat sink 4. This disclosure provides exemplary embodiments of the present invention. The scope of the present invention is not limited by these exemplary embodiments. Numerous variations, whether explicitly provided for by the specification or implied by the specification, such as variations in structure, dimension, type of material and manufacturing process may be implemented by one of skill in the art in view of this disclosure.
Claims (11)
1. A cooler assembly, comprising:
a heat sink, having an air circulating channel formed therethrough; and
a plurality of fins, each having a slot recessed from a bottom edge thereof and at least one contact part protruding therefrom, wherein the fins are stacked together and mounted across the heat sink via the slot, and the neighboring fins are separated from each other by the contact parts.
2. The cooler assembly of claim 1 , wherein the air circulating channel is recessed from a top surface of the heat sink and penetrating through the heat sink along an elongate direction of the heat sink.
3. The cooler assembly of claim 2 , wherein each fin is mounted across two side surfaces of the heat sink.
4. The cooler assembly of claim 1 , wherein each slot opens downwardly.
5. The cooler assembly of claim 4 , wherein two side surfaces of each slot comprise a pair of flanges for soldering or adhering the fins to the heat sink.
6. The cooler assembly of claim 1 , further comprising a fastening device in the air circulating channel.
7. The cooler assembly of claim 6 , wherein two ends of the fastening device are latched with a device socket in which a heat generating device is plugged, and the heat generating device is disposed between the heat sink and the device socket.
8. The cooler assembly of claim 1 , wherein the heat sink has a substantially trapezoid cross sectional profile, and each of the fins has a substantially inverse trapezoid profile.
9. The cooler assembly of claim 1 , wherein the air circulating channel opens upwardly and penetrate through the heat sink, and the fins are mounted across the side surfaces of the heat sink, and the slot of each fin opens downward and has a geometry mating the cross sectional profile of the heat sink.
10. The cooler assembly of claim 1 , wherein the slot is corresponsive with the air circulating channel.
11. A cooler assembly, including a plurality of stacked fins mounted across a heat sink, each of the fins having a slot opening downwardly, and the heat sink comprising a through air circulating channel open upwardly.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW91206424 | 2002-05-07 | ||
TW091206424U TW524434U (en) | 2002-05-07 | 2002-05-07 | Combinational structure of heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
US20030209342A1 true US20030209342A1 (en) | 2003-11-13 |
Family
ID=28038276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/424,076 Abandoned US20030209342A1 (en) | 2002-05-07 | 2003-04-28 | Cooler assembly |
Country Status (2)
Country | Link |
---|---|
US (1) | US20030209342A1 (en) |
TW (1) | TW524434U (en) |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6842342B1 (en) * | 2003-09-12 | 2005-01-11 | Leohab Enterprise Co., Ltd. | Heat sink |
US20050051296A1 (en) * | 2002-09-30 | 2005-03-10 | Ching-Fa Shiao | Heat sink |
US20050061479A1 (en) * | 2003-09-19 | 2005-03-24 | Lee Hsieh Kun | Radiator with streamline airflow guiding structure |
US20050103474A1 (en) * | 2003-10-28 | 2005-05-19 | Lee Hsieh K. | Heat dissipation device |
US20050103471A1 (en) * | 2003-11-14 | 2005-05-19 | Chun-Chi Chen | Heat sink |
US20050103476A1 (en) * | 2003-11-17 | 2005-05-19 | Chun-Chi Chen | Heat dissipating assembly with heat pipes |
US20050109488A1 (en) * | 2003-11-21 | 2005-05-26 | Jack Wang | Fastening structure of heat sink |
WO2005059465A1 (en) * | 2003-12-11 | 2005-06-30 | Molex Incorporated | Heat conduction device |
US20050252650A1 (en) * | 2004-05-12 | 2005-11-17 | Hul-Chun Hsu | Integrated heat dissipation apparatus |
KR100790790B1 (en) | 2006-09-14 | 2008-01-02 | (주)셀시아테크놀러지스한국 | Heat sink and cooler for integrated circuit |
US20090165998A1 (en) * | 2007-12-27 | 2009-07-02 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device |
US20100284142A1 (en) * | 2009-05-06 | 2010-11-11 | HONG FU JIN PRECISION INDUSTRY (ShenZhen ) CO.LTD. | Heat dissipating assembly |
US20110013392A1 (en) * | 2009-07-15 | 2011-01-20 | Little Jr William D | Lighting apparatus |
US20110013402A1 (en) * | 2009-07-15 | 2011-01-20 | Aphos Lighting Llc | Light Feature |
US20120024806A1 (en) * | 2010-07-02 | 2012-02-02 | Sabrie Soloman | Segmented Slat |
US20130105112A1 (en) * | 2011-10-31 | 2013-05-02 | Cooler Master Co., Ltd. | Heat sink |
US20130114213A1 (en) * | 2011-11-09 | 2013-05-09 | Silicon Intergrated Systems Corp. | Electronic device |
US9409264B2 (en) * | 2013-03-25 | 2016-08-09 | International Business Machines Corporation | Interleaved heat sink and fan assembly |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2023739A (en) * | 1935-02-14 | 1935-12-10 | Bush Mfg Company | Radiator |
US5509465A (en) * | 1995-03-10 | 1996-04-23 | Bioli Corporation | Heat-dissipating device for a central processing unit chip |
US6269003B1 (en) * | 1999-12-27 | 2001-07-31 | Wei Wen-Chen | Heat dissipater structure |
US6382306B1 (en) * | 2000-08-15 | 2002-05-07 | Hul Chun Hsu | Geometrical streamline flow guiding and heat-dissipating structure |
US6396697B1 (en) * | 2000-12-07 | 2002-05-28 | Foxconn Precision Components Co., Ltd. | Heat dissipation assembly |
US6415853B1 (en) * | 2002-01-22 | 2002-07-09 | Chaun-Choung Technology Corp. | Wind cover locking element structure of heat radiator |
US20020117295A1 (en) * | 2001-02-26 | 2002-08-29 | Ching-Hang Shen | Heat dissipating structure |
-
2002
- 2002-05-07 TW TW091206424U patent/TW524434U/en not_active IP Right Cessation
-
2003
- 2003-04-28 US US10/424,076 patent/US20030209342A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2023739A (en) * | 1935-02-14 | 1935-12-10 | Bush Mfg Company | Radiator |
US5509465A (en) * | 1995-03-10 | 1996-04-23 | Bioli Corporation | Heat-dissipating device for a central processing unit chip |
US6269003B1 (en) * | 1999-12-27 | 2001-07-31 | Wei Wen-Chen | Heat dissipater structure |
US6382306B1 (en) * | 2000-08-15 | 2002-05-07 | Hul Chun Hsu | Geometrical streamline flow guiding and heat-dissipating structure |
US6396697B1 (en) * | 2000-12-07 | 2002-05-28 | Foxconn Precision Components Co., Ltd. | Heat dissipation assembly |
US20020117295A1 (en) * | 2001-02-26 | 2002-08-29 | Ching-Hang Shen | Heat dissipating structure |
US6415853B1 (en) * | 2002-01-22 | 2002-07-09 | Chaun-Choung Technology Corp. | Wind cover locking element structure of heat radiator |
Cited By (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050051296A1 (en) * | 2002-09-30 | 2005-03-10 | Ching-Fa Shiao | Heat sink |
US6842342B1 (en) * | 2003-09-12 | 2005-01-11 | Leohab Enterprise Co., Ltd. | Heat sink |
US20050061479A1 (en) * | 2003-09-19 | 2005-03-24 | Lee Hsieh Kun | Radiator with streamline airflow guiding structure |
US7243708B2 (en) * | 2003-09-19 | 2007-07-17 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Radiator with streamline airflow guiding structure |
US7051792B2 (en) * | 2003-10-28 | 2006-05-30 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipation device |
US20050103474A1 (en) * | 2003-10-28 | 2005-05-19 | Lee Hsieh K. | Heat dissipation device |
US20050103471A1 (en) * | 2003-11-14 | 2005-05-19 | Chun-Chi Chen | Heat sink |
US7152666B2 (en) * | 2003-11-14 | 2006-12-26 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat sink |
US20050103476A1 (en) * | 2003-11-17 | 2005-05-19 | Chun-Chi Chen | Heat dissipating assembly with heat pipes |
US20050109488A1 (en) * | 2003-11-21 | 2005-05-26 | Jack Wang | Fastening structure of heat sink |
US6968889B2 (en) * | 2003-11-21 | 2005-11-29 | Waffer Technology Corp. | Fastening structure of heat sink |
US20070272390A1 (en) * | 2003-12-11 | 2007-11-29 | Jun-Liang Hu | Heat Conduction Device |
WO2005059465A1 (en) * | 2003-12-11 | 2005-06-30 | Molex Incorporated | Heat conduction device |
US8042605B2 (en) | 2003-12-11 | 2011-10-25 | Molex Incorporated | Heat conduction device |
US7040389B2 (en) * | 2004-05-12 | 2006-05-09 | Hul-Chun Hsu | Integrated heat dissipation apparatus |
US20050252650A1 (en) * | 2004-05-12 | 2005-11-17 | Hul-Chun Hsu | Integrated heat dissipation apparatus |
KR100790790B1 (en) | 2006-09-14 | 2008-01-02 | (주)셀시아테크놀러지스한국 | Heat sink and cooler for integrated circuit |
US20090165998A1 (en) * | 2007-12-27 | 2009-07-02 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device |
US7929293B2 (en) * | 2009-05-06 | 2011-04-19 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipating assembly |
US20100284142A1 (en) * | 2009-05-06 | 2010-11-11 | HONG FU JIN PRECISION INDUSTRY (ShenZhen ) CO.LTD. | Heat dissipating assembly |
US20110013402A1 (en) * | 2009-07-15 | 2011-01-20 | Aphos Lighting Llc | Light Feature |
US20110013392A1 (en) * | 2009-07-15 | 2011-01-20 | Little Jr William D | Lighting apparatus |
US8360613B2 (en) | 2009-07-15 | 2013-01-29 | Aphos Lighting Llc | Light feature |
US20120024806A1 (en) * | 2010-07-02 | 2012-02-02 | Sabrie Soloman | Segmented Slat |
US8413797B2 (en) * | 2010-07-02 | 2013-04-09 | Sabrie Soloman | Segmented slat |
US20130105112A1 (en) * | 2011-10-31 | 2013-05-02 | Cooler Master Co., Ltd. | Heat sink |
US20130114213A1 (en) * | 2011-11-09 | 2013-05-09 | Silicon Intergrated Systems Corp. | Electronic device |
US9409264B2 (en) * | 2013-03-25 | 2016-08-09 | International Business Machines Corporation | Interleaved heat sink and fan assembly |
Also Published As
Publication number | Publication date |
---|---|
TW524434U (en) | 2003-03-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: POLO TECH CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HSIN, LU CHUN;LUNG, LIN PAO;REEL/FRAME:014013/0221 Effective date: 20030330 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |