TW524434U - Combinational structure of heat sink - Google Patents

Combinational structure of heat sink

Info

Publication number
TW524434U
TW524434U TW091206424U TW91206424U TW524434U TW 524434 U TW524434 U TW 524434U TW 091206424 U TW091206424 U TW 091206424U TW 91206424 U TW91206424 U TW 91206424U TW 524434 U TW524434 U TW 524434U
Authority
TW
Taiwan
Prior art keywords
heat sink
combinational structure
combinational
sink
heat
Prior art date
Application number
TW091206424U
Other languages
Chinese (zh)
Inventor
Tsuan-Shing Liu
Bau-Lung Lin
Original Assignee
Polo Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polo Tech Co Ltd filed Critical Polo Tech Co Ltd
Priority to TW091206424U priority Critical patent/TW524434U/en
Publication of TW524434U publication Critical patent/TW524434U/en
Priority to US10/424,076 priority patent/US20030209342A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW091206424U 2002-05-07 2002-05-07 Combinational structure of heat sink TW524434U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW091206424U TW524434U (en) 2002-05-07 2002-05-07 Combinational structure of heat sink
US10/424,076 US20030209342A1 (en) 2002-05-07 2003-04-28 Cooler assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW091206424U TW524434U (en) 2002-05-07 2002-05-07 Combinational structure of heat sink

Publications (1)

Publication Number Publication Date
TW524434U true TW524434U (en) 2003-03-11

Family

ID=28038276

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091206424U TW524434U (en) 2002-05-07 2002-05-07 Combinational structure of heat sink

Country Status (2)

Country Link
US (1) US20030209342A1 (en)
TW (1) TW524434U (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW544081U (en) * 2002-09-30 2003-07-21 Ching-Fa Shiau Heat dissipation sheet assembly
US6842342B1 (en) * 2003-09-12 2005-01-11 Leohab Enterprise Co., Ltd. Heat sink
TWM244512U (en) * 2003-09-19 2004-09-21 Hon Hai Prec Ind Co Ltd Heat pipe type radiator
TWM247916U (en) * 2003-10-28 2004-10-21 Hon Hai Prec Ind Co Ltd Heat dissipatin device using heat pipe
CN2672865Y (en) * 2003-11-14 2005-01-19 鸿富锦精密工业（深圳）有限公司 Heat radiator
CN2664184Y (en) * 2003-11-17 2004-12-15 鸿富锦精密工业（深圳）有限公司 Heat sink
US6968889B2 (en) * 2003-11-21 2005-11-29 Waffer Technology Corp. Fastening structure of heat sink
CN2676128Y (en) * 2003-12-11 2005-02-02 东莞莫仕连接器有限公司 Heat conducting device
US7040389B2 (en) * 2004-05-12 2006-05-09 Hul-Chun Hsu Integrated heat dissipation apparatus
KR100790790B1 (en) 2006-09-14 2008-01-02 (주)셀시아테크놀러지스한국 Heat sink and cooler for integrated circuit
US20090165998A1 (en) * 2007-12-27 2009-07-02 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
CN201422226Y (en) * 2009-05-06 2010-03-10 鸿富锦精密工业（深圳）有限公司 Radiator combination
US8360613B2 (en) * 2009-07-15 2013-01-29 Aphos Lighting Llc Light feature
US20110013392A1 (en) * 2009-07-15 2011-01-20 Little Jr William D Lighting apparatus
US8413797B2 (en) * 2010-07-02 2013-04-09 Sabrie Soloman Segmented slat
US20130105112A1 (en) * 2011-10-31 2013-05-02 Cooler Master Co., Ltd. Heat sink
US20130114213A1 (en) * 2011-11-09 2013-05-09 Silicon Intergrated Systems Corp. Electronic device
US9409264B2 (en) * 2013-03-25 2016-08-09 International Business Machines Corporation Interleaved heat sink and fan assembly

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2023739A (en) * 1935-02-14 1935-12-10 Bush Mfg Company Radiator
US5509465A (en) * 1995-03-10 1996-04-23 Bioli Corporation Heat-dissipating device for a central processing unit chip
US6269003B1 (en) * 1999-12-27 2001-07-31 Wei Wen-Chen Heat dissipater structure
US6382306B1 (en) * 2000-08-15 2002-05-07 Hul Chun Hsu Geometrical streamline flow guiding and heat-dissipating structure
US6392888B1 (en) * 2000-12-07 2002-05-21 Foxconn Precision Components Co., Ltd. Heat dissipation assembly and method of assembling the same
US20020117295A1 (en) * 2001-02-26 2002-08-29 Ching-Hang Shen Heat dissipating structure
US6415853B1 (en) * 2002-01-22 2002-07-09 Chaun-Choung Technology Corp. Wind cover locking element structure of heat radiator

Also Published As

Publication number Publication date
US20030209342A1 (en) 2003-11-13

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees