US20050103476A1 - Heat dissipating assembly with heat pipes - Google Patents

Heat dissipating assembly with heat pipes Download PDF

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Publication number
US20050103476A1
US20050103476A1 US10/946,950 US94695004A US2005103476A1 US 20050103476 A1 US20050103476 A1 US 20050103476A1 US 94695004 A US94695004 A US 94695004A US 2005103476 A1 US2005103476 A1 US 2005103476A1
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US
United States
Prior art keywords
heat
base
assembly
dissipating assembly
heat dissipating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/946,950
Inventor
Chun-Chi Chen
Meng Fu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hon Hai Precision Industry Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Assigned to HON HAI PRECISION IND. CO., LTD. reassignment HON HAI PRECISION IND. CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHUN-CHI, FU, MENG
Publication of US20050103476A1 publication Critical patent/US20050103476A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Definitions

  • the present invention relates to cooling of electronic devices, and particularly to heat dissipating assemblies incorporating heat pipes.
  • a heat dissipating assembly 50 comprises a base 52 and a plurality of fins 54 .
  • the base 52 comprises two acclivitous surfaces.
  • the fins 54 are fixed on the acclivitous surfaces of the base 52 .
  • the base 52 has a large volume which results in it can absorb heat from an electronic device speedily.
  • a contact surface between the fins 54 and the base 52 is slant and larger than that of a common heat dissipating assembly which has a flat contact surface between the fins and the base thereof, which results in the heat can be efficiently transferred to the fins 54 from the base 52 .
  • the base 52 of the heat dissipating assembly 50 has a great weight and it is prone to damage the electronic device.
  • the heat dissipating assembly 60 comprises a base 62 , two heat pipes 64 and plural of fins 66 . Two holes are defined in the middle of the base 62 , and the heat pipes 64 are soldered in the holes. As the heat dissipating assembly illustrated in FIG. 3 , the base 62 of the heat dissipating assembly 60 still has a great weight. A solder is stacked unevenly in the holes, which leads the heat pipes 64 not intimately contacting the base 62 . Furthermore, the heat pipes 64 can't transfer heat from the base 62 to the fins 66 directly.
  • an object of the present invention is to provide a heat dissipating assembly which has a light base.
  • Another object of the present invention is to provide a heat dissipating assembly which utilizes a plurality of heat pipes to attain optimal heat transfer efficiency.
  • a heat dissipation assembly comprises a base, plural of fins and two heat pipes.
  • the base comprises a body and two heat-conducting portions extending slantwise from two sides of the body.
  • a void is defined in the base surrounded by the body and the heat-conducting portions.
  • Two grooves are defined in an upper surface of the body.
  • the fins are attached on the heat-conducting portions.
  • a through hole is defined in each of two sides of each fin.
  • One end of each heat pipe is securely received in the groove of the body and the other end of each heat pipe is extended through the corresponding holes of the fins, for transferring heat from the body to the fins effectively.
  • FIG. 1 is an exploded view of a heat dissipating assembly in accordance with the present invention
  • FIG. 2 is an assembled view of FIG. 1 ;
  • FIG. 3 is an assembled view of a conventional heat dissipating assembly
  • FIG. 4 is an assembled view of another conventional heat dissipating assembly.
  • a heat dissipating assembly in accordance with the present invention comprises a base 10 , plural of fins 30 and two heat pipes 40 .
  • the base 10 comprises a body 12 and two heat-conducting portions 14 extending slantwise from two sides of the body 12 .
  • a void 16 is defined in the base 10 surrounded by the body 12 and the heat-conducting portions 14 .
  • An airflow channel 17 is defined between top ends of the heat-conducting portions 14 to allow cooling air to come into the void 16 through the channel 17 to cool the base 10 directly.
  • a bottom surface of the base 10 is for contacting a CPU (not shown).
  • An upper surface of the body 12 defines two grooves 18 communicating with the void 16 .
  • the fins 30 are laminose-shaped.
  • a trapeziform cutout 32 is defined in a bottom of each fin 30 .
  • the cutouts 32 of the fins 30 cooperatively form a space for receiving the base 10 therein.
  • Each fin 30 has two hems 34 extending therefrom at opposite sides of the cutout 32 for keeping uniform distance between two adjacent fins 30 .
  • the hems 34 are soldered to the heat-conducting portions 14 to thereby attach the fins 30 to the base 10 .
  • a through hole 36 is defined in each of two sides of each fin 30 .
  • the heat pipes 40 both are U-shaped. Working fluid is filled in each heat pipe 40 .
  • One end of the heat pipe 40 is securely received in a corresponding groove 18 of the body 12 by soldering.
  • the other end of the heat pipe 40 is extended through the corresponding holes 36 of the fins 30 , for transferring the heat from the body 12 to the fins 30 effectively.
  • the working fluid of the heat pipes 40 evaporates when absorbing heat from the body 12 of the base 10 , and then condenses and releases the heat to the fins 30 effectively.
  • the heat dissipating assembly of the present invention comprises at least the following advantages. Solder is spread on the one end of the heat pipe 40 or the grooves 18 of the body 12 . The one end of the heat pipe 40 is placed in the groove 18 from top to down, and then the heat pipe 40 is pressed downwardly and soldered to the base 10 . Thus, the solder is spread between the heat pipes 40 and the body 12 in the grooves 18 uniformly, which reduces heat resistance.
  • the base 10 has the void 16 , which reduces the weight of the base 10 .

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipation assembly includes a base, plural of fins and two heat pipes. The base includes a body and two heat-conducting portions extending slantwise from two sides of the body. A void is defined in the base surrounded by the body and the heat-conducting portions. Two grooves are defined in an upper surface of the body. The fins are attached on the heat-conducting portions. A through hole is defined in each of two sides of each fin. One end of each heat pipe is securely received in the groove of the body and the other end of each heat pipe is extended through the holes of the fins, for transferring heat from the body to the fins effectively.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to cooling of electronic devices, and particularly to heat dissipating assemblies incorporating heat pipes.
  • 2. Prior Art
  • Developments in today's highly information-intensive society have led to remarkable improvements in performances of electronic devices. During operation of many contemporary electronic devices, large amounts of heat are produced. A conventional heat sink formed by extrusion is frequently no longer able to satisfactorily remove heat from modem high-speed electronic devices.
  • As thermal loads of electronic devices continue to increase, more effective ways to cool such devices have been sought. One apparatus developed to cool high-speed electronic devices is illustrated in FIG. 3. A heat dissipating assembly 50 comprises a base 52 and a plurality of fins 54. The base 52 comprises two acclivitous surfaces. The fins 54 are fixed on the acclivitous surfaces of the base 52. The base 52 has a large volume which results in it can absorb heat from an electronic device speedily. A contact surface between the fins 54 and the base 52 is slant and larger than that of a common heat dissipating assembly which has a flat contact surface between the fins and the base thereof, which results in the heat can be efficiently transferred to the fins 54 from the base 52. However, the base 52 of the heat dissipating assembly 50 has a great weight and it is prone to damage the electronic device.
  • Another apparatus developed to cool high-speed electronic devices is illustrated in FIG. 4. The heat dissipating assembly 60 comprises a base 62, two heat pipes 64 and plural of fins 66. Two holes are defined in the middle of the base 62, and the heat pipes 64 are soldered in the holes. As the heat dissipating assembly illustrated in FIG. 3, the base 62 of the heat dissipating assembly 60 still has a great weight. A solder is stacked unevenly in the holes, which leads the heat pipes 64 not intimately contacting the base 62. Furthermore, the heat pipes 64 can't transfer heat from the base 62 to the fins 66 directly.
  • Therefore, an improved heat dissipating assembly for an electronic device which overcomes the above problems is desired.
    • BRIEF SUMMARY OF THE INVENTION
  • Accordingly, an object of the present invention is to provide a heat dissipating assembly which has a light base.
  • Another object of the present invention is to provide a heat dissipating assembly which utilizes a plurality of heat pipes to attain optimal heat transfer efficiency.
  • To achieve the above-mentioned objects, a heat dissipation assembly comprises a base, plural of fins and two heat pipes. The base comprises a body and two heat-conducting portions extending slantwise from two sides of the body. A void is defined in the base surrounded by the body and the heat-conducting portions. Two grooves are defined in an upper surface of the body. The fins are attached on the heat-conducting portions. A through hole is defined in each of two sides of each fin. One end of each heat pipe is securely received in the groove of the body and the other end of each heat pipe is extended through the corresponding holes of the fins, for transferring heat from the body to the fins effectively.
  • Other objects, advantages and novel features of the present invention will be drawn from the following detailed description of a preferred embodiment of the present invention together with the attached drawings, in which:
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an exploded view of a heat dissipating assembly in accordance with the present invention;
  • FIG. 2 is an assembled view of FIG. 1;
  • FIG. 3 is an assembled view of a conventional heat dissipating assembly; and
  • FIG. 4 is an assembled view of another conventional heat dissipating assembly.
    • DESCRIPTION OF THE INVENTION
  • Referring to FIGS. 1 and 2, a heat dissipating assembly in accordance with the present invention comprises a base 10, plural of fins 30 and two heat pipes 40.
  • The base 10 comprises a body 12 and two heat-conducting portions 14 extending slantwise from two sides of the body 12. A void 16 is defined in the base 10 surrounded by the body 12 and the heat-conducting portions 14. An airflow channel 17 is defined between top ends of the heat-conducting portions 14 to allow cooling air to come into the void 16 through the channel 17 to cool the base 10 directly. A bottom surface of the base 10 is for contacting a CPU (not shown). An upper surface of the body 12 defines two grooves 18 communicating with the void 16.
  • The fins 30 are laminose-shaped. A trapeziform cutout 32 is defined in a bottom of each fin 30. The cutouts 32 of the fins 30 cooperatively form a space for receiving the base 10 therein. Each fin 30 has two hems 34 extending therefrom at opposite sides of the cutout 32 for keeping uniform distance between two adjacent fins 30. The hems 34 are soldered to the heat-conducting portions 14 to thereby attach the fins 30 to the base 10. A through hole 36 is defined in each of two sides of each fin 30.
  • The heat pipes 40 both are U-shaped. Working fluid is filled in each heat pipe 40. One end of the heat pipe 40 is securely received in a corresponding groove 18 of the body 12 by soldering. The other end of the heat pipe 40 is extended through the corresponding holes 36 of the fins 30, for transferring the heat from the body 12 to the fins 30 effectively.
  • In use, the working fluid of the heat pipes 40 evaporates when absorbing heat from the body 12 of the base 10, and then condenses and releases the heat to the fins 30 effectively.
  • The heat dissipating assembly of the present invention comprises at least the following advantages. Solder is spread on the one end of the heat pipe 40 or the grooves 18 of the body 12. The one end of the heat pipe 40 is placed in the groove 18 from top to down, and then the heat pipe 40 is pressed downwardly and soldered to the base 10. Thus, the solder is spread between the heat pipes 40 and the body 12 in the grooves 18 uniformly, which reduces heat resistance. In addition, the base 10 has the void 16, which reduces the weight of the base 10.
  • It is understood that the invention may be embodied in other forms without departing from the spirit thereof. Thus, the present example and embodiment are to be considered in all respects as illustrative and not restrictive, and the invention is not to be limited to the details given herein.

Claims (18)

1. A heat dissipating assembly comprising:
plural of fins cooperatively defining a space;
a base located in the space, a void defined in the base; and
at least a heat pipe, one end of the at least a heat pipe received in the base, an opposite end of the at least a heat pipe extending through the fins.
2. The heat dissipating assembly as described in claim 1, wherein each fin defines a cutout in a bottom thereof to cooperatively define the space.
3. The heat dissipating assembly as described in claim 1, wherein the base defines at least a groove communicating with the void, said one end of the at least a heat pipe being received in the at least a groove.
4. The heat dissipating assembly as described in claim 3, wherein the base comprises a body and two heat-conducting portions extending from the body, said void being defined between the body and the heat-conducting portions.
5. The heat dissipating assembly as described in claim 4, wherein the two heat-conducting portions extend slantwise from two sides of the body.
6. The heat dissipating assembly as described in claim 5, wherein the fins comprise a plurality of hems formed on opposite side of the space and attached on the heat-conducting portions.
7. The heat dissipating assembly as described in claim 4, wherein an airflow channel is defined between top ends of the two heat-conducting portions to allow cooling air to enter into the void.
8. The heat dissipating assembly as described in claim 1, wherein each fin defines at least a through hole for extension of the at least a heat pipe.
9. A heat dissipating assembly, comprising:
a base defining a void therein and at least a groove communicating with the void;
plural of fins arranged on the base; and
at least a heat pipe, one end of the at least a heat pipe received in the groove of the base, an opposite end of the at least a heat pipe extending through the fins.
10. The heat dissipating assembly as described in claim 9, wherein the base comprises a body and two heat-conducting portions extending from the body, said void being defined between the body and the heat-conducting portions.
11. The heat dissipating assembly as described in claim 10, wherein the groove is defined in an upper surface of the body.
12. The heat dissipating assembly as described in claim 10, wherein the fins are attached on the heat-conducting portions.
13. The heat dissipating assembly as described in claim 10, wherein the two heat-conducting portions extend slantwise from two sides of the body.
14. The heat dissipating assembly as described in claim 10, wherein an airflow channel is defined between top ends of the two heat-conducting portions.
15. The heat dissipating assembly as described in claim 9, wherein each fin defines at least a through hole for extension of the at least a heat pipe.
16. A heat dissipation assembly comprising:
a fin assembly including a plurality of spaced parallel fins cooperatively defining a space in one side face of said fin assembly;
a base configured to be snugly received in the space;
a void defined in said base with an opening for ventilating communication with a fan which is located on another side face of the fin assembly; and
a heat pipe defining a section which is attached to said base and exposed to said void.
17. The heat dissipation assembly as described in claim 16, wherein an opposite section of the heat pipe extends through said fin assembly in a perpendicular manner.
18. The heat dissipation assembly as described in claim 16, wherein said base is of a triangular configuration with said opening at the uppermost apex.
US10/946,950 2003-11-17 2004-09-21 Heat dissipating assembly with heat pipes Abandoned US20050103476A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2003201183609 2003-11-17
CN200320118360.9U CN2664184Y (en) 2003-11-17 2003-11-17 Heat sink

Publications (1)

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US20050103476A1 true US20050103476A1 (en) 2005-05-19

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CN (1) CN2664184Y (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050141198A1 (en) * 2003-12-26 2005-06-30 Lee Hsieh K. Heat dissipating device incorporating heat pipe
USD530682S1 (en) * 2005-08-04 2006-10-24 Molex Incorporated Heat sink fins
US20060238982A1 (en) * 2005-04-22 2006-10-26 Foxconn Technology Co., Ltd. Heat dissipation device for multiple heat-generating components
USD533145S1 (en) * 2005-08-04 2006-12-05 Molex Incorporated Heat sink
USD541758S1 (en) * 2005-12-19 2007-05-01 Zalman Tech Co., Ltd. Radiator for electronic parts
USD551633S1 (en) * 2005-08-04 2007-09-25 Molex Incorporated Heat sink fins
US20070295487A1 (en) * 2006-06-21 2007-12-27 Foxconn Technology Co., Ltd. Heat pipe type heat dissipation device
US20080043438A1 (en) * 2006-08-17 2008-02-21 Ati Technologies Inc. Cross-Flow Thermal Management Device and Method of Manufacture Thereof
US20080251239A1 (en) * 2007-04-10 2008-10-16 Fujikura Ltd. Heat sink
USD579423S1 (en) * 2007-11-19 2008-10-28 Foxconn Technology Co., Ltd. Heat sink
CN100446227C (en) * 2005-09-30 2008-12-24 鸿富锦精密工业（深圳）有限公司 Heat sink and manufacturing method thereof
US20090166006A1 (en) * 2007-12-27 2009-07-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20100014251A1 (en) * 2008-07-15 2010-01-21 Advanced Micro Devices, Inc. Multidimensional Thermal Management Device for an Integrated Circuit Chip
US20110277966A1 (en) * 2010-05-14 2011-11-17 Asia Vital Components Co., Ltd. Heat-dissipating device
US20130077293A1 (en) * 2011-09-26 2013-03-28 Posco Led Company Ltd Optical semiconductor-based lighting apparatus
US20140116659A1 (en) * 2012-11-01 2014-05-01 Msi Computer (Shenzhen) Co., Ltd. Heat dissipation device and heat dissipation fins thereof
USD805042S1 (en) * 2015-10-27 2017-12-12 Tsung-Hsien Huang Combined heat exchanger base and embedded heat pipes

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CN100368756C (en) * 2005-07-25 2008-02-13 苏州金美家具有限公司 Heat pipe seat and its manufacturing method
CN101409996B (en) * 2007-10-11 2012-05-23 曜越科技股份有限公司 A method of manufacturing a cooling module
CN101472439B (en) * 2007-12-29 2011-09-28 富准精密工业(深圳)有限公司 Radiating device
CN101616567B (en) * 2008-06-25 2011-06-08 富准精密工业(深圳)有限公司 Heat sink
CN101742890B (en) * 2008-11-14 2013-06-05 富准精密工业(深圳)有限公司 Radiation device
CN107872941B (en) * 2016-09-27 2019-10-22 技嘉科技股份有限公司 Heat sink device

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US20030209342A1 (en) * 2002-05-07 2003-11-13 Hsin Lu Chun Cooler assembly
US6651734B1 (en) * 2002-12-15 2003-11-25 Jefferson Liu Multi-element heat dissipating module
US20040074633A1 (en) * 2002-10-18 2004-04-22 Liu Heben Heat dissipating apparatus and method for producing same
US6779595B1 (en) * 2003-09-16 2004-08-24 Cpumate Inc. Integrated heat dissipation apparatus
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US6598667B1 (en) * 2002-01-14 2003-07-29 Kuo Yung-Pin Heat dispensing device for electronic parts
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Cited By (27)

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Publication number Priority date Publication date Assignee Title
US20050141198A1 (en) * 2003-12-26 2005-06-30 Lee Hsieh K. Heat dissipating device incorporating heat pipe
US7110259B2 (en) * 2003-12-26 2006-09-19 Hon Hai Precision Ind. Co., Ltd Heat dissipating device incorporating heat pipe
US7295437B2 (en) * 2005-04-22 2007-11-13 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device for multiple heat-generating components
US20060238982A1 (en) * 2005-04-22 2006-10-26 Foxconn Technology Co., Ltd. Heat dissipation device for multiple heat-generating components
USD551633S1 (en) * 2005-08-04 2007-09-25 Molex Incorporated Heat sink fins
USD533145S1 (en) * 2005-08-04 2006-12-05 Molex Incorporated Heat sink
USD530682S1 (en) * 2005-08-04 2006-10-24 Molex Incorporated Heat sink fins
CN100446227C (en) * 2005-09-30 2008-12-24 鸿富锦精密工业（深圳）有限公司 Heat sink and manufacturing method thereof
USD541758S1 (en) * 2005-12-19 2007-05-01 Zalman Tech Co., Ltd. Radiator for electronic parts
US20070295487A1 (en) * 2006-06-21 2007-12-27 Foxconn Technology Co., Ltd. Heat pipe type heat dissipation device
US7448438B2 (en) * 2006-06-21 2008-11-11 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat pipe type heat dissipation device
US20080043438A1 (en) * 2006-08-17 2008-02-21 Ati Technologies Inc. Cross-Flow Thermal Management Device and Method of Manufacture Thereof
US20080043437A1 (en) * 2006-08-17 2008-02-21 Ati Technologies Inc. Three-Dimensional Thermal Spreading in an Air-Cooled Thermal Device
US7974096B2 (en) 2006-08-17 2011-07-05 Ati Technologies Ulc Three-dimensional thermal spreading in an air-cooled thermal device
US7965511B2 (en) 2006-08-17 2011-06-21 Ati Technologies Ulc Cross-flow thermal management device and method of manufacture thereof
US7942194B2 (en) 2007-04-10 2011-05-17 Fujikura Ltd. Heat sink
EP1981080A3 (en) * 2007-04-10 2011-03-02 Fujikura, Ltd. Heat sink
US20080251239A1 (en) * 2007-04-10 2008-10-16 Fujikura Ltd. Heat sink
USD579423S1 (en) * 2007-11-19 2008-10-28 Foxconn Technology Co., Ltd. Heat sink
US20090166006A1 (en) * 2007-12-27 2009-07-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20100014251A1 (en) * 2008-07-15 2010-01-21 Advanced Micro Devices, Inc. Multidimensional Thermal Management Device for an Integrated Circuit Chip
US20110277966A1 (en) * 2010-05-14 2011-11-17 Asia Vital Components Co., Ltd. Heat-dissipating device
US9423186B2 (en) * 2010-05-14 2016-08-23 Asia Vital Components Co., Ltd. Heat-dissipating device
US20130077293A1 (en) * 2011-09-26 2013-03-28 Posco Led Company Ltd Optical semiconductor-based lighting apparatus
US9109784B2 (en) * 2011-09-26 2015-08-18 Posco Led Company Ltd. LED-based lighting apparatus with heat pipe cooling structure
US20140116659A1 (en) * 2012-11-01 2014-05-01 Msi Computer (Shenzhen) Co., Ltd. Heat dissipation device and heat dissipation fins thereof
USD805042S1 (en) * 2015-10-27 2017-12-12 Tsung-Hsien Huang Combined heat exchanger base and embedded heat pipes

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AS Assignment

Owner name: HON HAI PRECISION IND. CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, CHUN-CHI;FU, MENG;REEL/FRAME:015826/0559

Effective date: 20040203

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION