US20030019610A1

US20030019610A1 - Rapidly self - heat-conductive heat - dissipating module

Info

Publication number: US20030019610A1
Application number: US10/079,321
Authority: US
Inventors: Jefferson Liu
Original assignee: Individual
Current assignee: Individual
Priority date: 2001-07-26
Filing date: 2002-02-19
Publication date: 2003-01-30
Also published as: WO2003041472A1

Abstract

A rapidly self-heat-conductive heat-dissipating module has two fin sets which are overlapped. At least one heat convection super conductive tube is engaged with the two heatsink sets. One heatsink set is used to absorb heat from a heat source and the other one serves to dissipate heat. A heat dissipating fan blows air to the two heatsink sets for increasing heat dissipating efficiency. A plurality of rapidly self-heat-conductive heat-dissipating modules having heatsink sets and heat convection super conductive tubes can be assembled together and then heat dissipating fan is used to blow cold air. Therefore, the rapidly self-heat-conductive heat-dissipating module can dissipate rapidly and efficiently.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a rapidly self-heat-conductive heat-dissipating module, and particularly to a heat dissipating module which can transfer heat from the CPU of a computer or a device with large heat dissipation effectively.

2. Description of Related Art

The heat dissipating devices for central processing units (CPUs) of computers or high heat generating devices use heatsink devices with a plurality of metal fins to contact with the heat sources, absorb heat and then transfer heat to the fins. Then heat-dissipating fans are used to blow cold air for dispersing heat.

This prior art way is effective for heat from a small CPU, while for CPU dissipating a large amount of heat, it can not be operated effectively since the metal base of heatsink is spaced with the distal ends of the fins. Only the base of heatsink is in contact with the heat source (i.e., CPU), the heat from the base of heatsink can not be transferred to the distal ends of the fins, and the root portions of the fins and the distal ends absorb unequal heat amounts. In other words, the portion near the root portion of the base of heatsink absorbs more heat and vice versa. As a result, only the root portion of the base of heatsink is used to dissipate heat. Therefore, aforesaid conventional heat dissipating device can not match the requirement of the newly developed CPUs with high operation speed.

SUMMARY OF THE INVENTION

Accordingly, the primary object of the present invention is to provide a rapidly self-heat-conductive heat-dissipating module, wherein a rapidly self-heat-conductive heat-dissipating module has two heatsink sets which are overlapped. At least one heat convection super conductive tubes are engaged with the two heatsink sets. One heatsink set is used to absorb heat from a heat source and the other one serves to dissipate heat. A heat-dissipating fan blows air to the two heatsink sets for increasing heat-dissipating efficiency.

Another object of the present invention is to provide a rapidly self-heat-conductive heat-dissipating module, wherein a plurality of rapidly self-heat-conductive heat-dissipating modules having heatsink sets and heat convection super conductive tubes can be assembled together and then heat dissipating fan is used to blow cold air. Therefore, the rapidly self-heat-conductive heat-dissipating module can dissipate rapidly and efficiently.

The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawing.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded perspective view of the present invention having two heatsink sets and a plurality of U shape heat convection super conductive tubes. [0009]
FIG. 2 is a perspective view showing that the elements of FIG. 1 is assembled and a heat dissipating fan is further added. [0010]
FIG. 3 is an exploded perspective view wherein two heatsink sets are alternatively arranged and a plurality of U shape heat convection super conductive tubes and a heat dissipating fan are used. [0011]
FIG. 4 is a perspective view showing the element of FIG. 3 which are assembled. [0012]
FIG. 5 is the exploded perspective view of the present invention, wherein two double U shaped heat convection super conductive tubes and two heatsink sets are assembled. [0013]
FIG. 6 is a perspective view of the element of FIG. 5 which are assembled. [0014]
FIG. 7 is a perspective view showing the heat dissipating modules by two heatsink sets and a plurality of heat convection super conductive tubes which are assembled together.[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to FIG. 1, the rapidly self-heat-conductive heat-dissipating module of the present invention is illustrated. The heat-dissipating module has two [0016] heatsink sets 1 and a plurality of heat convection super conductive tubes 2. The heat convection super conductive tubes 2 are made of bendable metal tubes (for example, copper, aluminum, etc.). High temperature super conductor composites, such as yttrium barium copper oxide (YBCO) superconductor material, thallium barium calcium copper oxide (TBCCO) superconductor material, mercury barium calcium copper oxide (HBCCO) superconductor material, bismuth strontium calcium copper oxide (BSCCO) superconductor material, or other superconductor material, or other rapid heat conductive material. Two ends of the tube are closed for preventing the superconductor material to drain out of the tube. Therefore, heat convection super conductive tube 2 is formed by aforesaid metal tube and the superconductor material enclosed therein. The principle used is that when the molecules in the tube is heated, heat energy can be transferred by convection due to the rapid oscillation and large friction. Therefore, the heat can be transferred rapidly, and it is called as a heat convection super conductive tube. Since the heat transfer time in the heat convection super conductive tube from a heat end to a cold end is very short, the temperature difference between the heat end and the cold end is very small and thus an optimum heat transfer can be acquired. It has been appreciated that the speed of heat transfer is about five times of that of copper. Furthermore, it is quicker than general aluminum extruding heat dissipating heatsinks.
In the present invention, the [0017] heatsink sets 1 are elements contacting a CPU for absorbing heat. There are two heatsink sets 1. The reason for using two heatsink sets 1 is that when heat is transferred the upper heatsink set 1, since the upper and lower heatsink sets 1 are separated, no convection occurs and thus no heat returns.
FIG. 1 shows the first embodiment of the present invention. There are two heatsink sets [0018] 1 exposing out and having a plurality of fins 11. The lateral side of one heatsink set 1 near the base 10 has a plurality of trenches 12. A bottom of the base 10 of another heatsink set 1 is installed with a plurality of trenches 12. The heat convection super conductive tubes 2 are bent to have a U shape. One end of the U shape tube is placed in a trench 12 and another end thereof is placed in another trench 12. The two heatsink sets 1 are assembled as one set. Meanwhile, the heat convection super conductive tube 2 has the effect of buckling two sets of heatsink sets 1 (referring to FIG. 2). The bottom of the base 10 of the heatsink set 1 with trenches 12 serves for contacting a heat source, such as CPU. Therefore, large amount of heat can be transferred to another heatsink set 1 through the heat convection super conductive tube 2. Then heat is transferred to each heatsink. Therefore, a rapidly self-heat-conductive heat-dissipating module is formed by the heat convection super conductive tubes 2 and the heatsink sets 1. A heat dissipating fan 3 is assembled at the identical lateral side of the two heatsink sets 1 for blowing cold air to the fins 11 to achieve a high efficiency heat dissipation.
Referring to FIG. 3, the second embodiment of the present invention is illustrated. There are two [0019] identical heatsink sets 1. The bottom of the base 10 of the heatsink set 1 has a plurality of trenches 12. The heat convection super conductive tubes 2 are bent to have a U shape. Two ends of the U shape tube are placed in trenches 12. The two heatsink sets 1 are assembled as one set, and the fins of the two heatsink sets 1 are alternatively arranged. Meanwhile, the heat convection super conductive tube 2 has the effect of buckling two sets of heatsink sets 1 (referring to FIG. 4). The base 10 of the heatsink set 1 with trenches 12 serves for contacting a heat source. Therefore, large amount of heat can be transferred to another heatsink set 1 through the heat convection super conductive tube 2. Then heat is thus transferred to each heatsink. The alternatively arranged fins can increase the area of heat dissipation. A heat dissipating fan 3 is assembled at the identical lateral side of the two heatsink sets 1 for blowing cold air to the fins 11 to achieve a high efficiency heat dissipation.
FIG. 5 shows the second embodiment of the present invention. In this the present invention, the heatsink sets [0020] 1 are identical to those in the first embodiment. The difference is the heat convection super conductive tube 2. There are two heat convection super conductive tubes 2. Each heat convection super conductive tube 2 is formed by two U shapes. One heat convection super conductive tube 2 is wider, and the other is small. The two free ends of the double U shapes of the wider heat convection super conductive tube 2 can be placed in the two trenches 12 at the lateral sides. The U shape of the tube having no free end is placed in the two trenches 12 at the lateral sides. The two free ends of the double U shapes of the narrower heat convection super conductive tube 2 can be placed in the two trenches 12 at the inner sides. The U shape having no free end is placed in the two trenches 12 at the inner sides. Therefore, other than transferring through the fins 11, the heat absorbed by the base 10 can be transferred to the heatsinks through the heat convection super conductive tubes 2 rapidly so that heat can be dispersed on the fins 11. A heat dissipating fan 3 is assembled at the identical lateral side of the two heatsink sets 1 for blowing cold air to the fins 11 to achieve a high efficiency heat dissipation.
FIG. 7 shows the fourth embodiment of the present invention. In this embodiment, the heatsink sets [0021] 1 and the heat convection super conductive tube 2 can be assembled together and one or a plurality of heat dissipating fans are added for increasing the heat dissipating efficiency.
The rapidly self-heat-conductive heat-dissipating module of the present invention has the following advantages. [0022]
1. Heat from the heat source can be rapidly and effectively transferred to the heat dissipating module. [0023]
2. Heat from the heat source can be dispersed rapidly and effectively. [0024]
3. In the present invention, a plurality of rapidly self-heat-conductive heat-dissipating module can be assembly integrally, the heat from the heat source can be dispersed more effectively. [0025]
The present invention are thus described, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the present invention, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims. [0026]

Claims

What is claimed is:

1. A rapidly self-heat-conductive heat-dissipating module, comprising:

two heatsink sets each having a base and fins connected on the base;

at least one heat convection super conductive tube;

each heat convection super conductive tube having a portion being connected to the heatsink sets near a heat source and other portions far away from the heat source;

thereby, heat transferring from the portion near the heat source to the portions far away from the heat source; the heat convection super conductive tube serving to fix the two heatsink sets.

2. The rapidly self-heat-conductive heat-dissipating module as claimed in claim 1, wherein bottoms of the base of the two heatsink set are installed with a plurality of trenches; the heat convection super conductive tubes are bent to have a U shape; one end of the U shape tube is placed in a trench and another end thereof is placed in another trench; and the two heatsink sets are assembled as one set.

3. The rapidly self-heat-conductive heat-dissipating module as claimed in claim 2, wherein the two heatsink sets are assembled as one set and fins thereof are alternatively arranged.

4. The rapidly self-heat-conductive heat-dissipating module as claimed in claim 1, wherein bottoms of the base of the two heatsink sets have a plurality of trenches; there are two heat convection super conductive tubes; each heat convection super conductive tube is formed by double U shapes; two free ends of the double U shapes of the heat convection super conductive tube are placed into the two trenches of a heatsink set and the U shape has no free end is placed in the two trenches in another heatsink set; then the fins of the heatsink sets are assembled correspondingly.

5. The rapidly self-heat-conductive heat-dissipating module as claimed in claim 1, further comprising a heat dissipating fan assembled to an identical lateral side of the two heatsink sets for blowing cold air to the fins so as to acquire high efficient heat dissipation.

6. The rapidly self-heat-conductive heat-dissipating module as claimed in claim 1, wherein a plurality of heat dissipating modules formed by heatsink sets and heat convection super conductive tubes are assembled together.

7. The rapidly self-heat-conductive heat-dissipating module as claimed in claim 1, further comprising one or more heat dissipating fans.