US20040134642A1 - Heat dissipation device including heat sink and heat pipes - Google Patents

Heat dissipation device including heat sink and heat pipes Download PDF

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Publication number
US20040134642A1
US20040134642A1 US10/638,999 US63899903A US2004134642A1 US 20040134642 A1 US20040134642 A1 US 20040134642A1 US 63899903 A US63899903 A US 63899903A US 2004134642 A1 US2004134642 A1 US 2004134642A1
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United States
Prior art keywords
base
heat
plate
dissipation device
fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/638,999
Inventor
Wei-Ta Lo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hon Hai Precision Industry Co Ltd
Original Assignee
Individual
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Filing date
Publication date
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Assigned to HON HAI PRECISION IND. CO., LTD. reassignment HON HAI PRECISION IND. CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LO, WEI-TA
Publication of US20040134642A1 publication Critical patent/US20040134642A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to heat dissipation devices, and more particularly to a heat dissipation device including a heat sink and heat pipes for achieving great heat dissipation efficiency.
  • a heat sink comprises a solid metal base attached on the CPU, and a plurality of fins formed from the base.
  • the base is intimately attached on the CPU, and must be adequately cooled to ensure normal operation of the CPU. Most of the heat accumulated at the base is transferred firstly to the fins and then dissipated from the fins.
  • the electronics technology continues to advance, and increasing amounts of heat are being generated by powerful state-of-the-art CPUs. Many conventional heat sinks are no longer able to efficiently remove heat from these CPUs.
  • an object of the present invention is to provide a heat dissipation device which can quickly and efficiently transfer heat away from a base of a heat sink thereof.
  • a heat dissipation device in accordance with a preferred embodiment of the present invention comprises a heat sink and a pair of heat pipes.
  • the heat sink includes a base, a top plate, and a plurality of fins thermally connecting the base and the plate through solder. Opposite ends of each heat pipe are engaged with the base and the plate respectively, for transferring heat accumulated at the base to the plate.
  • Other related embodiments are also efficacious.
  • FIG. 1 is an isometric view of a heat dissipation device in accordance with the preferred embodiment of the present invention
  • FIG. 2 is an isometric view of a heat dissipation device in accordance with an alternative embodiment of the present invention
  • FIG. 3 is an isometric view of a heat dissipation device in accordance with a further alternative embodiment of the present invention.
  • FIG. 4 is an isometric view of a heat dissipation device in accordance with a still further alternative embodiment of the present invention.
  • a heat dissipation device in accordance with the preferred embodiment of the present invention comprises a heat sink 10 and a pair of heat pipes 20 .
  • the heat sink 10 comprises a solid base 12 adapted to be attached on an electronic package (not shown) and a flat plate 18 separate from and parallel to the base 12 .
  • a plurality of fins 16 extends between the base 12 and the plate 18 .
  • the plurality of fins 16 has opposite right angled ends 161 thereof soldered with solder such as tin, to the base 12 and the plate 18 at opposite ends thereof. Both of the right angled ends 161 not only provide sufficient area soldering to the corresponding base 12 and plate 18 but also abut against the neighboring fin for mutually enhancing rigidity of the neighboring fins.
  • a pair of first holes 14 is defined in a side of the base 12 .
  • a pair of second holes 19 is defined in a corresponding side of the plate 19 .
  • Each heat pipe 20 is substantially U-shaped, and forms a capillary structure therein. Work medium is contained in the pipe 20 . Opposite ends of each heat pipe 20 are engaged in a respective first hole 14 and a corresponding second hole 19
  • first holes 14 ′ are defined in opposite sides of a base 12 ′ of a heat sink 10 ′, and second holes 19 ′ are correspondingly defined in opposite sides of a plate 18 ′.
  • Four heat pipes 20 are engaged in the corresponding first and second holes 14 ′, 19 ′.
  • a pair of first cutouts 14 ′′ is defined in a side of a base 12 ′′ of a heat sink 10 ′′, and a pair of second cutouts 19 ′′ is defined in a corresponding side of a plate 18 ′′.
  • a pair of heat pipes 20 is engaged in the corresponding first and second cutouts 14 ′′, 19 ′′.
  • first cutouts 14 ′′′ are defined in opposite sides of a base 12 ′′′ of a heat sink 10 ′′′, and second cutouts 19 ′′′ are correspondingly defined in opposite sides of a plate 18 ′′′.
  • Four heat pipes 20 are engaged in the corresponding first and second cutouts 14 ′′′, 19 ′′′.
  • the base 12 / 12 ′/ 12 ′′/ 12 ′′′ maybe hollow and contain work medium therein.

Abstract

A heat dissipation device includes a heat sink (10) and a pair of heat pipes (20). The heat sink includes a base (12), a top plate (18), and a plurality of fins (16) thermally connecting the base and the plate through solder. Opposite ends of each heat pipe are engaged with the base and the plate respectively, for transferring heat accumulated at the base to the plate.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0001]
  • The present invention relates to heat dissipation devices, and more particularly to a heat dissipation device including a heat sink and heat pipes for achieving great heat dissipation efficiency. [0002]
  • 2. Description of Prior Art [0003]
  • During operation of an electronic device such as a computer central processing unit (CPU), a large amount of heat is often produced. The heat must be quickly removed from the CPU to prevent it from becoming unstable or being damaged. Typically, a heat sink is attached to an outer surface of the CPU to absorb heat from the CPU. The heat absorbed by the heat sink is then dissipated to ambient air. [0004]
  • Conventionally, a heat sink comprises a solid metal base attached on the CPU, and a plurality of fins formed from the base. The base is intimately attached on the CPU, and must be adequately cooled to ensure normal operation of the CPU. Most of the heat accumulated at the base is transferred firstly to the fins and then dissipated from the fins. However, the electronics technology continues to advance, and increasing amounts of heat are being generated by powerful state-of-the-art CPUs. Many conventional heat sinks are no longer able to efficiently remove heat from these CPUs. [0005]
  • An improved heat dissipation device is desired to overcome the above-described disadvantages of the prior art. [0006]
    • SUMMARY OF THE INVENTION
  • Accordingly, an object of the present invention is to provide a heat dissipation device which can quickly and efficiently transfer heat away from a base of a heat sink thereof. [0007]
  • In order to achieve the object set out above, a heat dissipation device in accordance with a preferred embodiment of the present invention comprises a heat sink and a pair of heat pipes. The heat sink includes a base, a top plate, and a plurality of fins thermally connecting the base and the plate through solder. Opposite ends of each heat pipe are engaged with the base and the plate respectively, for transferring heat accumulated at the base to the plate. Other related embodiments are also efficacious. [0008]
  • Other objects, advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:[0009]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an isometric view of a heat dissipation device in accordance with the preferred embodiment of the present invention; [0010]
  • FIG. 2 is an isometric view of a heat dissipation device in accordance with an alternative embodiment of the present invention; [0011]
  • FIG. 3 is an isometric view of a heat dissipation device in accordance with a further alternative embodiment of the present invention; and [0012]
  • FIG. 4 is an isometric view of a heat dissipation device in accordance with a still further alternative embodiment of the present invention.[0013]
    • DETAILED DESCRIPTION OF THE INVENTION
  • Referring to FIG. 1, a heat dissipation device in accordance with the preferred embodiment of the present invention comprises a [0014] heat sink 10 and a pair of heat pipes 20.
  • The [0015] heat sink 10 comprises a solid base 12 adapted to be attached on an electronic package (not shown) and a flat plate 18 separate from and parallel to the base 12. A plurality of fins 16 extends between the base 12 and the plate 18. The plurality of fins 16 has opposite right angled ends 161 thereof soldered with solder such as tin, to the base 12 and the plate 18 at opposite ends thereof. Both of the right angled ends 161 not only provide sufficient area soldering to the corresponding base 12 and plate 18 but also abut against the neighboring fin for mutually enhancing rigidity of the neighboring fins. A pair of first holes 14 is defined in a side of the base 12. A pair of second holes 19 is defined in a corresponding side of the plate 19. Each heat pipe 20 is substantially U-shaped, and forms a capillary structure therein. Work medium is contained in the pipe 20. Opposite ends of each heat pipe 20 are engaged in a respective first hole 14 and a corresponding second hole 19.
  • In the present invention as illustrated by the above preferred embodiment, some heat accumulated at the [0016] base 12 is transferred to the fins 16 through the solder therebetween, while some said heat is transferred to the plate 18 via the heat pipes 20. The heat on the plate 18 is then transferred to the fins 16 through the solder therebetween. Thus, the base 12 is rapidly cooled.
  • Referring to FIG. 2, in the alternative embodiment of the present invention, [0017] first holes 14′ are defined in opposite sides of a base 12′ of a heat sink 10′, and second holes 19′ are correspondingly defined in opposite sides of a plate 18′. Four heat pipes 20 are engaged in the corresponding first and second holes 14′, 19′.
  • Referring to FIG. 3, in the further alternative embodiment of the present invention, a pair of [0018] first cutouts 14″ is defined in a side of a base 12″ of a heat sink 10″, and a pair of second cutouts 19″ is defined in a corresponding side of a plate 18″. A pair of heat pipes 20 is engaged in the corresponding first and second cutouts 14″, 19″.
  • Referring to FIG. 4, in the still further alternative embodiment of the present invention, [0019] first cutouts 14′″ are defined in opposite sides of a base 12′″ of a heat sink 10′″, and second cutouts 19′″ are correspondingly defined in opposite sides of a plate 18′″. Four heat pipes 20 are engaged in the corresponding first and second cutouts 14′″, 19′″.
  • In yet further alternative embodiments of the present invention, the [0020] base 12/12′/12″/12′″ maybe hollow and contain work medium therein.
  • It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the fill extent indicated by the broad general meaning of the terms in which the appended claims are expressed. [0021]

Claims (10)

What is claimed is:
1. A heat dissipation device comprising:
a heat sink comprising a base and a plate spaced apart from the base, a plurality of fins soldered to the base and the plate at opposite ends thereof; and
a plurality of heat pipes thermally connecting the base and the plate.
2. The heat dissipation device of claim 1, wherein ports are defined in the base and the plate respectively, the ports receiving opposite ends of the heat pipes.
3. The heat dissipation device of claim 1, wherein the ports are holes.
4. The heat dissipation device of claim 1, wherein the ports are cutouts.
5. The hat dissipation device of claim 1, wherein the opposite ends of the fins are right angled and abut against the neighboring fins for not only providing sufficient area for soldering to both said base and plate, but also mutually enhancing rigidity of the neighboring fins.
6. A heat dissipation device comprising:
a heat sink comprising a base, a plate spaced apart from the base, and a plurality of fins thermally connecting the base and the plate through solder; and
a plurality of heat pipes engaged between the base and the plate, for transferring heat from the base to the plate.
7. The heat dissipation device of claim 6, wherein the solder is tin.
8. The hat dissipation device of claim 6, wherein at least one of the opposite ends of the fin is right angled and abuts against the neighboring fins, which not only provides sufficient area for soldering to the corresponding plate or base, but also mutually enhances rigidity of the neighboring fins.
9. A heat dissipation device comprising:
a heat sink comprising a base, a plate spaced apart from the base, and a plurality of fins located between said base and said plate and thermally respectively connecting to at least one of the base and the plate through solder; and
a plurality of heat pipes engaged between the base and the plate, for transferring heat from the base to the plate.
10. The hat dissipation device of claim 9, wherein at least one of the opposite ends of each of the fins is right angled and abuts against the neighboring fins, which not only provides sufficient area for soldering to the corresponding plate or base connected thereto, but also mutually enhances rigidity of the neighboring fins.
US10/638,999 2003-01-15 2003-08-11 Heat dissipation device including heat sink and heat pipes Abandoned US20040134642A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW092200665U TW557114U (en) 2003-01-15 2003-01-15 Heat dissipation device
TW92200665 2003-01-15

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030218849A1 (en) * 2002-04-15 2003-11-27 Fujikura Ltd. Tower type heat sink
US20060104032A1 (en) * 2004-11-16 2006-05-18 Hon Hai Precision Industry Co., Ltd Heat dissipation device
US20070137838A1 (en) * 2005-12-21 2007-06-21 Foster Jimmy G Sr Heat sink for distributing a thermal load
US20100149799A1 (en) * 2008-12-12 2010-06-17 Foxconn Technology Co., Ltd. Led illuminating device and light engine thereof
WO2017047756A1 (en) * 2015-09-18 2017-03-23 古河電気工業株式会社 Heat sink

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050183849A1 (en) * 2004-02-19 2005-08-25 Ki-Tak Ko Heat radiating apparatus

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5699853A (en) * 1996-08-30 1997-12-23 International Business Machines Corporation Combined heat sink and sink plate
US6189601B1 (en) * 1999-05-05 2001-02-20 Intel Corporation Heat sink with a heat pipe for spreading of heat
US20010001981A1 (en) * 1997-10-20 2001-05-31 William G. Kratz, Jr. Heat pipe type cooler
US6394175B1 (en) * 2000-01-13 2002-05-28 Lucent Technologies Inc. Top mounted cooling device using heat pipes
US6469894B2 (en) * 2001-03-08 2002-10-22 Kabushiki Kaisha Toshiba Apparatus for cooling an electronic component and electronic device comprising the apparatus
US20030019610A1 (en) * 2001-07-26 2003-01-30 Jefferson Liu Rapidly self - heat-conductive heat - dissipating module
US20030094275A1 (en) * 2001-11-21 2003-05-22 Fujikura Ltd. Heat sink and fin module
US20030173061A1 (en) * 2002-03-13 2003-09-18 Cheng-Tien Lai Heat dissipation device with working liquid received in circulatory route
US6651734B1 (en) * 2002-12-15 2003-11-25 Jefferson Liu Multi-element heat dissipating module
US20030230398A1 (en) * 2002-06-13 2003-12-18 Hsieh Kun Lee Heat dissipation device

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5699853A (en) * 1996-08-30 1997-12-23 International Business Machines Corporation Combined heat sink and sink plate
US20010001981A1 (en) * 1997-10-20 2001-05-31 William G. Kratz, Jr. Heat pipe type cooler
US6189601B1 (en) * 1999-05-05 2001-02-20 Intel Corporation Heat sink with a heat pipe for spreading of heat
US6394175B1 (en) * 2000-01-13 2002-05-28 Lucent Technologies Inc. Top mounted cooling device using heat pipes
US6469894B2 (en) * 2001-03-08 2002-10-22 Kabushiki Kaisha Toshiba Apparatus for cooling an electronic component and electronic device comprising the apparatus
US20030019610A1 (en) * 2001-07-26 2003-01-30 Jefferson Liu Rapidly self - heat-conductive heat - dissipating module
US20030094275A1 (en) * 2001-11-21 2003-05-22 Fujikura Ltd. Heat sink and fin module
US20030173061A1 (en) * 2002-03-13 2003-09-18 Cheng-Tien Lai Heat dissipation device with working liquid received in circulatory route
US20030230398A1 (en) * 2002-06-13 2003-12-18 Hsieh Kun Lee Heat dissipation device
US6651734B1 (en) * 2002-12-15 2003-11-25 Jefferson Liu Multi-element heat dissipating module

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030218849A1 (en) * 2002-04-15 2003-11-27 Fujikura Ltd. Tower type heat sink
US7165603B2 (en) * 2002-04-15 2007-01-23 Fujikura Ltd. Tower type heat sink
US20060104032A1 (en) * 2004-11-16 2006-05-18 Hon Hai Precision Industry Co., Ltd Heat dissipation device
US20070137838A1 (en) * 2005-12-21 2007-06-21 Foster Jimmy G Sr Heat sink for distributing a thermal load
US7347251B2 (en) * 2005-12-21 2008-03-25 International Business Machines Corporation Heat sink for distributing a thermal load
US20100149799A1 (en) * 2008-12-12 2010-06-17 Foxconn Technology Co., Ltd. Led illuminating device and light engine thereof
US8376587B2 (en) * 2008-12-12 2013-02-19 Foxconn Technology Co., Ltd. LED illuminating device and light engine thereof
WO2017047756A1 (en) * 2015-09-18 2017-03-23 古河電気工業株式会社 Heat sink
US10598441B2 (en) 2015-09-18 2020-03-24 Furukawa Electric Co., Ltd. Heat sink

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AS Assignment

Owner name: HON HAI PRECISION IND. CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LO, WEI-TA;REEL/FRAME:014389/0583

Effective date: 20030626

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION