US20080210404A1 - Cooling device with ringed fins - Google Patents

Cooling device with ringed fins Download PDF

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Publication number
US20080210404A1
US20080210404A1 US11968889 US96888908A US2008210404A1 US 20080210404 A1 US20080210404 A1 US 20080210404A1 US 11968889 US11968889 US 11968889 US 96888908 A US96888908 A US 96888908A US 2008210404 A1 US2008210404 A1 US 2008210404A1
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Patent type
Prior art keywords
heat
ringed
cooling device
heat pipe
fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11968889
Inventor
Ji-Ping PENG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cooler Master Co Ltd
Original Assignee
Cooler Master Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A cooling device includes a heat-conducting base, two fin sets, and a heat pipe. The two fin sets are respectively constructed by a metallic stripe that is periodically folded and is arranged as a ring type. The heat pipe has a heated section that is thermally connected to the heat-conducting base, and a condensing section that is extended from the heat-conducting base is further formed as a flat shape, on which two oppositely flat faces are formed. The two flat faces of the condensing section of the heat pipe are respectively contacted closely with the two fin sets by being sandwiched therein. In such case, the contact area between the condensing section of heat pipe and the fin sets is enhanced, thus that the heat-conducting effect is promoted significantly.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention generally relates to a cooler, and in particular, to a cooling device capable of solving the heating problem generated from an electronic element, such as CPU.
  • 2. Description of Prior Art
  • In order to solve the cooling problem of electronic elements which generates a great amount of heat, such as the CPU of a computer, heat pipe has become an indispensable member associated with current cooling device. Additionally, in order to provide an excellent distribution and cooperation between the fins arranged on the cooling device and the air flow supplied by the fan, it can arrange at least one set of ringed fins to the heat-conducting seat formed in a tube shape as disclosed in the “Cooling Device of Heat Pipe” of Taiwan Patent Publication No. 575154.
  • The cooling device of heat pipe includes a plate-typed base, a cylindrical heat-conducting tube with two sides opened, a plurality of heat pipes, and a plurality of cooling fins. The heat-conducting tube is integrally laid on the base, while the heat pipe passes through the base horizontally and is combined to the inner wall of the heat-conducting tube with a ring-typed configuration. The radially distributed fins are contacted with the interiors of heat-conducting tube. Meanwhile, a fan can be arranged in the heat-conducting tube, so the fan can fully develop an optimally cooling effect.
  • However, although there is an excellent distribution and cooperation between the cooling device of heat pipe and the air flow supplied by the fan, it is impossible to develop the heat-transferring effect of individual heat pipe completely, because it ignores the fact that there is too little contacting area between the heat pipe and the fins. On one hand, the cooling device of heat pipe poorly applies the heat-conducting tube as a heat-conducting media between the heat tube and the fins, such that the heat is unable to be transferred to the fins and the heat-transferring effect is influenced. On the other hand, regarding the flat parts of the heat pipe to be thermally contacted with the heat-conducting tube, since there is only one flat face contacted with the heat-conducting tube, while another face is not contacted with any fin or cooling structure, there is insufficient contacting area between the condensing part of heat pipe and the cooling structure. Therefore, the transferred heat can not be dissipated in time, causing the working fluid in the heat pipe unable to be restored to liquid phase, nor a heat exchange can be functioned successfully.
  • Accordingly, in order to solve aforementioned shortcomings, after a substantially devoted study, in cooperation with the application of relatively academic principles, the inventor has at last proposed the present invention that is designed reasonably to possess the capability to improve the prior arts significantly.
  • SUMMARY OF THE INVENTION
  • The invention is mainly to provide a cooling device with ringed fins, in which a heat pipe is applied as a heat-transferring element between a heat-conducting base and at least two fin sets. A condensing section applied as a thermal connection between the heat pipe and the fin sets is shown as a flat shape for the convenience of being positioned between two fin sets. Thereby, the contacting area of the condensing section of the heat pipe and each fin set may be enhanced significantly, and the heat transferring effect may be promoted markedly as well.
  • Secondly, the invention is to provide a cooling device with ringed fins, including a heat-conducting base, two fin sets, and a heat pipe. The two fin sets are respectively constructed by a metallic stripe that is periodically folded and is arranged as a ring type. The heat pipe has a heated section that is thermally connected to the heat-conducting base, and a condensing section that is extended from the heat-conducting base is further formed as a flat shape, on which two oppositely flat faces are formed. The two flat faces of the condensing section of the heat pipe are respectively contacted closely with the two fin sets by being sandwiched therein. In such case, the cooling device is thereby constructed.
  • BRIEF DESCRIPTION OF DRAWING
  • The features of the invention believed to be novel are set forth with particularity in the appended claims. The invention itself, however, may be best understood by reference to the following detailed description of the invention, which describes a number of exemplary embodiments of the invention, taken in conjunction with the accompanying drawings, in which:
  • FIG. 1 is a perspective explosive view of the present invention;
  • FIG. 2 is a perspective assembled view of the present invention;
  • FIG. 3 is a side plane view of the present invention;
  • FIG. 4 is a cross-sectional illustration of the present invention under a using status;
  • FIG. 5 is a cross-sectional illustration of another embodiment according to the present invention under a using status;
  • FIG. 6 is a cross-sectional illustration of a further embodiment according to the present invention under a using status; and
  • FIG. 7 is a cross-sectional illustration of a further another embodiment according to the present invention under a using status.
  • DETAILED DESCRIPTION OF THE INVENTION
  • In cooperation with attached drawings, the technical contents and detailed description of the present invention are described thereinafter according to a number of preferable embodiments, being not used to limit its executing scope. Any equivalent variation and modification made according to appended claims is all covered by the claims claimed by the present invention.
  • Please refer to FIG. 1 and FIG. 2, which respectively are a perspective explosive view and a perspective assembled view of the present invention. The invention is to provide a cooling device with ringed fins, which includes a heat-conducting base 1, at least two fin sets 2, and at least one heat pipe 3.
  • According to a preferable embodiment of the invention, the heat-conducting base 1 is made of materials with excellent heat conductivity, such as aluminum and copper. Its bottom face 10 is contacted closely with an electronic element 4, such as CPU, as shown in FIG. 4. A cooler 12 may be further arranged on a top part 11 of the heat-conducting base 1. The cooler 12 may be manufactured by means of an aluminum extrusion, and has a bottom part 120 closely contacted with the heat-conducting base 1 to be functioned as a heat-transfer connection and a plurality of fins 121 interspaced and integrated on the bottom part 120 to further supply a cooling effect to the heat-conducting base 1.
  • The fin sets 2 are separately a metallic stripe that is periodically folded and then structured to a ring configuration. The fin sets 2 interspaced one another are upright formed above the heat-conducting base 1 and the cooler 12. After the ring configuration has been made, a hollow part 20 at the centers of the fin sets 2 is formed for providing a circulation of outside air or an installing space of fan (not shown in the figures).
  • Please refer to FIG. 3 together. In this preferable embodiment, each heat pipe 3 at least has a heated section 30 and a condensing section 31 for making a heat-transferring mechanism existed between the heat-conducting base 1 and the fin sets 2. In this case, the quantity of the heat pipe 3 is plural, and two sides of each heat pipe are respectively configured as a heated section 30 and a condensing section 31. Furthermore, a plurality of lower grooves 110 are arranged on the top part 11 of the heat-conducting base 1, while a plurality of upper grooves 122 are arranged on the bottom part 120 of the cooler 120 corresponding to the plural lower grooves 110. When the cooler 12 is combined to the top part 11 of the heat-conducting base 1, the upper and lower grooves 122, 110 are merged together, whereby the heated section 30 of each heat pipe 3 may be inserted therein, making a heat-transferring mechanism existed between the heat-conducting base 1 and the cooler 12.
  • Please refer to FIG. 3 and FIG. 4. According to above description, each heat pipe 3 may also be interspaced one another by making each condensing section 31 extended upwardly from corresponding two sides of the heat-conducting base 1. Subsequently, the condensing section 31 of each heat pipe 3 is further formed as a flat shape, on which two opposite flat faces 310 are formed. The two flat faces 310 are respectively contacted closely with two interspaced fin sets 2 by sandwiching corresponding condensing section 31 of the heat pipe 3 therein. Therefore, the contacting surface area of a condensing section 31 with each fin sets 2 is thereby enhanced to further achieve a heat-transferring connection and promote the entire heat-transferring efficiency markedly; namely, the heat-transferring effect of the heat pipe 3 may be fully developed. Additionally, two lid plates 21 shown as ring shape may be respectively added to the outside face of two most external ring sets 2. Each lid plate 21 is made of material with excellent heat conductivity capable of helping the fin sets 2 process cooling procedure.
  • Again, as shown in FIG. 4, the condensing section 31 of each heat pipe 3 may also be bent according to the ring-shaped arrangement of the fin sets 2. Because of the bending configurations, two condensing sections 31 of any two adjacent heat pipes 3 (initially interspaced) may be further contacted at their ends.
  • Additionally, as shown in FIG. 5, it is a cross-sectional illustration of another preferable embodiment of the present invention under a using status. In this case, a middle section of the heat pipe 3 is acted as a heated section 30, which directly passes through the heat-conducting base 1, and two side parts of which are extended upwardly from two corresponding sides of the heat-conducting base 1, while another two sides parts are respectively functioned as a condensing section 31.
  • Furthermore, as shown in FIG. 6, it is a cross-sectional illustration of a further preferable embodiment of the present invention under a using status. In this case, one side part of the heat pipe 3 is still acted as a heated section 30, while another side part is functioned as a condensing section 31. However, the condensing section 31 is only extended upwardly from one side of the heat-conducting base 1 without any interspacing design.
  • Finally, as shown in FIG. 7, it is a cross-sectional illustration of a further another preferable embodiment of the present invention under a using status. In this case, the middle section of the heat pipe 3 is acted as a condensing section 31 and is correspondingly located above the heat-conducting base 1, from which two side parts of the heat pipe 3 are extended downwardly and respectively penetrate into corresponding two sides of the heat-conducting base 1, in which two heated sections 30 of the heat pipe 3 are interspaced to each other.
  • According to the aforementioned structure, a cooling device with ringed fins of the present invention is thereby obtained.
  • Summarizing aforementioned description, the invention is an indispensably novel structure for a compressor indeed, which may positively reach the expected usage objective for solving the drawbacks of the prior arts, and which extremely possesses the innovation and progressiveness to completely fulfill the applying merits of new type patent, according to which the invention is thereby applied. Please examine the application carefully and grant it as a formal patent for protecting the rights of the inventor.
  • However, the aforementioned description is only a preferable embodiment according to the present invention, being not used to limit the patent scope of the invention, so equivalently structural variation made to the contents of the present invention, for example, description and drawings, is all covered by the claims claimed thereinafter.

Claims (13)

  1. 1. A cooling device with ringed fins, including:
    a heat-conducting base;
    two fin sets, which are respectively constructed by a metallic stripe that is periodically folded and is arranged as a ring type; and
    a heat pipe, which has a heated section that is thermally connected to the heat-conducting base, and a condensing section that is extended from the heat-conducting base is further formed as a flat shape, on which two oppositely flat faces are formed;
    wherein the two flat faces of the condensing section are respectively contacted closely with the two fin sets by being sandwiched therein.
  2. 2. The cooling device with ringed fins according to claim 1, wherein a top part of the heat-conducting base is further arranged a cooler.
  3. 3. The cooling device with ringed fins according to claim 2, wherein the cooler is manufactured by means of an aluminum extrusion.
  4. 4. The cooling device with ringed fins according to claim 2, wherein the cooler comprises a bottom part that is closely contacted with the heat-conducting base, and a plurality of fins interspaced to be configured on the bottom part.
  5. 5. The cooling device with ringed fins according to claim 4, wherein a lower groove is arranged on a top part of the heat-conducting part, and an upper groove corresponding to the lower groove is arranged on the bottom part of the cooler, and the heated section of the heat pipe is sandwiched between the upper, lower grooves, for being functioned as a heat-transferring connection.
  6. 6. The cooling device with ringed fins according to claim 1, wherein a hollow part is formed at a center surrounded by the two fin sets of ring shape.
  7. 7. The cooling device with ringed fins according to claim 1, wherein two outside faces of the two fin sets are respectively arranged a lid plate of ring shape.
  8. 8. The cooling device with ringed fins according to claim 1, wherein the heated section and the condensing section of the heat pipe are respectively located at two side parts thereof.
  9. 9. The cooling device with ringed fins according to claim 1, wherein the heated section of the heat pipe is located at a middle part of the heat pipe, and two condensing sections are further arranged respectively at two side parts of the heat pipe.
  10. 10. The cooling device with ringed fins according to claim 1, wherein the condensing section of the heat pipe is located at a middle part of the heat pipe, and two heated sections are further arranged respectively at two side parts of the heat pipe and interspaced to each other.
  11. 11. The cooling device with ringed fins according to claim 1, wherein the condensing section of the heat pipe is bent according to the ringed arrangement of the fin sets.
  12. 12. The cooling device with ringed fins according to claim 1, wherein the heat pipe is plural, and each heat pipe is arranged in an interspaced manner, such that the condensing section is extended upwardly from two corresponding sides of the heat-conducting base.
  13. 13. The cooling device with ringed fins according to claim 12, wherein the condensing sections of any two adjacent heat pipes are further contacted face-to-face at each end thereof.
US11968889 2007-03-01 2008-01-03 Cooling device with ringed fins Abandoned US20080210404A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW096203389 2007-03-01
TW96203389 2007-03-01

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DE (1) DE202008001206U1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090242176A1 (en) * 2008-03-27 2009-10-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipe
US20100155023A1 (en) * 2008-12-22 2010-06-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus having heat pipes inserted therein
US20110024090A1 (en) * 2009-08-03 2011-02-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20110083830A1 (en) * 2009-10-12 2011-04-14 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20120186798A1 (en) * 2011-01-26 2012-07-26 Celsia Technologies Taiwan, I Cooling module for led lamp
US20130105112A1 (en) * 2011-10-31 2013-05-02 Cooler Master Co., Ltd. Heat sink

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5529115A (en) * 1994-07-14 1996-06-25 At&T Global Information Solutions Company Integrated circuit cooling device having internal cooling conduit
US20020121365A1 (en) * 2001-03-05 2002-09-05 Kozyra Kazimierz L. Radial folded fin heat sink
US6571862B1 (en) * 2002-06-25 2003-06-03 Waffer Technology Corp. Heat dissipating fin
US20040226690A1 (en) * 2003-04-23 2004-11-18 Lee Hsieh Kun Tubular heat dissipation device
US20050006061A1 (en) * 1998-06-08 2005-01-13 Tony Quisenberry Toroidal low-profile extrusion cooling system and method thereof
US20050067144A1 (en) * 2003-08-25 2005-03-31 Tatung Co., Ltd. Cooling device
US20050180110A1 (en) * 2004-02-18 2005-08-18 Lin I-Yung Heat dissipation structure
US20060060332A1 (en) * 2004-09-17 2006-03-23 Foxconn Technology Co.,Ltd Heat dissipating device
US20060185821A1 (en) * 2005-02-24 2006-08-24 Comp Take Technology Co., Ltd. Thermal dissipation device
US20060227506A1 (en) * 2005-04-11 2006-10-12 Zalman Tech Co., Ltd. Apparatus for cooling computer parts and method of manufacturing the same

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5529115A (en) * 1994-07-14 1996-06-25 At&T Global Information Solutions Company Integrated circuit cooling device having internal cooling conduit
US20050006061A1 (en) * 1998-06-08 2005-01-13 Tony Quisenberry Toroidal low-profile extrusion cooling system and method thereof
US20020121365A1 (en) * 2001-03-05 2002-09-05 Kozyra Kazimierz L. Radial folded fin heat sink
US6571862B1 (en) * 2002-06-25 2003-06-03 Waffer Technology Corp. Heat dissipating fin
US20040226690A1 (en) * 2003-04-23 2004-11-18 Lee Hsieh Kun Tubular heat dissipation device
US20050067144A1 (en) * 2003-08-25 2005-03-31 Tatung Co., Ltd. Cooling device
US20050180110A1 (en) * 2004-02-18 2005-08-18 Lin I-Yung Heat dissipation structure
US20060060332A1 (en) * 2004-09-17 2006-03-23 Foxconn Technology Co.,Ltd Heat dissipating device
US20060185821A1 (en) * 2005-02-24 2006-08-24 Comp Take Technology Co., Ltd. Thermal dissipation device
US20060227506A1 (en) * 2005-04-11 2006-10-12 Zalman Tech Co., Ltd. Apparatus for cooling computer parts and method of manufacturing the same

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090242176A1 (en) * 2008-03-27 2009-10-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipe
US8220527B2 (en) * 2008-03-27 2012-07-17 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipe
US20100155023A1 (en) * 2008-12-22 2010-06-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus having heat pipes inserted therein
US20110024090A1 (en) * 2009-08-03 2011-02-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US8579019B2 (en) * 2009-08-03 2013-11-12 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20110083830A1 (en) * 2009-10-12 2011-04-14 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US8430153B2 (en) * 2009-10-12 2013-04-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having heat sink enclosing conductive member therein
US20120186798A1 (en) * 2011-01-26 2012-07-26 Celsia Technologies Taiwan, I Cooling module for led lamp
US20130105112A1 (en) * 2011-10-31 2013-05-02 Cooler Master Co., Ltd. Heat sink

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AS Assignment

Owner name: COOLER MASTER CO., LTD, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:PENG, JI-PING;REEL/FRAME:020313/0116

Effective date: 20071231