CN208210561U - The radiator of three-dimensional grid structure form for electronic equipment - Google Patents
The radiator of three-dimensional grid structure form for electronic equipment Download PDFInfo
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- CN208210561U CN208210561U CN201820834433.0U CN201820834433U CN208210561U CN 208210561 U CN208210561 U CN 208210561U CN 201820834433 U CN201820834433 U CN 201820834433U CN 208210561 U CN208210561 U CN 208210561U
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- radiator
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Abstract
The utility model proposes a kind of radiators of three-dimensional grid structure form for electronic equipment, it include: heat transfer structure, the radiator structure that is fixed on heat transfer structure, radiator structure includes multiple heat pipe units, and each heat pipe unit is using one of following form: (1) multiple heat pipes form polyhedron single cell structure；(2) multiple pentagonal configurations and multiple hexagonal structures are separately constituted by multiple heat pipes, multiple pentagonal configurations and hexagonal structure is spliced into fullerene single cell structure；According to the size of electronic equipment, multiple heat pipe units are spliced into an entirety according to default normalized form, radiator structure is formed, which is fixed on heat transfer structure, and heat transfer structure is pasted at the mainboard and solar panel of electronic equipment；Wherein, each heat pipe is coated with heat radiation coating.The utility model has the characteristics of structure is simply adjustable, perfect heat-dissipating.
Description
Technical field
The utility model relates to technical field of electronic equipment, in particular to a kind of three-dimensional grid structure for electronic equipment
The radiator of form.
Background technique
In recent decades, advancing by leaps and bounds with modern electronic technology, electronic equipment is smaller towards volume, integrated level more
High, with better function, the more sensitive direction of reaction is developed.Number of transistors is more and more on unit area, unit area power
And if the heat generated is also continuously increased and does not take away these heats rapidly, electronic device will cannot normal work due to high temperature
Make, or even burns.Increase by 10 DEG C when the temperature of electronic device is every in 70 DEG C of -80 DEG C of levels, reliability will decline 50%.Mesh
Before, it 55% is caused by temperature is excessively high that the failure of 50% or more electronic equipment, which is caused by various environmental factors, and among these,.
For electronic equipment (mobile phone) radiating requirements, the radiating modes such as air-cooled, misting cooling, heat pipe are widely used now,
Heat pipe can be transmitted at a distance amount of heat without additional dynamic by the section of very little as a kind of efficient heat transfer element
Power.Heat pipe heat radiation be current aerospace, weaponry, high performance electronics mainstream radiating mode, heat pipe is a kind of tool
There is the heat transfer element of very high thermal conductivity, transmits heat by becoming in the vapour of Totally enclosed vacuum intraductal working medium, liquid phase, there is pole
High thermal conductivity has the laudatory title of " hot superconductor ".Since heat pipe comes out, the cooling system of power electronic equipment is made to have new hair
Exhibition.No matter which kind of radiating mode, final heat dissipation vehicle is air, other are all intermediate link.When natural convection air is cooling
Mode most directly with simplicity, heat pipe expand rapidly self cooling application range.Because heat pipe self-cold radiating system without fan,
There is no noise, non-maintaining, safe and reliable, heat-pipe air-cooling is even self cooling can to replace water-cooling system.In addition, heat pipe heat radiation can also incite somebody to action
Heat generating member is concentrated, or even sealing, improves the security reliability and application range of electrical equipment.
Typical heat pipe consists of a tube shell, a liquid suction core and an end cover, as shown in Figure 1.1.3 × (10-1~10- will be pumped into pipe
4) be filled with suitable working fluid after the negative pressure of Pa, make be close to inside pipe wall liquid-sucking core capillary-porous material in it is hydraulically full after plus
With sealing.One end of pipe is evaporator section (bringing-up section), and the other end is condensation end (cooling section), is needed according to application two sections of centres
It can arrange adiabatic section.When one end of the heat pipe is heated, in capillary wick liquid evaporation gasification, steam flow under a slight pressure difference to
The other end.Liquid is condensed into after releasing heat, liquid flows back to evaporator section along porous internal walls by the effect of capillary force.So circulation
Repeatedly, heat is from one end of the heat pipe to the other end.Fig. 1 heat pipe operation principle schematic diagram.It is limited by the limit of conventional fabrication techniques
System, heat-pipe radiator on the market is several single heat pipe series connection heat dissipations at present.First is that heat pipe is relatively thick, (normal dia is
2-8mm), though ultrathin heat pipe, and by heat pipe flatten be made, performance is very impacted；Second is that in order to meet demand need by
Directly-heated pipe carries out various bendings, its performance is decreased obviously after bending；Third is that single heat pipe series connection, Homogeneouslly-radiating performance are limited
System, single tube radiator as shown in Figure 2.
Therefore, it is badly in need of developing a kind of three-dimensional net rack connection structure micro heat pipe, meets the needs of hyundai electronics industry is to heat dissipation.
For the market demand number of electronic radiation industry with hundred billion, high performance heat pipe product can form biggish market scale, push China
Huge economic benefit and social benefit are brought while microelectronic field transition and upgrade.Traditional heat pipe mostly uses mechanical add
Work is unfavorable for radiating so that heat pipe is relatively thick.
Utility model content
The purpose of this utility model aims to solve at least one of described technological deficiency.
For this purpose, the purpose of this utility model is that proposing a kind of heat dissipation of three-dimensional grid structure form for electronic equipment
Device.
To achieve the goals above, the radiator for the three-dimensional grid structure form that the embodiments of the present invention provide, packet
Include: heat transfer structure, the radiator structure being fixed on the heat transfer structure, the radiator structure include multiple heat pipe units, each
The heat pipe unit is using one of following form:
(1) polyhedron single cell structure is formed by multiple heat pipes, wherein the shape of the polyhedron single cell structure is according to
The size of electronic equipment is configured；
(2) multiple pentagonal configurations and multiple hexagonal structures are separately constituted by multiple heat pipes, by the multiple pentagon
Structure and hexagonal structure are spliced into fullerene single cell structure；
According to the size of the electronic equipment, by multiple heat pipe units according to default normalized form be spliced into one it is whole
Body forms the radiator structure, which is fixed on the heat transfer structure, and the heat transfer structure is pasted on institute
It states at the mainboard and solar panel of electronic equipment；
Wherein, each heat pipe is coated with heat radiation coating.
Further, the diameter of each heat pipe is micron grade.
Further, the diameter of each heat pipe is 0.1mm~0.5mm, and length is 0.5mm~2mm.
Further, the polyhedron that the heat pipe unit is formed is hexahedron or octahedron.
Further, when the heat pipe unit is hexahedron, by 12 heat pipe heats at cuboid or square, one is formed
Hexahedron single cell structure；By the hexahedron single cell structure of multiple above structure forms, it is combined into a cuboid or the square bodily form
The overall structure of formula forms radiator structure.
Further, octahedra using 18 heat pipe compositions, wherein top surface and bottom when the heat pipe unit is octahedra
Face is hexagon, and side is rectangle, forms an octahedra single cell structure；The octahedron of multiple above structure forms is single
Born of the same parents' structure is combined into a stratiform multi-panel overall structure, forms radiator structure.
Further, when the heat pipe unit is fullerene single cell structure, each heat pipe unit is spherical shape, will be multiple
The spherical fullerene single cell structure of above structure form is combined into a stratiform multi-panel overall structure, forms radiator structure.
Further, the electronic equipment is mobile phone, tablet computer.
Further, the heat transfer structure is using laminated structure made of high thermal conductivity micron order boron nitride.
Further, the heat pipe heat radiation end in the radiator structure is fixed on the frame of the electronic equipment.
According to the radiator of the three-dimensional grid structure form for electronic equipment of the utility model embodiment, by electricity
The radiator structure of the heat transfer structure for having Thermal conductivity, polyhedron and fullerene single cell structure form is set in sub- equipment,
Realize the heat dissipation to major heat producing components in electronic equipment.Since the diameter of each heat pipe can reach micron grade, size is all non-
Chang Wei little, therefore the length of entire radiator structure, width and height can be combined adjustment according to the size of electronic equipment, tie
Structure is simple, and heat dissipation performance is good, easy to produce and can be effectively reduced production cost, simple production process and production efficiency compared with
Height, while the production quality for the radiator produced is effectively ensured.
The additional aspect of the utility model and advantage will be set forth in part in the description, partially will be from following description
In become obvious, or recognized by the practice of the utility model.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the utility model from the description of the embodiment in conjunction with the following figures will
Become obvious and be readily appreciated that, in which:
Fig. 1 is the heat pipe operation principle schematic diagram of the prior art；
Fig. 2 is the schematic diagram of the single tube radiator of the prior art；
Fig. 3 is the schematic diagram according to the hexahedron heat pipe unit of the utility model embodiment；
Fig. 4 is the structural schematic diagram of the radiator formed according to the hexahedron heat pipe unit of the utility model embodiment；
Fig. 5 is the schematic diagram according to the octahedra heat pipe unit of the utility model embodiment；
Fig. 6 is the structural schematic diagram of the radiator formed according to the octahedra heat pipe unit of the utility model embodiment；
Fig. 7 is the schematic diagram according to the heat pipe unit of the fullerene single cell structure of the utility model embodiment；
Fig. 8 is that the structure of the radiator formed according to the fullerene single cell structure heat pipe unit of the utility model embodiment is shown
It is intended to.
Specific embodiment
The embodiments of the present invention are described below in detail, the example of embodiment is shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to for explaining the utility model, and should not be understood as the limit to the utility model
System.
The utility model provides a kind of radiator of three-dimensional grid structure form for electronic equipment, can be adapted for micro-
In the electronic equipment of electronic industry, the especially radiator of the electronic products such as mobile phone, PAD.
The radiator of the three-dimensional grid structure form for electronic equipment of the utility model embodiment, comprising: heat transfer knot
Structure, the radiator structure 100 being fixed on heat transfer structure.Wherein, electronic equipment can be the terminals such as mobile phone, tablet computer.
In the present invention, heat transfer structure can be using laminated structure made of high thermal conductivity micron order boron nitride.
Specifically, radiator structure 100 includes multiple heat pipe units 10, each heat pipe unit 10 is using one of following form:
(1) polyhedron single cell structure is formed by multiple heat pipes 1, wherein the shape of polyhedron single cell structure is set according to electronics
Standby size is configured.For example, the polyhedron that heat pipe unit 10 is formed is hexahedron or octahedron.
(2) multiple pentagonal configurations and multiple hexagonal structures are separately constituted by multiple heat pipes 1, by multiple pentagonal configurations
Fullerene single cell structure is spliced into hexagonal structure；
Wherein, each heat pipe 1 is coated with heat radiation coating, and the radiating end of heat pipe 1 can be fixed on the electronic equipment
Frame on.
In one embodiment of the utility model, the heat pipe 1 of the utility model and its heat pipe unit 10 formed, heat dissipation
Structure 100 can be used 3D printing technique realization, the diameter of heat pipe be contracted to micron grade.
In one embodiment of the utility model, the diameter of each heat pipe 1 is 0.1mm~0.5mm, length 0.5mm
~2mm.Preferably, the diameter of each heat pipe 1 is 0.3mm, length 1mm.It should be noted that above-mentioned heat pipe parameter only goes out
In exemplary purpose, rather than in order to limit the utility model.According to the specific size of electronic equipment, heat pipe and 1 its formed
Heat pipe unit 10, the size of radiator structure 100 can also be adjusted.
When heat pipe unit 10 is hexahedron, cuboid or square are formed by 12 heat pipes 1, forms a hexahedron list
Born of the same parents' structure, as shown in Figure 3.By the hexahedron single cell structure of multiple above structure forms, it is combined into a cuboid or square
The overall structure of form forms radiator structure 100, as shown in Figure 4.According to the size of mobile phone, had using multiple heat pipe units 10
Sequence combination, forms a radiator structure 100.Since the size of each hexahedron unit cell is very small, entire radiator
Length, width and height can be combined, be adjusted according to the size of electronic equipment.
When heat pipe unit 10 is octahedra, octahedron is formed using 18 heat pipes 1, wherein top and bottom are six
Side shape, side are rectangle, form an octahedra single cell structure, as shown in Figure 5.By the octahedron of multiple above structure forms
Single cell structure is combined into a stratiform multi-panel overall structure, forms radiator structure 100, as shown in Figure 6.According to the size of mobile phone,
Using multiple 10 sequential combinations of heat pipe unit, a radiator structure 100 is formed.Due to each octahedra unit cell size very
It is small, therefore the length of entire radiator, width and height can be combined according to the size of electronic equipment, adjust.
When heat pipe unit 10 is fullerene single cell structure, each heat pipe unit 10 is spherical shape.As shown in fig. 7, using adopting
With heat pipe 1 with 12 pentagons and 20 hexagonal groups at the heat pipe unit 10 of a fullerene unit cell.By multiple above structures
The spherical fullerene single cell structure of form is combined into a stratiform multi-panel overall structure, radiator structure 100 is formed, such as Fig. 8 institute
Show.The radiator structure 100 of an electronic equipment is formed using multiple 10 sequential combinations of heat pipe unit according to the size of mobile phone.By
It is very small in the size of each fullerene structure unit cell, therefore the length of entire radiator structure 100, width and height
It is combined, adjusted according to the size of electronic equipment.
Then, according to the size of electronic equipment, by multiple heat pipe units 10 according to default normalized form be spliced into one it is whole
Body forms radiator structure 100, which is fixed on heat transfer structure, and heat transfer structure is pasted on electronic equipment
Mainboard and solar panel at.
The radiator of the three-dimensional grid structure form for electronic equipment of the utility model embodiment, working principle is such as
Under: electronic equipment can generate the mainboard of heat, especially electronic equipment at work and solar panel generates heat maximum.Passing through will
Mainboard and solar panel generate heat transfer to using heat transfer structure made of high thermal conductivity micron order boron nitride, and further by more
The radiator structure of face body structure and fullerene single cell structure form heat pipe unit composition is exported to external environment, is realized to electronics
The heat dissipation effect of equipment.
According to the radiator of the three-dimensional grid structure form for electronic equipment of the utility model embodiment, by electricity
The radiator structure of the heat transfer structure for having Thermal conductivity, polyhedron and fullerene single cell structure form is set in sub- equipment,
Realize the heat dissipation to major heat producing components in electronic equipment.Since the diameter of each heat pipe can reach micron grade, size is all non-
Chang Wei little, therefore the length of entire radiator structure, width and height can be combined adjustment according to the size of electronic equipment, tie
Structure is simple, and heat dissipation performance is good, easy to produce and can be effectively reduced production cost, simple production process and production efficiency compared with
Height, while the production quality for the radiator produced is effectively ensured.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is contained at least one embodiment or example of the utility model.In the present specification, to the schematic table of above-mentioned term
Stating may not refer to the same embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be
It can be combined in any suitable manner in any one or more embodiment or examples.
Although the embodiments of the present invention have been shown and described above, it is to be understood that above-described embodiment is
Illustratively, it should not be understood as limiting the present invention, those skilled in the art are not departing from the utility model
Principle and objective in the case where above-described embodiment can be changed in the scope of the utility model, modify, replace and
Modification.The scope of the utility model is by appended claims and its equivalent limits.
Claims (10)
1. a kind of radiator of three-dimensional grid structure form for electronic equipment characterized by comprising heat transfer structure is consolidated
Radiator structure on the heat transfer structure, the radiator structure include multiple heat pipe units, and each heat pipe unit is adopted
With one of following form:
(1) polyhedron single cell structure is formed by multiple heat pipes, wherein the shape of the polyhedron single cell structure is according to the electronics
The size of equipment is configured；
(2) multiple pentagonal configurations and multiple hexagonal structures are separately constituted by multiple heat pipes, by the multiple pentagonal configuration
Fullerene single cell structure is spliced into hexagonal structure；
According to the size of the electronic equipment, multiple heat pipe units are spliced into an entirety according to default normalized form,
The radiator structure is formed, which is fixed on the heat transfer structure, and the heat transfer structure is pasted on described
At the mainboard and solar panel of electronic equipment；
Wherein, each heat pipe is coated with heat radiation coating.
2. the radiator of three-dimensional grid structure form for electronic equipment as described in claim 1, which is characterized in that each
The diameter of the heat pipe is micron grade.
3. the radiator of three-dimensional grid structure form for electronic equipment as claimed in claim 1 or 2, which is characterized in that
The diameter of each heat pipe is 0.1mm~0.5mm, and length is 0.5mm~2mm.
4. the radiator of three-dimensional grid structure form for electronic equipment as described in claim 1, which is characterized in that described
The polyhedron that heat pipe unit is formed is hexahedron or octahedron.
5. the radiator of three-dimensional grid structure form for electronic equipment as claimed in claim 4, which is characterized in that work as institute
State heat pipe unit be hexahedron when, by 12 heat pipe heats at cuboid or square, form a hexahedron single cell structure；It will be more
The hexahedron single cell structure of a above structure form is combined into the overall structure of a cuboid or square form, is formed and is dissipated
Heat structure.
6. the radiator of three-dimensional grid structure form for electronic equipment as claimed in claim 4, which is characterized in that work as institute
It is octahedra using 18 heat pipes compositions, wherein top and bottom are hexagon, and side is when to state heat pipe unit be octahedra
Rectangle forms an octahedra single cell structure；By the octahedra single cell structure of multiple above structure forms, it is combined into a layer
Shape multi-panel overall structure forms radiator structure.
7. the radiator of three-dimensional grid structure form for electronic equipment as described in claim 1, which is characterized in that work as institute
State heat pipe unit be fullerene single cell structure when, each heat pipe unit be spherical shape, by the spherical shape of multiple above structure forms
Fullerene single cell structure is combined into a stratiform multi-panel overall structure, forms radiator structure.
8. the radiator of three-dimensional grid structure form for electronic equipment as described in claim 1, which is characterized in that described
Electronic equipment is mobile phone, tablet computer.
9. the radiator of three-dimensional grid structure form for electronic equipment as described in claim 1, which is characterized in that described
Heat transfer structure is using laminated structure made of high thermal conductivity micron order boron nitride.
10. the radiator of three-dimensional grid structure form for electronic equipment as described in claim 1, which is characterized in that institute
The heat pipe heat radiation end stated in radiator structure is fixed on the frame of the electronic equipment.
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| CN201820834433.0U CN208210561U (en) | 2018-05-31 | 2018-05-31 | The radiator of three-dimensional grid structure form for electronic equipment |
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| CN201820834433.0U CN208210561U (en) | 2018-05-31 | 2018-05-31 | The radiator of three-dimensional grid structure form for electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108901174A (en) * | 2018-05-31 | 2018-11-27 | 孙莅宁 | The radiator of three-dimensional grid structure form for electronic equipment |
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2018
- 2018-05-31 CN CN201820834433.0U patent/CN208210561U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108901174A (en) * | 2018-05-31 | 2018-11-27 | 孙莅宁 | The radiator of three-dimensional grid structure form for electronic equipment |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181207 Termination date: 20200531 |
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| CF01 | Termination of patent right due to non-payment of annual fee |