TWM571957U - Temperature uniform plate radiator structure - Google Patents

Abstract

A uniform temperature plate heat sink structure comprises a temperature equalizing plate base and at least one temperature equalizing plate fin, the temperature equalizing plate base has a bottom plate and a top plate, and a first chamber is arranged in the bottom plate and the top plate. The top plate is provided with at least one through hole, and the temperature equalizing plate fin has a two-phase stacked fin plate, and the second fin plate is surrounded by a second chamber, and the temperature equalizing plate fin is closely connected to the through hole. The first and second chambers are connected to each other; wherein the surface of any of the two fins is provided with a plurality of protruding structures.

Description

Temperature uniform plate radiator structure

This creation is related to a uniform temperature plate, especially a uniform temperature plate radiator structure.

According to the rapid development of the electronics industry, the heat sinks formed by the uniform temperature plate and the plurality of fins still cannot fully meet the high temperature and high heat generated by the current electronic heating elements during operation. Therefore, through the integration of the plurality of uniform temperature plates, the heat sink itself is a uniform temperature plate heat sink composed of a plurality of temperature equalizing plates, and is increasingly used in heat dissipation applications.

However, the conventional uniform temperature plate is mainly formed by the two plates being stacked on each other, and a hollow chamber is formed between the two plates as a phase change space, so that the surface of the plate body is flat; On the other hand, on the other hand, it is also convenient to contact the surface of the heat source. However, this also limits the heat dissipation area of the temperature equalizing plate that can be in contact with the outside world, and thus cannot further improve the heat dissipation performance under the existing structure.

In view of this, the creator is trying to improve and solve the above-mentioned shortcomings, and he has devoted himself to researching and cooperating with the application of theory, and finally proposed a creation that is reasonable in design and effective in improving the above-mentioned defects.

The main purpose of the present invention is to provide a uniform temperature plate heat sink structure. Therefore, it is mainly formed on the surface of the temperature equalizing plate as a fin, and has a protruding structure capable of increasing the heat dissipation area, so that it can be The structure of the warm plate heat sink further improves the heat dissipation efficiency.

In order to achieve the above object, the present invention provides a temperature equalizing plate heat sink structure, comprising a temperature equalizing plate base and at least one temperature equalizing plate fin, the temperature equalizing plate base has a bottom plate and a top plate, and the bottom plate and the bottom plate a first chamber is disposed in the top of the top plate, and at least one through hole is disposed on the top plate, and the temperature plate fin has a two-phase stacked fin plate, and the second fin is surrounded by a second chamber. The temperature equalizing plate fins are closely connected to the through holes to connect the first and second chambers to each other; wherein the surface of any of the two fin plates is provided with a plurality of protruding structures.

In order to further disclose the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only for reference and description, and are not intended to limit the creation.

Please refer to FIG. 1 and FIG. 2 , which are respectively a schematic perspective view and a cross-sectional view of the creation. The present invention provides a temperature equalizing plate heat sink structure comprising a temperature equalizing plate base 1 and at least one temperature equalizing plate fin 2; wherein:

The temperature equalizing plate base 1 comprises a bottom plate 10 and a top plate 11 stacked on the bottom plate 10, and the bottom plate 10 is overlapped with the top plate 11 and can be surrounded by a first The chamber 12 has a hollow shape, and the inner wall thereof can be provided with capillary structure and can be filled with a working fluid (not shown); since the internal structure of the temperature equalizing plate is a conventional technique and is not a creation The scope of the application is not described here.

The temperature equalizing plate fins 2 may be singular or plural; and in the embodiment of the present invention, the temperature equalizing plate fins 2 are plural and arranged at intervals in the above-mentioned temperature equalizing plate base 1 The top plate 11 and each of the temperature equalizing plate fins 2 are composed of two-phase stacked fins 20, and after the two fin plates 20 are stacked, a second chamber 21 can be disposed between each other. The second chamber 21 is also hollow, and the inner wall thereof may be provided with capillary structure and may also be filled with a working fluid (not shown); since the internal structure of the temperature equalizing plate fin 2 is also different from that of a general temperature equalizing plate. It is a prior art and is not part of the scope of this creation application and therefore will not be repeated.

Referring to FIG. 3 together, the top plate 11 of the above-mentioned uniform temperature plate base 1 is provided with through holes 110 corresponding to the number of the uniform temperature plate fins 2, so that the respective temperature equalizing plate fins 2 respectively correspond to And closely connected to each of the through holes 110, so that the first chamber 12 of the temperature equalizing plate base 1 and the second chamber 21 of the temperature equalizing plate fins 2 communicate with each other; in more detail, each of the uniform temperature plate fins 2 An insertion portion 200 having an opening shape is formed on one end of each of the through holes 110 so as to be embedded in the through hole 110 to make the second chamber 21 of each of the temperature equalizing plate fins 2 and the first temperature plate base 1 A chamber 12 is in communication.

The present invention is mainly applied to the surface of any of the fins 20 of each of the above-mentioned uniform temperature plate fins 2, and a plurality of protruding structures 201 are provided. The protruding structure 201 may be a stud, a bump, or any protrusion or structure, which may be formed by a process such as etching, or may be formed by the inner surface of any fin 20 to form a protrusion on the outer surface thereof. And distributed on the surface of any of the fins 20; preferably, the protruding structures 201 are arranged in a staggered manner and distributed on the surface of the fin 20, and the protrusions are also distributed on the surface of the second fins 20 Shape 201.

Therefore, by the above-mentioned structural composition, the structure of the uniform temperature plate radiator can be obtained.

Accordingly, as shown in FIG. 4, when the present invention is disposed on a heat source 3, the bottom plate 10 of the temperature equalization plate base 1 is directly or indirectly attached to the surface of the heat source 3, thereby absorbing the heat source. 3 The heat generated during operation. At this time, since the first chamber 12 of the temperature equalizing plate base 1 and the second chamber 21 of each of the temperature equalizing plate fins 2 communicate with each other, heat can be quickly transmitted to the inside by the phase change inside the temperature equalizing plate. Each of the uniform temperature plate fins 2 is further brought into contact with the outside air by natural convection, etc., to achieve the effect of condensing the temperature equalizing plate fins 2; and the present invention is provided on the surface of the uniform temperature plate fins 2 The protruding structure 201 can increase the contact area with the outside air, thereby increasing the heat dissipation area, and the protruding structures 201 can be arranged in a misaligned manner, so that the airflow is not blocked in circulation, and The opportunity to contact the respective protruding structures 201 can thus contribute to the improvement of the heat dissipation effect of each of the temperature equalizing plate fins 2.

Therefore, with the creation of the uniform temperature plate heat sink structure, through the good heat transfer characteristics of the temperature equalizing plate itself, the cooling effect of the uniform temperature plate fin 2 can be directly improved by natural convection; and in the previous question, the creation is further The surface of the uniform temperature plate fin 2 is provided with a protruding structure 201, which can effectively increase the contact area between the surface of the temperature equalizing plate fin 2 and the air, that is, increase the heat dissipation area, and can be transparent or embossed in the process. The forming method such as recessing does not need to increase the cost of the components, and the formed protruding structure 201 does not occupy space, and does not affect the arrangement pitch of the uniform temperature plate fins 2, so that the heat can be dissipated in the existing uniform temperature plate. The structure of the device further improves its heat dissipation efficiency.

In summary, this creation is a rare new creative product, which can achieve the intended use, but solve the lack of knowledge, and because of its novelty and progress, it fully meets the requirements of new patent applications. To file an application in accordance with the Patent Law, please check and grant the patent in this case to protect the rights of the creator.

However, the above description is only a preferred and feasible embodiment of the present invention, and thus the scope of the patent of the present invention is not limited thereby, and therefore equivalent structural changes made by using the present specification and the contents of the drawings are equally included in the present invention. Within the scope of creation, he is given to Chen Ming.

<this creation>

1‧‧‧Homothermal plate base

10‧‧‧floor

11‧‧‧ top board

110‧‧‧through hole

12‧‧‧ first chamber

2‧‧‧Homothermal plate fins

20‧‧‧Fin

200‧‧‧ embedded department

201‧‧‧ protruding structure

21‧‧‧Second chamber

3‧‧‧heat source

Figure 1 is a schematic view of the three-dimensional appearance of the present creation.

Figure 2 is a schematic cross-sectional view of the present creation.

Figure 3 is an enlarged detail of a portion A of Figure 2.

Figure 4 is a schematic diagram of the creation state of the present invention.

Claims (10)

A uniform temperature plate heat sink structure, comprising: a temperature equalizing plate base having a bottom plate and a top plate, wherein the bottom plate and the top plate are provided with a first chamber, and the top plate is provided with at least one through hole; And at least one uniform temperature plate fin having two stacked fins, wherein the second fin is surrounded by a second chamber, and the temperature equalizing plate fin is in close contact with the through hole and the first The two chambers are connected to each other; wherein the two fins are provided with a plurality of protruding structures on the surface. The uniform temperature plate radiator structure according to claim 1, wherein the inner wall of the first chamber is provided with capillary structure and filled with a working fluid. The uniform temperature plate radiator structure according to claim 1 or 2, wherein the inner wall of the second chamber is provided with capillary structure and filled with a working fluid. The uniform temperature plate heat sink structure according to claim 1, wherein the temperature equalizing plate fins are plural and arranged at intervals on the top plate of the temperature equalizing plate base. The uniform temperature plate heat sink structure according to claim 1 or 4, wherein the top plate of the temperature equalizing plate base is provided with a through hole corresponding to the number of the temperature equalizing plate fins, and the The warm plate fins correspond to and are in close contact with the through holes. The uniform temperature plate heat sink structure according to claim 5, wherein the one of the uniform temperature plate fins is provided with an opening portion corresponding to the through hole, and the embedded portion is embedded therein. In the through hole, the second chamber of the temperature equalizing plate fin is in communication with the first chamber of the temperature equalizing plate base. The uniform temperature plate radiator structure according to claim 1, wherein the protruding structure is a stud, a protrusion, or a protrusion. The uniform temperature plate heat sink structure according to claim 1, wherein the protruding structure is formed by recessing an inner surface of any of the fins to form a protrusion. The uniform temperature plate heat sink structure of claim 1, wherein the protruding structures are misaligned and distributed on any of the fin surfaces. The uniform temperature plate heat sink structure according to claim 9, wherein the protrusion structure is distributed on the surface of the two fins.