TW201738522A - Heat dissipation device - Google Patents

Abstract

A heat dissipation device includes a first and a second housing, at least one pipe, and a working fluid. The first and the second housing internally respectively defines a first and a second chamber, in which a first and a second wick structure is respectively formed, and has at least one first and second opening communicated with the first and the second chamber respectively. The pipe has a pipe body, and a first and second extended portion, which respectively has a first and a second open end, and a first and a second through opening, and is inserted into and connected to the first and the second chamber via the first and the second opening respectively. The pipe internally defines a pipe chamber, in which a pipe wick structure is formed. The working fluid is provided in the first and the second, and the pipe chamber.

Description

Heat sink

The present invention is a heat sink device, and more particularly relates to a heat sink device for heat dissipation.

With the current gradual appeal of electronic devices, all components must be reduced in size, but the heat generated by the shrinking of electronic devices has become a major obstacle to the improvement of performance of electronic devices and systems. Therefore, in order to effectively solve the problem of heat dissipation of components in electronic equipment, the industry has proposed a Vapor chamber and a heat pipe with better heat conduction performance to effectively solve the current heat dissipation problem. The tempering plate (the Vapor chamber) comprises a capillary structure having a rectangular shape and a wall surface of the inner chamber of the casing, and the inside of the casing is filled with a working liquid, and one side of the casing (ie, an evaporation zone) is Attaching a heat generating component (such as a central processing unit, a north-south bridge chip, a transistor, or other electronic component) to heat generated by the heat generating component, so that the liquid working fluid is evaporated in the evaporation zone of the casing to be converted into In the vapor state, the heat is conducted to the condensation zone of the casing, and the vaporous working liquid is cooled and condensed into a liquid state in the condensation zone, and the liquid working fluid is returned to the evaporation zone through the gravity or capillary structure to continue the vapor-liquid circulation. In order to effectively achieve the effect of uniform temperature heat dissipation, the principle and theoretical structure of the heat pipe is the same as that of the temperature equalizing plate, mainly in which the hollow part of the heat pipe of the circular pipe diameter is filled with metal powder, and the heat pipe is sintered. The inner wall forms an annular capillary structure, after which the heat pipe is evacuated and filled with the working liquid, and finally closed to form a heat pipe structure. When the working liquid is evaporated by the evaporation portion, the solution is diffused to the a condensation end, wherein the working liquid is in a vapor state in the evaporation portion, and is gradually cooled by the evaporation portion to be discharged into the liquid state after being separated from the evaporation portion, and is further returned to the evaporation portion through the capillary structure. The heat conduction mode of the plate and the heat pipe is different. The heat conduction mode of the temperature plate is two-dimensional, and the heat conduction mode of the surface is used as the average temperature. However, the heat conduction mode of the heat pipe is one-dimensional heat conduction mode (ie, heat dissipation at the far end). Therefore, today's electronic components are not suitable for use with a single heat pipe or a uniform temperature plate. Therefore, how to combine the heat pipe and the temperature equalizing plate to achieve uniform temperature and remote heat conduction or heat dissipation, in order to greatly improve heat conduction. The efficiency and effective solution to the heat dissipation problem of high-power electronic components is the improvement that the current industry needs. Therefore, how to solve the above problems and problems, that is, the creators of this case and related manufacturers engaged in this industry Those who want to study the direction of improvement.

Therefore, in order to effectively solve the above problems, an object of the present invention is to provide a tube body supported between the first and second housings, wherein the first and second housings are in communication with the tube body, thereby enabling the first A heat dissipating device having no interface thermal resistance between the two shells and the tube body. Another object of the present invention is to provide a first and second capillary structure in the first and second housings through a tubular capillary structure in the tube body, so that the cooled working fluid can be recirculated by capillary force and gravity. In order to achieve the effect of improving heat transfer efficiency and uniform temperature, and thus effectively increasing the efficiency of vapor-liquid circulation. Another object of the present invention is to provide a heat dissipation heat dissipation effect by rapidly dissipating heat energy in the first and second housings and the tube body to the air by assembling the first heat dissipation fin group and the second heat dissipation fin group. Heat sink. In order to achieve the above object, the present invention provides a heat dissipating device, comprising a first housing having a first chamber and at least one first opening, the first chamber having a first capillary structure, the first opening being connected The second chamber has a second chamber and at least one second opening, the second chamber has a second capillary structure, and the second opening communicates with the second chamber; at least one The tube body has a first extending portion and a first extending portion, and a second opening portion is formed with a second open end and a second extending portion a second through hole, the first extending portion is inserted into the first chamber from the first opening, the second extending portion is inserted into the second chamber from the second opening, and a tube is disposed in the tube body a body chamber and a tube capillary structure; and a working fluid disposed in the first and second chambers and the tube chamber; thereby, the interface between the first and second shells and the tube body is not in contact Thermal resistance improves heat transfer efficiency and temperature uniformity.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings. Please refer to the figures 1, 2, 2a, 3, 4 and 5, which are the perspective view, the exploded view and the exploded view of the first embodiment of the temperature equalizing plate structure of the present invention. The heat dissipating device of the present invention comprises a first housing 100, a second housing 200, at least one tube 300, and a working fluid 400. The first and second housings 100 and 200 are described above as a temperature equalizing plate. However, the present invention is not limited thereto, and other equivalents may be used in the specific implementation. The first housing 100 has a first chamber 110 and at least one first opening 101. The first chamber 110 is defined by a first cover plate 105 and a first bottom plate 103. A first capillary structure 111 is formed in a cavity 110, and the first capillary structure 111 is formed on an inner wall 112 of the first chamber 110. The first capillary structure 111 is preferably a powder sintered body, but It is not limited thereto, and may be selected as a mesh body, a fiber body, a braid or a groove or a combination of the foregoing in a specific implementation. The first opening 101 is disposed in the first cover plate 105 of the first housing 100 and penetrates through the first chamber 110. The first opening 101 in this embodiment is illustrated by one, but Not limited to this, in the specific implementation, the number of the foregoing first openings 101 may be one or more. The second housing 200 has a second chamber 210 and at least one second opening 201. The second chamber 210 is defined by a second cover 205 and a second bottom plate 203. The second capillary structure 211 has a second capillary structure 211 formed on an inner wall 212 of the second chamber 210. The second capillary structure 211 is preferably a powder sintered body, but It is not limited thereto, and may be selected as a mesh body, a fiber body, a braid or a groove or a combination of the foregoing in a specific implementation. The second opening 201 is disposed in the second bottom plate 203 of the second housing 200 and penetrates through the second chamber 210. The second opening 201 in this embodiment is described as one, but not To be limited thereto, in the specific implementation, the number of the foregoing second openings 201 may be one or more, and the actual number is matched with the number of the first openings 101 of the first housing 100. The tube body 300 has a tube body 310 and a first extension portion 320 and a second extension portion 330. The tube body 300 is preferably a heat pipe, but is not limited thereto, and may be other equivalents in a specific implementation. Things. The first extending portion 320 is formed with a first open end 322 and a first through opening 324 . The first extending portion 320 is inserted into the first chamber 110 from the first opening 101 . The second extending portion 330 is formed with a second open end 332 and a second through opening 334 . The second extending portion 330 is inserted into the second chamber 210 from the second opening 201 . A tubular body chamber 311 and a tubular capillary structure 312 are disposed in the tubular body 310. The tubular body chamber 311 is disposed between the first and second open ends 322 and 332. The tubular capillary structure 312 is formed on the tubular body. The inner wall 311a of the tubular body chamber 311 is on the inner wall 311a. The tube capillary structure 312 is preferably a powder sintered body, but is not limited thereto, and may be selected as a mesh body, a fiber body, a groove, a braid, or a combination thereof in a specific embodiment. The working fluid 400 is disposed in the first and second chambers 110 and 210 and the tube chamber 311. The working fluid 400 is preferably pure water or methanol, but is not limited thereto, and may be embodied in a specific implementation. Is the other equivalent. Therefore, the first and second housings 100 and 200 and the tubular body 300 of the present invention are integrated into one body, and the first and second chambers 110 and 210 and the tubular body chamber 311 are in a communicating structure, so that the first and second housings 100 are There is no interface thermal resistance between the 200 and the tube 300. In addition, the first extending portion 320 is inserted into the first chamber 110 from the first opening 101, and the first open end 322 is directly abutting the first capillary on the first bottom plate 103 of the first housing 100. The second opening portion 332 is inserted into the second chamber 210 from the second opening 201, and the second open end 332 is directly abutted on the second cover 205 of the second housing 200. The second capillary structure 211, that is, the first and second extensions 310 and 320 respectively extend into the first bottom plate 103 and the second cover plate 205 in the first and second openings 101 and 201 respectively, so that the first opening is performed. The end 322 is coupled to the first capillary structure 111 on the first bottom plate 103 of the first housing 100, and the second open end 332 and the second capillary on the second cover 205 of the second housing 200 The first and second extensions 320, 330 are the body 310. A part of the inner wall 311a of the first and second extensions 320, 330 is the inner wall 311a of the tubular body 310. The first and second through openings 324 and 334 respectively extend through the inner and outer sides of the tubular body 310, and the first through opening 324 is opposite to the first chamber 110, and the second through opening 334 is opposite to the second The chamber 210 is configured to communicate the first and second chambers 311 through the first and second through openings 324 and 334. In the embodiment, the first and second through openings 324 and 334 are five. To be specific, in the specific implementation, each of the first and second through openings 324, 334, or other first and second through openings 324, 334 having equal effects. In addition, the tubular capillary structure 312 is capillaryly coupled to the first and second capillary structures 111 and 211. As shown in FIGS. 4 and 5, the tubular capillary structure 312 on the inner wall 311a of the tubular body 310 is attached thereto. The first bottom plate and the second cover plate 205 of the first and second housings 100 and 200 are capillaryly connected (or connected to each other) at the first and second open ends 322 and 332 of the first and second extending portions 320 and 330. First and second capillary structures 111, 211 thereon. Here, the term "capillary connection" as used herein means that the pores of the first and second capillary structures 111, 211 are in communication with the pores of the tube capillary structure 312, so that capillary forces can be transmitted or extended from the tube capillary structure 312. To the first and second capillary structures 111, 211, the cooled working fluid 400 can be returned from the second capillary structure 211 to the tubular capillary structure 312 by the capillary force and gravity, and then the first capillary structure 111 is reflowed. In turn, it returns to the first chamber 110. Therefore, the design of the first and second capillary structures 111, 211 is capillaryly coupled by the tubular capillary structure 312 of the present invention, so that the working fluid cooled in the first chamber 110 can be passed through the tubular capillary structure of the tubular body 300. The capillary force and gravity of 312 rapidly return the working fluid to the second capillary structure 211 in the second chamber 210, or the working fluid cooled in the second chamber 210 can be passed through the tube body of the tube 300. The capillary force and gravity of the capillary structure 312 quickly return the working fluid to the first capillary structure 111 in the first chamber 110, thereby achieving the effect of improving the heat transfer efficiency and the uniform temperature, thereby effectively increasing the vapor-liquid circulation efficiency. Therefore, when the first bottom plate 103 of the first housing 100 is externally attached to a first heat generating component 500 (such as a central processing unit or an MCU or other electronic component), the first bottom plate of the first housing 100 103 absorbs a heat generated by the first heating element 500, so that the inner wall 112 of the first bottom plate 103 of the first casing 100 is heated and evaporated by the working fluid 400 of the first capillary structure 111 to be evaporated. The working fluid (or vapor working fluid) causes the vaporized working fluid to flow toward the first cover plate 105 in the first chamber 110, and a portion of the evaporated working fluid also passes through the first portion of the tubular body 300. An open end 322 flows into the tubular chamber 311, and another portion of the evaporated working fluid flows through the tubular chamber 311 into the second chamber 210 of the second housing 200 until the evaporated working fluid is in the first The first cover plate 105 of a casing 100 and the inside of the pipe body 310 and the second cover plate 205 and the second bottom plate 203 are condensed and converted into a cooled working fluid (or liquid working fluid). Two cover plates 205 and the second bottom plate 203 and the inside of the pipe body 310 The cooled working fluid is rapidly returned to the first bottom plate 103 on the first bottom plate 103 in the first chamber 100 by the capillary force and gravity of the second capillary structure 211 and the tubular capillary structure 312, thereby The working fluid 400 is continuously vaporized and circulated in the first chamber 110 and the tubular chamber 311 and the second chamber 210 to achieve a better heat dissipation effect. In addition, the first housing 100 further has at least one first flange 113 adjacent to the circumference of the first opening 101 and upward from a first cover 105 of the first housing 100. The inner wall of the first opening 101 is butted against the inner side of the first flange 113 opposite to the outer side of the first extending portion 320. The second housing 200 further has at least one second flange 213 adjacent to the circumference of the second opening 201 and extending downward from the second bottom plate 203 of the second housing 200. The inner wall of the second opening 201 is butted against the inner side of the second flange 213 opposite to the outer side of the second extending portion 330. The first and second flanges 113 and 213 can effectively increase the bonding area with the pipe body 300, so that the pipe body 300 can be firmly and tightly coupled to the first and second casings 100 and 200. Please refer to Figures 6, 7, 8, and 9 for a perspective view, a combined cross-sectional view, a partially enlarged cross-sectional view C, and a partially enlarged cross-sectional view D of the second embodiment of the heat sink of the present invention, supplemented by reference to the first As shown in the figure, the structure and function of the embodiment are the same as those of the foregoing first embodiment, and therefore will not be described herein again. However, the difference between the embodiment and the foregoing first embodiment is that the first The two through openings 324, 334 are respectively described. The first and second through openings 324, 334 can interconnect the first and second chambers 110, 210 with the tubular body chamber 311, thereby The same effect as the foregoing first embodiment is achieved. Please refer to FIG. 10 , which is a perspective combination diagram of a third embodiment of the heat dissipation device of the present invention, and is supplemented with reference to the figures 2, 3, 4, 5, 6, 7, 8, and 9, as shown in the figure. The structure and function of the embodiment are the same as those of the foregoing first and second embodiments, and therefore will not be described herein again. However, the difference between the embodiment and the first and second embodiments is that the second housing 200 is The second cover plate 205 is disposed opposite to the second heat generating component 600, and the first chamber 110 serves as a condensation chamber for the vaporized working fluid, thereby achieving the same as the first and second embodiments described above. The effect. In addition, the first bottom plate 103 of the first casing 100 and the second cover plate 205 of the second casing 200 are respectively attached to the first and second heating elements 500 and 600 (not shown). The same cooling effect. Please refer to FIG. 11 , which is a perspective assembled view of a fourth embodiment of the heat sink of the present invention, and is supplemented with reference to the figures 2, 3, 4, 5, 6, 7, 8, and 9, as shown in the figure. The structure and function of the embodiment are the same as those of the foregoing first, second and third embodiments, and therefore will not be described again here, but the difference between the embodiment and the first, second and third embodiments is that the first A mounting space 700 is defined between the housing 100 and the second housing 200 and the tube 300, and a first heat dissipation fin set 800 is disposed in the installation space 700. The first heat dissipation fin set 800 The outer side of the first cover plate 105 of the first housing 100 and the outer side of the tubular body 310 of the tubular body 300 and the outer side of the second bottom plate 203 of the second housing 200 are connected by air The first heat dissipation fin set 800 having a large contact area allows the thermal energy of the first cover plate 105 and the second bottom plate 203 and the tubular body 311 to be quickly transmitted to the air, thereby lifting the first and second housings. 100,200 condensation efficiency. Please refer to Figures 12 and 13 for a perspective view and a combined sectional view of a fifth embodiment of the heat sink according to the present invention, and with reference to Figures 2, 3, 4, 5, 6, 7, 8, and 9, As shown in the figure, the structure of the embodiment is the same as that of the foregoing fourth embodiment, and therefore will not be described herein again. However, the difference between the embodiment and the foregoing embodiment is that when the second housing 200 is When the second cover 205 is not attached to the second heat generating component 600, the second cover 205 of the second housing 200 is further provided with a second heat dissipation fin set 900, and the second heat dissipation fin set 900 is The outer side of the second cover plate 205 of the second housing 200 is connected, and the thermal energy of the second cover plate 205 is quickly transmitted to the second heat dissipation fin set 900 with a large contact area with air. In the air, the condensation efficiency of the first and second housings 100, 200 is increased. Please refer to Figures 14 and 15 for a top cross-sectional view and a cross-sectional view of a sixth embodiment of the heat sink of the present invention, supplemented by reference to Figures 2, 3, 4, 5, 6, 7, 8, 9, and 12. 13, as shown in the figure, the structure of the embodiment is the same as the first, second, third, fourth and fifth embodiments, and therefore will not be described again here, but the difference between the embodiment and the foregoing is that The inner wall 311a of the tubular body 300 is formed with a plurality of convex bodies 311b. The convex bodies 311b are annularly arranged and axially extended on the inner wall 311a. The convex bodies 311b have at least one groove 311c therebetween, as shown in FIG. The cross-section of the tube 300 is observed to be annularly spaced from each other to form a gear-like shape, but is not limited thereto, and the adjacent protrusions 311b may be arranged non-equally, and the same The groove 311c can also be formed into other shapes, and the capillary structure 312 is formed on the surfaces of the protrusions 311b and the grooves 311c. Since the protrusions 311b and 311c increase the surface area of the inner wall 311a, Therefore, the number of pores of the capillary structure 312 on the surface of the inner wall 311a is also increased, so that the working fluid 400 is at the first Chamber 110 and the tubular body and the chamber 311 to accelerate vapor-liquid circulating within the second chamber 210, to achieve a better heat dissipation effect. Please refer to FIGS. 16 and 17 for a top cross-sectional view and a cross-sectional view of a seventh embodiment of the heat sink according to the present invention, supplemented by reference to the second, third, fourth, fifth, sixth, seventh, eighth, ninth, and fourth, 13, 14, and 15, as shown in the figure, the structure of the embodiment is the same as the first, second, third, fourth, fifth, and sixth embodiments, and therefore will not be described again, but the embodiment and the foregoing The difference is that the tubular body 311 of the tubular body 311 is provided with a cylinder 313 having a first top end 313a and a second top end 313b, and the first top end 313a of the post 313 and The second top end 313b extends into the first and second chambers 110 and 210 and connects the first bottom plate 103 and the second bottom plate 205 of the first and second housings 100 and 200, and the surface of the column 313 is provided. There is a third capillary structure 313c, wherein the third capillary structure 313c is preferably a powder sintered body, but is not limited thereto, and may be selected as a mesh body, a fiber body, a braid or a groove or the foregoing in a specific implementation. In combination, the third capillary structure 313c is capillaryly coupled to the first and second capillary structures 111, 211. The working fluid 400 located in the first and second capillary structures 111, 211 can be recirculated from the third capillary structure 313c in addition to being recirculated from the tubular capillary structure 312, so that the working fluid 400 is in the first chamber 110. The vapor-liquid circulation in the tubular chamber 311 and the second chamber 210 is accelerated to achieve a better heat dissipation effect. As described above, the present invention has the following advantages over the prior art: 1. There is no interface thermal resistance between the first and second housings and the tube body; 2. Saving production cost; 3. Improving heat transfer efficiency and temperature uniformity Effect; 4. Increase the efficiency of vapor-liquid circulation; 5. Rapidly transfer heat energy into the air. The present invention has been described in detail above, but the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention. That is, the equivalent changes and modifications made by the scope of the present application should remain within the scope of the patent of the present invention.

100‧‧‧ first housing
101‧‧‧ first opening
103‧‧‧first bottom plate
105‧‧‧First cover
110‧‧‧ first chamber
111‧‧‧First capillary structure
112‧‧‧The inner wall of the first casing
113‧‧‧First flange
200‧‧‧ second housing
201‧‧‧ second opening
203‧‧‧second bottom plate
205‧‧‧second cover
210‧‧‧Second chamber
211‧‧‧Second capillary structure
212‧‧‧The inner wall of the second casing
213‧‧‧second flange
300‧‧‧ tube body
310‧‧‧ tube body
311‧‧‧Body chamber
311a‧‧‧The inner wall of the pipe body
311b‧‧‧ convex
311c‧‧‧ Groove
312‧‧‧ tube body capillary structure
313‧‧‧Cylinder
313a‧‧‧ first top
313b‧‧‧second top
313c‧‧‧ third capillary structure
320‧‧‧First Extension
322‧‧‧ first open end
324‧‧‧ first through opening
330‧‧‧Second extension
332‧‧‧ second open end
334‧‧‧Second opening
400‧‧‧Working fluid
500‧‧‧First heating element
600‧‧‧second heating element
700‧‧‧ installation space
800‧‧‧First heat sink fin set
900‧‧‧Second heat sink fin set

The following drawings are intended to provide a more complete understanding of the invention, and are in the The specific embodiments of the present invention are explained in detail by the specific embodiments herein, and reference to the accompanying drawings. 1 is a perspective assembled view of a first embodiment of a heat sink of the present invention; FIG. 2 is an exploded perspective view of a first embodiment of the heat sink of the present invention; 3 is a cross-sectional view of a first embodiment of the heat sink of the present invention; FIG. 4 is a partial enlarged cross-sectional view A of the first embodiment of the heat sink of the present invention; 5 is a partially enlarged cross-sectional view B of a first embodiment of a heat dissipating device of the present invention; FIG. 6 is an exploded perspective view of a second embodiment of the heat dissipating device of the present invention; 2 is a partial enlarged cross-sectional view C of a second embodiment of the heat sink of the present invention; and FIG. 9 is a partially enlarged cross-sectional view D of the second embodiment of the heat sink of the present invention. Figure 10 is a perspective view of a third embodiment of the heat sink of the present invention; Figure 11 is a perspective view of a fourth embodiment of the heat sink of the present invention; Three-dimensional combination of five embodiments Figure 13 is a cross-sectional view showing a fifth embodiment of the heat sink of the present invention; Figure 14 is a plan sectional view showing a sixth embodiment of the heat sink of the present invention; 6 is a cross-sectional view of a seventh embodiment of the heat sink of the present invention; and FIG. 17 is a cross-sectional view of a seventh embodiment of the heat sink of the present invention.

100‧‧‧ first housing

200‧‧‧ second housing

300‧‧‧ tube body

Claims (13)

A heat dissipating device comprising: a first housing having a first chamber and at least one first opening, the first chamber having a first capillary structure, the first opening communicating with the first chamber; a second housing having a second chamber and at least one second opening, the second chamber having a second capillary structure, the second opening communicating with the second chamber; at least one tube having a body and a first extending portion and a first extending portion, the second extending portion forming a second open end and a second through opening, the first extending portion An extension portion is inserted into the first chamber from the first opening, the second extension portion is inserted into the second chamber from the second opening, and a tubular body chamber and a tube capillary structure are disposed in the tube body And a working fluid disposed in the first and second chambers and the chamber chamber. The heat dissipating device of claim 1, wherein the first chamber of the first housing is defined by a first cover and a first bottom plate and the second housing The second chamber is defined by a second cover and a second bottom plate being covered with each other. The heat dissipation device of claim 2, wherein the first opening is disposed in the first cover of the first housing and the second opening is disposed on the second bottom plate of the second housing . The heat dissipation device of claim 2, wherein the first capillary structure and the second capillary structure are respectively formed on an inner wall of the first chamber and an inner wall of the second chamber, and The first capillary structure and the second capillary structure are selected from any one of the powder sintered body, the mesh body, the fibrous body, the groove, and the braid, or any combination thereof. The heat dissipation device of claim 2, wherein the first open end abuts the first capillary structure on the first bottom plate of the first housing and the second open end abuts the second housing a second capillary structure on the second cover, and the capillary structure of the tube is capillaryly coupled to the first capillary structure and the second capillary structure. The heat dissipation device according to claim 1, wherein the capillary structure of the tube body is formed on an inner wall of the tube body chamber, and the capillary structure of the tube body is selected as a powder sintered body, a mesh body, and a fibrous body. Any one of the grooves, and the braid, or any combination of the foregoing. The heat dissipating device of claim 6, wherein the inner wall of the tube body is formed with a plurality of convex bodies, and the annular array of the convex bodies is axially extended on the inner wall, and at least one of the convex bodies is provided. a groove, and the capillary structure is formed on the protrusions and the grooves. The heat dissipating device of claim 1, wherein the tubular body chamber is provided with a cylinder, the cylinder has a first top end and a second top end, and the first and second top ends respectively extend to connect the first a second casing, and a surface of the cylinder is provided with a third capillary structure, the third capillary structure is capillaryly coupled to the first and second capillary structures, and the third capillary structure is selected as a powder sintered body, a mesh body, a groove, Any one or any of the foregoing fibrous bodies and braids are combined. The heat dissipating device of claim 1, wherein the first and second through openings respectively extend through the inner and outer sides of the tubular body, and the tubular body chamber communicates with the first and second cavities through the first and second through openings room. The heat dissipating device of claim 1, wherein the tube chamber is disposed between the first and second open ends. The heat sink of claim 1, wherein the first housing is a temperature equalizing plate. The heat sink of claim 1, wherein the second housing is a temperature equalizing plate. The heat dissipating device of claim 1, wherein the tube body is a heat pipe.