複合式均溫板結構Composite uniform temperature plate structure
本創作是有關於一種均溫板結構，尤指一種可大幅提高散熱效率之複合式均溫板結構。This creation is related to a uniform temperature plate structure, especially a composite isothermal plate structure which can greatly improve the heat dissipation efficiency.
隨現行電子設備逐漸以輕薄作為標榜之訴求，故各項元件皆須隨之縮小其尺寸，但電子設備之尺寸縮小伴隨而來產生的熱變成電子設備與系統改善性能的主要障礙。所以業界為了有效解決電子設備內的元件散熱問題，便分別提出具有導熱效能較佳的均溫板（Vapor chamber）及熱管（Heat pipe），以有效解決現階段的散熱問題。
均溫板（Vapor chamber）係包括呈矩型狀之殼體及其殼體內部腔室壁面的毛細結構，且該殼體內部填充有工作液體，並該殼體的一側（即蒸發區）係貼設在一發熱元件（如中央處理器、南北橋晶、電晶體等）上吸附該發熱元件所產生之熱量，使液態之工作液體於該殼體之蒸發區產生蒸發轉換為汽態，將熱量傳導至該殼體之冷凝區，該汽態之工作液體於冷凝區受冷卻後冷凝為液態，該液態之工作液體再透過重力或毛細結構回流至蒸發區繼續汽液循環，以有效達到均溫散熱之效果。
熱管（Heat pipe）的原理與理論架構與均溫板相同，於該熱管之內壁設有一毛細結構，其後將該熱管抽真空並填充工作液體，最後封閉以形成熱管結構。當工作液體由蒸發部受熱蒸發後擴散至該冷凝端，並該工作液體於該蒸發部係為汽態，由該蒸發部離開後向該冷凝端擴散時逐步受冷卻冷凝轉換為液態，並且再透過毛細結構回流至該蒸發部。
比較均溫板與熱管兩者只有熱傳導的方式不同，均溫板的熱傳導方式是二維的，是面的熱傳導方式，然而，熱管的熱傳導方式是一維的熱傳導方式（即遠端散熱），故現今的電子元件僅配合單一的熱管或均溫板已不敷使用，因此，有業者將均溫板與熱管結合在一起使用，當均溫板內部的工作液體受熱蒸發後轉換成汽態工作液體，除了一部分工作液體會朝均溫板頂側方向流動外，另一部份的工作液體會流到熱管的一冷凝端而轉換為液態工作液體後，再經由熱管毛細結構的毛細力回流到均溫板內而達到汽液循環，然而，雖然習知的均溫板結合熱管能同時具有均溫散熱及遠端散熱之功效，但相對地，當液態工作液體從熱管之冷凝端回流至均溫板內部的過程中其流動路徑也相對被拉長，如此也增加了散熱時間，導致散熱效率較差。
With the current gradual appeal of electronic devices, all components must be reduced in size, but the heat generated by the shrinking of electronic devices has become a major obstacle to the improvement of performance of electronic devices and systems. Therefore, in order to effectively solve the problem of heat dissipation of components in electronic equipment, the industry has proposed a Vapor chamber and a heat pipe with better heat conduction performance to effectively solve the current heat dissipation problem.
The Vapor chamber includes a capillary structure in a rectangular shape and a wall surface of the inner chamber of the housing, and the inside of the housing is filled with a working liquid, and one side of the housing (ie, an evaporation zone) Attaching a heat generating component (such as a central processing unit, a north-south bridge crystal, a transistor, etc.) to heat generated by the heat generating component, so that the liquid working fluid is evaporated into a vapor state in an evaporation zone of the casing. Conducting heat to the condensation zone of the casing, the vaporized working liquid is condensed into a liquid state after being cooled in the condensation zone, and the liquid working liquid is again returned to the evaporation zone by gravity or capillary structure to continue the vapor-liquid circulation, thereby effectively achieving The effect of uniform temperature cooling.
The principle and theoretical structure of the heat pipe is the same as that of the temperature equalizing plate. A capillary structure is arranged on the inner wall of the heat pipe, and then the heat pipe is vacuumed and filled with the working liquid, and finally closed to form a heat pipe structure. When the working liquid is evaporated by the evaporation portion and evaporated to the condensation end, and the working liquid is in a vapor state in the evaporation portion, when the evaporation portion is separated and diffused toward the condensation end, it is gradually cooled and condensed into a liquid state, and then It is returned to the evaporation portion through the capillary structure.
Comparing the method of heat conduction between the temperature equalizing plate and the heat pipe is different, the heat conduction mode of the temperature equalizing plate is two-dimensional, which is the heat conduction mode of the surface. However, the heat conduction mode of the heat pipe is one-dimensional heat conduction mode (ie, remote heat dissipation). Therefore, today's electronic components are only used with a single heat pipe or a uniform temperature plate. Therefore, some companies use a temperature equalizing plate and a heat pipe together. When the working liquid inside the temperature equalizing plate is evaporated by heat, it is converted into a vapor state. The liquid, except that a part of the working liquid will flow toward the top side of the uniform temperature plate, and the other part of the working liquid will flow to a condensation end of the heat pipe and be converted into a liquid working liquid, and then flow back through the capillary force of the heat pipe capillary structure. The vapor-liquid circulation is achieved in the temperature equalizing plate. However, although the conventional temperature-averaging plate combined with the heat pipe can simultaneously have the functions of uniform temperature heat dissipation and remote heat dissipation, relatively, when the liquid working liquid is returned from the condensation end of the heat pipe to both The flow path inside the warm plate is also relatively elongated, which also increases the heat dissipation time, resulting in poor heat dissipation efficiency.
爰此，為有效解決上述之問題，本創作之主要目的在於提供一種大幅提升整體散熱效率之複合式均溫板結構。
為達上述目的，本創作係提供一種複合式均溫板結構，係包括一本體及至少一管體；
該本體具有一第一腔室及一第一開口及一第二開口，該第一腔室內具有一第一毛細結構並填充有一工作液體，該第一、二開口貫穿該本體一側並與該第一腔室相連通，該管體具有一第一端及一第二端及一通道，該第一、二端分別對應插接前述第一、二開口，並該通道透過該第一、二端與所述第一腔室相連通。
透過本創作此結構的設計，當至少一熱源與該本體相貼附時，首先，所述本體的第一板體（即蒸發區）會吸附該熱源產生的熱量將第一腔室內的液態工作液體產生蒸發並轉換為汽態工作液體，一部分的汽態工作液體擴散將熱量傳導至該本體的第二板體（即冷凝區）處，並於該處汽態之工作液體受冷卻後冷凝為液態，該液態之工作液體滴落該第一毛細結構回流至該第一板體以繼續汽液循環，進以有效達到均溫散熱之效果，此外，另一部分的汽態工作液體藉由所述管體之通道與該本體之第一腔室彼此相互連通的結構設計擴散至該管體之通道中進行冷凝，並於該通道冷凝轉化為液態工作液體，如此一來，本創作複合式均溫板結構同時具有二維及三維的熱傳導方式，得以達到該本體的第一腔室及管體的通道內部形成一迴路式汽液循環，進而可大幅提升整體散熱效率。
Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a composite uniform temperature plate structure which greatly improves the overall heat dissipation efficiency.
To achieve the above objective, the present invention provides a composite isothermal plate structure comprising a body and at least one tube;
The body has a first chamber and a first opening and a second opening. The first chamber has a first capillary structure and is filled with a working liquid. The first and second openings penetrate the side of the body and The first chamber is connected to the first end, the second end and the second end, and the first end and the second end respectively corresponding to the first and second openings, and the passage passes through the first and second The end is in communication with the first chamber.
Through the design of the structure of the present invention, when at least one heat source is attached to the body, first, the first plate body (ie, the evaporation zone) of the body absorbs the heat generated by the heat source to work the liquid in the first chamber. The liquid evaporates and is converted into a vapor working liquid, and a portion of the vapor working liquid diffuses heat to the second plate body (ie, the condensation zone) of the body, where the vaporized working liquid is cooled and condensed into a liquid liquid, the liquid working liquid dripping off the first capillary structure to the first plate body to continue the vapor-liquid circulation, thereby effectively achieving the effect of uniform temperature heat dissipation, and further, another part of the vapor working liquid is The structure of the tube body and the first chamber of the body communicate with each other to diffuse into the channel of the tube body for condensation, and the channel is condensed and converted into a liquid working liquid, so that the composite temperature is uniform The plate structure has two-dimensional and three-dimensional heat conduction modes, so as to form a loop-type vapor-liquid circulation inside the passage of the first chamber and the pipe body of the body, thereby greatly improving the overall Thermal efficiency.
本創作之上述目的及其結構與功能上的特性，將依據所附圖式之較佳實施例予以說明。
請參閱第1、2、3圖，係為本創作之複合式均溫板結構之立體分解圖及立體組合圖及部分立體剖視圖，如圖所示，一種複合式均溫板結構2，係包括一本體20及至少一管體3；
該本體20係由一第一板體20a及一第二板體20b對應蓋合並且共同界定形成一第一腔室200，於本創作之結構態樣中，該本體20可選擇為一均溫板或一熱板或是其他等效物，其皆可達到本案相同之效果。
前述第二板體20b上貫設形成有一第一開口201及一第二開口202，並該第一、二開口201、202與該第一腔室200相連通，於該第一腔室200內設有一第一毛細結構21並其內部填充有一工作液體22。
所述管體3具有一第一端30及一第二端31，並該管體3內部形成有一通道32，該第一、二端30、31分別對應插接所述本體20的第一開口201及第二開口202，得以令所述管體3之通道32透過該第一、二端30、31與所述本體20的第一腔室200相連通，並且，由第1、2圖明顯可看出，插設於該本體20上的管體3由俯視觀之其係呈近似於〝ㄩ〞形或〝U〞形的結構態樣。
前述之本體20及管體3之材質係選擇為銅或鋁或鐵或不鏽鋼或鈦或鈦合金材質其中任一，所述本體20及管體3可選用相同材質或以混搭之方式配合使用。
此外，於本創作之結構態樣中，所述管體3係選擇為一圓形熱管或一扁平熱管或一D型熱管或一平板式熱管或是其他等效物，其皆可達到本案相同之效果。
該通道32的內壁可再進一步設置有一第二毛細結構（圖中未示），或者該通道32的內壁不設置該第二毛細結構（如第2圖所示），於本實施例中，係以該通道32內壁不具有第二毛細結構作為說明實施例並不引以為限。
前述之第一、二毛細結構21較佳為粉末燒結體，但並不侷限於此，於具體實施時也可以選擇為網格體、纖維體、溝槽、編織體其中任一種，所述第一、二毛細結構21可選擇為相同結構體或相異結構體或複合型毛細，並該第一、二毛細結構21係透過電化學沉積或電鑄或3D列印或印刷方式所形成。
另外，可直接在前述本體20及管體3之內壁上設置一鍍層（圖中未示），亦或者，也可在所述第一、二毛細結構21上再設置所述鍍層作為提升內部汽液循環效率之結構使用，所述鍍層係為親水性或疏水性其中任一。
覆請參閱第1圖，該複合式均溫板結構2更具有至少一第一凸緣4及一第二凸緣5，該第一、二凸緣4、5對應設於所述第二板體20b的第一、二開口201、202上，前述管體3之第一、二端30、31分別對應與該第一、二凸緣4、5相互連接設置。
請參閱第3圖，為本創作之第二實施例之部分立體剖視圖，如圖所示，所述管體3之第一、二端30、31更分別向外延伸形成一第一延伸部300及一第二延伸部310，並該第一、二延伸部300、310延伸插入該本體20之第一腔室200內，而於所述第一、二延伸部300、310處更分別開設至少一第一缺口301及至少一第二缺口311，所述第一、二缺口301、311與前述本體20的第一腔室200彼此相互連通，前述第一、二延伸部301、311係可選擇抵接（如第3圖所示）或未抵接（圖中未示）所述第一腔室200之底側（即設置在第一毛細結構21之一側）。
因此，透過本創作此結構的設計，當至少一熱源（圖中未示）與該本體20相互貼附時，首先，所述本體20的第一板體20a（即蒸發區）會吸附該熱源產生的熱量將第一腔室200內的液態工作液體22產生蒸發並轉換為汽態工作液體22，一部分的汽態工作液體22擴散將熱量傳導至該本體20的第二板體20b（即冷凝區）處，並於該處汽態之工作液體22受冷卻後冷凝為液態，該液態之工作液體22滴落該第一毛細結構21回流至該第一板體20a以繼續汽液循環，進以有效達到均溫散熱之效果。
此外，另一部分的汽態工作液體22藉由所述管體3之通道32與該本體20之第一腔室200彼此相互連通的結構設計擴散至該管體3之通道32中進行冷凝，並於該該通道32冷凝轉化為液態工作液體22，如此一來，本創作複合式均溫板結構2同時具有二維維及三維的熱傳導方式，得以達到該本體20的第一腔室200及管體3的通道32內部形成一迴路式汽液循環，進而可大幅提升整體散熱效率。
請參閱第4、5、6圖，係為本創作複合式均溫板結構第三實施例之立體分解圖及立體組合圖及實施示意圖，如圖所示，與前述第一實施例之差別在於，於該本體20上可設置兩管體3，該管體3的數量及設置位置並無限制，其係依照使用者的需求進行管體3的設置及數量調整，並該管體3也可依照搭配結構及高度不盡相同的複數散熱鰭片組6（如第6圖所示）作調配，同樣也可達成前述之功效。
以上所述，本創作相較於習知具有下列優點：
1.大幅提升散熱效率。
以上已將本創作做一詳細說明，惟以上所述者，僅為本創作之一較佳實施例而已，當不能限定本創作實施之範圍，即凡依本創作申請範圍所作之均等變化與修飾等，皆應仍屬本創作之專利涵蓋範圍。
The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
Please refer to Figures 1, 2 and 3, which are the three-dimensional exploded view, the three-dimensional combined view and the partial three-dimensional sectional view of the composite homogeneous temperature plate structure. As shown in the figure, a composite uniform temperature plate structure 2 includes a body 20 and at least one tube 3;
The body 20 is correspondingly covered by a first plate body 20a and a second plate body 20b and is jointly defined to form a first chamber 200. In the structural aspect of the present invention, the body 20 can be selected as an average temperature. A plate or a hot plate or other equivalent can achieve the same effect in this case.
A first opening 201 and a second opening 202 are formed in the second plate body 20b, and the first and second openings 201 and 202 communicate with the first chamber 200 in the first chamber 200. A first capillary structure 21 is provided and is internally filled with a working fluid 22.
The pipe body 3 has a first end 30 and a second end 31, and a pipe 32 is formed in the pipe body 3. The first and second ends 30 and 31 respectively correspond to the first opening of the body 20. 201 and the second opening 202, such that the passage 32 of the tubular body 3 communicates with the first chamber 200 of the body 20 through the first and second ends 30, 31, and is apparent from the first and second figures It can be seen that the tubular body 3 inserted into the body 20 has a structural shape similar to a dome shape or a U-shaped shape in a plan view.
The material of the body 20 and the tube body 3 is selected from the group consisting of copper or aluminum or iron or stainless steel or titanium or titanium alloy. The body 20 and the tube body 3 can be used in the same material or in a mixed manner.
In addition, in the structural aspect of the present invention, the pipe body 3 is selected as a circular heat pipe or a flat heat pipe or a D-type heat pipe or a flat plate heat pipe or other equivalents, which can all achieve the same in this case. The effect.
The inner wall of the channel 32 can be further provided with a second capillary structure (not shown), or the inner wall of the channel 32 is not provided with the second capillary structure (as shown in FIG. 2), in this embodiment. The embodiment in which the inner wall of the passage 32 does not have the second capillary structure is not limited.
The first and second capillary structures 21 are preferably powder sintered bodies, but are not limited thereto. In the specific implementation, any one of a mesh body, a fiber body, a groove, and a braid may be selected. The first and second capillary structures 21 may be selected from the same structure or the dissimilar structure or the composite type capillary, and the first and second capillary structures 21 are formed by electrochemical deposition or electroforming or 3D printing or printing.
In addition, a plating layer (not shown) may be directly disposed on the inner wall of the body 20 and the pipe body 3, or the plating layer may be further disposed on the first and second capillary structures 21 as a lifting interior. The structure of vapor-liquid circulation efficiency is used, and the plating layer is either hydrophilic or hydrophobic.
Referring to FIG. 1 , the composite temperature equalizing plate structure 2 further has at least a first flange 4 and a second flange 5 , and the first and second flanges 4 and 5 are correspondingly disposed on the second plate. In the first and second openings 201 and 202 of the body 20b, the first and second ends 30 and 31 of the tubular body 3 are respectively connected to the first and second flanges 4 and 5 so as to be connected to each other.
Referring to FIG. 3, a partial perspective view of a second embodiment of the present invention. As shown, the first and second ends 30, 31 of the tubular body 3 extend outwardly to form a first extension 300. And a second extension portion 310, and the first and second extension portions 300, 310 extend into the first chamber 200 of the body 20, and at least the first and second extension portions 300, 310 are respectively opened at least a first notch 301 and at least one second notch 311, wherein the first and second notches 301 and 311 and the first chamber 200 of the body 20 communicate with each other, and the first and second extensions 301 and 311 are selectable. The bottom side of the first chamber 200 (i.e., disposed on one side of the first capillary structure 21) is abutted (as shown in Fig. 3) or not abutted (not shown).
Therefore, by designing the structure of the present structure, when at least one heat source (not shown) and the body 20 are attached to each other, first, the first plate 20a of the body 20 (ie, the evaporation zone) adsorbs the heat source. The generated heat evaporates and converts the liquid working liquid 22 in the first chamber 200 into a vapor working liquid 22, and a portion of the vapor working liquid 22 diffuses heat to the second plate 20b of the body 20 (ie, condensation) At the zone, where the vaporous working liquid 22 is cooled and condensed into a liquid state, the liquid working liquid 22 drops the first capillary structure 21 back to the first plate 20a to continue the vapor-liquid circulation. In order to effectively achieve the effect of uniform temperature cooling.
In addition, another portion of the vaporous working fluid 22 is diffused into the passage 32 of the tubular body 3 by means of a structure in which the passage 32 of the tubular body 3 and the first chamber 200 of the body 20 communicate with each other for condensation, and The channel 32 is condensed and converted into a liquid working liquid 22, so that the composite composite temperature equalizing plate structure 2 has two-dimensional and three-dimensional heat conduction modes to reach the first chamber 200 and the tube of the body 20. A loop-type vapor-liquid circulation is formed inside the passage 32 of the body 3, thereby greatly improving the overall heat dissipation efficiency.
Please refer to Figures 4, 5 and 6 for the perspective view and the three-dimensional combination diagram and the implementation diagram of the third embodiment of the composite temperature-equalizing plate structure. As shown in the figure, the difference from the first embodiment is that Two tubes 3 can be disposed on the body 20. The number and arrangement position of the tubes 3 are not limited. The tube body 3 is arranged and adjusted according to the needs of the user, and the tube 3 can also be According to the matching structure and the height of the plurality of heat-dissipating fin sets 6 (as shown in Fig. 6), the same effects can be achieved.
As mentioned above, this creation has the following advantages over the prior art:
1. Significantly improve heat dissipation efficiency.
The above description has been made in detail, but the above is only a preferred embodiment of the present invention. When it is not possible to limit the scope of the creation of the creation, that is, the equivalent change and modification according to the scope of the present application. Etc., should still be covered by the patents of this creation.
2‧‧‧複合式均溫板結構
20‧‧‧本體
20a‧‧‧第一板體
20b‧‧‧第二板體
200‧‧‧第一腔室
201‧‧‧第一開口
202‧‧‧第二開口
21‧‧‧第一毛細結構
22‧‧‧工作液體
3‧‧‧管體
30‧‧‧第一端
300‧‧‧第一延伸部
301‧‧‧第一缺口
31‧‧‧第二端
310‧‧‧第二延伸部
311‧‧‧第二缺口
32‧‧‧通道
4‧‧‧第一凸緣
5‧‧‧第二凸緣
6‧‧‧散熱鰭片組
2‧‧‧Composite isothermal plate structure
20‧‧‧ body
20a‧‧‧ first board
20b‧‧‧Second plate
200‧‧‧ first chamber
201‧‧‧ first opening
202‧‧‧second opening
21‧‧‧First capillary structure
22‧‧‧Working liquid
3‧‧‧pipe body
30‧‧‧ first end
300‧‧‧First Extension
301‧‧‧ first gap
31‧‧‧ second end
310‧‧‧Second extension
311‧‧‧ second gap
32‧‧‧ channel
4‧‧‧First flange
5‧‧‧second flange
6‧‧‧Fixing fin group
第1圖係為本創作複合式均溫板結構第一實施例之立體分解圖；
第2圖係為本創作複合式均溫板結構第一實施例之立體組合圖；
第3圖係為本創作複合式均溫板結構第二實施例之部分立體剖視圖；
第4圖係為本創作複合式均溫板結構第三實施例之立體分解圖；
第5圖係為本創作複合式均溫板結構第三實施例之立體組合圖；
第6圖係為本創作複合式均溫板結構第三實施例之實施示意圖。
Figure 1 is a perspective exploded view of the first embodiment of the composite composite temperature equalizing plate structure;
2 is a three-dimensional combination diagram of the first embodiment of the composite composite temperature equalizing plate structure;
Figure 3 is a partial perspective cross-sectional view showing a second embodiment of the composite composite temperature equalizing plate structure;
Figure 4 is a perspective exploded view of the third embodiment of the composite temperature equalizing plate structure;
Figure 5 is a three-dimensional combination diagram of the third embodiment of the composite temperature equalizing plate structure;
Fig. 6 is a schematic view showing the implementation of the third embodiment of the composite composite temperature equalizing plate structure.