CN210137569U - Composite temperature equalization board structure - Google Patents
Composite temperature equalization board structure Download PDFInfo
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- CN210137569U CN210137569U CN201920611647.6U CN201920611647U CN210137569U CN 210137569 U CN210137569 U CN 210137569U CN 201920611647 U CN201920611647 U CN 201920611647U CN 210137569 U CN210137569 U CN 210137569U
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Abstract
The utility model provides a combined type temperature-uniforming plate structure, including a body and an at least body, this body has a first cavity and a first opening and a second opening, has a first capillary structure and packs in this first cavity and have a working liquid, this first opening, second opening run through this body one side and are linked together with this first cavity, this body has a first end and a second end and a passageway, this first end, second end correspond respectively and peg graft aforementioned first opening, second opening to this passageway through this first end, second end with first cavity is linked together and forms a vapour-liquid circulation circuit.
Description
Technical Field
The utility model relates to a samming plate structure indicates a combined type samming plate structure that can improve radiating efficiency by a wide margin especially.
Background
Along with the demand of the current electronic devices for being light and thin as a target board, the size of each component should be reduced accordingly, but the heat generated by the size reduction of the electronic devices becomes a major obstacle for improving the performance of the electronic devices and systems. Therefore, in order to effectively solve the Heat dissipation problem of the components in the electronic device, a Vapor chamber (Vapor chamber) and a Heat pipe (Heat pipe) with better Heat conduction efficiency are respectively provided to effectively solve the Heat dissipation problem at the present stage.
The Vapor chamber comprises a rectangular shell and a capillary structure on the wall surface of a cavity in the shell, wherein working liquid is filled in the shell, one side (namely an evaporation area) of the shell is attached to a heating element (such as a central processing unit, a north-south bridge crystal, a transistor and the like) to adsorb heat generated by the heating element, so that the liquid working liquid is evaporated and converted into a Vapor state in the evaporation area of the shell, the heat is transferred to a condensation area of the shell, the Vapor working liquid is cooled in the condensation area and then condensed into a liquid state, and the liquid working liquid flows back to the evaporation area through gravity or the capillary structure to continue Vapor-liquid circulation so as to effectively achieve the effect of uniform temperature and heat dissipation.
The principle of the Heat pipe (Heat pipe) is the same as that of the theoretical structure of the uniform temperature plate, a capillary structure is arranged on the inner wall of the Heat pipe, then the Heat pipe is vacuumized and filled with working liquid, and finally the Heat pipe is sealed to form a Heat pipe structure. When the working liquid is heated and evaporated by the evaporation part and then is diffused to the condensation end, the working liquid is in a vapor state in the evaporation part, is gradually cooled and condensed to be converted into a liquid state after leaving from the evaporation part and then is diffused to the condensation end, and then flows back to the evaporation part through the capillary structure.
Compared with the heat conduction mode of the uniform temperature plate and the heat pipe, which is different only in heat conduction mode, the heat conduction mode of the uniform temperature plate is two-dimensional and is a surface heat conduction mode, however, the heat conduction mode of the heat pipe is a one-dimensional heat conduction mode (namely, far-end heat radiation), so that the existing electronic component is only matched with a single heat pipe or the uniform temperature plate and is not applied, therefore, a manufacturer combines the uniform temperature plate and the heat pipe together for use, when working liquid in the uniform temperature plate is heated and evaporated, the working liquid is converted into vapor working liquid, except that a part of the working liquid flows towards the top side of the uniform temperature plate, the other part of the working liquid flows to a condensation end of the heat pipe and is converted into liquid working liquid, and then the liquid working liquid flows back into the uniform temperature plate through the capillary force of the capillary structure of the heat pipe to achieve vapor-liquid circulation, however, the existing uniform temperature plate combined with the heat pipe can have the effects, however, the flow path of the liquid working fluid is relatively elongated when the liquid working fluid flows back from the condensation end of the heat pipe to the inside of the vapor chamber, which increases the heat dissipation time and results in poor heat dissipation efficiency.
SUMMERY OF THE UTILITY MODEL
Accordingly, to effectively solve the above-mentioned problems, the present invention is directed to a composite temperature equalization plate structure that greatly improves the overall heat dissipation efficiency.
In order to achieve the above object, the utility model provides a combined type temperature equalization plate structure, a serial communication port, include:
the body is provided with a first cavity, a first opening and a second opening, a first capillary structure is arranged in the first cavity and filled with working liquid, and the first opening and the second opening penetrate through one side of the body and are communicated with the first cavity; and
at least one tube body, which has a first end, a second end and a channel, wherein the first end and the second end are correspondingly inserted into the first opening and the second opening respectively, and the channel is communicated with the first chamber through the first end and the second end.
The combined type temperature-equalizing plate structure, wherein: the inner wall of the channel is also provided with a second capillary structure.
The combined type temperature-equalizing plate structure, wherein: the body is formed by a first plate body and a second plate body which are correspondingly covered, the first cavity is defined by the first plate body and the second plate body together, and the first opening and the second opening penetrate through the second plate body.
The combined type temperature-equalizing plate structure, wherein: at least one first flange and one second flange are correspondingly arranged on the first opening and the second opening, and the first end and the second end of the pipe body are correspondingly connected with the first flange and the second flange.
The combined type temperature-equalizing plate structure, wherein: the first end and the second end of the tube body are respectively provided with a first extending part and a second extending part, the first extending part and the second extending part extend and are inserted into the first cavity of the body, and the first extending part and the second extending part are selectively abutted or not abutted to the bottom side of the first cavity.
The combined type temperature-equalizing plate structure, wherein: the first extending part and the second extending part are respectively provided with at least one first gap and at least one second gap, and the first gap and the second gap are communicated with the first cavity.
The combined type temperature-equalizing plate structure, wherein: the body is a temperature equalizing plate or a hot plate.
The combined type temperature-equalizing plate structure, wherein: the tube body is a circular heat tube or a flat heat tube or a D-shaped heat tube or a flat heat tube.
The combined type temperature-equalizing plate structure, wherein: the tube body is in a shape of ㄩ or U from a top view.
The combined type temperature-equalizing plate structure, wherein: the first capillary structure and the second capillary structure are selected from any one of a powder sintered body, a grid body, a fiber body, a groove or a woven body, and the first capillary structure and the second capillary structure are selected from the same structure body, different structure bodies or a composite capillary.
The combined type temperature-equalizing plate structure, wherein: the first capillary structure and the second capillary structure are formed by electrochemical deposition or electroforming or 3D printing or printing.
The combined type temperature-equalizing plate structure, wherein: the tube body is provided with a body and a tube body, and the tube body is provided with a coating which is formed on the inner walls of the body and the tube body.
The combined type temperature-equalizing plate structure, wherein: the body and the pipe body are made of any one of copper, aluminum, iron, stainless steel, titanium or titanium alloy materials, and the body and the pipe body are made of the same material or are matched in a mixed mode.
Through the design of the structure of the utility model, when at least one heat source is attached to the body, firstly, the first plate body (i.e. the evaporation area) of the body can adsorb the heat generated by the heat source to evaporate the liquid working fluid in the first cavity and convert the liquid working fluid into the vapor working fluid, one part of the vapor working fluid diffuses to conduct the heat to the second plate body (i.e. the condensation area) of the body, and the vapor working fluid is cooled and condensed into the liquid state, the liquid working fluid drips the first capillary structure and flows back to the first plate body to continue vapor-liquid circulation, so as to effectively achieve the effect of uniform temperature heat dissipation, in addition, the other part of the vapor working fluid diffuses into the channel of the pipe body by means of the structural design that the channel of the pipe body and the first cavity of the body are mutually communicated with each other to condense, and is condensed and converted into the liquid working fluid in the channel, therefore, the utility model discloses combined type temperature-uniforming plate structure has two-dimentional and three-dimensional heat-conduction mode simultaneously, can reach the inside loop-type vapour-liquid circulation that forms of the first cavity of this body and the passageway of body, and then can promote whole radiating efficiency by a wide margin.
Drawings
FIG. 1 is an exploded perspective view of a first embodiment of the composite vapor chamber structure of the present invention;
FIG. 2 is a perspective view of the first embodiment of the composite vapor chamber structure of the present invention;
FIG. 3 is a partial perspective sectional view of a second embodiment of the composite temperature equalization plate structure of the present invention;
FIG. 4 is an exploded perspective view of a third embodiment of the composite vapor chamber structure of the present invention;
FIG. 5 is a perspective view of a third embodiment of the composite vapor chamber structure of the present invention;
fig. 6 is a schematic view illustrating a third embodiment of the composite temperature-uniforming plate structure of the present invention.
Description of reference numerals: a composite temperature-uniforming plate structure 2; a body 20; the first plate body 20 a; a second plate body 20 b; a first chamber 200; a first opening 201; a second opening 202; a first capillary structure 21; a working liquid 22; a pipe body 3; a first end 30; a first extension 300; a first notch 301; a second end 31; a second extension 310; a second notch 311; a channel 32; a first flange 4; a second flange 5; and a heat radiation fin group 6.
Detailed Description
The above objects, together with the structure and functional characteristics of the invention, will be best understood from the following description of the preferred embodiments when read in connection with the accompanying drawings.
Please refer to fig. 1, fig. 2, and fig. 3, which are exploded, assembled and partially cut-away views of a composite temperature-uniforming plate structure of the present invention, as shown in the drawings, a composite temperature-uniforming plate structure 2 includes a body 20 and at least one tube 3;
the body 20 is covered by a first plate 20a and a second plate 20b and defines a first chamber 200 together, in the present invention, the body 20 can be selected as a uniform temperature plate or a hot plate or other equivalent, which can achieve the same effect of the present case.
A first opening 201 and a second opening 202 are formed through the second plate 20b, and the first opening 201, the second opening 202 are communicated with the first chamber 200, and a first capillary structure 21 is disposed in the first chamber 200 and filled with a working fluid 22.
The tube 3 has a first end 30 and a second end 31, and a channel 32 is formed inside the tube 3, the first end 30 and the second end 31 are respectively inserted into the first opening 201 and the second opening 202 of the body 20, so that the channel 32 of the tube 3 is communicated with the first chamber 200 of the body 20 through the first end 30 and the second end 31, and as is apparent from fig. 1 and 2, the tube 3 inserted into the body 20 is similar to "ㄩ" or "U" in a top view.
The material of the body 20 and the tube 3 is selected from any one of copper, aluminum, iron, stainless steel, titanium and titanium alloy, and the body 20 and the tube 3 can be made of the same material or can be used in combination in a mixed manner.
In addition, in the structural aspect of the present invention, the tube body 3 is selected to be a circular heat pipe, a flat heat pipe, a D-shaped heat pipe, a flat heat pipe, or other equivalent, which all achieve the same effect of the present application.
The inner wall of the channel 32 may further be provided with a second capillary structure (not shown), or the inner wall of the channel 32 is not provided with the second capillary structure (as shown in fig. 2), and in this embodiment, the inner wall of the channel 32 is not provided with the second capillary structure as an illustrative embodiment and not limited thereto.
The first and second capillary structures 21 are preferably sintered powder bodies, but not limited thereto, and may be selected as any one of a mesh, a fiber, a groove, and a woven body in practical implementation, the first and second capillary structures 21 may be selected as the same structure, or different structures, or a composite capillary, and the first and second capillary structures 21 are formed by electrochemical deposition, electroforming, or 3D printing or printing.
In addition, a plating layer (not shown) may be directly disposed on the inner walls of the body 20 and the tube 3, or the first capillary structure and the second capillary structure 21 may be further disposed with the plating layer as a structure for improving the internal vapor-liquid circulation efficiency, wherein the plating layer is either hydrophilic or hydrophobic.
Referring to fig. 1, the composite temperature-equalizing plate structure 2 further has at least a first flange 4 and a second flange 5, the first and second flanges 4, 5 are correspondingly disposed on the first and second openings 201, 202 of the second plate 20b, and the first and second ends 30, 31 of the pipe 3 are correspondingly connected to the first and second flanges 4, 5, respectively.
Referring to fig. 3, which is a partial perspective cross-sectional view of a second embodiment of the present invention, as shown in the figure, the first end 30 and the second end 31 of the tube 3 further extend outward to form a first extending portion 300 and a second extending portion 310, respectively, and the first extending portion 300 and the second extending portion 310 are inserted into the first chamber 200 of the body 20 in an extending manner, and at least one first notch 301 and at least one second notch 311 are further formed at the first extending portion 300 and the second extending portion 310, respectively, the first notch 301, the second notch 311 and the first chamber 200 of the body 20 are communicated with each other, and the first extending portion 301, the second extending portion 311 can be selectively abutted (as shown in fig. 3) or not abutted (not shown) against the bottom side of the first chamber 200 (i.e., disposed at one side of the first capillary structure 21).
Therefore, through the design of the present invention, when at least one heat source (not shown) is attached to the body 20, firstly, the first plate 20a (i.e. the evaporation area) of the body 20 can absorb the heat generated by the heat source to evaporate the liquid working fluid 22 in the first chamber 200 and convert the heat into the vapor working fluid 22, and a portion of the vapor working fluid 22 diffuses to conduct the heat to the second plate 20b (i.e. the condensation area) of the body 20, and the vapor working fluid 22 is cooled and condensed into a liquid state, and the liquid working fluid 22 drips the first capillary structure 21 to flow back to the first plate 20a to continue vapor-liquid circulation, thereby effectively achieving the effect of uniform temperature heat dissipation.
In addition, the other part of the vaporous working fluid 22 is diffused to the channel 32 of the tube 3 by the mutual communication of the channel 32 of the tube 3 and the first cavity 200 of the tube 20, and condensed and converted into the liquid working fluid 22 in the channel 32, so the utility model discloses the combined type temperature equalization plate structure 2 has two-dimensional and three-dimensional heat conduction mode simultaneously, can reach the first cavity 200 of the tube 20 and the inside loop type vapour-liquid circulation that forms of the channel 32 of the tube 3, and then can greatly improve the whole heat dissipation efficiency.
Please refer to fig. 4, fig. 5, and fig. 6, which are a three-dimensional exploded view, a three-dimensional assembled view, and an implementation schematic view of a third embodiment of the composite temperature-uniforming plate structure of the present invention, as shown in the figures, the difference from the first embodiment is that two tubes 3 can be disposed on the main body 20, the number and the disposition position of the tubes 3 are not limited, the tubes 3 can be disposed and adjusted according to the needs of users, and the tubes 3 can be disposed according to a plurality of heat dissipation fin sets 6 (as shown in fig. 6) with different matching structures and heights, and the aforementioned effects can also be achieved.
It is above, compared with the prior art, the utility model has the following advantages:
1. the heat dissipation efficiency is greatly improved.
The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (13)
1. The utility model provides a combined type samming plate structure which characterized in that includes:
the body is provided with a first cavity, a first opening and a second opening, a first capillary structure is arranged in the first cavity and filled with working liquid, and the first opening and the second opening penetrate through one side of the body and are communicated with the first cavity; and
at least one tube body, which has a first end, a second end and a channel, wherein the first end and the second end are correspondingly inserted into the first opening and the second opening respectively, and the channel is communicated with the first chamber through the first end and the second end.
2. The composite temperature equalization plate structure of claim 1, wherein: the inner wall of the channel is also provided with a second capillary structure.
3. The composite temperature equalization plate structure of claim 1, wherein: the body is formed by a first plate body and a second plate body which are correspondingly covered, the first cavity is defined by the first plate body and the second plate body together, and the first opening and the second opening penetrate through the second plate body.
4. The composite temperature equalization plate structure of claim 1, wherein: at least one first flange and one second flange are correspondingly arranged on the first opening and the second opening, and the first end and the second end of the pipe body are correspondingly connected with the first flange and the second flange.
5. The composite temperature equalization plate structure of claim 1, wherein: the first end and the second end of the tube body are respectively provided with a first extending part and a second extending part, the first extending part and the second extending part extend and are inserted into the first cavity of the body, and the first extending part and the second extending part are selectively abutted or not abutted to the bottom side of the first cavity.
6. The composite temperature equalization plate structure of claim 5, wherein: the first extending part and the second extending part are respectively provided with at least one first gap and at least one second gap, and the first gap and the second gap are communicated with the first cavity.
7. The composite temperature equalization plate structure of claim 1, wherein: the body is a temperature equalizing plate or a hot plate.
8. The composite temperature equalization plate structure of claim 1, wherein: the tube body is a circular heat tube or a flat heat tube or a D-shaped heat tube or a flat heat tube.
9. The composite temperature equalization plate structure of claim 1, wherein: the tube body is in a shape of ㄩ or U from a top view.
10. The composite temperature equalization plate structure of claim 2, wherein: the first capillary structure and the second capillary structure are selected from any one of a powder sintered body, a grid body, a fiber body, a groove or a woven body, and the first capillary structure and the second capillary structure are selected from the same structure body, different structure bodies or a composite capillary.
11. The composite temperature equalization plate structure of claim 2, wherein: the first capillary structure and the second capillary structure are formed by electrochemical deposition or electroforming or 3D printing or printing.
12. The composite temperature equalization plate structure of claim 1, wherein: the tube body is provided with a body and a tube body, and the tube body is provided with a coating which is formed on the inner walls of the body and the tube body.
13. The composite temperature equalization plate structure of claim 1, wherein: the body and the pipe body are made of any one of copper, aluminum, iron, stainless steel, titanium or titanium alloy materials, and the body and the pipe body are made of the same material or are matched in a mixed mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920611647.6U CN210137569U (en) | 2019-04-26 | 2019-04-26 | Composite temperature equalization board structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920611647.6U CN210137569U (en) | 2019-04-26 | 2019-04-26 | Composite temperature equalization board structure |
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| CN210137569U true CN210137569U (en) | 2020-03-10 |
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| CN201920611647.6U Active CN210137569U (en) | 2019-04-26 | 2019-04-26 | Composite temperature equalization board structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110072370A (en) * | 2019-04-26 | 2019-07-30 | 深圳兴奇宏科技有限公司 | Combined type equalizing plate structure |
| TWI805943B (en) * | 2020-09-09 | 2023-06-21 | 萬在工業股份有限公司 | Vertically stacked heat sink device |
-
2019
- 2019-04-26 CN CN201920611647.6U patent/CN210137569U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110072370A (en) * | 2019-04-26 | 2019-07-30 | 深圳兴奇宏科技有限公司 | Combined type equalizing plate structure |
| TWI805943B (en) * | 2020-09-09 | 2023-06-21 | 萬在工業股份有限公司 | Vertically stacked heat sink device |
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