TW202040083A - Complex vapor chamber structure - Google Patents

Complex vapor chamber structure Download PDF

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TW202040083A
TW202040083A TW108114675A TW108114675A TW202040083A TW 202040083 A TW202040083 A TW 202040083A TW 108114675 A TW108114675 A TW 108114675A TW 108114675 A TW108114675 A TW 108114675A TW 202040083 A TW202040083 A TW 202040083A
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composite
plate structure
structure according
chamber
plate
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TW108114675A
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TWI696801B (en
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劉雪輝
陳九明
殷建武
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大陸商深圳興奇宏科技有限公司
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Abstract

A complex vapor chamber structure includes a main body and at least one tubular body. The main body has a first chamber, a first opening and a second opening. A first capillary structure is disposed in the first chamber. A working fluid is filled in the first chamber. The first and second openings pass through one face of the main body to communicate with the first chamber. The tubular body has a first end, a second end and a passage. The first and second ends are respectively correspondingly inserted in the first and second openings, whereby the passage of the tubular body communicates with the first chamber via the first and second ends to form a loop for vapor-liquid circulation.

Description

複合式均溫板結構Composite uniform temperature plate structure

本發明是有關於一種均溫板結構,尤指一種可大幅提高散熱效率之複合式均溫板結構。The present invention relates to a temperature equalizing plate structure, in particular to a composite temperature equalizing plate structure that can greatly improve heat dissipation efficiency.

隨現行電子設備逐漸以輕薄作為標榜之訴求,故各項元件皆須隨之縮小其尺寸,但電子設備之尺寸縮小伴隨而來產生的熱變成電子設備與系統改善性能的主要障礙。所以業界為了有效解決電子設備內的元件散熱問題,便分別提出具有導熱效能較佳的均溫板(Vapor chamber)及熱管(Heat pipe),以有效解決現階段的散熱問題。 均溫板(Vapor chamber)係包括呈矩型狀之殼體及其殼體內部腔室壁面的毛細結構,且該殼體內部填充有工作液體,並該殼體的一側(即蒸發區)係貼設在一發熱元件(如中央處理器、南北橋晶、電晶體等)上吸附該發熱元件所產生之熱量,使液態之工作液體於該殼體之蒸發區產生蒸發轉換為汽態,將熱量傳導至該殼體之冷凝區,該汽態之工作液體於冷凝區受冷卻後冷凝為液態,該液態之工作液體再透過重力或毛細結構回流至蒸發區繼續汽液循環,以有效達到均溫散熱之效果。 熱管(Heat pipe)的原理與理論架構與均溫板相同,於該熱管之內壁設有一毛細結構,其後將該熱管抽真空並填充工作液體,最後封閉以形成熱管結構。當工作液體由蒸發部受熱蒸發後擴散至該冷凝端,並該工作液體於該蒸發部係為汽態,由該蒸發部離開後向該冷凝端擴散時逐步受冷卻冷凝轉換為液態,並且再透過毛細結構回流至該蒸發部。 比較均溫板與熱管兩者只有熱傳導的方式不同,均溫板的熱傳導方式是二維的,是面的熱傳導方式,然而,熱管的熱傳導方式是一維的熱傳導方式(即遠端散熱),故現今的電子元件僅配合單一的熱管或均溫板已不敷使用,因此,有業者將均溫板與熱管結合在一起使用,當均溫板內部的工作液體受熱蒸發後轉換成汽態工作液體,除了一部分工作液體會朝均溫板頂側方向流動外,另一部份的工作液體會流到熱管的一冷凝端而轉換為液態工作液體後,再經由熱管毛細結構的毛細力回流到均溫板內而達到汽液循環,然而,雖然習知的均溫板結合熱管能同時具有均溫散熱及遠端散熱之功效,但相對地,當液態工作液體從熱管之冷凝端回流至均溫板內部的過程中其流動路徑也相對被拉長,如此也增加了散熱時間,導致散熱效率較差。As the current electronic equipment is gradually advertised as thin and light, all components must be reduced in size accordingly. However, the heat generated by the reduction in the size of electronic equipment has become a major obstacle to improving the performance of electronic equipment and systems. Therefore, in order to effectively solve the heat dissipation problem of components in electronic equipment, the industry has respectively proposed a Vapor chamber and a heat pipe with better thermal conductivity to effectively solve the current heat dissipation problem. The vapor chamber (Vapor chamber) includes a rectangular casing and a capillary structure on the inner chamber wall of the casing, and the casing is filled with working liquid, and one side of the casing (ie, the evaporation zone) It is attached to a heating element (such as central processing unit, north-south bridge crystal, transistor, etc.) to absorb the heat generated by the heating element, so that the liquid working fluid is evaporated in the evaporation zone of the casing and converted into a vapor state. The heat is transferred to the condensation zone of the shell. The vapor working liquid is cooled in the condensation zone and then condensed into a liquid state. The liquid working liquid flows back to the evaporation zone through gravity or capillary structure to continue the vapor-liquid circulation to effectively achieve The effect of uniform temperature and heat dissipation. The principle and theoretical structure of a heat pipe is the same as that of a temperature equalizing plate. A capillary structure is provided on the inner wall of the heat pipe. Then the heat pipe is evacuated and filled with working fluid, and finally closed to form a heat pipe structure. When the working fluid is heated and evaporated from the evaporating part, it diffuses to the condensation end, and the working fluid is in the vapor state at the evaporating part, and when it leaves the evaporating part and diffuses to the condensation end, it is gradually cooled and condensed into a liquid state, and then again It flows back to the evaporation part through the capillary structure. Comparing the temperature equalization plate and the heat pipe, only the heat conduction method is different. The heat conduction method of the equalization plate is two-dimensional, which is the surface heat conduction method. However, the heat conduction method of the heat pipe is the one-dimensional heat conduction method (that is, remote heat dissipation). Therefore, the current electronic components only work with a single heat pipe or a uniform temperature plate. Therefore, some companies combine the uniform temperature plate and the heat pipe to use, and when the working liquid inside the uniform temperature plate is heated and evaporated, it is converted into a vapor state. Liquid, except for a part of the working liquid that will flow toward the top side of the uniform temperature plate, another part of the working liquid will flow to a condensing end of the heat pipe and be converted into a liquid working fluid, and then flow back to the liquid through the capillary force of the capillary structure of the heat pipe The vapor-liquid circulation is achieved in the uniform temperature plate. However, although the conventional uniform temperature plate combined with the heat pipe can simultaneously have the functions of uniform temperature heat dissipation and remote heat dissipation, relatively, when the liquid working fluid flows back from the condensing end of the heat pipe to the uniform temperature In the process of warming the interior of the plate, the flow path is relatively elongated, which also increases the heat dissipation time, resulting in poor heat dissipation efficiency.

爰此,為有效解決上述之問題,本發明之主要目的在於提供一種大幅提升整體散熱效率之複合式均溫板結構。 為達上述目的,本發明係提供一種複合式均溫板結構,係包括一本體及至少一管體; 該本體具有一第一腔室及一第一開口及一第二開口,該第一腔室內具有一第一毛細結構並填充有一工作液體,該第一、二開口貫穿該本體一側並與該第一腔室相連通,該管體具有一第一端及一第二端及一通道,該第一、二端分別對應插接前述第一、二開口,並該通道透過該第一、二端與所述第一腔室相連通。 透過本發明此結構的設計,當至少一熱源與該本體相貼附時,首先,所述本體的第一板體(即蒸發區)會吸附該熱源產生的熱量將第一腔室內的液態工作液體產生蒸發並轉換為汽態工作液體,一部分的汽態工作液體擴散將熱量傳導至該本體的第二板體(即冷凝區)處,並於該處汽態之工作液體受冷卻後冷凝為液態,該液態之工作液體滴落該第一毛細結構回流至該第一板體以繼續汽液循環,進以有效達到均溫散熱之效果,此外,另一部分的汽態工作液體藉由所述管體之通道與該本體之第一腔室彼此相互連通的結構設計擴散至該管體之通道中進行冷凝,並於該通道冷凝轉化為液態工作液體,如此一來,本發明複合式均溫板結構同時具有二維及三維的熱傳導方式,得以達到該本體的第一腔室及管體的通道內部形成一迴路式汽液循環,進而可大幅提升整體散熱效率。Therefore, in order to effectively solve the above-mentioned problems, the main purpose of the present invention is to provide a composite temperature equalizing plate structure that greatly improves the overall heat dissipation efficiency. To achieve the above objective, the present invention provides a composite temperature equalizing plate structure, which includes a body and at least one tube body; The body has a first chamber, a first opening, and a second opening. The first chamber has a first capillary structure and is filled with a working fluid. The first and second openings penetrate one side of the body and are connected to the The first chamber communicates with each other. The tube body has a first end, a second end, and a passage. The first and second ends are respectively inserted into the aforementioned first and second openings, and the passage passes through the first and second openings. The end communicates with the first chamber. Through the design of the structure of the present invention, when at least one heat source is attached to the main body, first, the first plate (ie, the evaporation zone) of the main body will absorb the heat generated by the heat source to work the liquid state in the first chamber The liquid evaporates and transforms into a vaporous working liquid. A part of the vaporous working liquid diffuses and conducts heat to the second plate (condensing zone) of the body, where the vaporous working liquid is cooled and condensed into Liquid, the liquid working liquid drips from the first capillary structure back to the first plate to continue the vapor-liquid circulation, so as to effectively achieve the effect of uniform temperature and heat dissipation. In addition, another part of the vaporous working liquid is The structure design that the channel of the tube body and the first chamber of the body communicate with each other diffuses into the channel of the tube body for condensation, and the channel is condensed and converted into a liquid working liquid. In this way, the composite temperature uniformity of the present invention The plate structure has both two-dimensional and three-dimensional heat conduction methods, so that a loop vapor-liquid circulation is formed inside the first chamber of the body and the channel of the tube body, thereby greatly improving the overall heat dissipation efficiency.

本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 請參閱第1、2、3圖,係為本發明之複合式均溫板結構之立體分解圖及立體組合圖及部分立體剖視圖,如圖所示,一種複合式均溫板結構2,係包括一本體20及至少一管體3; 該本體20係由一第一板體20a及一第二板體20b對應蓋合並且共同界定形成一第一腔室200,於本發明之結構態樣中,該本體20可選擇為一均溫板或一熱板或是其他等效物,其皆可達到本案相同之效果。 前述第二板體20b上貫設形成有一第一開口201及一第二開口202,並該第一、二開口201、202與該第一腔室200相連通,於該第一腔室200內設有一第一毛細結構21並其內部填充有一工作液體22。 所述管體3具有一第一端30及一第二端31,並該管體3內部形成有一通道32,該第一、二端30、31分別對應插接所述本體20的第一開口201及第二開口202,得以令所述管體3之通道32透過該第一、二端30、31與所述本體20的第一腔室200相連通,並且,由第1、2圖明顯可看出,插設於該本體20上的管體3由俯視觀之其係呈近似於〝ㄩ〞形或〝U〞形的結構態樣。 前述之本體20及管體3之材質係選擇為銅或鋁或鐵或不鏽鋼或鈦或鈦合金材質其中任一,所述本體20及管體3可選用相同材質或以混搭之方式配合使用。 此外,於本發明之結構態樣中,所述管體3係選擇為一圓形熱管或一扁平熱管或一D型熱管或一平板式熱管或是其他等效物,其皆可達到本案相同之效果。 該通道32的內壁可再進一步設置有一第二毛細結構(圖中未示),或者該通道32的內壁不設置該第二毛細結構(如第2圖所示),於本實施例中,係以該通道32內壁不具有第二毛細結構作為說明實施例並不引以為限。 前述之第一、二毛細結構21較佳為粉末燒結體,但並不侷限於此,於具體實施時也可以選擇為網格體、纖維體、溝槽、編織體其中任一種,所述第一、二毛細結構21可選擇為相同結構體或相異結構體或複合型毛細,並該第一、二毛細結構21係透過電化學沉積或電鑄或3D列印或印刷方式所形成。 另外,可直接在前述本體20及管體3之內壁上設置一鍍層(圖中未示),亦或者,也可在所述第一、二毛細結構21上再設置所述鍍層作為提升內部汽液循環效率之結構使用,所述鍍層係為親水性或疏水性其中任一。 覆請參閱第1圖,該複合式均溫板結構2更具有至少一第一凸緣4及一第二凸緣5,該第一、二凸緣4、5對應設於所述第二板體20b的第一、二開口201、202上,前述管體3之第一、二端30、31分別對應與該第一、二凸緣4、5相互連接設置。 請參閱第3圖,為本發明之第二實施例之部分立體剖視圖,如圖所示,所述管體3之第一、二端30、31更分別向外延伸形成一第一延伸部300及一第二延伸部310,並該第一、二延伸部300、310延伸插入該本體20之第一腔室200內,而於所述第一、二延伸部300、310處更分別開設至少一第一缺口301及至少一第二缺口311,所述第一、二缺口301、311與前述本體20的第一腔室200彼此相互連通,前述第一、二延伸部301、311係可選擇抵接(如第3圖所示)或未抵接(圖中未示)所述第一腔室200之底側(即設置在第一毛細結構21之一側)。 因此,透過本發明此結構的設計,當至少一熱源(圖中未示)與該本體20相互貼附時,首先,所述本體20的第一板體20a(即蒸發區)會吸附該熱源產生的熱量將第一腔室200內的液態工作液體22產生蒸發並轉換為汽態工作液體22,一部分的汽態工作液體22擴散將熱量傳導至該本體20的第二板體20b(即冷凝區)處,並於該處汽態之工作液體22受冷卻後冷凝為液態,該液態之工作液體22滴落該第一毛細結構21回流至該第一板體20a以繼續汽液循環,進以有效達到均溫散熱之效果。 此外,另一部分的汽態工作液體22藉由所述管體3之通道32與該本體20之第一腔室200彼此相互連通的結構設計擴散至該管體3之通道32中進行冷凝,並於該該通道32冷凝轉化為液態工作液體22,如此一來,本發明複合式均溫板結構2同時具有二維維及三維的熱傳導方式,得以達到該本體20的第一腔室200及管體3的通道32內部形成一迴路式汽液循環,進而可大幅提升整體散熱效率。 請參閱第4、5、6圖,係為本發明複合式均溫板結構第三實施例之立體分解圖及立體組合圖及實施示意圖,如圖所示,與前述第一實施例之差別在於,於該本體20上可設置兩管體3,該管體3的數量及設置位置並無限制,其係依照使用者的需求進行管體3的設置及數量調整,並該管體3也可依照搭配結構及高度不盡相同的複數散熱鰭片組6(如第6圖所示)作調配,同樣也可達成前述之功效。 以上所述,本發明相較於習知具有下列優點: 1.大幅提升散熱效率。 以上已將本發明做一詳細說明,惟以上所述者,僅為本發明之一較佳實施例而已,當不能限定本發明實施之範圍,即凡依本發明申請範圍所作之均等變化與修飾等,皆應仍屬本發明之專利涵蓋範圍。The above-mentioned objects and structural and functional characteristics of the present invention will be described based on the preferred embodiments of the accompanying drawings. Please refer to Figures 1, 2 and 3, which are the three-dimensional exploded view, three-dimensional assembly view and partial three-dimensional cross-sectional view of the composite temperature equalizing plate structure of the present invention. As shown in the figure, a composite temperature equalizing plate structure 2 includes A body 20 and at least one tube body 3; The body 20 is correspondingly covered by a first plate body 20a and a second plate body 20b and jointly defines a first chamber 200. In the structural aspect of the present invention, the body 20 can be selected as a uniform temperature A plate or a hot plate or other equivalents can achieve the same effect in this case. A first opening 201 and a second opening 202 are formed through the aforementioned second plate body 20b, and the first and second openings 201, 202 are connected to the first chamber 200 and are located in the first chamber 200 A first capillary structure 21 is provided and a working liquid 22 is filled inside. The pipe body 3 has a first end 30 and a second end 31, and a channel 32 is formed inside the pipe body 3. The first and second ends 30, 31 are respectively inserted into the first opening of the body 20 201 and the second opening 202 enable the passage 32 of the tube body 3 to communicate with the first chamber 200 of the body 20 through the first and second ends 30, 31, and it is obvious from the first and second figures It can be seen that the tube body 3 inserted on the body 20 has a structure similar to a """ shape or a "U" shape when viewed from above. The material of the aforementioned body 20 and the tube 3 is selected to be any of copper, aluminum, iron, stainless steel, titanium or titanium alloy. The body 20 and the tube 3 can be made of the same material or used in a mixed manner. In addition, in the structural aspect of the present invention, the tube body 3 is selected to be a circular heat pipe or a flat heat pipe or a D-type heat pipe or a flat heat pipe or other equivalents, all of which can achieve the same in this case The effect. The inner wall of the channel 32 can be further provided with a second capillary structure (not shown in the figure), or the inner wall of the channel 32 is not provided with the second capillary structure (as shown in Figure 2), in this embodiment It is not limited to taking the inner wall of the channel 32 without the second capillary structure as an illustrative embodiment. The aforementioned first and second capillary structures 21 are preferably powder sintered bodies, but are not limited to this, and can also be selected to be any one of mesh body, fiber body, groove, and braid in specific implementation. The first and second capillary structures 21 can be selected as the same structure or different structures or composite capillaries, and the first and second capillary structures 21 are formed by electrochemical deposition, electroforming, 3D printing or printing. In addition, a plating layer (not shown in the figure) can be directly provided on the inner wall of the aforementioned main body 20 and the tube body 3, or alternatively, the plating layer can be further provided on the first and second capillary structures 21 as a lifting interior. The structure of vapor-liquid circulation efficiency is used, and the coating is either hydrophilic or hydrophobic. Please refer to Figure 1, the composite temperature equalizing plate structure 2 further has at least one first flange 4 and a second flange 5, the first and second flanges 4, 5 are correspondingly provided on the second plate On the first and second openings 201, 202 of the body 20b, the first and second ends 30, 31 of the aforementioned tube 3 are respectively connected to the first and second flanges 4, 5 respectively. Please refer to FIG. 3, which is a partial perspective cross-sectional view of the second embodiment of the present invention. As shown in the figure, the first and second ends 30, 31 of the tube body 3 further extend outward to form a first extension 300 And a second extension portion 310, and the first and second extension portions 300, 310 are extended and inserted into the first chamber 200 of the body 20, and the first and second extension portions 300, 310 are respectively provided with at least A first notch 301 and at least one second notch 311. The first and second notches 301, 311 and the first chamber 200 of the body 20 are in communication with each other. The first and second extensions 301, 311 are optional Abutting (as shown in Figure 3) or not abutting (not shown in the figure) the bottom side of the first chamber 200 (that is, it is arranged on one side of the first capillary structure 21). Therefore, through the design of the structure of the present invention, when at least one heat source (not shown) is attached to the main body 20, firstly, the first plate 20a (ie, the evaporation zone) of the main body 20 will adsorb the heat source The generated heat evaporates the liquid working liquid 22 in the first chamber 200 and converts it into a vaporous working liquid 22. A part of the vaporous working liquid 22 diffuses and conducts the heat to the second plate 20b of the body 20 (ie condensation Area), and where the working liquid 22 in the vapor state is cooled and condensed into a liquid state, the liquid working liquid 22 drips onto the first capillary structure 21 and returns to the first plate 20a to continue the vapor-liquid circulation and enter In order to effectively achieve the effect of uniform temperature and heat dissipation. In addition, another part of the vapor working liquid 22 is diffused into the channel 32 of the tube 3 to be condensed by the structural design that the channel 32 of the tube 3 and the first chamber 200 of the body 20 communicate with each other. The channel 32 is condensed and converted into a liquid working fluid 22. As a result, the composite uniform temperature plate structure 2 of the present invention has both two-dimensional and three-dimensional heat conduction methods to reach the first chamber 200 and the tube of the body 20. The channel 32 of the body 3 forms a loop type vapor-liquid circulation, which can greatly improve the overall heat dissipation efficiency. Please refer to Figures 4, 5, and 6, which are the three-dimensional exploded view, three-dimensional assembly view and implementation schematic diagram of the third embodiment of the composite temperature equalizing plate structure of the present invention. As shown in the figure, the difference from the aforementioned first embodiment is , The main body 20 can be provided with two pipes 3, the number and location of the pipes 3 are not limited, which is based on the needs of the user to set and adjust the number of pipes 3, and the pipes 3 can also The above-mentioned effects can also be achieved by deploying a plurality of heat sink fin groups 6 (as shown in Figure 6) with different structures and heights. As mentioned above, the present invention has the following advantages over the prior art: 1. Significantly improve heat dissipation efficiency. The present invention has been described in detail above, but what is described above is only a preferred embodiment of the present invention, and should not limit the scope of implementation of the present invention, that is, all equivalent changes and modifications made in accordance with the scope of application of the present invention Etc., should still be covered by the patent of the present invention.

2:複合式均溫板結構 20:本體 20a:第一板體 20b:第二板體 200:第一腔室 201:第一開口 202:第二開口 21:第一毛細結構 22:工作液體 3:管體 30:第一端 300:第一延伸部 301:第一缺口 31:第二端 310:第二延伸部 311:第二缺口 32:通道 4:第一凸緣 5:第二凸緣 6:散熱鰭片組 212:第二槽部 22:工作流體 23:毛細結構 24:填充口 25:肋條 3:基座 30:第一側 300:嵌槽 31:第二側 4:散熱裝置 5:熱源 6:熱傳元件 2: Composite uniform temperature plate structure 20: body 20a: The first board 20b: second board 200: first chamber 201: first opening 202: second opening 21: The first capillary structure 22: working fluid 3: Tube body 30: first end 300: first extension 301: The first gap 31: second end 310: second extension 311: The second gap 32: Channel 4: first flange 5: second flange 6: cooling fin set 212: second groove 22: working fluid 23: Capillary structure 24: Filling port 25: rib 3: Pedestal 30: First side 300: Insert slot 31: second side 4: heat sink 5: Heat source 6: Heat transfer element

第1圖係為本發明複合式均溫板結構第一實施例之立體分解圖; 第2圖係為本發明複合式均溫板結構第一實施例之立體組合圖; 第3圖係為本發明複合式均溫板結構第二實施例之部分立體剖視圖; 第4圖係為本發明複合式均溫板結構第三實施例之立體分解圖; 第5圖係為本發明複合式均溫板結構第三實施例之立體組合圖; 第6圖係為本發明複合式均溫板結構第三實施例之實施示意圖。Figure 1 is a three-dimensional exploded view of the first embodiment of the composite uniform temperature plate structure of the present invention; Figure 2 is a three-dimensional assembly diagram of the first embodiment of the composite temperature equalizing plate structure of the present invention; Figure 3 is a partial three-dimensional cross-sectional view of the second embodiment of the composite temperature equalizing plate structure of the present invention; Figure 4 is a three-dimensional exploded view of the third embodiment of the composite temperature equalizing plate structure of the present invention; Figure 5 is a three-dimensional assembly diagram of the third embodiment of the composite temperature equalizing plate structure of the present invention; Fig. 6 is a schematic diagram of the third embodiment of the composite temperature equalizing plate structure of the present invention.

2:複合式均溫板結構 2: Composite uniform temperature plate structure

20:本體 20: body

20a:第一板體 20a: The first board

20b:第二板體 20b: second board

201:第一開口 201: first opening

202:第二開口 202: second opening

3:管體 3: Tube body

30:第一端 30: first end

31:第二端 31: second end

4:第一凸緣 4: first flange

5:第二凸緣 5: second flange

Claims (13)

一種複合式均溫板結構,係包括: 一本體,具有一第一腔室及一第一開口及一第二開口,該第一腔室內具有一第一毛細結構並填充有一工作液體,該第一、二開口貫穿該本體一側並與該第一腔室相連通;及 至少一管體,具有一第一端及一第二端及一通道,該第一、二端分別對應插接前述第一、二開口,並該通道透過該第一、二端與所述第一腔室相連通。A composite temperature equalizing plate structure, including: A body having a first chamber, a first opening, and a second opening. The first chamber has a first capillary structure and is filled with a working fluid. The first and second openings penetrate one side of the body and are connected with The first chamber is connected; and At least one tube body has a first end, a second end, and a passage. The first and second ends are respectively inserted into the first and second openings, and the passage passes through the first and second ends and the first One chamber is connected. 如請求項1所述之複合式均溫板結構,其中所述通道之內壁更設置一第二毛細結構。The composite temperature equalizing plate structure according to claim 1, wherein the inner wall of the channel is further provided with a second capillary structure. 如請求項1所述之複合式均溫板結構,其中所述本體係由一第一板體及一第二板體對應蓋合所形成,並該第一腔室由該第一、二板體共同界定形成,所述第一、二開口係貫穿該第二板體。The composite temperature uniform plate structure according to claim 1, wherein the system is formed by correspondingly covering a first plate body and a second plate body, and the first chamber is formed by the first and second plates The body is jointly defined and formed, and the first and second openings penetrate the second plate body. 如請求項1所述之複合式均溫板結構,其中更具有至少一第一凸緣及一第二凸緣對應設於所述第一、二開口上,前述管體之第一、二端對應與該第一、二凸緣接設。The composite temperature uniform plate structure according to claim 1, wherein at least one first flange and one second flange are correspondingly provided on the first and second openings, and the first and second ends of the tube body Correspondingly connect with the first and second flanges. 如請求項1所述之複合式均溫板結構,其中所述管體之第一、二端更分別具有一第一延伸部及一第二延伸部,並該第一、二延伸部延伸插入該本體之第一腔室內,該第一、二延伸部係選擇抵接或未抵接所述第一腔室之底側。The composite temperature equalizing plate structure according to claim 1, wherein the first and second ends of the tube body further have a first extension and a second extension respectively, and the first and second extensions are extended and inserted In the first cavity of the main body, the first and second extensions are selected to abut or not abut the bottom side of the first cavity. 如請求項5所述之複合式均溫板結構,其中所述第一、二延伸部更分別開設至少一第一缺口及至少一第二缺口,該第一、二缺口與所述第一腔室相連通。The composite temperature equalizing plate structure according to claim 5, wherein the first and second extension portions further define at least one first notch and at least one second notch respectively, and the first and second notches are connected to the first cavity The rooms are connected. 如請求項1所述之複合式均溫板結構,其中所述本體為一均溫板或一熱板。The composite uniform temperature plate structure according to claim 1, wherein the body is a uniform temperature plate or a hot plate. 如請求項1所述之複合式均溫板結構,其中所述管體係為一圓形熱管或一扁平熱管或一D型熱管或一平板式熱管。The composite uniform temperature plate structure according to claim 1, wherein the tube system is a circular heat pipe or a flat heat pipe or a D-type heat pipe or a flat heat pipe. 如請求項1所述之複合式均溫板結構,其中所述管體由俯視觀之係呈〝ㄩ〞形或〝U〞形。The composite temperature equalizing plate structure according to claim 1, wherein the tube body is in a """ shape or "U" shape when viewed from above. 如請求項2所述之複合式均溫板結構,其中所述第一、二毛細結構係選擇為粉末燒結體或網格體或纖維體或溝槽或編織體其中任一,所述第一、二毛細結構可選擇為相同結構體或相異結構體或複合型毛細。The composite temperature uniform plate structure according to claim 2, wherein the first and second capillary structures are selected to be any one of a powder sintered body, a grid body, a fiber body, a groove or a braid, and the first , The two capillary structures can be selected as the same structure or different structures or composite capillaries. 如請求項2所述之複合式均溫板結構,其中所述第一、二毛細結構係透過電化學沉積或電鑄或3D列印或印刷方式所形成。The composite uniform temperature plate structure according to claim 2, wherein the first and second capillary structures are formed by electrochemical deposition, electroforming, 3D printing or printing. 如請求項1所述之複合式均溫板結構,其中更具有一鍍層,該鍍層係形成於所述本體及管體之內壁上。The composite uniform temperature plate structure according to claim 1, wherein there is a plating layer formed on the inner wall of the main body and the tube body. 如請求項1所述之複合式均溫板結構,其中所述本體及管體之材質係選擇為銅或鋁或鐵或不鏽鋼或鈦或鈦合金材質其中任一,所述本體及管體可選用相同材質或以混搭之方式配合使用。The composite temperature uniform plate structure according to claim 1, wherein the material of the body and the tube body is selected to be any one of copper, aluminum, iron, stainless steel, titanium or titanium alloy, and the body and the tube body can be Use the same material or mix and match.
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