CN201479531U

CN201479531U - U-shaped tubular phase-change electronic radiator

Info

Publication number: CN201479531U
Application number: CN2009201884269U
Authority: CN
Inventors: 张洪涛; 曾玉; 郭芳芳
Original assignee: Jiangxi University of Technology
Current assignee: Changde Liyuan New Material Co., Ltd.
Priority date: 2009-07-31
Filing date: 2009-07-31
Publication date: 2010-05-19
Anticipated expiration: 2019-07-31

Abstract

A U-shaped tubular phase-change electronic radiator comprises U-shaped copper pipes, a heat spreading cavity, a foam metal and a phase-change material. The U-shaped tubular phase-change electronic radiator is characterized in that the heat spreading tube is connected with an integral hollow cavity consisting of a plurality of U-shaped copper pipes; the phase-change material is arranged in the hollow cavity; and a needle tube is filled with a thin foam metal wall. By using the foam metal as the wick structure of the evaporating cavity of the radiator, the U-shaped tubular phase-change electronic radiator has the advantages of greatly reduced cost, high yield, small thermal resistance, high heat dissipation, and light weight.

Description

U type tube phase change electronic radiation device

Technical field

The utility model relates to a kind of radiator, relates in particular to a kind of U type tube phase change electronic radiation device.

Background technology

Along with the continuous development of electronic technology, electronic devices such as high performance chip, high-power light-emitting diode continue to bring out.These electronic devices can produce high hot-fluid in the course of the work, and electronic device temperature is raise rapidly, and at high temperature, electronic device can lose efficacy even burn, so the electronic radiation technology becomes the key that guarantees the electronic device operate as normal.With central processing unit (CPU) CPU is example, and its arithmetic speed is more and more faster, and quality is more and more lighter.These performances are to realize by the integrated level that improves constantly chip, and this makes that the power density of chip is more and more higher, and therefore developing advanced heat dissipation technology is the guarantee that improves chip integration, stability.Usually the metallic aluminium of usefulness high heat conductance and copper are as radiator material, and the radiator of making has fin, needle-like, heat pipe to cooperate structures such as fin, has brought into play important effect at different times.At present, have only heat pipe to cooperate the fin technology can satisfy technical need.The radiating mode of heat pipe is an one dimension, mode with line is conducted heat, the needs that under the less situation of chip size, can also adapt to product, when the size of chip big or chip assembling on the printed circuit board (PCB) under the situation than comparatively dense, the use of heat pipe has been subjected to limitation.Moreover these radiators all are that copper or aluminium block by a high heat conduction contacts with chip heat is passed to fin or heat pipe, because thermal conductivity is relatively low, are difficult to make the temperature distribution on the chip even, especially in the bigger occasion of chip power.In order to improve the uniformity of temperature on the chip, the scientific worker develops high thermal conductivity material energetically, and as diamond, graphite etc., but cost is very high, is not suitable for civil area.The flat radiating element of " soaking plate " (vapor chamber) by the use to soaking plate, can improve the temperature homogeneity of chip greatly.This technology type is like heat pipe principle, can conduct heat come out rapidly from chip, cooperate corresponding radiator portion that heat dissipation is fallen afterwards, change the one dimensional heat transfer mode of heat pipe greatly, the local overheating of the chip of avoiding can satisfy the needs that large size chip or chip group are dispelled the heat.Usually soaking plate places between chip (thermal source) and the radiator, the heat of thermal source passes through it excessively to radiator, in order to reduce cost, radiator still adopts copper or aluminium preparation, and the contact-making surface of radiator and soaking plate can produce very high thermal resistance, therefore, this electronic radiation technology is to have improved heat-sinking capability limitedly.In addition, many at present employing powder copper sintered porous structures are made the soaking plate inner surface, realize capillarity.This method complex process, rate of finished products is low, cost is high, therefore adopt the radiator price comparison costliness of soaking plate making, simultaneously because powder sintered capillary structure porosity is relatively low, the resistance that phase transformation is flowed therein is big, the interior phase change medium loading of unit volume is little, and heat-transfer capability is limited.In order further to improve the heat-sinking capability of radiator, excavate traditional material heat radiation potentiality, reduce cost, the present invention adopts a kind of new augmentation of heat transfer material one foam metal, in conjunction with the advantage of soaking plate and heat pipe, produce light weight, thermal resistance is little, heat radiation is strong, cost is low needle-like phase-change heat sink.

Summary of the invention

The purpose of this utility model is to provide a kind of U type tube phase change electronic radiation device, and this heatsink mass is light, thermal resistance is little, heat radiation is strong, cost is low.

The utility model is achieved like this, it comprises U type copper pipe, soaking chamber, foam metal and phase-change material, it is characterized in that Thiele tube connects several U type copper pipes and forms an integral cavity, phase-change material is arranged in the cavity, needle tubing inside is filled with the foam metal thin-walled.

Foam metal described in the utility model is made the open celled foam attitude by copper product and is formed.

Phase-change material described in the utility model is liquid phase-change material or solid phase change material.

Liquid phase-change material described in the utility model is water, alcohol or acetone.

Technique effect of the present utility model is: adopts the capillary structure of foam metal, greatly reduces cost as the radiator evaporation cavity, and the rate of finished products height, thermal resistance is little, and heat radiation is strong, and weight is lower.

Description of drawings

Fig. 1 is a structural representation of the present utility model;

Fig. 2 is a partial sectional view of the present utility model;

U type copper pipe 1a, U type copper pipe wall 1b, foam metal 2, soaking chamber 3, phase-change material in the drawings, 1,

Embodiment

As shown in Figure 1 and Figure 2, the utility model comprises U type copper pipe 1, soaking chamber 2 and phase-change material 3, it is characterized in that U type copper pipe 1 and soaking chamber 2 combine, be that soaking chamber 2 is provided with a plurality of U type copper pipes, U type copper pipe 1 is communicated with integral cavity of formation with soaking chamber 2, the inwall of U type copper pipe 1 is done capillary structure with foam metal 1b thin-walled, and inside is filled with phase-change material.Usually, foam metal is attached on the U type copper pipe wall 1a can adopts sintering process, and the mode that U type copper pipe 1 is communicated with soaking chamber 2 can adopt soldering side's technology, certain vacuum is extracted in last certain phase-change material 3 backs of injecting in cavity.Phase-change material is generally the liquid phase-change material, in particular cases available solid phase change material.Under the situation of using the liquid phase-change material, cavity extracts certain vacuum according to the real work needs, guarantees phase-change material, evaporates in suitable temperature as water, alcohol, acetone etc.When using the utility model, U type tube phase change electronic radiation device is placed on the electronic device, 2 bottoms, soaking chamber contact with electronic device, after absorbing the heat that gives out from electronic device, phase-change material 3 undergoes phase transition heat absorption, and the heat of electronic device is taken out of from soaking chamber 2 rapidly to U type copper pipe wall 1a and top by capillarity, the fan that forced convertion is equipped with on the side of U type pipe or top, when crossing U type copper pipe 1 outer wall, wind can take away heat, get back to again by the capillarity phase-change material in the bottom and soaking chamber 2 of U type copper pipe, the phase transformation once more of being heated, so move in circles, reach the purpose of heat radiation.Because U type copper pipe 1 inner filled and process metal 1b does capillary structure, the backflow of coagulating liq just is not subjected to gravity effect in the radiator like this, and radiator can be installed arbitrarily, and the recipient has not reduced cost to influence, and heat radiation is strong, and weight is lighter.

Claims

1. U type tube phase change electronic radiation device, it comprises U type copper pipe, soaking chamber, foam metal and phase-change material, it is characterized in that Thiele tube connects several U type copper pipes and forms an integral cavity, phase-change material is arranged in the cavity, needle tubing inside is filled with the foam metal thin-walled.

2. U type tube phase change electronic radiation device according to claim 1 is characterized in that described foam metal makes the open celled foam attitude by copper product and form.

3. U type tube phase change electronic radiation device according to claim 1 is characterized in that described phase-change material is liquid phase-change material or solid phase change material.

4. U type tube phase change electronic radiation device according to claim 3 is characterized in that described liquid phase-change material is water, alcohol or acetone.