CN216414899U

CN216414899U - Radiator integrating one-way heat-conducting temperature-uniforming plate and foam metal radiating module

Info

Publication number: CN216414899U
Application number: CN202120988809.5U
Authority: CN
Inventors: 任晓英; 林连凯; 马晓龙; 雷淑雅
Original assignee: Taicang Huaying Electronic Material Co ltd
Current assignee: Taicang Huaying Electronic Material Co ltd
Priority date: 2021-05-13
Filing date: 2021-05-13
Publication date: 2022-04-29
Anticipated expiration: 2031-05-13

Abstract

The utility model discloses a radiator integrating a unidirectional heat-conducting temperature-equalizing plate and a foam metal radiating module, which comprises the temperature-equalizing plate and the foam metal radiating module arranged at the top of the temperature-equalizing plate; the vapor chamber is provided with a phase-change heat transfer working medium, and the inner surface of the condensing plate is a super-hydrophobic layer, so that large-angle water drops formed by condensation of the gaseous working medium on the condensing surface are absorbed in a capillary structure, the condensing surface area in the vapor chamber is dried, and the vapor chamber only has one-way heat conduction performance; the foam metal radiating module is provided with a plurality of foam metal radiating fins which have a porous structure, so that the foam metal radiating module has a large heat exchange specific surface area to increase the heat exchange efficiency.

Description

Radiator integrating one-way heat-conducting temperature-uniforming plate and foam metal radiating module

Technical Field

The utility model relates to the field of heat dissipation, in particular to a structural radiator with efficient heat dissipation and unidirectional heat conduction.

Background

The traditional heat dissipation assembly is mainly suitable for the condition that the temperature of a heat source is higher than the ambient temperature around equipment, if the ambient temperature is higher than the heat source, the heat dissipation assembly cannot achieve a good heat dissipation effect, and even transmits the ambient temperature to the equipment, so that the performance of the equipment is further reduced.

The heat dissipation fins of the traditional radiator are mostly made of metal sheets, and the heat transfer resistance between the metal sheets and a heat pipe or a vapor chamber is small, so that heat can be effectively conducted to the heat dissipation fins and then transferred to the air through convection heat exchange. However, the heat convection coefficient of the metal sheet is low, and thus the overall heat dissipation efficiency of the heat sink is low.

Therefore, how to improve the overall heat dissipation efficiency of the heat sink to meet the higher and higher heat dissipation needs is a problem that needs to be solved urgently.

Disclosure of Invention

In order to solve the above problems, the present invention provides a heat dissipation structure integrating a unidirectional heat-conducting temperature-uniforming plate and a foam metal heat dissipation module.

The technical scheme provided by the utility model for solving the technical problems is as follows:

a radiator integrating a unidirectional heat conduction temperature-equalizing plate and a foam metal radiating module comprises the temperature-equalizing plate and the foam metal radiating module arranged at the top of the temperature-equalizing plate;

the temperature-equalizing plate comprises an evaporation plate and a condensation plate, a vacuum chamber is formed between the evaporation plate and the condensation plate, a phase-change heat transfer working medium is arranged in the vacuum chamber, a super-hydrophobic layer is formed on the inner surface of the condensation plate, and the outer surface of the condensation plate is combined with the foam metal heat-radiating module.

Preferably, the foam metal heat dissipation module is provided with at least one substrate, the substrate is provided with an upper surface and a lower surface, the upper surface of the substrate is provided with a plurality of foam metal fins arranged at intervals, and the lower surface of the substrate is attached to the outer surface of the condensation plate in a welding or adhesive connection mode.

Preferably, the upper surface of the base plate is provided with grooves corresponding to the foam metal fins, each groove is internally provided with one foam metal fin, and the surfaces of the grooves and the foam metal fins, which are in contact with each other, are fixed by welding or gluing.

Preferably, each of the foam metal fins is integrally formed with the base plate.

Preferably, the foam metal heat dissipation module is provided with a plurality of foam metal fins, and the foam metal fins are arranged at intervals;

the outer surface of the condensation plate is provided with grooves corresponding to the foam metal fins, each groove is internally provided with one foam metal fin, and the surfaces of the grooves and the foam metal fins, which are in contact with each other, are fixed by welding or gluing.

Preferably, the material of the foam metal heat dissipation module is aluminum, copper, stainless steel and alloys thereof.

Preferably, the evaporating plate and the condensing plate are made of copper.

Preferably, the evaporation plate and the condensation plate are arranged in an alignment mode, and the evaporation plate is welded and connected with the outer edge of the condensation plate through high-temperature diffusion welding.

Preferably, the inner surface of the evaporation plate is provided with a capillary structure, a vacuum gap is formed between the capillary structure and the super-hydrophobic layer, and the capillary structure is selected from one of a groove type, a wire mesh and sintered metal powder.

Preferably, the super-hydrophobic layer is formed by hydrophobic treatment with a chemical agent, and the chemical agent is selected from: 1-hexadecanethiol, 12-hydroxystearic acid and n-dodecylmercaptan.

The utility model has the beneficial effects that:

compared with the prior art, the radiator integrating the unidirectional heat conduction temperature-equalizing plate and the foam metal radiating module only has the unidirectional heat conduction function, and cannot reversely transfer heat from the environment to the electronic equipment, so that the temperature of the electronic equipment is prevented from being increased due to the increase of the environmental temperature, and the performance of the electronic equipment is reduced; compared with the traditional radiating fins, the foam metal radiating fins in the radiator have a porous structure, so that the heat exchange specific surface area is large, and the heat exchange efficiency is improved.

In addition, the structure of the foam metal is relatively complex, and the air flow can generate complex three-dimensional flow during air convection, so that the temperature flow is increased, and the overall heat exchange efficiency of the radiator is improved.

Drawings

The utility model will be further described with reference to the drawings and examples, in which:

fig. 1 is a schematic structural diagram of a heat sink integrated with a unidirectional heat-conducting vapor chamber and a foam metal fin disclosed in the present application;

FIG. 2 is an enlarged schematic view of the structure within the dashed circle of FIG. 1;

FIG. 3 is a top view of the heat sink shown in FIG. 1;

fig. 4 is a sectional view of the heat sink of fig. 3 taken along line a-a.

Description of reference numerals:

1-foam metal radiating module

11-substrate

111-upper surface

112-lower surface

12-foam metal fin

2-temperature equalizing plate

21-cold plate

211-condensation plate outer surface

212-interior surface of condensation plate

22-evaporating plate

221-inner surface of evaporating plate

222-outer surface of evaporating plate

3-vacuum chamber

31-phase change heat transfer working medium and working medium liquid drop

32-capillary structure

4-solder layer

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

In order to explain the technical means of the present invention, the following description will be given by way of specific examples.

Referring to fig. 1 to 4, a heat sink integrating a unidirectional heat-conducting temperature-uniforming plate and a foam metal heat-dissipating module disclosed in the present application includes a temperature-uniforming plate 2 and a foam metal heat-dissipating module 1 disposed on the top of the temperature-uniforming plate 2.

Referring to fig. 4, the material of the temperature equalizing plate 2 is preferably metal copper, which includes a condensing plate 21 and an evaporating plate 22, the condensing plate 21 and the evaporating plate 22 are disposed in an aligned manner, and edges of the condensing plate 21 and the evaporating plate 22 are welded together by high temperature diffusion welding, the condensing plate 21 and the evaporating plate 22 together define a vacuum chamber 3, and a phase change heat transfer working medium 31 (not labeled in the drawings) is disposed in the vacuum chamber 3.

The surface of the condensation plate 21 inside the vacuum chamber 3 is a condensation plate inner surface 212, and the surface outside the vacuum chamber 3 is a condensation plate outer surface 211. Similarly, the surface of the evaporation plate 22 inside the vacuum chamber 3 is an inner evaporation plate surface 221, and the surface of the evaporation plate 22 outside the vacuum chamber 3 is an outer evaporation plate surface 222.

Specifically, the outer surface 211 of the condensation plate is coated with a layer of solder 4 for soldering the foam metal heat dissipation module 1; the metal foam heat dissipation module 1 has a substrate 11, the substrate 11 has an upper surface 111 and a lower surface 112, the upper surface 111 of the substrate 11 is provided with a plurality of metal foam fins 12 arranged at intervals, the substrate 11 and each metal foam fin 12 are formed by integral punching (as shown in fig. 2), and the lower surface 112 of the substrate 11 is attached to an outer surface 211 of the condensation plate in a welding or adhesive connection manner. The solder may be solder paste or other solder, and the substrate 11 and the condensation plate may be attached and fixed by other connection methods, such as locking, and the like, which is not limited herein.

Specifically, the evaporation plate inner surface 221 is provided with a capillary structure 32, and a vacuum gap (not labeled in the drawing) is formed between the capillary structure 32 and the condensation plate inner surface 212. The capillary structure 32 can be selected from one of groove type, silk screen and sintered metal powder, and the capillary structure 32 is mainly used for adsorbing the working medium droplets 31 to enable the working medium droplets 31 to be gathered in the capillary structure 32; wherein the capillary structure 32 can be super-hydrophilic.

In this embodiment, the inner surface 212 of the condensation plate is subjected to a hydrophobic treatment using a chemical reagent, and the hydrophobic treatment forces the inner surface 212 of the condensation plate to become a superhydrophobic surface (i.e., a superhydrophobic layer). After treatment, the working medium liquid drop 31 formed after condensation on the super-hydrophobic surface forms a static contact angle of about 120 degrees on the super-hydrophobic surface, so that the working medium liquid drop 31 with a large angle can be formed. Among them, the chemical reagents for the hydrophobic treatment can be selected from: any one of 1-hexadecanethiol, 12-hydroxystearic acid and n-dodecylmercaptan.

Specifically, the outer surface 222 of the evaporation plate is attached to the heat source of the electronic device, when the temperature of the heat source of the electronic device is higher than the environment, the working medium droplets 31 in the capillary structure 32 evaporate and carry heat to pass through the vacuum gap, large-angle working medium droplets 31 are formed after the inner surface 212 of the condensation plate is condensed, and the working medium droplets 31 pass through the vacuum gap and are absorbed back by the capillary structure 32 on the evaporation plate 22, so that a heat dissipation cycle is formed. When the environmental temperature is higher than the temperature of the heat source of the electronic device, the working medium droplets 31 are firmly adsorbed in the capillary structure 32, so that the area of the inner surface 212 of the condensing plate inside the vacuum chamber 3 of the vapor chamber plate is dry, the heat transfer of the heat sink is poor, and the vapor chamber plate 2 only has the performance of unidirectional heat conduction.

In the present embodiment, the foam metal fin 12 is shaped like a plate, and the foam metal fin 1 has a porous structure, which makes it have a large heat exchange specific surface area, and can increase the heat exchange efficiency with air; in addition, the structure of the foam metal is relatively complex, and the air flow can generate complex three-dimensional flow during air convection, so that the temperature flow is increased, and the overall heat exchange efficiency of the radiator is improved.

Specifically, the material of the metal foam heat dissipation module 1 is preferably aluminum, copper, stainless steel or an alloy thereof, and the shape of the metal foam fins 12 may be other shapes, such as: curved plate-like and other implementable shapes.

In another embodiment, there is a difference from the first embodiment: the upper surface 111 of the substrate 11 in the metal foam heat dissipation module 1 is provided with grooves corresponding to the metal foam fins 12, each groove is provided with one metal foam fin 12, and the surfaces of the grooves and the metal foam fins 12, which are in contact with each other, are fixed by welding or gluing. In the present embodiment, the groove is used to fix the single metal foam fin 12 in the substrate 11, which can provide a supporting function for the metal foam fin 12, so that the whole metal foam heat dissipation module 1 is more stable.

In the third embodiment, there is a difference from the first embodiment in that: the base plate 11 is not arranged in the foam metal heat dissipation module 1, the foam metal heat dissipation module 1 is provided with a plurality of foam metal fins 12, the foam metal fins 12 are arranged at intervals, grooves corresponding to the foam metal fins 12 are formed in the outer surface 211 of the condensation plate, the foam metal fins 12 are also arranged in the grooves, and the surfaces, in contact with each other, of the grooves and the foam metal fins 12 are fixed through welding or gluing. Compared with the second embodiment, the present embodiment has a smaller number of substrates 11, which reduces the number of raw materials required for heat sink processing and reduces the cost.

In summary, the heat sink integrating the unidirectional heat-conducting temperature-uniforming plate and the foam metal heat-dissipating module provided by the utility model only has the unidirectional heat-conducting function, and cannot reversely transfer heat from the environment to the electronic equipment, so as to avoid the temperature of the electronic equipment from rising due to the rise of the environmental temperature, and further reduce the performance of the electronic equipment; compared with the traditional radiating fins, the foam metal radiating fins in the radiator have a porous structure, so that the heat exchange specific surface area is large, and the heat exchange efficiency is improved.

Claims

1. A radiator integrating a unidirectional heat conduction temperature-uniforming plate and a foam metal radiating module is characterized by comprising the temperature-uniforming plate and the foam metal radiating module arranged at the top of the temperature-uniforming plate;

2. The heat sink of claim 1, wherein the heat sink comprises at least one base plate having an upper surface and a lower surface, the upper surface of the base plate is provided with a plurality of spaced foam fins, and the lower surface of the base plate is attached to the outer surface of the condensation plate by welding or adhesive.

3. The heat sink of claim 2, wherein the upper surface of the base plate is provided with grooves corresponding to the foam metal fins, each groove is provided with a foam metal fin, and the surfaces of the grooves and the foam metal fins contacting each other are fixed by welding or gluing.

4. The heat sink of claim 2, wherein each of the foam metal fins is integrally formed with the base plate.

5. The heat sink of claim 1, wherein the heat sink module comprises a plurality of foam fins, and the foam fins are arranged at intervals;

6. The heat sink of claim 1, wherein the material of the foam metal heat sink module is aluminum or copper or stainless steel.

7. The heat sink of claim 1, wherein the evaporation plate and the condensation plate are made of copper.

8. The heat sink of claim 7, wherein the evaporation plate and the condensation plate are aligned, and the evaporation plate and the condensation plate are welded together at their outer edges by high temperature diffusion welding.

9. The heat sink of claim 1, wherein the inner surface of the evaporation plate is provided with a capillary structure, and the capillary structure and the super-hydrophobic layer have a vacuum gap therebetween, and the capillary structure is selected from one of a groove type, a wire mesh type and a sintered metal powder type.

10. The heat sink of claim 1, wherein the super-hydrophobic layer is formed by hydrophobic treatment with a chemical agent, wherein the chemical agent is selected from the group consisting of: 1-hexadecanethiol, 12-hydroxystearic acid and n-dodecylmercaptan.