CN213873935U

CN213873935U - Heat pipe heat dissipation device

Info

Publication number: CN213873935U
Application number: CN202022050374.8U
Authority: CN
Inventors: 李恒
Original assignee: Beijing Xinquansheng Technology Co ltd
Current assignee: Beijing Xinquansheng Technology Co ltd
Priority date: 2020-09-17
Filing date: 2020-09-17
Publication date: 2021-08-03
Anticipated expiration: 2030-09-17

Abstract

The utility model discloses a heat pipe heat dissipation and transfer device, which comprises a metal base, a plurality of heat pipes, heat dissipation fins and a heat dissipation fan; each heat pipe comprises a heat absorption end and a heat dissipation end, the heat absorption ends of the plurality of heat pipes are arranged in parallel, and the center distances among the heat absorption ends of the plurality of heat pipes are different; the tops of the heat absorbing ends of the heat pipes are closely attached to the metal base; the heat dissipation ends of the heat pipes are arranged in the heat dissipation fins in a penetrating way; the heat dissipation fan is arranged on the heat dissipation fin. The utility model discloses a heat transfer device is different through the centre-to-centre spacing between the heat absorption end of adjustment heat pipe for the heat pipe of core radiating area, in the maximum power that the heat pipe designed, heat pipe efficiency promotes, and core radiating area heat pipe can reach abundant evaporation, condensation, and the radiating efficiency of core radiating area heat pipe is just higher, and the heat of taking away is more, finally makes holistic heat abstractor radiating effect better.

Description

Heat pipe heat dissipation device

Technical Field

The utility model relates to a desktop computer CPU heat dissipation field especially relates to a heat pipe heat dissipation heat transfer device.

Background

At present, a relatively novel and efficient heat dissipation device is a heat pipe heat dissipation device, which generally transfers heat through a heat pipe and dissipates heat through a heat dissipation end connected to the other end of the heat pipe. The heat pipe is generally made of a hollow cylindrical thin-wall copper pipe, copper powder is attached to the inner wall of the copper pipe, and a porous capillary structure is formed through high-temperature sintering. After the heat pipe is filled with proper distilled water, the two ends of the copper pipe are sintered and sealed under a negative pressure state (semi-vacuum). When one end of the heat pipe is heated, the distilled water in the capillary tube is quickly evaporated, the steam is condensed at the heat dissipation end and flows back to the heat absorption end, and simultaneously releases heat, and the distilled water flows back to the heat absorption end along the porous material under the action of capillary force or gravity, so that a closed circulation heat transfer and dissipation system is repeatedly formed.

The heat pipe transfers heat by utilizing liquid phase change. Within the maximum power designed by the heat pipe, as the heat absorbed by the heat pipe is more and more, the internal medium can be fully evaporated and condensed, and the heat dissipation efficiency of the heat pipe is higher.

As shown in fig. 1, when the CPU is operating, the core generates heat intensively, the surface of the CPU is covered with the temperature-equalizing copper cap, and the temperature-equalizing copper cap cannot form a temperature-equalizing body, so that there is a temperature gradient distribution centered on the core of the CPU, that is, a high-temperature region and a low-temperature region on the surface of the CPU.

The prior art arrangement of the heat pipes has several forms, such as four heat pipes 1 in parallel with equal center distance as shown in fig. 2 or four heat pipes 1 in close contact with each other as shown in fig. 3, with almost no gap left. Theoretically, the arrangement of fig. 2 and 3 is basically an arrangement with equal center distances.

The prior art arrangement of heat pipes has the following disadvantages: as shown in fig. 4, the heat pipes are evenly distributed and distributed, and the core area is not completely covered, so that the heat pipes have low heat absorption efficiency, cannot efficiently transfer heat, and have poor heat dissipation effect. As shown in fig. 5, the heat pipes are arranged without gaps, and are concentrated to a small extent, and the blank areas at the upper and lower ends are too large, so that the heat of the non-core area on the CPU cannot be effectively taken away in time, and the heat dissipation effect is not ideal.

The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information constitutes prior art already known to a person skilled in the art.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat pipe heat transfer device that looses, the heat absorption end of its heat pipe covers the core district that generates heat more concentratedly for heat transfer rate is faster, can make the core temperature in the district that generates heat lower at the CPU during operation, and the radiating rate is faster.

In order to achieve the above object, the present invention provides a heat pipe heat dissipation device, which comprises a metal base, a plurality of heat pipes, heat dissipation fins and a heat dissipation fan; each heat pipe comprises a heat absorption end and a heat dissipation end, the heat absorption ends of the plurality of heat pipes are arranged in parallel, and the center distances among the heat absorption ends of the plurality of heat pipes are different; the tops of the heat absorbing ends of the heat pipes are closely attached to the metal base; the heat dissipation ends of the heat pipes are arranged in the heat dissipation fins in a penetrating way; the heat dissipation fan is arranged on the heat dissipation fin.

In a preferred embodiment, the shape of the heat pipe includes a U-shape or an L-shape.

In a preferred embodiment, the number of heat pipes is a minimum of four.

In a preferred embodiment, the center distance between the heat absorbing ends of two adjacent heat pipes located in the middle among the plurality of heat pipes is different from the center distance between the heat absorbing ends of two adjacent heat pipes located on the sides.

In a preferred embodiment, the center distance between the heat absorbing ends of two adjacent heat pipes located in the middle among the plurality of heat pipes is smaller than the center distance between the heat absorbing ends of two adjacent heat pipes located on the sides.

In a preferred embodiment, the center distance between the heat absorbing ends of two adjacent heat pipes located in the middle among the plurality of heat pipes is larger than the center distance between the heat absorbing ends of two adjacent heat pipes located on the sides.

In a preferred embodiment, the bottom of the heat absorbing end of each heat pipe is a plane, and the bottoms of the heat absorbing ends of the plurality of heat pipes are in the same plane.

In a preferred embodiment, the bottom of the heat absorbing end of each heat pipe is a cambered surface.

In a preferred embodiment, the heat pipe heat dissipation and transfer device further comprises a copper bottom plate, wherein the mounting surface of the copper bottom plate comprises a plurality of grooves, and the cross-sectional shapes of the grooves are matched with the cambered surface of the bottom of the heat absorption end of the heat pipe.

In a preferred embodiment, the center distance of the grooves of the copper bottom plate is the same as the center distance between the heat absorbing ends of the heat pipes.

Compared with the prior art, the utility model discloses a heat dissipation and transmission device has following beneficial effect: when the heat pipes are fixed with the metal base, the non-equal center distance arrangement is shown on the metal base, the arrangement of the core heat dissipation area is compact, the arrangement of the non-core part is sparse, the heat pipes of the core heat dissipation area are enabled to be different by adjusting the center distance between the heat absorption ends of the heat pipes, the efficiency of the heat pipes is greatly improved within the maximum power of the heat pipe design, the heat pipes of the core heat dissipation area can achieve sufficient evaporation and condensation, the heat dissipation efficiency of the heat pipes of the core heat dissipation area is higher, more heat is taken away, the heat pipes of the non-core heat dissipation area can effectively absorb the heat distributed in other areas on the surface of the CPU copper cover, and finally the heat dissipation effect of the whole heat dissipation device is enabled to be better.

Drawings

FIG. 1 is a schematic diagram of a heat generating area of a CPU according to the prior art;

FIG. 2 is a schematic diagram of a heat pipe arrangement according to one embodiment of the prior art;

FIG. 3 is a schematic view of an arrangement of heat pipes according to another embodiment of the prior art;

FIG. 4 is a schematic diagram of a defect in an arrangement of heat pipes according to one embodiment of the prior art;

FIG. 5 is a schematic diagram of a defect in an arrangement of heat pipes according to another embodiment of the prior art;

fig. 6 is a schematic perspective view of a heat pipe heat dissipation device according to an embodiment of the present invention;

fig. 7 is a schematic plan view of a heat pipe heat sink in accordance with an embodiment of the present invention;

fig. 8 is an advantageous schematic view of a heat pipe heat sink according to an embodiment of the present invention;

fig. 9 is a schematic bottom view of a heat pipe heat dissipating and transfer device according to an embodiment of the present invention;

fig. 10 is a schematic front view of a heat pipe heat dissipating device according to an embodiment of the present invention;

fig. 11 is a schematic left side view of a heat pipe heat dissipating device according to an embodiment of the present invention;

fig. 12 is a perspective view of a heat pipe heat sink according to another embodiment of the present invention.

Description of the main reference numerals:

1-metal base, 2-heat pipe, 3-heat radiation fin, 4-heat radiation fan, 5-copper bottom plate.

Detailed Description

The following detailed description of the present invention is provided in conjunction with the accompanying drawings, but it should be understood that the scope of the present invention is not limited by the following detailed description.

Throughout the specification and claims, unless explicitly stated otherwise, the word "comprise", or variations such as "comprises" or "comprising", will be understood to imply the inclusion of a stated element or component but not the exclusion of any other element or component.

As shown in fig. 6 to 9, a heat pipe heat dissipation device according to a preferred embodiment of the present invention includes a metal base 1, a plurality of heat pipes 2, heat dissipation fins 3, and a heat dissipation fan 4.

In some embodiments, the shape of the heat pipe 2 includes, but is not limited to, a U-shape or an L-shape, and the U-shape is exemplified in the present embodiment.

In some embodiments, each heat pipe 2 includes a heat absorption end and a heat dissipation end, the heat absorption ends of the plurality of heat pipes 2 are arranged in parallel and in the same plane, and the center distances between the heat absorption ends of the plurality of heat pipes 2 are different. Each heat pipe 2 is U-shaped, the bottom of the U-shape of the heat pipes 2 is a heat absorption end, the upper part of the U-shape of the heat pipes 2 is a heat dissipation end, and the heat absorption ends of the U-shape of the heat pipes 2 are arranged in parallel and are positioned on the same plane.

In some embodiments, the U-shaped heat absorbing ends of the heat pipes 2 in the same plane are mounted on the metal base 1 by fastening or screwing, and the heat absorbing ends are first coated with heat conducting paste on the heating area of the CPU. The U-shaped heat dissipation ends of the heat pipes 2 are inserted into the heat dissipation fins 3. The heat radiation fan 4 is disposed on the heat radiation fins 3.

Referring to fig. 7 to 9, in some embodiments, the number of the plurality of heat pipes 2 is at least four. The center distance H between two adjacent heat pipes 2 positioned in the middle among the plurality of heat pipes 2 is different from the center distance H between two adjacent heat pipes 2 positioned on the sides. Preferably, H is less than H.

In some embodiments, the number of the heat pipes 2 may be five, six, seven, eight, or more than four. If five heat absorbing ends are arranged, the heat absorbing ends in the middle three heat absorbing ends are closely arranged or are closer to each other, and the heat absorbing ends on the two sides are slightly farther from each other. In the case of six, the two in the middle are arranged closely or the distance between the two is the nearest, the distance between the two positioned slightly outside and the middle two is slightly larger, and the distance between the two positioned outermost is the largest. Seven, eight or even more rules can be analogized, the middle density is the largest, and the outer density is the smallest. The non-equidistant arrangement of the heat pipes 2 of this embodiment is generally only suitable for the case that the heat generating band is concentrated on the middle position of the CPU, but the present invention is not limited thereto, and if there is the case that the heat generating band is concentrated on the two side positions of the CPU, the principle that the heat pipes 2 are arranged is that the arrangement in the heat generating band concentrated region is denser. Since the heat transfer medium in the heat pipe 2 has a heat transfer characteristic in that the higher the temperature is, the higher the heat transfer efficiency is. Therefore, the greater the arrangement density of the heat pipes 2 in the heat generation concentrated region, the more advantageous the improvement of the heat dissipation efficiency.

As shown in fig. 10 to 11, in some embodiments, the U-shaped heat dissipation ends of the plurality of heat pipes 2 are not arranged in parallel when passing through the heat dissipation fins 3, and the staggered arrangement is more favorable for uniform heat conduction of the heat pipes 2 and the heat dissipation fins 3.

Fig. 12 is a perspective view of a heat pipe heat dissipation device according to another embodiment of the present invention, as shown in fig. 12. The difference between this embodiment and the foregoing embodiment is that the heat absorbing ends of the heat pipes 2 of the foregoing embodiment are slightly flattened, so that the tops of the heat absorbing ends of the plurality of heat pipes 2 are located in a same plane, the bottoms of the heat absorbing ends of the plurality of heat pipes 2 are located in a same plane, and the upper plane and the lower plane are parallel. The top of the heat absorption end of the heat pipes 2 is attached to the metal base 1, and the bottom of the heat pipes is attached to the heating area of the CPU. The heat absorbing end of the heat pipe 2 in the embodiment of fig. 7 is not flattened, but a groove (or an entire groove capable of accommodating the heat absorbing ends of the plurality of heat pipes 2 at the same time) with the same center distance as the heat absorbing ends of the plurality of heat pipes 2 is arranged on the metal base 1 to be attached to the top of the heat absorbing ends of the plurality of heat pipes 2, and a copper bottom plate 5 is additionally arranged on the copper bottom plate, and the same groove as the groove on the metal base 1 is arranged on the copper bottom plate to be attached to the bottom of the heat absorbing ends of the plurality of heat pipes 2. The metal base 1 and the copper bottom plate 5 are buckled with each other on the surfaces with grooves, and holes capable of accommodating a plurality of heat absorbing ends are formed in the middle of the metal base and the copper bottom plate for installing the plurality of heat absorbing ends. When the heat absorption device is installed, a gap between the heat absorption end and the groove is filled with heat conduction glue or soldering tin, so that the grooves of the metal base 1 and the copper bottom plate 5 and the heat absorption end are integrated. The surface of the copper bottom plate 5, which is back to the groove, is a plane, and the plane is used for being attached to a heating area of the CPU.

To sum up, the heat pipe heat dissipation and transmission device of the utility model has the following advantages: when the heat pipes are fixed with the metal base, the non-equal center distance arrangement is shown on the metal base, the arrangement of the core heat dissipation area is compact, the arrangement of the non-core part is sparse, the heat pipes of the core heat dissipation area are enabled to be different by adjusting the center distance between the heat absorption ends of the heat pipes, the efficiency of the heat pipes is greatly improved within the maximum power of the heat pipe design, the heat pipes of the core heat dissipation area can achieve sufficient evaporation and condensation, the heat dissipation efficiency of the heat pipes of the core heat dissipation area is higher, more heat is taken away, the heat pipes of the non-core heat dissipation area can effectively absorb the heat distributed in other areas on the surface of the CPU copper cover, and finally the heat dissipation effect of the whole heat dissipation device is enabled to be better.

The foregoing descriptions of specific exemplary embodiments of the present invention have been presented for purposes of illustration and description. It is not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain certain principles of the invention and its practical application to enable one skilled in the art to make and use various exemplary embodiments of the invention and various alternatives and modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims and their equivalents.

Claims

1. A heat pipe heat sink comprising:

each heat pipe comprises a heat absorption end and a heat dissipation end, the heat absorption ends of the heat pipes are arranged in parallel, and the center distances among the heat absorption ends of the heat pipes are different;

the top parts of the heat absorbing ends of the heat pipes are closely attached to the metal base;

the heat dissipation ends of the heat pipes penetrate through the heat dissipation fins; and

a heat dissipation fan disposed on the heat dissipation fin.

2. A heat pipe heat sink and transfer device as recited in claim 1, wherein said heat pipe has a shape including a U-shape or an L-shape.

3. A heat pipe heat sink and transfer device as recited in claim 2, wherein said plurality of heat pipes is a minimum of four.

4. A heat pipe heat dissipating and transferring device as set forth in claim 1, wherein a center-to-center distance between said heat absorbing ends of two adjacent ones of said plurality of heat pipes located in the middle is different from a center-to-center distance between said heat absorbing ends of two adjacent ones of said plurality of heat pipes located on the sides.

5. A heat pipe heat dissipating and transferring device as set forth in claim 1, wherein a center-to-center distance between said heat absorbing ends of two adjacent ones of said plurality of heat pipes located in the middle is smaller than a center-to-center distance between said heat absorbing ends of two adjacent ones of said heat pipes located on the sides.

6. A heat pipe heat dissipating and transferring device as set forth in claim 1, wherein a center-to-center distance between said heat absorbing ends of two adjacent ones of said plurality of heat pipes located in the middle is larger than a center-to-center distance between said heat absorbing ends of two adjacent ones of said heat pipes located on the sides.

7. A heat pipe heat sink and transfer device as recited in claim 1, wherein a bottom of said heat absorbing end of each of said heat pipes is planar, and wherein bottoms of said heat absorbing ends of said plurality of heat pipes are in a same plane.

8. A heat pipe heat sink and transfer device as recited in claim 1, wherein a bottom of said heat absorbing end of each of said heat pipes is a curved surface.

9. A heat pipe heat sink and transfer device as recited in claim 8, further comprising a copper base plate having a mounting surface comprising a plurality of grooves, said plurality of grooves having a cross-sectional shape matching an arc of a bottom of said heat absorbing end of said heat pipe.

10. A heat pipe heat sink and transfer device as recited in claim 9, wherein a center-to-center distance of said plurality of grooves of said copper base plate is the same as a center-to-center distance between said heat absorbing ends of said plurality of heat pipes.