JP3118374U - Heat pipe type high density fin heat dissipation device - Google Patents

Abstract

A heat pipe type high density fin heat dissipating device capable of increasing the number of heat dissipating fins or heat dissipating area and simultaneously effectively reducing the overall volume of the heat dissipating body.
A first heat radiator 1, a second heat radiator 2, and a heat pipe. The first and second radiators are aluminum presses or rivet-connected radiators, both of which are formed by arranging radiating fins 11 and 21 at regular intervals on the bases 10 and 20, respectively. The first heat radiating body 1 and the second heat radiating body 2 are combined in a nested manner, and a cooling air flow path is formed between these fins. The heat pipes are connected from the base of the first heat radiating body arranged in contact with the heat source to the base of the second heat radiating body, and are alternately arranged.
[Selection] Figure 6

Description

  The present invention relates to a kind of heat pipe type high density fin heat dissipation device. In particular, the present invention relates to a heat pipe type high-density fin heat dissipating device that includes two heat dissipators and in which fins are alternately arranged.

With the progress of computer technology, many high-precision electronic components have been developed. These electronic components have not only enhanced functions and improved operating speed, but also greatly increased the amount of heat generated. For this reason, in order to maintain the function of electronic components under an allowable temperature range, how to quickly and effectively dissipate heat is one of the urgent issues of research and development.
Known radiators include an aluminum press type radiator 1a shown in FIG. 1 and a rivet connection type radiator 2a shown in FIG. The fins 10a and 20a of the two types of radiators 1a and 2a need to maintain a constant distance between the fins 10a and 20a due to manufacturing process restrictions. For this reason, the total amount of the fins 10a and 20a cannot be increased under the same heat radiation volume, and the heat radiation area is limited.
3 includes a heat pipe 30a and two heat radiators 31a and 32a, and two heat radiators 31a and 32a are connected to both ends of the heat pipe 30a by heat transfer, respectively. Thus, the upper and lower sides of the two radiators 31a and 32a are installed in correspondence with each other.
However, although the two-layer stacked heat radiator 3a can increase the heat radiation area through the heat radiation fins 310a and 320a of the two heat radiators 31a and 32a, the heat radiator 31a after stacking has an overall height. Becomes very high, and the arrangement space is limited. Furthermore, the corresponding connection structure of the fins 310a and 320a of the two radiators 31a and 32a is not sufficiently stable, and the heat pipe 30a is merely used as a support structure for the two radiators 31a and 32a. is there. However, this is a heavy burden for the aluminum heat pipe 30a.
JP 2004-293830 A JP 2003-224237 A

The known structure has the following drawbacks.
That is, the known two-layer stacked heat radiator can increase the heat radiation area through each heat radiation fin of the two heat radiators, but the heat radiator after stacking has a very high overall height, and its application space There are limitations. Further, the corresponding connection structure of the fins of the two radiators is not sufficiently stable, and the heat pipe is merely used as a support structure for the two radiators. It is a burden.
The present invention provides a heat pipe type high density fin heat dissipating device which solves the problems of the above structure.

In order to solve the above problems, the present invention provides the following heat pipe type high density fin heat dissipating device.
It can mainly reduce the overall volume of the radiator at the same time, in the situation where the number of radiating fins or the radiating area can be increased, and can solve the problem that the stacked structure is unstable,
That is, it includes a first radiator, a second radiator, at least one heat pipe,
The first and second heat dissipating bodies include a base and are constituted by a plurality of fins standing upright on the corresponding base surface,
The heat pipe has a heat receiving end and a cooling end, and the heat receiving end and the cooling end of the heat pipe are in heat conductive connection with the first and second bases, respectively.
The second radiator is located above and opposite the first radiator, and the fins of the first and second radiators are alternately arranged with each other,
As a result, the fins of the first and second radiators can enter each other to reduce the overall height of the radiator, and it is necessary to consider the problem of insufficient stability on the connection structure caused by stacking. This is a heat pipe type high density fin heat dissipating device characterized by disappearance.

  As described above, the present invention can increase the number of heat dissipating fins or the heat dissipating area, and at the same time, can effectively reduce the overall volume of the heat dissipating member, and solves the problem that the stacked structure is unstable. Is possible.

As shown in FIGS. 4 and 5, the heat pipe type high density fin heat dissipating device of the present invention includes a first heat dissipating body 1, a second heat dissipating body 2, and at least one heat pipe 3.
The first and second radiators 1 and 2 can be known aluminum press type radiators or rivet connection type radiators (see FIGS. 6 and 7). Press-molded with the same mold. Moreover, the first and second radiators 1 and 2 include bases 10 and 20, respectively, and are configured by a plurality of fins 11 and 21 that stand upright on the surfaces of the corresponding bases 10 and 20, respectively. The first and second fins 11 and 21 are arranged with a space therebetween, and a first flow path 12 and a second flow path 22 are formed between them. The second radiator 2 is positioned above the first radiator 1, and the second radiator 2 is installed upside down in a normal use state. Thereby, each second fin 21 of the second heat radiating body 2 extends downward, and the second base 20 is positioned above each second fin 21. In addition, this causes the surfaces of the bases 10 and 20 of the first and second heat dissipating bodies 1 and 2 to turn over and turn 180 degrees.

Each heat pipe 3 has a U-shaped curved shape, and includes a heat receiving end 30 and a cooling end 31. The heat receiving end 30 and the cooling end 31 of each heat pipe 3 are extended relative to each other, and are connected by a connection portion 32 to constitute the heat pipe 3. The heat receiving end 30 and the cooling end 31 of the heat pipe 3 are in thermal conductive connection with the first and second bases 10 and 20, respectively.
In the embodiment of the present invention, perforations 13 and 23 are formed on the sides of the first and second bases 10 and 20, respectively, and the perforations 13 on the first and second bases 10 and 20 are formed. , 23 corresponds to the number of heat pipes 3 to be combined. Thus, the heat receiving end 30 of each heat pipe 3 is coupled to each perforation 13 of the first base 10, and the cooling end 31 of each heat pipe 3 is coupled to each perforation 23 of the second base 20. As a result, a heat source (such as a CPU) is positioned below the base 10 of the first radiator 1, and the heat energy absorbed by the base 10 of the first radiator 1 from the heat source is received by the heat pipes 3. The heat is transmitted to the cooling end 31 through the end 30 by the connecting portion 32 and is radiated to the cooling end 31 of each heat pipe 3 by the second heat radiator 2.

Next, as shown in FIG. 6, in the present invention, the fins 11 on the first heat radiator 1 are mainly arranged in the flow paths 22 between the fins 21 of the first heat radiator 2. At the same time, the second fins 21 on the second radiator 2 are also arranged in the flow paths 12 between the first fins 11 on the first radiator 1. Thus, the fins 11 and 21 of the first and second heat dissipating bodies 1 and 2 are alternately arranged to reduce the overall height of the heat dissipating device, and the first and second heat dissipating bodies 1. In 2, it is not necessary to consider problems such as insufficient structural stability such as connections caused by stacking.
When there are a plurality of the heat pipes 3, the heat receiving ends 30 of the heat pipes 3 are arranged in a concentrated parallel arrangement on the first base 10. The cooling end 31 of each heat pipe 3 is horizontally spaced on the second base 20. Thus, the heat receiving ends 30 of the heat pipes 3 are concentrated on the heat generating sources, and heat energy generated by the heat generating sources is transferred to the positions of the heat receiving ends 30 through the heat pipes 3. Since 31 is arranged on the second base 20 at intervals, it is advantageous for dissipating heat by dispersing thermal energy.

Subsequently, as shown in FIG. 7, in the second embodiment of the present invention, the first and second radiators 1, 2 are rivet connection type radiators. The first and second fins 11 and 12 are made of a material having excellent thermal conductivity such as copper and aluminum. In addition, the first flow path 12 and the second flow path 22 are formed between the first and second fins 11 and 21, respectively, to exhibit a heat dissipation effect.
Further, as shown in FIG. 8, in the third embodiment of the present invention, the arrangement direction of the perforations 13 and 23 of the first and second bases 10 and 20 coincides with the arrangement direction of the fins 11 and 21. In the first embodiment, as shown in FIG. 6, the direction of the first and second bases 10 and 20 toward the perforations 13 and 23 coincides with the molding direction of the fins 11 and 21.

It is a plane directions figure of a publicly known aluminum press type radiator. It is a top sectional view of a publicly known rivet connection type radiator. It is a top sectional view of a publicly known two layer type radiator. It is a three-dimensional exploded view of the first embodiment of the present invention. It is a three-dimensional combination diagram of the first embodiment of the present invention. 1 is a plan sectional view of a first embodiment of the present invention. It is plane sectional drawing of this invention 2nd Example. It is a three-dimensional combination diagram of the third embodiment of the present invention.

Explanation of symbols

1a radiator 10a fin 2a radiator 20a fin 3a radiator 30a heat pipe 31a radiator 310a radiator fin 32a radiator 320a radiator fin 1 first radiator 10 first base 11 first fin 12 first channel 13 perforation 2 second Radiator 20 Second base 21 Second fin 22 Second flow path 23 Perforation 3 Heat pipe 30 Heat receiving end 31 Cooling end 32 Connection portion

Claims (9)

Consists of a first radiator 1, a second radiator 2, and one or more heat pipes,
The first and second radiators are provided with a first fin and a second fin on a first base and a second base, respectively.
The heat pipe has a heat receiving end and a cooling end, and is connected to the first and second bases to conduct heat, respectively.
The first radiator and the second radiator are reversed and arranged, and the first fin and the second fin are arranged in a mutually nested manner and combined.
A heat pipe type high density fin heat dissipating device. 2. The heat pipe type high density fin heat dissipating device according to claim 1, wherein the first heat dissipating member is an aluminum press heat dissipator or a rivet connection heat dissipator. The heat pipe type high density fin heat dissipating device according to claim 1 or 2, wherein the second heat dissipating member is an aluminum press heat dissipator or a rivet connection type heat dissipator. 2. The heat pipe type high density fin heat dissipating device according to claim 1, wherein the first and second base surfaces are reversed and arranged in opposite directions. The first and second base sides are each provided with a perforation penetrating inside, and the heat receiving end of the heat pipe is connected to the first base perforation, and the cooling end of the heat pipe is the second base. The heat pipe type high-density fin heat dissipating device according to claim 1, wherein the heat pipe type high-density fin heat dissipating device is connected to the perforation. The heat pipe type high-density fin heat dissipating apparatus according to claim 1, wherein the heat pipe has a U-shaped curved shape. 2. The heat pipe type high density fin heat dissipating apparatus according to claim 1, wherein the heat pipe extends between the heat receiving end and the cooling end to form a connecting portion. The heat pipes are plural, and the heat receiving ends of the heat pipes are arranged in a centrally parallel arrangement on the first base, and the cooling ends of the heat pipes are horizontally spaced on the second base. The heat pipe type high-density fin heat dissipating device according to claim 1. The first fins are respectively disposed in a second flow path between the second fins, and the second fins are respectively disposed in a first flow path between the first fins. The heat pipe type high-density fin heat dissipation device according to 1.

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