TWM517315U - Heat dissipating unit - Google Patents
Heat dissipating unit Download PDFInfo
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- TWM517315U TWM517315U TW104218835U TW104218835U TWM517315U TW M517315 U TWM517315 U TW M517315U TW 104218835 U TW104218835 U TW 104218835U TW 104218835 U TW104218835 U TW 104218835U TW M517315 U TWM517315 U TW M517315U
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Description
本創作係一種散熱單元,尤其有關於應用於散熱之散熱單元。This creation is a heat sink unit, especially for heat sinks that are used for heat dissipation.
隨現行電子設備逐漸以輕薄作為標榜之訴求,故各項元件皆須隨之縮小其尺寸,但電子設備之尺寸縮小伴隨而來產生的熱變成電子設備與系統改善性能的主要障礙。所以業界為了有效解決電子設備內的元件散熱問題,便分別提出具有導熱效能較佳的均溫板(Vapor chamber)及熱管(Heat pipe),以有效解決現階段的散熱問題。With the current gradual appeal of electronic devices, all components must be reduced in size, but the heat generated by the shrinking of electronic devices has become a major obstacle to the improvement of performance of electronic devices and systems. Therefore, in order to effectively solve the problem of heat dissipation of components in electronic equipment, the industry has proposed a Vapor chamber and a heat pipe with better heat conduction performance to effectively solve the current heat dissipation problem.
均溫板(Vapor chamber)係呈矩型狀之殼體(或板體),其殼體內部腔室壁面設置毛細結構,且該殼體內部填充有工作液體,並該殼體的一側(即蒸發區)係貼設在一發熱元件(如中央處理器、南北橋晶片、電晶體、MCU等)上吸附該發熱元件所產生之熱量,使液態之工作液體於該殼體之蒸發區產生蒸發轉換為汽態,將熱量傳導至該殼體之冷凝區,該汽態之工作液體於冷凝區受冷卻後冷凝為液態,該液態之工作液體再透過重力或毛細結構回流至蒸發區繼續汽液循環,以有效達到均溫散熱之效果。The Vapor chamber is a rectangular casing (or plate body), and a capillary structure is arranged on the inner wall of the casing, and the inside of the casing is filled with working liquid, and one side of the casing ( That is, the evaporation zone is attached to a heating element (such as a central processing unit, a north-south bridge chip, a transistor, an MCU, etc.) to adsorb heat generated by the heating element, so that the liquid working liquid is generated in the evaporation zone of the housing. The evaporation is converted into a vapor state, and the heat is transferred to the condensation zone of the casing. The vaporized working liquid is cooled and condensed into a liquid state in the condensation zone, and the liquid working liquid is recirculated through the gravity or capillary structure to the evaporation zone to continue the steam. Liquid circulation to effectively achieve the effect of uniform temperature dissipation.
熱管(Heat pipe)的原理與理論架構與均溫板相同,主要是在圓管口徑的熱管內之中空部分填入金屬粉末(或是置入編織網狀的毛細),並透過燒結之方式於該熱管之內壁形成一環狀的毛細結構,其後將該熱管抽真空並填充工作液體,最後封閉以形成熱管結構。當工作液體由蒸發部受熱蒸發後擴散至該冷凝端,並該工作液體於該蒸發部係為汽態,由該蒸發部離開後向該冷凝端擴散時逐步受冷卻冷凝轉換為液態,並且再透過毛細結構回流至該蒸發部。The principle and theoretical structure of the heat pipe is the same as that of the temperature equalizing plate. The hollow part of the heat pipe of the circular pipe is filled with metal powder (or woven mesh-like capillary) and sintered. The inner wall of the heat pipe forms an annular capillary structure, after which the heat pipe is evacuated and filled with a working liquid, and finally closed to form a heat pipe structure. When the working liquid is evaporated by the evaporation portion and evaporated to the condensation end, and the working liquid is in a vapor state in the evaporation portion, when the evaporation portion is separated and diffused toward the condensation end, it is gradually cooled and condensed into a liquid state, and then It is returned to the evaporation portion through the capillary structure.
比較均溫板與熱管兩者只有熱傳導的方式不同,均溫板的熱傳導方式是二維的,是面的熱傳導方式,然而熱管的熱傳導方式是一維的熱傳導方式。Comparing the method of heat conduction between the temperature equalizing plate and the heat pipe is different, the heat conduction mode of the temperature equalizing plate is two-dimensional, which is the heat conduction mode of the surface, but the heat conduction mode of the heat pipe is a one-dimensional heat conduction mode.
如何更有效率的使用這兩種熱傳遞單元,是目前業者所需努力的。How to use these two heat transfer units more efficiently is the current efforts of the industry.
爰此,為有效解決上述之問題,本創作之一目的在提供一種兩腔室連通的一殼體及一熱管,且該殼體的腔室內的毛細結構毛細連結該熱管內的腔室內的毛細結構的散熱單元。Therefore, in order to effectively solve the above problems, an object of the present invention is to provide a casing and a heat pipe in which two chambers are connected, and the capillary structure in the chamber of the casing is capillaryly coupled to the capillary in the chamber in the heat pipe. Structure of the heat sink unit.
本創作之另一目的在提供一種散熱單元包括殼體及熱管,其中殼體的殼體腔室內的殼體毛細結構厚度等於該熱管的熱管管壁厚度加上熱管毛細結構厚度,以使殼體毛細結構毛細連結熱管毛細結構。Another object of the present invention is to provide a heat dissipating unit including a casing and a heat pipe, wherein a capillary structure thickness of the casing in the casing chamber of the casing is equal to a thickness of the heat pipe wall of the heat pipe plus a thickness of the heat pipe capillary structure to make the casing capillary The structure is capillaryly connected to the heat pipe capillary structure.
本創作之另一目的在提供一種毛細力能從一殼體內的腔室傳遞或延伸至一熱管內的腔室,使得冷卻的工作流體能從熱管藉由毛細力回流至殼體內的熱傳單元。Another object of the present invention is to provide a capillary force that can be transferred from a chamber within a housing or to a chamber within a heat pipe such that the cooled working fluid can be returned from the heat pipe to the heat transfer unit within the housing by capillary forces. .
為達上述目的,本創作係提供一種散熱單元,包括:一殼體,具有一殼體腔室,該殼體腔室內容設有一殼體毛細結構及一工作流體;一熱管,具有一封閉端、一開放端及一熱管壁,該熱管壁具有一外側及一內側,該內側界定一熱管腔室連通該開放端,一熱管毛細結構設於該熱管壁的內側且位於該熱管腔室內;其中該熱管的開放端係插接於該殼體腔室內,該熱管腔室通過該開放端連通該殼體腔室,該熱管毛細結構係毛細連結該殼體毛細結構。In order to achieve the above object, the present invention provides a heat dissipating unit, comprising: a casing having a casing chamber, the casing chamber is provided with a casing capillary structure and a working fluid; and a heat pipe having a closed end and a An open end and a heat pipe wall having an outer side and an inner side, the inner side defining a heat pipe chamber communicating with the open end, a heat pipe capillary structure being disposed on the inner side of the heat pipe wall and located in the heat pipe cavity The indoor end; wherein the open end of the heat pipe is inserted into the housing chamber, and the heat pipe chamber communicates with the housing chamber through the open end, and the heat pipe capillary structure is capillaryly coupled to the housing capillary structure.
在一實施,該殼體毛細結構係局部或全部界定一第一厚度,該熱管壁係界定一第二厚度,該熱管毛細結構係界定一第三厚度,且該第一厚度等於該第二厚度加上第三厚度。In one implementation, the capillary structure of the housing partially or completely defines a first thickness, the heat pipe wall defines a second thickness, the heat pipe capillary structure defines a third thickness, and the first thickness is equal to the second thickness The thickness is added to the third thickness.
在一實施,該殼體毛細結構具有一第一端,該熱管毛細結構具有一第二端毛細連結該第一端。In one implementation, the housing capillary structure has a first end, and the heat pipe capillary structure has a second end capillaryly coupled to the first end.
在一實施,該殼體腔室具有一殼體內壁界定一無毛細結構區域,且該殼體毛細結構設置在避開該無毛細結構區域的殼體內壁上。In one implementation, the housing chamber has a housing inner wall defining a capillary-free structural region, and the housing capillary structure is disposed on the inner wall of the housing that avoids the capillary-free structural region.
在一實施,該殼體毛細結構具有一第一連結側連結該殼體內壁及一第一自由側面對該殼體腔室,該第一厚度界定在該第一連結側及該第一自由側之間;該熱管毛細結構具有一第二連結側連結該熱管壁的內側及一第二自由側面對該熱管腔室,該第三厚度界定在該第二連結側及該第二自由側之間。In one embodiment, the housing capillary structure has a first connecting side connecting the inner wall of the housing and a first free side to the housing chamber, the first thickness being defined on the first connecting side and the first free side The heat pipe capillary structure has a second connecting side connecting the inner side of the heat pipe wall and a second free side to the heat pipe chamber, the third thickness being defined on the second connecting side and the second free side between.
10‧‧‧殼體10‧‧‧shell
101‧‧‧頂側101‧‧‧ top side
102‧‧‧底側102‧‧‧ bottom side
103‧‧‧側邊103‧‧‧ side
1031‧‧‧開口1031‧‧‧ openings
11‧‧‧殼體腔室11‧‧‧Shell chamber
112‧‧‧殼體內壁112‧‧‧ housing inner wall
1121‧‧‧無毛細結構區域1121‧‧‧No capillary structure area
114‧‧‧殼體毛細結構114‧‧‧Shell capillary structure
1141‧‧‧第一端1141‧‧‧ first end
1143‧‧‧第一連結側1143‧‧‧ first link side
1144‧‧‧第一自由側1144‧‧‧First free side
20‧‧‧熱管20‧‧‧heat pipe
201‧‧‧封閉端201‧‧‧closed end
202‧‧‧開放端202‧‧‧open end
203‧‧‧熱管壁203‧‧‧Hot wall
2031‧‧‧外側2031‧‧‧ outside
2032‧‧‧內側2032‧‧‧ inside
204‧‧‧熱管腔室204‧‧‧heat pipe chamber
205‧‧‧熱管毛細結構205‧‧‧heat pipe capillary structure
2051‧‧‧第二端2051‧‧‧ second end
2053‧‧‧第二連結側2053‧‧‧Second link side
2054‧‧‧第二自由側2054‧‧‧Second free side
B1‧‧‧第一厚度B1‧‧‧first thickness
B2‧‧‧第二厚度B2‧‧‧second thickness
B3‧‧‧第三厚度B3‧‧‧ third thickness
40‧‧‧散熱鰭片組40‧‧‧Fixing fin set
401‧‧‧散熱鰭片401‧‧‧heat fins
下列圖式之目的在於使本創作能更容易被理解,於本文中會詳加描述該些圖式,並使其構成具體實施例的一部份。透過本文中之具體實施例並參考相對應的圖式,俾以詳細解說本創作之具體實施例,並用以闡述創作之作用原理。The following figures are intended to make the present invention easier to understand, and the drawings are described in detail herein and form part of the specific embodiments. Through the specific embodiments herein and with reference to the corresponding drawings, the specific embodiments of the present invention are explained in detail, and the function principle of the creation is explained.
第1圖係為本創作之立體分解示意圖;Figure 1 is a three-dimensional exploded view of the creation;
第2圖係為本創作之立體組合示意圖;Figure 2 is a three-dimensional combination diagram of the creation;
第3圖係為本創作之剖視分解示意圖;Figure 3 is a schematic cross-sectional view of the creation;
第4圖係為本創作之剖視組合示意圖;Figure 4 is a schematic cross-sectional view of the creation;
第5圖係為第4圖之局部放大示意圖:Figure 5 is a partial enlarged view of Figure 4:
第6圖係為本創作與鰭片組結合之示意圖。Figure 6 is a schematic diagram of the combination of the creation and the fin set.
本創作之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
請參閱第1圖係為本創作之立體分解示意圖;第2圖係為本創作之立體組合示意圖;第3圖係為本創作之剖視分解示意圖;第4圖係為本創作之剖視組合示意圖;第5圖係為第4圖之局部放大示意圖。如圖所示本創作包括一殼體10及至少一熱管20。該殼體10係為平板式的熱傳導單元,例如為均溫板或平板式熱管,具有一頂側101、一底側102及一側邊103環設在該頂側101及該底側102之間。該側邊103開設至少一開口1031,該開口1031的數量配合該熱管20的數量。Please refer to Fig. 1 for a three-dimensional exploded view of the creation; Figure 2 is a three-dimensional combination diagram of the creation; Figure 3 is a schematic exploded view of the creation; Figure 4 is a cross-sectional combination of the creation Fig. 5 is a partially enlarged schematic view of Fig. 4. As shown, the present invention includes a housing 10 and at least one heat pipe 20. The housing 10 is a flat-plate heat conduction unit, for example, a temperature equalizing plate or a flat plate heat pipe, and has a top side 101, a bottom side 102 and a side edge 103 ringed on the top side 101 and the bottom side 102. between. The side 103 defines at least one opening 1031. The number of the openings 1031 matches the number of the heat pipes 20.
一殼體腔室11界定在該頂側101及該底側102及該側邊103之間。該殼體腔室11內容置一工作流體(無圖示)及一殼體毛細結構114,該工作流體例如但不限制為純水、無機化合物、醇類、酮類、液態金屬、冷煤、有機化合物或其混合物。該殼體腔室11具有一殼體內壁112,該殼體內壁112界定一無毛細結構區域1121相鄰該開口1031,該殼體毛細結構114設置在避開該無毛細結構區域1121的殼體內壁112上,且具有一第一端1141對應該無毛細結構區域1121。A housing chamber 11 is defined between the top side 101 and the bottom side 102 and the side edges 103. The housing chamber 11 is provided with a working fluid (not shown) and a casing capillary structure 114, such as but not limited to pure water, inorganic compounds, alcohols, ketones, liquid metal, cold coal, organic a compound or a mixture thereof. The housing chamber 11 has a housing inner wall 112 defining a capillary-free structural region 1121 adjacent the opening 1031, the housing capillary structure 114 being disposed on the inner wall of the housing avoiding the eccentric structure region 1121 112 has a first end 1141 corresponding to the wickless structure region 1121.
該熱管20 具有一封閉端201、一開放端202及一熱管壁203。該熱管壁203具有一外側2031及一內側2032,該內側2032界定一熱管腔室204位於該封閉端201及開放端202之間且連通該開放端202,一熱管毛細結構205設於該熱管壁203的內側2032且從該熱管腔室204延伸到該開放端202,並具有一第二端2051位於該開放端202。The heat pipe 20 has a closed end 201, an open end 202 and a heat pipe wall 203. The heat pipe wall 203 has an outer side 2031 and an inner side 2032. The inner side 2032 defines a heat pipe chamber 204 between the closed end 201 and the open end 202 and communicates with the open end 202. A heat pipe capillary structure 205 is disposed thereon. The inner side 2032 of the heat pipe wall 203 extends from the heat pipe chamber 204 to the open end 202 and has a second end 2051 located at the open end 202.
前述熱管20的封閉端201例如但不限制為彎曲延伸到該殼體10的上方或水平延伸,該熱管20的開放端202係從該殼體10的側邊103插接於該殼體腔室11內,以使該熱管腔室204通過該開放端202連通該殼體腔室11,且該熱管毛細結構205毛細連結該殼體毛細結構114,亦即該殼體毛細結構114的第一端1141毛細連結該熱管毛細結構205的第二端2051。The closed end 201 of the heat pipe 20 is, for example but not limited to, curved to extend above or horizontally of the housing 10, and the open end 202 of the heat pipe 20 is inserted into the housing chamber 11 from the side 103 of the housing 10. The heat pipe chamber 204 communicates with the housing chamber 11 through the open end 202, and the heat pipe capillary structure 205 is capillaryly coupled to the housing capillary structure 114, that is, the first end 1141 of the housing capillary structure 114. The capillary ends join the second end 2051 of the heat pipe capillary structure 205.
前述的殼體毛細結構114具有一第一連結側1143連結該殼體內壁112及一第一自由側1144面對該殼體腔室11。前述的熱管毛細結構205具有一第二連結側2053連結該熱管壁203的內側2032及一第二自由側2054面對該熱管腔室204。該殼體毛細結構114及熱管毛細結構205例如為燒結金屬粉末體或網目編織體或溝槽或束股纖維等,係為具有多孔隙的結構能提供毛細力驅動該工作流體流動。The aforementioned housing capillary structure 114 has a first connecting side 1143 connecting the housing inner wall 112 and a first free side 1144 facing the housing chamber 11. The heat pipe capillary structure 205 has a second connecting side 2053 connecting the inner side 2032 of the heat pipe wall 203 and a second free side 2054 facing the heat pipe cavity 204. The casing capillary structure 114 and the heat pipe capillary structure 205 are, for example, sintered metal powder bodies or mesh braids or grooves or bundle fibers, etc., and have a porous structure capable of providing capillary force to drive the working fluid flow.
「毛細連結」係指該殼體毛細結構114的多孔隙連通該熱管毛細結構205的多孔隙,使得毛細力能從該熱管毛細結構205傳遞或延伸到該殼體毛細結構114,而冷卻的工作流體可以藉由該毛細力從該熱管毛細結構205回流至該殼體毛細結構114進而回到殼體腔室11內。By "capillary connection" is meant that the porous structure of the capillary structure 114 communicates with the porosity of the heat pipe capillary structure 205 such that capillary forces can be transferred or extended from the heat pipe capillary structure 205 to the housing capillary structure 114, while cooling work The fluid can be returned from the heat pipe capillary structure 205 to the housing capillary structure 114 by the capillary force to return to the housing chamber 11.
再者,該殼體毛細結構114界定一第一厚度B1在該第一連結側1143及該第一自由側1144之間,該熱管壁203係界定一第二厚度B2在該外側2031及該內側2032之間,該熱管毛細結構205係界定一第三厚度B3在該第二連結側2053及該第二自由側2054之間,且該殼體毛細結構114的第一厚度B1等於該熱管壁203的第二厚度加上該熱管毛細結構205的第三厚度B3,藉此使該殼體毛細結構114能夠直接毛細連結跟該熱管毛細結構205,不會產生厚度不一致或高低落差的問題造成無法毛細連結。Furthermore, the housing capillary structure 114 defines a first thickness B1 between the first connecting side 1143 and the first free side 1144. The heat pipe wall 203 defines a second thickness B2 on the outer side 2031 and the Between the inner side 2032, the heat pipe capillary structure 205 defines a third thickness B3 between the second connecting side 2053 and the second free side 2054, and the first thickness B1 of the housing capillary structure 114 is equal to the heat pipe. The second thickness of the wall 203 is added to the third thickness B3 of the heat pipe capillary structure 205, thereby enabling the housing capillary structure 114 to be directly capillaryly coupled to the heat pipe capillary structure 205 without causing problems of inconsistent thickness or high and low drop. Unable to make a capillary link.
尤其要說明的,在本實施的圖示雖然表示該殼體毛細結構114的整體為第一厚度B1,但是在一替代實施,也可以只有該殼體毛細結構114的第一端1141為第一厚度B1,其餘的厚度比該第一厚度B1略薄,如此可以減少殼體腔室11被殼體毛細結構114佔據的空間,並使該殼體毛細結構114能夠直接毛細連結跟該熱管毛細結構205。In particular, although the illustration of the present embodiment indicates that the entirety of the housing capillary structure 114 is the first thickness B1, in an alternative implementation, only the first end 1141 of the housing capillary structure 114 may be the first. The thickness B1, the remaining thickness is slightly thinner than the first thickness B1, so that the space occupied by the housing capillary structure 114 can be reduced, and the housing capillary structure 114 can be directly capillaryly coupled with the heat pipe capillary structure 205. .
請繼續參考第6圖所示,一併參考第1至5圖所示,一散熱鰭片組40串接在該熱管20上且位於殼體10的上方,散熱鰭片組40包括複數散熱鰭片401間隔排列,用以幫助該熱管20內的工作流體散熱。Please refer to FIG. 6 again. Referring to FIGS. 1 to 5 together, a heat dissipation fin set 40 is serially connected to the heat pipe 20 and located above the casing 10. The heat dissipation fin set 40 includes a plurality of heat dissipation fins. The sheets 401 are spaced apart to assist in the dissipation of the working fluid within the heat pipe 20.
因此當殼體腔室11內的工作流體吸熱蒸發成氣體後,通過該熱管20的開放端202流至該熱管腔室204內,然後藉由該散熱鰭片組40散熱,冷卻後的工作流體變成液體後從該熱管毛細結構205藉由毛細力回流至該殼體毛細結構114,然後回到該殼體腔室11內。Therefore, after the working fluid in the housing chamber 11 is evaporated to a gas, the open end 202 of the heat pipe 20 flows into the heat pipe chamber 204, and then the heat-dissipating fin group 40 dissipates heat, and the cooled working fluid After being turned into a liquid, it is returned from the heat pipe capillary structure 205 by capillary force to the casing capillary structure 114, and then returned to the casing chamber 11.
藉由以上的設置,使該殼體毛細結構114與該熱管毛細結構205的毛細連結,以令該熱管腔室204及殼體腔室11的毛細力能夠互相傳遞或延伸。With the above arrangement, the capillary structure 114 of the housing is coupled to the capillary of the heat pipe capillary structure 205 so that the capillary forces of the heat pipe chamber 204 and the housing chamber 11 can be transmitted or extended to each other.
惟以上所述者,僅係本創作之較佳可行之實施例而已,舉凡利用本創作上述之方法、形狀、構造、裝置所為之變化,皆應包含於本案之權利範圍內。However, the above descriptions are only preferred embodiments of the present invention, and variations of the methods, shapes, structures, and devices described above are intended to be included in the scope of the present invention.
10‧‧‧殼體 10‧‧‧shell
101‧‧‧頂側 101‧‧‧ top side
102‧‧‧底側 102‧‧‧ bottom side
103‧‧‧側邊 103‧‧‧ side
11‧‧‧殼體腔室 11‧‧‧Shell chamber
112‧‧‧殼體內壁 112‧‧‧ housing inner wall
114‧‧‧殼體毛細結構 114‧‧‧Shell capillary structure
1141‧‧‧第一端 1141‧‧‧ first end
1143‧‧‧第一連結側 1143‧‧‧ first link side
1144‧‧‧第一自由側 1144‧‧‧First free side
20‧‧‧熱管 20‧‧‧heat pipe
201‧‧‧封閉端 201‧‧‧closed end
202‧‧‧開放端 202‧‧‧open end
2031‧‧‧外側 2031‧‧‧ outside
2032‧‧‧內側 2032‧‧‧ inside
204‧‧‧熱管腔室 204‧‧‧heat pipe chamber
205‧‧‧熱管毛細結構 205‧‧‧heat pipe capillary structure
2051‧‧‧第二端 2051‧‧‧ second end
2053‧‧‧第二連結側 2053‧‧‧Second link side
2054‧‧‧第二自由側 2054‧‧‧Second free side
B1‧‧‧第一厚度 B1‧‧‧first thickness
B2‧‧‧第二厚度 B2‧‧‧second thickness
B3‧‧‧第三厚度 B3‧‧‧ third thickness
Claims (6)
一殼體,具有一殼體腔室,該殼體腔室內容設有一殼體毛細結構及一工作流體;
一熱管,具有一封閉端、一開放端及一熱管壁,該熱管壁具有一外側及一內側,該內側界定一熱管腔室連通該開放端,一熱管毛細結構設於該熱管壁的內側且從該熱管腔室延伸到該開放端;
其中該熱管的開放端係插接於該殼體腔室內,該熱管腔室通過該開放端連通該殼體腔室,該熱管毛細結構係毛細連結該殼體毛細結構。 A heat dissipation unit comprising:
a housing having a housing chamber, the housing chamber being provided with a housing capillary structure and a working fluid;
a heat pipe having a closed end, an open end and a heat pipe wall, the heat pipe wall having an outer side and an inner side, the inner side defining a heat pipe chamber communicating with the open end, and a heat pipe capillary structure being disposed on the heat pipe An inner side of the wall and extending from the heat pipe chamber to the open end;
The open end of the heat pipe is inserted into the housing cavity, and the heat pipe cavity communicates with the casing cavity through the open end, and the heat pipe capillary structure is capillaryly coupled to the casing capillary structure.
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107123628A (en) * | 2016-02-24 | 2017-09-01 | 讯凯国际股份有限公司 | Communicate-type heat transfer unit (HTU) |
TWI601934B (en) * | 2016-07-26 | 2017-10-11 | 邁萪科技股份有限公司 | Vapor chamber and heat pipe combined structure and combination method thereof |
TWI601933B (en) * | 2016-04-07 | 2017-10-11 | 訊凱國際股份有限公司 | Heat-conducting structure |
CN107306488A (en) * | 2016-04-21 | 2017-10-31 | 奇鋐科技股份有限公司 | Heat radiation module |
TWI620911B (en) * | 2017-04-05 | 2018-04-11 | 邁萪科技股份有限公司 | Heat conduction structure with liquid-gas separation mechanism |
TWI652444B (en) | 2018-06-29 | 2019-03-01 | 奇鋐科技股份有限公司 | Vapor chamber structure |
US10288356B2 (en) | 2016-10-14 | 2019-05-14 | Taiwan Microloops Corp. | Vapor chamber and heat pipe combined structure and combining method thereof |
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2015
- 2015-11-24 TW TW104218835U patent/TWM517315U/en unknown
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107123628A (en) * | 2016-02-24 | 2017-09-01 | 讯凯国际股份有限公司 | Communicate-type heat transfer unit (HTU) |
CN107123628B (en) * | 2016-02-24 | 2019-04-16 | 讯凯国际股份有限公司 | Communicate-type heat transfer unit (HTU) |
TWI601933B (en) * | 2016-04-07 | 2017-10-11 | 訊凱國際股份有限公司 | Heat-conducting structure |
CN107306488A (en) * | 2016-04-21 | 2017-10-31 | 奇鋐科技股份有限公司 | Heat radiation module |
CN107306488B (en) * | 2016-04-21 | 2023-02-28 | 奇鋐科技股份有限公司 | Heat radiation module |
TWI601934B (en) * | 2016-07-26 | 2017-10-11 | 邁萪科技股份有限公司 | Vapor chamber and heat pipe combined structure and combination method thereof |
US10288356B2 (en) | 2016-10-14 | 2019-05-14 | Taiwan Microloops Corp. | Vapor chamber and heat pipe combined structure and combining method thereof |
TWI620911B (en) * | 2017-04-05 | 2018-04-11 | 邁萪科技股份有限公司 | Heat conduction structure with liquid-gas separation mechanism |
TWI652444B (en) | 2018-06-29 | 2019-03-01 | 奇鋐科技股份有限公司 | Vapor chamber structure |
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