TWM631832U - Heat-dissipation module - Google Patents

Abstract

The present invention provides a heat dissipation module, which includes a heat conducting shell and at least one heat pipe. The heat conducting shell includes a first half shell and a second half shell, the first half shell and the second half shell are opposite and closed, a capillary structure is attached to the inner wall of the heat conducting shell, and the heat conducting shell is filled with working fluid. The heat pipe penetrates through the heat conducting shell, and the heat pipe is attached to the inner wall of the bottom of the first half shell.

Description

cooling module

This creation is about heat pipe heat dissipation, especially a heat dissipation module with a heat pipe combined with a vapor chamber structure.

Heat pipes are commonly used components in the field of electronic heat dissipation, which are mainly used to transmit thermal energy. Generally speaking, a part of the heat pipe is used for heat absorption, and the other part is used for heat release. The exothermic part is discharged separately. The vapor chamber is often used as the aforementioned heat conductor. The heat absorbing part of the heat pipe penetrates into the vapor chamber. The heat pipe is usually spaced from the inner wall of the vapor chamber to facilitate convection of the working fluid in the vapor chamber. Although the vapor chamber can quickly remove heat energy from the heat source, only the vaporized working fluid is used as the heat exchange medium between the heat pipe and the vapor chamber, and the heat exchange rate is still insufficient, so the heat energy is easily accumulated in the vapor chamber.

In view of this, the creator of the present invention has devoted himself to the research and application of the theory, and tried his best to solve the above-mentioned problems, which is the goal of the creator's improvement.

This creation provides a heat dissipation module with a heat pipe combined with a temperature equalizing plate structure.

The present invention provides a heat dissipation module, which includes a heat conducting shell and at least one heat pipe. The heat conducting shell includes a first half shell and a second half shell, the first half shell and the second half shell are opposite and closed, a capillary structure is attached to the inner wall of the heat conducting shell, and the heat conducting shell is filled with working fluid. The heat pipe penetrates through the heat conducting shell, and the heat pipe is attached to the inner wall of the bottom of the first half shell.

In the heat dissipation module of the present invention, the opening edge of the first half-shell is provided with a pair of first notch edges arranged oppositely, and the heat pipe is embedded in the pair of first notch edges and penetrates the first half-shell. The opening edge of the second half-shell is provided with a pair of oppositely arranged second notch edges, and the heat pipe is embedded in the pair of second notch edges and penetrates the second half-shell. The capillary structure coats the outer wall of the heat pipe.

In the heat dissipation module of the present invention, the heat pipe has a heat absorption section, the heat absorption section is accommodated in the heat conduction shell, and the lateral cross-sectional area of the heat absorption section is smaller than the lateral cross-sectional area of the rest of the heat pipe. The capillary structure covers the heat absorbing section. The heat absorbing section is flat and one side of the heat absorbing section is attached to the inner wall of the first half shell.

In the heat-dissipating module of the present invention, a plurality of heat-conducting columns are arranged in the heat-conducting shell, and two ends of each heat-conducting column are respectively connected to the inner wall of the first half-shell and the inner wall of the second half-shell. The heat-conducting columns are arranged separately from the heat-absorbing section. The capillary structure coats the outer wall of each thermally conductive column.

In the heat dissipation module of the present invention, the heat pipes are plural and spaced apart. A plurality of heat conduction columns are arranged in the heat conduction shell. The two ends of each heat conduction column are respectively connected to the inner wall of the first half shell and the inner wall of the second half shell. Thermal columns are arranged in the distance between the heat pipes.

In the heat dissipation module of this creation, the capillary structure covers the outer wall of each heat conduction column.

In the heat dissipation module of the present invention, the heat pipe can be arranged separately from the inner wall of the bottom of the second half shell. The heat pipe can also be attached to the inner wall of the bottom of the second half shell.

In the heat dissipation module of the present invention, one side of the heat pipe is attached to the first half-shell to facilitate the absorption of heat energy from the heat-conducting shell.

Referring to FIGS. 1 to 3 , a preferred embodiment of the present invention provides a heat dissipation module, which includes a thermally conductive housing 100 and at least one heat pipe 200 .

In this embodiment, the thermally conductive housing 100 is generally made of aluminum or copper, the thermally conductive housing 100 is flat, and a capillary structure 130 is attached to the inner wall of the thermally conductive housing 100 . The fluid can be a low boiling point fluid such as water or a refrigerant. The capillary structure 130 can be a copper woven mesh or copper powder sintered on the thermal shell, which has pores and can absorb liquid working fluid. The thermally conductive housing 100 is divided into a first half-shell 110 and a second half-shell 120 along its thickness direction. The thickness of the first half-shell 110 is preferably smaller than that of the second half-shell 120 . The first half-shell 110 and the second half-shell 120 are both flat and one side is open. The open surfaces of the first half-shell 110 and a second half-shell 120 are opposite to and closed, and the bottom of the first half-shell 110 is closed. It is disposed opposite to the bottom of a second half-shell 120 .

In this embodiment, the heat dissipation module includes a plurality of identical heat pipes 200 . Each heat pipe 200 penetrates through the thermally conductive housing 100 through one side of the edge of the thermally conductive housing 100 to the other side of the edge of the thermally conductive housing 100 . Specifically, corresponding to each heat pipe 200 , the opening edge of the first half-shell 110 is provided with a pair of first cut edges 111 opposite to each other, so each heat pipe 200 is embedded in the pair of first cut edges 111 and penetrates through the first half-shell 110. Preferably, the opening edge of the second half-shell 120 is also provided with a pair of second cut edges 121 opposite to each other corresponding to each heat pipe 200, so that each heat pipe 200 is embedded in the pair of second cut edges 121 and penetrates through the second half. Shell 120. Since the thickness of the first half-shell 110 is smaller than that of the second half-shell 120 , the heat pipe 200 is attached to the inner wall of the bottom of the first half-shell 110 , and the heat pipe 200 is separated from the inner wall of the bottom of the second half-shell 120 .

The middle section of the heat pipe 200 forms a heat absorbing section 210 , the heat absorbing section 210 is accommodated in the heat conducting shell 100 , and the transverse cross-sectional area of the heat absorbing section 210 is smaller than that of the rest of the heat pipe 200 . At least one side of the heat absorbing section 210 is extruded to be flat and attached to the inner wall of the bottom of the first half-shell 110 to facilitate absorbing heat energy from the thermally conductive shell 100 . Moreover, the first half-shell 110 may be used to attach the heat source to improve the heat exchange efficiency between the thermally conductive housing 100 and the heat source. The heat absorption section 210 and the inner wall of the bottom of the second half shell 120 can be separated and configured to facilitate convection of the vaporized working fluid. The heat-absorbing section 210 can also be flat as shown in FIG. 7 , one side of the heat-absorbing section 210 is attached to the inner wall of the first half-shell 110 , and the other side of the heat-absorbing section 210 and the inner wall of the bottom of the second half-shell 120 can be with wider spacing.

As shown in FIG. 8 to FIG. 11 , the thickness of the first half-shell 110 can also be equal to the thickness of the second half-shell 120 , so that the heat absorbing section 210 is also attached to the inner wall of the bottom of the second half-shell 120 to facilitate the self-heating shell 100 to absorb the heat thermal energy.

A plurality of thermally conductive columns 140 are disposed in the thermally conductive housing 100 , and two ends of each thermally conductive column 140 are respectively connected to the inner wall of the bottom of the first half-shell 110 and the inner wall of the bottom of the second half-shell 120 to improve the heat transfer between the two sides of the thermally conductive housing 100 . transmission efficiency. The heat-conducting columns 140 are arranged in the distance between the heat pipes 200 so that the heat-conducting columns 140 are separated from the heat absorbing section 210 , thus facilitating assembly and convection of the working fluid. The capillary structure 130 can coat the outer wall of each thermal conductive column 140 to increase the heat exchange area with the working fluid.

As shown in FIG. 3 , the heat pipe 200 may be directly connected to the inner wall of the bottom of the first half-shell 110 . Different capillary structures 130 may be configured in various ways according to the process of capillary structure 130 . As shown in FIG. 4 , the capillary structure 130 may be connected between the inner wall of the bottom of the first half-shell 110 and the heat pipe 200 . As shown in FIG. 5 and FIG. 6 , the capillary structure 130 may further coat the outer wall of the heat pipe 200 , specifically, the capillary structure 130 coats the heat absorption section 210 .

The above descriptions are only preferred embodiments of this creation, and are not intended to limit the patent scope of this creation. Other equivalent changes using the patent spirit of this creation shall all belong to the patent scope of this creation.

100: Thermally conductive shell 110: First Half Shell 111: The first miss 120: Second half shell 121: The Second Missing 130: capillary structure 140: Thermal column 200: heat pipe 210: Endothermic section

FIG. 1 is a three-dimensional schematic diagram of a heat dissipation module according to a preferred embodiment of the present invention.

FIG. 2 is a schematic exploded perspective view of a heat dissipation module according to a preferred embodiment of the present invention.

FIG. 3 is a transverse cross-sectional view of a heat dissipation module according to a preferred embodiment of the present invention.

FIG. 4 to FIG. 11 are schematic diagrams of various changes of the heat dissipation module of the preferred embodiment of the present invention.

110: First Half Shell

111: The first miss

120: Second half shell

121: The Second Missing

140: Thermal column

200: heat pipe

210: Endothermic section

Claims (14)

A heat dissipation module, comprising: A heat-conducting shell includes a first half-shell and a second half-shell, the first half-shell and the second half-shell are opposite and closed, a capillary structure is attached to the inner wall of the heat-conducting shell, and the heat-conducting shell is filled with injected with a working fluid; and At least one heat pipe runs through the heat conducting shell, wherein the heat pipe is attached to the inner wall of the bottom of the first half shell. The heat dissipation module of claim 1, wherein the opening edge of the first half-shell is provided with a pair of first cut edges opposite to each other, and the heat pipe is embedded in the pair of first cut edges and penetrates the first half shell. The heat dissipation module of claim 1, wherein the opening edge of the second half-shell is provided with a pair of second cut edges arranged opposite to each other, and the heat pipe is embedded in the pair of second cut edges and penetrates the second half shell. The heat dissipation module of claim 1, wherein the capillary structure covers the outer wall of the heat pipe. The heat dissipation module of claim 1, wherein the heat pipe has a heat absorbing section, the heat absorbing section is accommodated in the thermally conductive shell, and the transverse cross-sectional area of the heat absorbing section is smaller than that of the rest of the heat pipe. The heat dissipation module of claim 5, wherein the capillary structure covers the heat absorption section. The heat dissipation module according to claim 5, wherein the heat absorbing section is flat and one side of the heat absorbing section is attached to the inner wall of the first half shell. The heat dissipation module according to claim 5, wherein a plurality of heat conduction columns are arranged in the heat conduction shell, and two ends of each of the heat conduction columns are respectively connected to the inner wall of the first half shell and the inner wall of the second half shell. The heat dissipation module of claim 8, wherein the thermally conductive pillars are disposed separately from the heat absorption section. The heat dissipation module according to claim 8, wherein the capillary structure covers the outer walls of each of the thermally conductive columns. The heat dissipation module according to claim 1, wherein the heat pipes are plural and spaced apart, a plurality of heat conducting columns are arranged in the heat conducting shell, and two ends of each heat conducting column are respectively connected to the inner wall of the first half shell and the second half shell. On the inner wall of the half shell, the heat conduction columns are arranged in the distance between the heat pipes. The heat dissipation module of claim 1, wherein the capillary structure covers the outer walls of each of the thermally conductive columns. The heat dissipation module of claim 1, wherein the heat pipe is disposed separately from the inner wall of the bottom of the second half-shell. The heat dissipation module of claim 1, wherein the heat pipe is attached to the inner wall of the bottom of the second half shell.

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