TWI641309B - Heat dissipation element - Google Patents

Heat dissipation element Download PDF

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TWI641309B
TWI641309B TW105125883A TW105125883A TWI641309B TW I641309 B TWI641309 B TW I641309B TW 105125883 A TW105125883 A TW 105125883A TW 105125883 A TW105125883 A TW 105125883A TW I641309 B TWI641309 B TW I641309B
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heat dissipating
dissipating component
convex
space
plate
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TW105125883A
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TW201806469A (en
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藍文基
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奇鋐科技股份有限公司
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Abstract

一種散熱元件,係包括一第一本體、一第二本體及一第一、二工作流體,其中該第一本體具有一第一空間,且該第一本體一側凸設至少一凸體,該凸體具有一第二空間與該第一空間相連通並共同界定一第一腔室,該第一腔室填充有該第一工作流體,該第二本體具有一第二腔室並填充有該第二工作流體,該第二本體一側與所述凸體一端相連接固定,所述第一腔室與該第二腔室不相連通,透過本發明的設計,不僅可保有較佳的熱傳效率及均溫的效果外,還可大幅減少生產成本。 A heat dissipating component includes a first body, a second body, and a first and second working fluid, wherein the first body has a first space, and the first body has a convex body at a side thereof. The protrusion has a second space in communication with the first space and collectively defines a first chamber, the first chamber is filled with the first working fluid, and the second body has a second chamber and is filled with the a second working fluid, the second body side is fixedly connected to one end of the convex body, and the first chamber is not in communication with the second chamber, and the design of the invention not only retains better heat In addition to the efficiency and uniform temperature effect, the production cost can be greatly reduced.

Description

散熱元件 Heat sink

本發明是有關於一種散熱元件,尤指一種可大幅減少生產成本之效果外還可保有較佳的熱傳效率之散熱元件。 The invention relates to a heat dissipating component, in particular to a heat dissipating component which can greatly reduce the production cost and can maintain better heat transfer efficiency.

按,隨著半導體技術的進步,積體電路的體積亦逐漸縮小,而為了使積體電路能處理更多的資料,相同體積下的積體電路,已經可以容納比以往多上數倍以上的計算元件,當積體電路內的計算元件數量越來越多時執行效率越來越高,因此計算元件工作時所產生的熱能亦越來越大,以常見的中央處理器為例,在高滿載的工作量時,中央處理器散發出的熱度,足以使中央處理器整個燒毀,因此,積體電路的散熱裝置變成為重要的課題。 According to the advancement of semiconductor technology, the volume of the integrated circuit is gradually reduced, and in order to make the integrated circuit can process more data, the integrated circuit under the same volume can accommodate more than several times more than before. Computational components, when the number of computing components in the integrated circuit is increasing, the execution efficiency is getting higher and higher, so the thermal energy generated by the computing components is getting larger and larger, taking the common central processor as an example, at a high level. At full load, the heat generated by the central processing unit is enough to cause the central processor to burn out. Therefore, the heat sink of the integrated circuit becomes an important issue.

電子設備中之中央處理單元及晶片或其他電子元件均係為電子設備中的發熱源,當電子設備運作時,該發熱源將會產生熱量,故現行常使用導熱元件如熱管、均溫板、平板式熱管等具有良好散熱及導熱效能來進行導熱或均溫,其中熱管主要係作為遠端導熱之使用;其係由一端吸附熱量將內部工作流體由液態轉換為汽態蒸發將熱量傳遞至熱管另一端,進而達到熱傳導之目的,而針對熱傳面積較大之部位係會選擇均溫板作為散熱元件,均溫板主要係由與熱源接觸之一側平面吸附熱量,再將熱量傳導至另一側作散熱冷凝。 The central processing unit and the chip or other electronic components in the electronic device are heat sources in the electronic device. When the electronic device operates, the heat source generates heat. Therefore, heat conducting components such as heat pipes and temperature equalizing plates are often used. The flat heat pipe has good heat dissipation and heat conduction performance for heat conduction or even temperature. The heat pipe is mainly used as the remote heat conduction; the heat is transferred from the liquid to the vaporization by the internal working fluid from the liquid to the heat pipe. At the other end, the purpose of heat conduction is achieved, and for the part with a large heat transfer area, the temperature equalizing plate is selected as the heat dissipating component, and the temperature equalizing plate mainly absorbs heat from one side plane in contact with the heat source, and then conducts heat to the other. One side is used for heat dissipation condensation.

然而,由於習知之熱管及均溫板等散熱元件均為單一解決方案之散熱元件,換言之,習知之散熱元件設置於電子設備中僅能針對熱管或均溫板接觸熱源的位 置處進行導熱或均溫等散熱,並無法具有多重如同時具有均溫及遠端導熱的散熱的功能,當然熱交換效率也相對地較差。 However, since the heat-dissipating components such as the heat pipe and the uniform temperature plate are the heat-dissipating components of a single solution, in other words, the conventional heat-dissipating component is disposed in the electronic device and can only contact the heat source or the temperature of the uniform temperature plate. The heat dissipation or the uniform temperature and the like are dissipated, and it is not possible to have multiple functions such as uniform temperature and remote heat conduction. Of course, the heat exchange efficiency is relatively poor.

爰此,為有效解決上述之問題,本發明之主要目的在於提供一種可大幅減少生產成本之散熱元件。 Accordingly, in order to effectively solve the above problems, the main object of the present invention is to provide a heat dissipating component which can greatly reduce the production cost.

本發明之次要目的,在於提供一種可保有熱傳效率及均溫效果之散熱元件。 A secondary object of the present invention is to provide a heat dissipating component that can maintain heat transfer efficiency and uniform temperature effect.

本發明之次要目的,在於提供一種具有遠端散熱效果之散熱元件。 A secondary object of the present invention is to provide a heat dissipating component having a remote heat dissipation effect.

為達上述目的,本發明係提供一種散熱元件係包括一第一本體、一第二本體及一第一、二工作流體,該第一本體具有一第一空間,並其一側凸設至少一凸體,該凸體具有一第二空間並與該第一空間相連通以共同界定有一第一腔室,該第二本體具有一第二腔室,該第二本體一側與所述凸體一端相連接固定,前述之第一腔室與所述第二腔室係不相連通,所述第一工作流體填充於所述第一腔室內,所述第二工作流體填充於該第二腔室內,透過本發明的設計,不僅可保有較佳的熱傳效率及均溫效果,有效增加汽液循環效率外,還可大幅減少生產成本。 To achieve the above objective, the present invention provides a heat dissipating component including a first body, a second body, and a first and second working fluid. The first body has a first space and at least one side of the first body is protruded. a convex body having a second space and communicating with the first space to jointly define a first chamber, the second body having a second chamber, the second body side and the convex body One end is connected and fixed, the first chamber is not in communication with the second chamber, the first working fluid is filled in the first chamber, and the second working fluid is filled in the second chamber Through the design of the invention, not only the better heat transfer efficiency and the uniform temperature effect can be maintained, but also the vapor-liquid circulation efficiency is effectively increased, and the production cost can be greatly reduced.

1‧‧‧散熱元件 1‧‧‧ Heat Dissipation Components

10‧‧‧第一本體 10‧‧‧First Ontology

101‧‧‧第一板體 101‧‧‧ first board

1011‧‧‧凸緣 1011‧‧‧Flange

102‧‧‧第二板體 102‧‧‧Second plate

103‧‧‧第一腔室 103‧‧‧First chamber

103a‧‧‧第一空間 103a‧‧‧First space

103b‧‧‧第二空間 103b‧‧‧Second space

104‧‧‧第一毛細結構 104‧‧‧First capillary structure

105‧‧‧開孔 105‧‧‧Opening

11‧‧‧凸體 11‧‧ ‧ convex

111‧‧‧封閉端 111‧‧‧closed end

112‧‧‧開放端 112‧‧‧Open end

113‧‧‧通孔 113‧‧‧through hole

115‧‧‧第二毛細結構 115‧‧‧Second capillary structure

116‧‧‧凸部 116‧‧‧ convex

117‧‧‧凹槽 117‧‧‧ Groove

12‧‧‧第二本體 12‧‧‧Second ontology

121‧‧‧第三板體 121‧‧‧ Third plate

122‧‧‧第四板體 122‧‧‧fourth plate

123‧‧‧第二腔室 123‧‧‧Second chamber

124‧‧‧第三毛細結構 124‧‧‧ Third capillary structure

13‧‧‧柱體 13‧‧‧Cylinder

131‧‧‧第一頂端 131‧‧‧ first top

132‧‧‧第二頂端 132‧‧‧second top

133‧‧‧第四毛細結構 133‧‧‧Fourth capillary structure

14‧‧‧第一工作流體 14‧‧‧First working fluid

15‧‧‧第二工作流體 15‧‧‧Second working fluid

2‧‧‧熱源 2‧‧‧heat source

3‧‧‧散熱器 3‧‧‧heatsink

第1圖係為本發明散熱元件之第一實施例之立體分解圖;第2圖係為本發明散熱元件之第一實施例之立體組合圖;第3圖係為本發明散熱元件之第一實施例之剖面圖;第4圖係為本發明散熱元件之第一實施例之局部放大圖;第5圖係為本發明散熱元件之第一實施例之實施示意圖;第6圖係為本發明散熱元件之第二實施例之實施示意圖; 第7圖係為本發明散熱元件之第三實施例之立體分解圖;第8圖係為本發明散熱元件之第三實施例之立體組合圖;第9圖係為本發明散熱元件之第三實施例之剖面圖;第10圖係為本發明散熱元件之第三實施例之局部放大圖;第11圖係為本發明散熱元件之第四實施例之立體分解圖;第12圖係為本發明散熱元件之第四實施例之立體組合圖;第13圖係為本發明散熱元件之第四實施例之剖面圖;第14圖係為本發明散熱元件之第四實施例之局部放大圖;第15圖係為本發明散熱元件之第五實施例之俯視剖面圖;第16圖係為本發明散熱元件之第五實施例之剖面圖;第17圖係為本發明散熱元件之第六實施例之俯視剖面圖;第18圖係為本發明散熱元件之第六實施例之剖面圖。 1 is a perspective exploded view of a first embodiment of a heat dissipating component of the present invention; FIG. 2 is a perspective assembled view of a first embodiment of the heat dissipating component of the present invention; and FIG. 3 is the first heat dissipating component of the present invention. FIG. 4 is a partial enlarged view of a first embodiment of a heat dissipating component of the present invention; FIG. 5 is a schematic view of the first embodiment of the heat dissipating component of the present invention; A schematic diagram of the implementation of the second embodiment of the heat dissipating component; 7 is a perspective exploded view of a third embodiment of the heat dissipating component of the present invention; FIG. 8 is a perspective assembled view of a third embodiment of the heat dissipating component of the present invention; and FIG. 9 is a third heat dissipating component of the present invention. FIG. 10 is a partially enlarged view of a third embodiment of a heat dissipating component of the present invention; FIG. 11 is an exploded perspective view of a fourth embodiment of the heat dissipating component of the present invention; FIG. 13 is a cross-sectional view showing a fourth embodiment of the heat dissipating component of the present invention; and FIG. 14 is a partially enlarged view showing a fourth embodiment of the heat dissipating component of the present invention; Figure 15 is a plan sectional view showing a fifth embodiment of the heat dissipating component of the present invention; Figure 16 is a cross-sectional view showing a fifth embodiment of the heat dissipating component of the present invention; and Figure 17 is a sixth embodiment of the heat dissipating component of the present invention. FIG. 18 is a cross-sectional view showing a sixth embodiment of the heat dissipating member of the present invention.

本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

請參閱第1、2、3、4圖,係為本發明散熱元件之第一實施例之立體分解圖及立體組合圖及剖面圖及局部放大圖,如圖所示,一種散熱元件1係包括一第一本體10、一第二本體12、一第一工作流體14及一第二工作流體15,其中該第一本體10具有一第一板體101及一第二板體102,該第一、二板體101、102係對應蓋合並共同界定一第一空間103a,該第一板體101向上(即向外)凸設至少一凸體11,換言之,該凸體11係由該第一板體101凸伸形成的一體成型之結構,所述凸體11係利用機械加工對該第一板體101施予一壓力而形成的,該凸體11具有一第二空間103b,所述第一、二空間103a、103b共同界定形成一第一腔室103,於該第一 腔室103之內壁設有一第一毛細結構104,所述第二空間103b與該第一空間103a係彼此相互連通,於本實施例中,該凸體11係以一個做說明,但並不侷限於此,於具體實施時,前述凸體11的數量可依照使用者的需求及設計調整為一個或一個以上;所述第二本體12具有一第三板體121及一第四板體122,該第三、四板體121、122係對應蓋合並共同界定一第二腔室123,於該第二腔室123內壁設有一第三毛細結構124,該第三板體121係與所述凸體11之一端相互連接固定,其中,該凸體11之一端與該第三板體121相連接固定之方式係可選擇為焊接、機械加工或膠黏或直接貼合等方式其中任一種方式,但並不引以為限,使用者也可使用其他等效之方式進行接合固定,前述之第一腔室103與該第二腔室123係不相連通;所述第一工作流體14係填充於所述第一腔室103內,所述第二工作流體15係填充於所述第二腔室123內,所述第一、二工作流體14、15可係為純水、無機化合物、醇類、酮類、液態金屬、冷煤或有機化合物其中任一;前述第一、三毛細結構104、124係選擇為網目、纖維體、燒結粉末體、網目及燒結粉末組合或微溝槽等其中任一或複數組合搭配亦可;前述之第一、二本體10、12可選擇一均溫板或一熱板,但並不侷限於此,於具體實施時也可以是其他等效物。 Please refer to the figures 1 , 2 , 3 and 4 , which are perspective exploded views and sectional views and partial enlarged views of the first embodiment of the heat dissipating component of the present invention. As shown, a heat dissipating component 1 includes a first body 10, a second body 12, a first working fluid 14 and a second working fluid 15, wherein the first body 10 has a first plate body 101 and a second plate body 102, the first The two plates 101 and 102 are combined to form a first space 103a corresponding to the cover, and the first plate body 101 protrudes upward (ie, outwardly) at least one protrusion 11 , in other words, the protrusion 11 is formed by the first The integrally formed structure is formed by the protrusion of the plate body 101. The protrusion 11 is formed by applying a pressure to the first plate body 101 by mechanical processing. The protrusion 11 has a second space 103b. The first and second spaces 103a and 103b collectively define a first chamber 103, and the first The inner wall of the chamber 103 is provided with a first capillary structure 104, and the second space 103b and the first space 103a are in communication with each other. In the embodiment, the convex body 11 is described as one, but not In this embodiment, the number of the protrusions 11 can be adjusted to one or more according to the needs and design of the user. The second body 12 has a third plate 121 and a fourth plate 122. The third and fourth plates 121 and 122 are combined to form a second chamber 123 corresponding to the cover, and a third capillary structure 124 is disposed on the inner wall of the second chamber 123. One end of the convex body 11 is fixedly connected to each other, and one end of the convex body 11 is fixedly connected to the third plate body 121 in a manner of welding, machining, or adhesive or direct bonding. The manner, but not limited to the limit, the user may also use other equivalent means for the joint fixation, the first chamber 103 and the second chamber 123 are not in communication; the first working fluid 14 Filled in the first chamber 103, the second working fluid 15 Filled in the second chamber 123, the first and second working fluids 14, 15 may be pure water, inorganic compounds, alcohols, ketones, liquid metals, cold coal or organic compounds; The first and third capillary structures 104 and 124 are selected from the group consisting of a mesh, a fibrous body, a sintered powder body, a mesh and a sintered powder combination or a micro-groove, and the like, and the first and second bodies 10, 12 may select a temperature equalizing plate or a hot plate, but is not limited thereto, and may be other equivalents in specific implementations.

續請一併參閱第5圖,透過本發明此結構的設計,當所述第一本體10之第二板體102接觸一熱源2(例如CPU、MCU、圖形處理器或其他會產生發熱之電子元件或線圈等等)時,且所述第一、二本體10、12之間設置有至少一散熱器(散熱鰭片)3;當散熱時,設置於該第一腔室103內的液態第一工作流體14因受熱會形成汽態第一工作流體14,此時,一部份的汽態第一工作流體14會朝向該第一空間103a的方向移動,該汽態第一工作流體14於該第一空間103a靠近該第一板體101時會因 均溫及外部散熱器3的作用將汽態第一工作流體14冷凝轉化為液態第一工作流體14,之後再藉由該第一腔室103內壁設置的第一毛細結構104將液態第一工作流體14毛細回流至所述第一空間103a內繼續循環,而前述另一部分之汽態第一工作流體14則分流至第二空間103b,透過凸體11令該汽態第一工作流體14將熱傳導至所述第二本體12進行散熱,使之具有遠端散熱之特性。 Continuing to refer to FIG. 5, through the design of the structure of the present invention, when the second board 102 of the first body 10 contacts a heat source 2 (such as a CPU, an MCU, a graphics processor, or other electrons that generate heat) At least one heat sink (heat sink fin) 3 is disposed between the first and second bodies 10, 12; and the liquid state disposed in the first chamber 103 when dissipating heat A working fluid 14 forms a vaporous first working fluid 14 due to heat. At this time, a portion of the vaporous first working fluid 14 moves toward the first space 103a, and the vaporous first working fluid 14 When the first space 103a is close to the first plate 101, the cause is The uniform temperature and the action of the external heat sink 3 condense and convert the vaporous first working fluid 14 into the liquid first working fluid 14, and then the liquid first through the first capillary structure 104 disposed on the inner wall of the first chamber 103. The working fluid 14 is capillaryly recirculated into the first space 103a to continue to circulate, and the other portion of the vaporous first working fluid 14 is branched to the second space 103b, and the vaporous first working fluid 14 is passed through the convex body 11 The heat is transferred to the second body 12 for heat dissipation to have the characteristics of remote heat dissipation.

請參閱第6圖並一併參閱第1、2、3圖,係為本發明散熱元件之第二實施例之實施示意圖,所述散熱元件部份元件及元件間之相對應之關係與前述散熱元件相同,故在此不再贅述,惟本散熱元件與前述最主要之差異為,於所述第二本體12的第四板體122上再貼設有前述之散熱器3,藉由與空氣接觸面積較大的散熱器3,使於該第四板體122的熱更能得以迅速傳導至空氣中,提升整體散熱元件1的冷凝效率。 Please refer to FIG. 6 and refer to the first, second, and third figures, which are schematic diagrams of the second embodiment of the heat dissipating component of the present invention, the corresponding components of the heat dissipating component and the corresponding relationship between the components and the heat dissipation. The components are the same, so the details are not described here, but the main difference between the heat dissipating component and the foregoing is that the heat sink 3 is attached to the fourth plate 122 of the second body 12 by using the air. The heat sink 3 having a larger contact area enables the heat of the fourth plate body 122 to be more quickly transmitted to the air, thereby improving the condensation efficiency of the overall heat dissipating component 1.

請參閱第7、8、9、10圖,係為本發明散熱元件之第三實施例之立體分解圖及立體組合圖及剖面圖及局部放大圖,所述散熱元件部份元件及元件間之相對應之關係與前述散熱元件相同,故在此不再贅述,惟本散熱元件與前述最主要之差異為,所述第一板體101開設至少一開孔105,該開孔105連通該第一空間103a,所述凸體11更具有一封閉端111及一開放端112並共同界定所述第二空間103b,該開放端112與該開孔105相互連接,以令該第二空間103b與該第一空間103a相連通,於該第二空間103b內壁更設有一第二毛細結構115,並該第二毛細結構115與所述第一毛細結構104相毛細連接;其中,前述所稱的「毛細連接」係指該第一毛細結構104的多孔隙連通該凸體11的第二毛細結構115的多孔隙,使得毛細力能從該凸體11的第二毛細結構115傳遞或延伸到該第一毛細結構104,因此冷卻的第一工作流體14可以藉由毛細力及重力從該凸體11的第二毛細結構115回流該第一毛細結構104,進而回到第一空間103a內,所述第二毛細結構115係選擇為網目、纖維體、燒結粉末體、網目及 燒結粉末組合或微溝槽等,為具有多孔隙的結構能提供毛細力驅動該工作流體流動;於本實施例中,於所述第一板體101更向上凸伸有一凸緣1011,該凸緣1011係相對應凸設於所述開孔105之周緣,透過該凸緣1011可有效增加與該凸體11的結合面積,藉以讓凸體11可穩固緊密結合於該第一本體10上;於本實施例中,所述凸體11係為一熱管,但並不侷限於此,於具體實施時也可以是其他等效物,換言之,本實施例與前述第一實施例之差異為,所述凸體11與第一板體101係為兩不相同之元件相結合而形成該第一本體10,並組合所述第二本體12進以形成本案之散熱元件1,同樣也可達到前述之功效。 Please refer to FIGS. 7, 8, 9, and 10, which are perspective exploded view, sectional view, and partial enlarged view of a third embodiment of the heat dissipating component of the present invention. The corresponding relationship is the same as that of the heat dissipating component. Therefore, the difference between the heat dissipating component and the main difference is that the first plate body 101 has at least one opening 105, and the opening 105 communicates with the first portion. a space 103a, the protrusion 11 further has a closed end 111 and an open end 112 and jointly define the second space 103b. The open end 112 and the opening 105 are connected to each other to make the second space 103b and The first space 103a is in communication with the second space 103, and the second capillary structure 115 is connected to the first capillary structure 104; wherein, the aforementioned By "capillary connection" is meant the porosity of the second capillary structure 115 of the first capillary structure 104 that communicates with the second capillary structure 115 of the projection 11 such that capillary forces can be transferred or extended from the second capillary structure 115 of the projection 11. First capillary structure 104, thus cooling A working fluid 14 can be returned from the second capillary structure 115 of the convex body 11 by capillary force and gravity to the first space 103a, and the second capillary structure 115 is selected as a mesh. , fibrous body, sintered powder body, mesh and A sintered powder combination or a micro-groove or the like can provide a capillary force to drive the flow of the working fluid for the structure having a plurality of pores; in the embodiment, a flange 1011 is protruded upward from the first plate body 101, and the convex The edge 1011 is correspondingly disposed on the periphery of the opening 105. The flange 1011 can effectively increase the bonding area with the protrusion 11, so that the protrusion 11 can be firmly and tightly coupled to the first body 10; In this embodiment, the convex body 11 is a heat pipe, but is not limited thereto, and may be other equivalents in a specific implementation. In other words, the difference between the present embodiment and the foregoing first embodiment is that The convex body 11 and the first plate body 101 are combined with two different components to form the first body 10, and the second body 12 is combined to form the heat dissipating component 1 of the present invention. The effect.

請參閱第11、12、13、14圖並一併參閱第7、8、9圖,係為本發明散熱元件之第四實施例之立體分解圖及立體組合圖及剖面圖及局部放大圖,所述散熱元件部份元件及元件間之相對應之關係與前述散熱元件相同,故在此不再贅述,惟本散熱元件與前述最主要之差異為,所述凸體11之開放端112係抵頂至該第二板體102之內側壁,以令該凸體11之第二毛細結構115與該第一本體10之第一毛細結構104垂直接觸毛細連接,該凸體11之開放端112開設至少一通孔113,以令該第一空間103a的第一工作流體14透過該通孔113可流至所述第二空間103b,進以完成散熱元件1內部之汽液循環之散熱作用,達到較佳的熱傳效率及均溫的效果。請參閱第15、16圖,係為本發明散熱元件之第五實施例之俯視剖面圖及剖面圖,所述散熱元件部份元件及元件間之相對應之關係與前述散熱元件相同,故在此不再贅述,惟本散熱元件與前述最主要之差異為,所述凸體11的內壁形成有複數凸部116,該等凸部116環形陣列並軸向延伸設置於該凸體11內壁,該等凸部116間具有至少一凹槽117,如第15圖係為俯視觀察該凸體11內部之結構,該等凸部116相互環形間隔排列,以形成類似齒輪狀,但並不侷限於此,相鄰設置的凸部116也可為非等距排列,該等凹槽117也可形成其他形狀,並該第一毛細結 構104形成在該等凸部116及該等凹槽117表面上,由於所述凸部116及凹槽117增加了該凸體11內壁的表面積,因此該凸體11內壁表面上的第一毛細結構104的孔隙數量也增加,進以提升該第一工作流體14於所述第一腔室103內的汽液循環的作用,達到較佳的散熱效果。 Please refer to Figures 11, 12, 13, and 14 and refer to Figures 7, 8, and 9 for a perspective view, a perspective view, a cross-sectional view, and a partial enlarged view of a fourth embodiment of the heat dissipating component of the present invention. The corresponding relationship between the components of the heat dissipating component and the components is the same as that of the heat dissipating component, and therefore will not be described herein. However, the main difference between the heat dissipating component and the foregoing is that the open end 112 of the protruding body 11 is Abutting against the inner side wall of the second plate body 102 such that the second capillary structure 115 of the protrusion 11 is in capillary contact with the first capillary structure 104 of the first body 10, and the open end 112 of the protrusion 11 Opening at least one through hole 113, so that the first working fluid 14 of the first space 103a can flow through the through hole 113 to the second space 103b, so as to complete the heat dissipation of the vapor-liquid circulation inside the heat dissipating component 1 Better heat transfer efficiency and uniform temperature effect. 15 and FIG. 16 are a top cross-sectional view and a cross-sectional view of a fifth embodiment of the heat dissipating component of the present invention. The corresponding relationship between the components and components of the heat dissipating component is the same as that of the heat dissipating component. Therefore, the main difference between the heat dissipating component and the foregoing is that the inner wall of the convex body 11 is formed with a plurality of convex portions 116, and the convex portions 116 are annularly arrayed and axially extended in the convex body 11. The wall has at least one groove 117 between the convex portions 116. As shown in Fig. 15, the structure of the convex body 11 is viewed from a plan view. The convex portions 116 are annularly spaced from each other to form a gear-like shape, but To be limited thereto, the adjacently disposed protrusions 116 may also be non-equidistantly arranged, and the grooves 117 may also form other shapes, and the first capillary knot The structure 104 is formed on the surfaces of the convex portions 116 and the grooves 117. Since the convex portions 116 and the grooves 117 increase the surface area of the inner wall of the convex body 11, the surface on the inner wall surface of the convex body 11 The number of pores of a capillary structure 104 also increases, and the effect of increasing the vapor-liquid circulation of the first working fluid 14 in the first chamber 103 is achieved to achieve a better heat dissipation effect.

請參閱第17、18圖,係為本發明散熱元件之第六實施例之俯視剖面圖及剖面圖,所述散熱元件部份元件及元件間之相對應之關係與前述散熱元件相同,故在此不再贅述,惟本散熱元件與前述最主要之差異為,所述第一腔室103內設置有一柱體13,該柱體13具有一第一頂端131及一第二頂端132,該第一、二頂端131、132分別延伸連接所述第二板體102的內壁及凸體11之封閉端111的內壁,該柱體13表面設有一第四毛細結構133,其係選擇為網目、纖維體、燒結粉末體、網目及燒結粉末組合或微溝槽其中任何一種,且第四毛細結構133與所述第一毛細結構104相互接觸連接,藉此位於第二空間103b的該第一工作流體14除了可透過該凸體11的第一毛細結構104回流之外,也可從該第四毛細結構133進行回流,進以提升該第一工作流體14於所述第一腔室103內的汽液循環的作用,達到較佳的散熱效果。 17 and 18 are top cross-sectional views and cross-sectional views of a sixth embodiment of the heat dissipating component of the present invention. The corresponding relationship between the components and components of the heat dissipating component is the same as that of the heat dissipating component. Therefore, the main difference between the heat dissipating component and the foregoing is that the first chamber 103 is provided with a cylinder 13 having a first top end 131 and a second top end 132. The first and second ends 131 and 132 respectively extend to connect the inner wall of the second plate body 102 and the inner wall of the closed end 111 of the protrusion 11. The surface of the column 13 is provided with a fourth capillary structure 133, which is selected as a mesh. Any one of a fibrous body, a sintered powder body, a mesh and a sintered powder combination or a micro-groove, and the fourth capillary structure 133 and the first capillary structure 104 are in contact with each other, whereby the first portion of the second space 103b is located The working fluid 14 can be recirculated from the fourth capillary structure 133 in addition to being permeable to the first capillary structure 104 of the protrusion 11 to enhance the first working fluid 14 in the first chamber 103. The role of the vapor-liquid cycle, to achieve better Cooling effect.

以上所述,本發明相較於習知具有下列優點:1.大幅降低生產成本;2.保有較佳的熱傳效率及均溫效果;3.具有遠端散熱之功效。 As described above, the present invention has the following advantages as compared with the prior art: 1. greatly reducing the production cost; 2. maintaining better heat transfer efficiency and uniform temperature effect; 3. having the effect of remote heat dissipation.

以上已將本發明做一詳細說明,惟以上所述者,僅為本發明之一較佳實施例而已,當不能限定本發明實施之範圍。即凡依本發明申請範圍所作之均等變化與修飾等,皆應仍屬本發明之專利涵蓋範圍。 The present invention has been described in detail above, but the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention. That is, the equivalent changes and modifications made by the scope of the present application should remain within the scope of the patent of the present invention.

Claims (16)

一種散熱元件,係包括:一第一本體,係為一均溫板或一熱板,該第一本體具有一第一空間,該第一本體一側凸設至少一凸體,該凸體具有一第二空間與該第一空間相連通,所述第一、二空間共同界定形成一第一腔室;一第二本體,係為一均溫板或一熱板,該第二本體具有一第二腔室,該第二本體一側與所述凸體一端相連接固定,並所述第一腔室與所述第二腔室不相連通;一第一工作流體,係填充於所述第一腔室內;及一第二工作流體,係填充於所述第二腔室內。A heat dissipating component comprises: a first body, which is a temperature equalizing plate or a hot plate, the first body has a first space, and the first body has a convex body at one side, the convex body has a second space is connected to the first space, the first and second spaces are jointly defined to form a first chamber; a second body is a temperature equalizing plate or a hot plate, and the second body has a a second chamber, the second body side is fixedly connected to one end of the convex body, and the first chamber is not in communication with the second chamber; a first working fluid is filled in the a first working chamber; and a second working fluid filled in the second chamber. 如申請專利範圍第1項所述之散熱元件,其中所述凸體係由該第一本體一側向上凸伸一體成型而形成。The heat dissipating component of claim 1, wherein the convex system is formed by integrally forming one side of the first body and protruding upward. 如申請專利範圍第2項所述之散熱元件,其中係利用機械加工對該第一本體施予一壓力以形成所述凸體。The heat dissipating component of claim 2, wherein the first body is subjected to a pressure by machining to form the protrusion. 如申請專利範圍第1項所述之散熱元件,其中所述第一本體一側開設至少一開孔,該開孔連通該第一空間,所述凸體更具有一封閉端及一開放端並共同界定所述第二空間,該開放端連接該開孔,以令該第二空間與該第一空間相連通。The heat dissipating component of claim 1, wherein the first body side has at least one opening, the opening is connected to the first space, and the convex body has a closed end and an open end. The second space is defined together, and the open end is connected to the opening to connect the second space with the first space. 如申請專利範圍第4項所述之散熱元件,其中所述第一本體更具有一第一板體及一第二板體,該第一、二板體對應蓋合並共同界定所述第一腔室,所述凸體係凸設於該第一板體上。The heat dissipating component of claim 4, wherein the first body further has a first plate body and a second plate body, and the first and second plate bodies are combined to jointly define the first cavity. a convex system protruding from the first plate. 如申請專利範圍第5項所述之散熱元件,其中所述開孔係開設於該第一板體上。The heat dissipating component of claim 5, wherein the opening is formed on the first plate. 如申請專利範圍第5項所述之散熱元件,其中所述第二本體更具有一第三板體及一第四板體,該第三、四板體對應蓋合並共同界定所述第二腔室,所述凸體之封閉端係與該第三板體相連接固定。The heat dissipating component of claim 5, wherein the second body further has a third plate body and a fourth plate body, wherein the third and fourth plate bodies are combined to jointly define the second cavity. The closed end of the convex body is fixedly connected to the third plate body. 如申請專利範圍第7項所述之散熱元件,其中所述第一腔室之內壁具有一第一毛細結構,所述第二腔室之內壁具有一第三毛細結構。The heat dissipating component of claim 7, wherein the inner wall of the first chamber has a first capillary structure, and the inner wall of the second chamber has a third capillary structure. 如申請專利範圍第8項所述之散熱元件,其中所述第一空間之內壁具有所述第一毛細結構,該第二空間之內壁更具有一第二毛細結構,該第一毛細結構與該第二毛細結構相毛細連接。The heat dissipating component of claim 8, wherein the inner wall of the first space has the first capillary structure, and the inner wall of the second space further has a second capillary structure, the first capillary structure It is capillaryly connected to the second capillary structure. 如申請專利範圍第9項所述之散熱元件,其中所述第一、二、三毛細結構係選擇為網目、纖維體、燒結粉末體、網目及燒結粉末組合或微溝槽其中任一或複數的組配者。The heat dissipating component according to claim 9, wherein the first, second, and third capillary structures are selected from the group consisting of a mesh, a fibrous body, a sintered powder body, a mesh, a sintered powder combination, or a microgroove. The composition of the group. 如申請專利範圍第10項所述之散熱元件,其中所述凸體之開放端係抵頂至該第二板體之內側壁,該凸體之開放端開設至少一通孔,以令該第一空間透過該通孔與所述第二空間相連通。The heat dissipating component of claim 10, wherein the open end of the convex body abuts against the inner side wall of the second plate body, and the open end of the convex body defines at least one through hole to make the first The space communicates with the second space through the through hole. 如申請專利範圍第7項所述之散熱元件,其中所述第一板體更向上凸伸有一凸緣,該凸緣係相對應凸設於所述開孔之周緣。The heat dissipating component of claim 7, wherein the first plate body protrudes upwardly from a flange, and the flange is correspondingly protruded from a periphery of the opening. 如申請專利範圍第7項所述之散熱元件,其中所述凸體之封閉端與該第三板體相連接固定之方式係選擇為焊接、機械加工或膠黏或直接貼合等方式其中任一。The heat dissipating component of claim 7, wherein the closed end of the convex body is fixedly connected to the third plate body by means of welding, machining or glue or direct bonding. One. 如申請專利範圍第10項所述之散熱元件,其中所述凸體的內壁形成有複數凸部,該等凸部環形陣列並軸向延伸設置於該內壁,該等凸部間具有至少一凹槽,該第一毛細結構係形成在該等凸部及該等凹槽上。The heat dissipating component of claim 10, wherein the inner wall of the convex body is formed with a plurality of convex portions, and the annular array of the convex portions is axially extended and disposed on the inner wall, and at least the convex portions have at least A groove, the first capillary structure is formed on the protrusions and the grooves. 如申請專利範圍第10項所述之散熱元件,其中所述第一腔室內設置有一柱體,該柱體具有一第一頂端及一第二頂端,該第一、二頂端分別延伸連接所述第二板體及凸體之封閉端,該柱體表面設有一第四毛細結構,該第四毛細結構連接所述第一毛細結構,該第四毛細結構係選擇為網目、纖維體、燒結粉末體、網目及燒結粉末組合或微溝槽其中任一。The heat dissipating component of claim 10, wherein the first chamber is provided with a cylinder, the cylinder has a first top end and a second top end, and the first and second top ends respectively extend to connect the a closed end of the second plate body and the convex body, the surface of the column body is provided with a fourth capillary structure, the fourth capillary structure is connected to the first capillary structure, and the fourth capillary structure is selected as a mesh, a fiber body, and a sintered powder. Any combination of body, mesh and sintered powder or micro-trench. 如申請專利範圍第4項所述之散熱元件,其中所述凸體係為一熱管。The heat dissipating component of claim 4, wherein the convex system is a heat pipe.
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TW200624030A (en) * 2004-10-21 2006-07-01 Hewlett Packard Development Co Twin fin arrayed cooling device with heat spreader
TW201317532A (en) * 2011-10-21 2013-05-01 Sunonwealth Electr Mach Ind Co Heat-dissipating device
TWM525477U (en) * 2016-04-21 2016-07-11 Asia Vital Components Co Ltd Heat dissipation apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200624030A (en) * 2004-10-21 2006-07-01 Hewlett Packard Development Co Twin fin arrayed cooling device with heat spreader
TW201317532A (en) * 2011-10-21 2013-05-01 Sunonwealth Electr Mach Ind Co Heat-dissipating device
TWM525477U (en) * 2016-04-21 2016-07-11 Asia Vital Components Co Ltd Heat dissipation apparatus

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