TWI598562B - Heat dissipation component - Google Patents

Heat dissipation component Download PDF

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Publication number
TWI598562B
TWI598562B TW105112503A TW105112503A TWI598562B TW I598562 B TWI598562 B TW I598562B TW 105112503 A TW105112503 A TW 105112503A TW 105112503 A TW105112503 A TW 105112503A TW I598562 B TWI598562 B TW I598562B
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Taiwan
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chamber
heat dissipating
dissipating component
plate body
connecting portion
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TW105112503A
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Chinese (zh)
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TW201738523A (en
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藍文基
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奇鋐科技股份有限公司
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散熱元件 Heat sink

本發明是有關於一種散熱元件,尤指一種具有多重散熱效果且可大幅提升熱交換效率之散熱元件。 The invention relates to a heat dissipating component, in particular to a heat dissipating component which has multiple heat dissipating effects and can greatly improve heat exchange efficiency.

按,隨著半導體技術的進步,積體電路的體積亦逐漸縮小,而為了使積體電路能處理更多的資料,相同體積下的積體電路,已經可以容納比以往多上數倍以上的計算元件,當積體電路內的計算元件數量越來越多時執行效率越來越高,因此計算元件工作時所產生的熱能亦越來越大,以常見的中央處理器為例,在高滿載的工作量時,中央處理器散發出的熱度,足以使中央處理器整個燒毀,因此,積體電路的散熱裝置變成為重要的課題。 According to the advancement of semiconductor technology, the volume of the integrated circuit is gradually reduced, and in order to make the integrated circuit can process more data, the integrated circuit under the same volume can accommodate more than several times more than before. Computational components, when the number of computing components in the integrated circuit is increasing, the execution efficiency is getting higher and higher, so the thermal energy generated by the computing components is getting larger and larger, taking the common central processor as an example, at a high level. At full load, the heat generated by the central processing unit is enough to cause the central processor to burn out. Therefore, the heat sink of the integrated circuit becomes an important issue.

電子設備中之中央處理單元及晶片或其他電子元件均係為電子設備中的發熱源,當電子設備運作時,該發熱源將會產生熱量,故現行常使用導熱元件如熱管、均溫板、平板式熱管等具有良好散熱及導熱效能來進行導熱或均溫,其中熱管主要係作為遠端導熱之使用;其係由一端吸附熱量將內部工作流體由液態轉換為汽態蒸發將熱量傳遞至熱管另一端,進而達到熱傳導之目的,而針對熱傳面積較大之部位係會選擇均溫板作為散熱元件,均溫板主要係由與熱源接觸之一側平面吸附熱量,再將熱量傳導至另一側作散熱冷凝。 The central processing unit and the chip or other electronic components in the electronic device are heat sources in the electronic device. When the electronic device operates, the heat source generates heat. Therefore, heat conducting components such as heat pipes and temperature equalizing plates are often used. The flat heat pipe has good heat dissipation and heat conduction performance for heat conduction or even temperature. The heat pipe is mainly used as the remote heat conduction; the heat is transferred from the liquid to the vaporization by the internal working fluid from the liquid to the heat pipe. At the other end, the purpose of heat conduction is achieved, and for the part with a large heat transfer area, the temperature equalizing plate is selected as the heat dissipating component, and the temperature equalizing plate mainly absorbs heat from one side plane in contact with the heat source, and then conducts heat to the other. One side is used for heat dissipation condensation.

然而,由於習知之熱管及均溫板等散熱元件均為單一解決方案之散熱元件,換言之,習知之散熱元件設置於電子設備中僅能針對熱管或均溫板接觸熱源的位 置處進行導熱或均溫等散熱,並無法具有多重如同時具有均溫及遠端導熱的散熱的功能,當然熱交換效率也相對地較差。 However, since the heat-dissipating components such as the heat pipe and the uniform temperature plate are the heat-dissipating components of a single solution, in other words, the conventional heat-dissipating component is disposed in the electronic device and can only contact the heat source or the temperature of the uniform temperature plate. The heat dissipation or the uniform temperature and the like are dissipated, and it is not possible to have multiple functions such as uniform temperature and remote heat conduction. Of course, the heat exchange efficiency is relatively poor.

爰此,為有效解決上述之問題,本發明之主要目的在於提供一種具有多重散熱效果之散熱元件。 Accordingly, in order to effectively solve the above problems, the main object of the present invention is to provide a heat dissipating component having multiple heat dissipation effects.

本發明之次要目的,在於提供一種可大幅提升熱交換效率之散熱元件。 A secondary object of the present invention is to provide a heat dissipating component that can greatly improve heat exchange efficiency.

為達上述目的,本發明係提供一種散熱元件係包括一第一本體、一第二本體、一第一管體、一第三本體、一第二管體、一工作流體,該第一本體具有一第一板體及一第二板體,該第一、二板體對應蓋合並共同界定一第一腔室,並於該第一腔室設有一第一毛細結構,於該第二板體處開設一第一連接部,該第二本體具有一第三板體及一第四板體,該第三、四板體對應蓋合並共同界定一第二腔室,並於該第二腔室設有一第二毛細結構,於該第三板體處開設一第二連接部,該第一管體具有一第一端及一第二端及一第一流道,並於該第一管體內之管壁設有一第四毛細結構,該第一端對接所述第一連接部並抵頂至所述第一板體之內側壁,該第二端對接所述第二連接部並抵頂至所述第四板體內側壁,並令該第四毛細結構與所述第一、二毛細結構相毛細連接,所述第一管體之第一端開設至少一第一通孔連通該第一腔室,所述第一管體之第二端開設至少一第二通孔連通該第二腔室,以令該第一流道透過所述第一、二通孔與所述第一、二腔室相連通,於所述第四板體處對應該第二連接部更開設一第三連接部,所述第三本體更具有一第五板體及一第六板體,該第五、六板體對應蓋合並共同界定一第三腔室,並於該第三腔室設有一第三毛細結構,於該第五板體處開設一第四連接部,所述第二管體具有一第三端及一第四端及一第二流道,並於該 第二管體內之管壁設有一第五毛細結構,該第三端係貫設所述第一、二、三連接部並穿設該第一流道且抵頂至所述第一板體之內側壁,所述第四端對接所述第四連接部並抵頂至所述第六板體之內側壁,並令該第五毛細結構與所述第一、三毛細結構相毛細連接,所述第二管體之第三端開設至少一第三通孔連通該第一腔室,所述第二管體之第四端開設至少一第四通孔連通該第三腔室,以令該第二流道透過所述第三、四通孔與所述第一、三腔室相連通,且所述第二管體之管徑係小於該第一管體之管徑。 In order to achieve the above object, the present invention provides a heat dissipating component including a first body, a second body, a first tube body, a third body, a second tube body, and a working fluid, the first body having a first plate body and a second plate body, wherein the first and second plates correspond to the cover to jointly define a first chamber, and the first chamber is provided with a first capillary structure, and the second plate body a first connecting portion is disposed, the second body has a third plate body and a fourth plate body, and the third and fourth plates correspond to the cover to jointly define a second chamber, and the second chamber a second capillary structure is disposed, and a second connecting portion is disposed at the third plate body, the first tubular body has a first end and a second end and a first flow channel, and is in the first tubular body The tube wall is provided with a fourth capillary structure, the first end abuts the first connecting portion and abuts against an inner side wall of the first plate body, the second end abuts the second connecting portion and abuts against the Determining the inner side wall of the fourth plate and causing the fourth capillary structure to be capillaryly connected to the first and second capillary structures, The first end of the first tube has at least one first through hole communicating with the first chamber, and the second end of the first tube defines at least one second through hole communicating with the second chamber to make the first flow The first and second through holes communicate with the first and second chambers, and a third connecting portion is further disposed at the fourth plate body corresponding to the second connecting portion, the third body is further Having a fifth plate body and a sixth plate body, the fifth and sixth plate bodies correspondingly define a third chamber, and a third capillary structure is disposed on the third chamber. a fourth connecting portion is disposed at the body, the second pipe body has a third end and a fourth end and a second flow path, and a tube wall of the second tube is provided with a fifth capillary structure, the third end is disposed through the first, second and third connecting portions and passes through the first flow path and abuts into the first plate body a side wall, the fourth end abuts the fourth connecting portion and abuts against an inner side wall of the sixth plate body, and causes the fifth capillary structure to be capillaryly connected to the first and third capillary structures, The third end of the second tube defines at least one third through hole communicating with the first chamber, and the fourth end of the second tube defines at least one fourth through hole communicating with the third chamber to enable the third portion The second flow passage communicates with the first and third chambers through the third and fourth through holes, and the diameter of the second tubular body is smaller than the diameter of the first tubular body.

透過本發明此結構的設計,當所述散熱元件之第一本體接觸所述熱源時,其設置於該第一腔室內的液態工作流體遇熱會形成汽態工作流體,接著,一部份之汽態工作流體會經由該第一管體之第一通孔通過該第一流道流至所述第二腔室內,且該汽態工作流體於該第二腔室內會冷凝轉化為液態工作流體後,並藉由所述第二、四毛細結構回流至第一腔室內繼續循環,而另部份之汽態工作流體則會經由該第一管體之第一通孔通過該第二流道流至所述第三腔室內,且該汽態工作流體於該第三腔室內也同樣會冷凝轉化為液態工作流體後,並藉由所述第三、五毛細結構回流至第一腔室內繼續循環,並與設置於該第一、二本體之間及第二、三本體之間的散熱器相互搭配使用,進以完成散熱元件內部之汽液循環之散熱作用,藉以達到多重散熱之效果,且可大幅提升熱交換效率。 Through the design of the structure of the present invention, when the first body of the heat dissipating component contacts the heat source, the liquid working fluid disposed in the first chamber is heated to form a vapor working fluid, and then, a part of The vaporous working fluid flows into the second chamber through the first passage through the first through hole of the first pipe body, and the vapor working fluid is condensed and converted into a liquid working fluid in the second chamber. And continuing to circulate through the second and fourth capillary structures to the first chamber, and another portion of the vapor working fluid passing through the second flow path through the first through hole of the first tube And into the third chamber, and the vapor working fluid is also condensed into a liquid working fluid in the third chamber, and is circulated back to the first chamber by the third and fifth capillary structures to continue circulating And the heat sink disposed between the first and second bodies and between the second and third bodies are used together to complete the heat dissipation of the vapor-liquid circulation inside the heat-dissipating component, thereby achieving the effect of multiple heat dissipation, and Can greatly increase heat Conversion efficiency.

1‧‧‧散熱元件 1‧‧‧ Heat Dissipation Components

11‧‧‧第一本體 11‧‧‧First Ontology

111‧‧‧第一板體 111‧‧‧ first board

112‧‧‧第二板體 112‧‧‧Second plate

1121‧‧‧第一連接部 1121‧‧‧First connection

113‧‧‧第一腔室 113‧‧‧First chamber

114‧‧‧第一毛細結構 114‧‧‧First capillary structure

12‧‧‧第二本體 12‧‧‧Second ontology

121‧‧‧第三板體 121‧‧‧ Third plate

1211‧‧‧第二連接部 1211‧‧‧Second connection

122‧‧‧第四板體 122‧‧‧fourth plate

1221‧‧‧第三連接部 1221‧‧‧ Third connection

123‧‧‧第二腔室 123‧‧‧Second chamber

124‧‧‧第二毛細結構 124‧‧‧Second capillary structure

13‧‧‧第三本體 13‧‧‧ Third ontology

131‧‧‧第五板體 131‧‧‧ Fifth plate

1311‧‧‧第四連接部 1311‧‧‧fourth connection

132‧‧‧第六板體 132‧‧‧6th plate

1321‧‧‧第五連接部 1321‧‧‧ fifth connection

133‧‧‧第三腔室 133‧‧‧ third chamber

134‧‧‧第三毛細結構 134‧‧‧ Third capillary structure

14‧‧‧第一管體 14‧‧‧First tube

141‧‧‧第一端 141‧‧‧ first end

1411‧‧‧第一通孔 1411‧‧‧First through hole

142‧‧‧第二端 142‧‧‧ second end

1421‧‧‧第二通孔 1421‧‧‧second through hole

143‧‧‧第一流道 143‧‧‧First runner

144‧‧‧第四毛細結構 144‧‧‧Fourth capillary structure

15‧‧‧第二管體 15‧‧‧Second body

151‧‧‧第三端 151‧‧‧ third end

1511‧‧‧第三通孔 1511‧‧‧3rd through hole

152‧‧‧第四端 152‧‧‧ fourth end

1521‧‧‧第四通孔 1521‧‧‧4th through hole

153‧‧‧第二流道 153‧‧‧Second runner

154‧‧‧第五毛細結構 154‧‧‧Final capillary structure

16‧‧‧第四本體 16‧‧‧4th ontology

161‧‧‧第七板體 161‧‧‧ seventh plate

1611‧‧‧第六連接部 1611‧‧‧ sixth connection

162‧‧‧第八板體 162‧‧‧ eighth plate

163‧‧‧第四腔室 163‧‧‧fourth chamber

164‧‧‧第六毛細結構 164‧‧‧ sixth capillary structure

17‧‧‧第三管體 17‧‧‧3rd body

171‧‧‧第五端 171‧‧‧ fifth end

1711‧‧‧第五通孔 1711‧‧‧5th through hole

172‧‧‧第六端 172‧‧‧ sixth end

1721‧‧‧第六通孔 1721‧‧‧ sixth through hole

173‧‧‧第三流道 173‧‧‧ third runner

174‧‧‧第七毛細結構 174‧‧‧ seventh capillary structure

18‧‧‧凸肋 18‧‧‧ rib

19‧‧‧溝槽 19‧‧‧ trench

2‧‧‧工作流體 2‧‧‧Working fluid

3‧‧‧熱源 3‧‧‧heat source

4‧‧‧散熱器 4‧‧‧ radiator

5‧‧‧支撐柱 5‧‧‧Support column

51‧‧‧第八毛細結構 51‧‧‧eighth capillary structure

第1圖係為本發明散熱元件之第一實施例之立體分解圖;第2圖係為本發明散熱元件之第一實施例之立體組合圖;第3圖係為本發明散熱元件之第一實施例之剖面圖;第4圖係為本發明散熱元件之第一實施例之剖面示意圖; 第5圖係為本發明散熱元件之第二實施例之立體組合圖;第6圖係為本發明散熱元件之第二實施例之剖面圖;第7圖係為本發明散熱元件之第二實施例之剖面示意圖;第8圖係為本發明散熱元件之第三實施例之俯視圖;第9圖係為本發明散熱元件之第四實施例之剖面圖。 1 is a perspective exploded view of a first embodiment of a heat dissipating component of the present invention; FIG. 2 is a perspective assembled view of a first embodiment of the heat dissipating component of the present invention; and FIG. 3 is the first heat dissipating component of the present invention. A cross-sectional view of an embodiment; FIG. 4 is a cross-sectional view showing a first embodiment of the heat dissipating component of the present invention; 5 is a perspective view of a second embodiment of the heat dissipating component of the present invention; FIG. 6 is a cross-sectional view of a second embodiment of the heat dissipating component of the present invention; and FIG. 7 is a second embodiment of the heat dissipating component of the present invention. FIG. 8 is a plan view showing a third embodiment of the heat dissipating component of the present invention; and FIG. 9 is a cross-sectional view showing a fourth embodiment of the heat dissipating component of the present invention.

本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

請參閱第1、2、3圖,係為本發明散熱元件之第一實施例之立體分解圖及立體組合圖及剖面圖,如圖所示,一種散熱元件1係包括一第一本體11、一第二本體12、一第一管體14、一第三本體13、一第二管體15、一工作流體2,該第一本體11具有一第一板體111及一第二板體112,該第一、二板體111、112對應蓋合並共同界定一第一腔室113,並於該第一腔室113設有一第一毛細結構114,於該第二板體112處開設一第一連接部1121,該第二本體12具有一第三板體121及一第四板體122,該第三、四板體121、122對應蓋合並共同界定一第二腔室123,並於該第二腔室123設有一第二毛細結構124,於該第三板體121處開設一第二連接部1211,該第一管體14具有一第一端141及一第二端142及一第一流道143,並於該第一管體14內之管壁設有一第四毛細結構144,該第一端141對接所述第一連接部1121並抵頂至所述第一板體111之內側壁,該第二端142對接所述第二連接部1211並抵頂至所述第四板體122之內側壁,並令該第四毛細結構144與所述第一、二毛細結構114、124相毛細連接接觸,所述第一管體14之第一端141開設置少一第一通孔1411連通該第一腔室113,所述第一管體14 之第二端142開設至少一第二通孔1421連通該第二腔室123,以令該第一流道143透過所述第一、二通孔1411、1421與所述第一、二腔室113、123相連通;於所述第四板體122處對應該第二連接部1211更開設一第三連接部1221,所述第三本體13更具有一第五板體131及一第六板體132,該第五、六板體131、132對應蓋合並共同界定一第三腔室133,並於該第三腔室133設有一第三毛細結構134,於該第五板體131處開設一第四連接部1311;所述第二管體15具有一第三端151及一第四端152及一第二流道153,並於該第二管體15內之管壁設有一第五毛細結構154,該第三端151係貫設所述第一、二、三連接部1121、1211、1221並穿設該第一流道143且抵頂至所述第一板體111之內側壁,所述第四端152對接所述第四連接部1311並抵頂至所述第六板體132之內側壁,並令該第五毛細結構154與所述第一、三毛細結構114、134相毛細連接,所述第二管體15之第三端151開設至少一第三通孔1511連通該第一腔室113,所述第二管體15之第四端152開設至少一第四通孔1521連通該第三腔室133,以令該第二流道153透過所述第三、四通孔1511、1521與所述第一、三腔室113、133相連通;所述工作流體2係填充於所述第一、二、三腔室113、123、133內,該工作流體2可係為純水、無機化合物、醇類、酮類、液態金屬、冷煤或有機化合物其中任一;前述第一、二、三、四、五毛細結構114、124、134、144、154係選擇為網目、纖維體、燒結粉末體、網目及燒結粉末組合或微溝槽等,為具有多孔隙的結構能提供毛細力驅動該工作流體2流動;所述第二管體15之管徑係小於該第一管體14之管徑,又所述第三、四連接部1221、1311之直徑係小於所述所述第一、二連接部1121、1211之直徑,換言之, 所述第一管體14之管徑係與所述第一、二連接部1121、1211之直徑大小相同,以令該第一管體14與所述第一、二本體11、12可相緊密連接結合,所述第二管體15之管徑係與所述第三、四連接部1221、1311之直徑大小相同,以令該第二管體15與所述第二、三本體12、13可相緊密連接結合。 1 and 2 are a perspective exploded view and a perspective view and a cross-sectional view of a first embodiment of the heat dissipating component of the present invention. As shown, a heat dissipating component 1 includes a first body 11 . A second body 12, a first tube body 14, a third body 13, a second tube body 15, and a working fluid 2, the first body 11 having a first plate body 111 and a second plate body 112 The first and second plates 111 and 112 respectively define a first chamber 113 corresponding to the cover, and a first capillary structure 114 is disposed in the first chamber 113, and a first opening is formed in the second plate 112. a connecting portion 1121, the second body 12 has a third plate body 121 and a fourth plate body 122. The third and fourth plate bodies 121 and 122 jointly define a second chamber 123 corresponding to the cover. The second chamber 123 is provided with a second capillary structure 124. A second connecting portion 1211 is defined in the third plate body 121. The first tube body 14 has a first end 141 and a second end 142 and a first portion. a first channel 143, and a fourth capillary structure 144 is disposed on the wall of the first tube 14. The first end 141 abuts the first connecting portion 1121 and abuts the top An inner side wall of the first plate body 111, the second end 142 abuts the second connecting portion 1211 and abuts against an inner side wall of the fourth plate body 122, and the fourth capillary structure 144 is The first and second capillary structures 114 and 124 are in capillary contact, and the first end 141 of the first tubular body 14 is open to provide a first through hole 1411 communicating with the first chamber 113. The first tubular body 14 The second end 142 defines at least one second through hole 1421 to communicate with the second chamber 123 to pass the first flow path 143 through the first and second through holes 1411, 1421 and the first and second chambers 113. And a third connecting portion 1221 is further disposed on the second connecting portion 1211, and the third body 13 further has a fifth plate body 131 and a sixth plate body. 132. The fifth and sixth plates 131 and 132 respectively define a third chamber 133 corresponding to the cover, and a third capillary structure 134 is disposed in the third chamber 133, and a fifth capillary 131 is opened at the fifth plate 131. The fourth connecting portion 1311 has a third end 151 and a fourth end 152 and a second flow path 153, and a fifth capillary is disposed on the wall of the second tube 15 a structure 154, the third end 151 is disposed through the first, second, and third connecting portions 1121, 1211, and 1221 and penetrates the first flow path 143 and abuts against the inner side wall of the first plate body 111. The fourth end 152 abuts the fourth connecting portion 1311 and abuts against the inner side wall of the sixth plate 132, and causes the fifth capillary structure 154 and the first and third capillary structures 114. The 134-phase capillary connection, the third end 151 of the second tubular body 15 defines at least one third through hole 1511 communicating with the first chamber 113, and the fourth end 152 of the second tubular body 15 defines at least one The fourth through hole 1521 communicates with the third chamber 133 to allow the second flow path 153 to communicate with the first and third chambers 113, 133 through the third and fourth through holes 1511, 1521; The fluid 2 is filled in the first, second and third chambers 113, 123, 133, and the working fluid 2 can be pure water, inorganic compounds, alcohols, ketones, liquid metals, cold coal or organic compounds. Any of the foregoing first, second, third, fourth, and fifth capillary structures 114, 124, 134, 144, and 154 are selected from the group consisting of a mesh, a fibrous body, a sintered powder body, a mesh, a sintered powder combination, or a micro-groove, etc. The porous structure can provide a capillary force to drive the flow of the working fluid 2; the diameter of the second tubular body 15 is smaller than the diameter of the first tubular body 14, and the third and fourth connecting portions 1221, 1311 The diameter is smaller than the diameter of the first and second connecting portions 1121, 1211, in other words, The diameter of the first tube body 14 is the same as the diameter of the first and second connecting portions 1121, 1211, so that the first tube body 14 and the first and second bodies 11 and 12 can be closely arranged. The connection of the second pipe body 15 is the same as the diameter of the third and fourth connecting portions 1221, 1311, so that the second pipe body 15 and the second and third bodies 12, 13 Can be combined tightly together.

所述第一、二、三、四連接部1121、1211、1221、1311處形成有一凸緣,透過該凸緣可令所述第一、二本體11、12與該第一管體14及所述第二、三本體12、13與該第二管體15更緊密結合。 Forming a flange at the first, second, third, and fourth connecting portions 1121, 1211, 1221, and 1311, and the first and second bodies 11, 12 and the first tube body 14 are disposed through the flange. The second and third bodies 12, 13 are more closely coupled to the second tube 15.

續請參閱第4圖,透過本發明此結構的設計,當所述第一本體11之第一板體111接觸一熱源3(例如CPU、MCU、圖形處理器等等)時,且所述第一、二本體11、12及第二、三本體12、13之間設置有至少一散熱器4,但並不限於此,於實際實施時,該熱源3也可能會依據電子設備內部的擺設設置而與所述第三本體13之第六板體132相接觸(圖中未示),而所述散熱器4則係可選擇設置於第一、二本體11、12之間或是第二、三本體12、13之間(圖中未示),亦或同時有兩散熱器4分別設置於第一、二本體11、12之間及第二、三本體12、13之間。 Continuing to refer to FIG. 4, through the design of the structure of the present invention, when the first board 111 of the first body 11 contacts a heat source 3 (eg, a CPU, an MCU, a graphics processor, etc.), and the At least one heat sink 4 is disposed between the first and second bodies 11 and 12 and the second and third bodies 12 and 13. However, the heat source 3 may also be set according to the internal arrangement of the electronic device. The fourth body 132 of the third body 13 is in contact with the third body 132 (not shown), and the heat sink 4 is selectively disposed between the first and second bodies 11 and 12 or the second Between the three bodies 12, 13 (not shown), or two heat sinks 4 are disposed between the first and second bodies 11, 12 and between the second and third bodies 12, 13, respectively.

當所述散熱元件1之第一本體11接觸所述熱源3時,其設置於該第一腔室113內的液態工作流體2遇熱會形成汽態工作流體2,接著,一部份之汽態工作流體2會經由該第一管體14之第一通孔1411通過該第一流道143流至所述第二腔室123內,且該汽態工作流體2於該第二腔室123內會冷凝轉化為液態工作流體2後,並藉由所述第二、四毛細結構124、144回流至第一腔室113內繼續循環,而另部份之汽態工作流體2則會經由該第一管體14之第一通孔1411通過該第二流道153流至所述第三腔室133內,且該汽態工作流體2於該第三腔室133內也同樣會冷凝轉化為液態工作流體2後,並藉由所述第三、五毛細結構134、154 回流至第一腔室113內繼續循環,並與設置於該第一、二本體11、12之間及第二、三本體12、13之間的散熱器4相互搭配使用,進以完成散熱元件1內部之汽液循環之散熱作用,藉以達到多重散熱之效果,且可大幅提升熱交換效率。 When the first body 11 of the heat dissipating component 1 contacts the heat source 3, the liquid working fluid 2 disposed in the first chamber 113 is heated to form a vapor working fluid 2, and then, a part of the steam. The working fluid 2 flows through the first through hole 1411 of the first pipe body 14 into the second chamber 123 through the first through hole 1411, and the vapor working fluid 2 is in the second chamber 123. After being condensed and converted into the liquid working fluid 2, the second and fourth capillary structures 124, 144 are returned to the first chamber 113 to continue the circulation, and the other part of the vaporous working fluid 2 is passed through the first The first through hole 1411 of the pipe body 14 flows into the third chamber 133 through the second flow path 153, and the vaporous working fluid 2 is also condensed and converted into a liquid state in the third chamber 133. After the working fluid 2, and by the third and fifth capillary structures 134, 154 Reflowing into the first chamber 113 to continue the circulation, and using the heat sink 4 disposed between the first and second bodies 11, 12 and between the second and third bodies 12, 13 to complete the heat dissipating component 1 The internal heat dissipation of the vapor-liquid circulation, in order to achieve multiple heat dissipation effects, and can greatly improve the heat exchange efficiency.

除此之外,還可透過所述第一、二管體14、15的兩端分別底頂至所述第一、二、三本體11、12、13之一側的結構,取代習知均溫板內的支撐結構,有效達到節省成本及製造工時效果之散熱元件1。 In addition, the two ends of the first and second tubes 14, 15 may be respectively connected to the one side of the first, second, and third bodies 11, 12, and 13 to replace the conventional ones. The support structure in the warm plate effectively realizes the heat dissipating component 1 which saves cost and manufactures man-hour effects.

請參閱第5、6、7圖並一併參閱第1、2、3圖,係為本發明散熱元件之第二實施例之立體組合圖及剖面圖及剖面示意圖,所述散熱元件部份元件及元件間之相對應之關係與前述散熱元件相同,故在此不再贅述,惟本散熱元件與前述最主要之差異為,於所述第六板體132處對應該第四連接部1311更開設一第五連接部1321,所述散熱元件1更具有一第四本體16及一第三管體17,該第四本體16具有一第七板體161及一第八板體162,該第七、八板體161、162對應蓋合並共同界定一第四腔室163,並於該第四腔室163內設有一第六毛細結構164,於該第七板體161處開設一第六連接部1611;所述第三管體17貫設所述第二、三本體12、13並與所述第一、四本體11、16相毛細連接,該第三管體17內部形成一第三流道173並於其管壁內設有一第七毛細結構174,該第三管體17具有一第五端171及一第六端172,該第五端171係貫穿所述第一、二、三、四、五連接部1121、1211、1221、1311、1321並穿設該第二流道153且抵頂至所述第一板體111之內側壁,該第六端172對接所述第六連接部1611並抵頂至所述第八板體162之內側壁,並令該第七毛細結構174與所述第一、六毛細結構114、164相毛細連接,該第五端171開設至少一第五通孔1711連通該第一腔室113,該第六端172開設至少一第六通孔1721連通該 第四腔室163,以令該第三流道173透過所述第五、六通孔1711、1721與所述第一、四腔室113、163相連通;所述第三管體17之管徑係小於第二管體15之管徑,又所述第五、六連接部1321、1611之直徑係小於所述第三、四連接部1221、1311之直徑,且所述第五、六連接部1321、1611處形成有所述凸緣,以令所述第四本體16及第三管體17可緊密地與第三本體13相結合。 Please refer to Figures 5, 6, and 7 and refer to Figures 1, 2, and 3, which are perspective, cross-sectional, and cross-sectional views of a second embodiment of the heat dissipating component of the present invention. The corresponding relationship between the components and the components is the same as that of the heat dissipating component. Therefore, the details of the heat dissipating component and the above-mentioned main difference are that the fourth connecting portion 1311 corresponds to the sixth connecting portion 1311. A fifth connecting portion 1321 is defined. The heat dissipating component 1 further includes a fourth body 16 and a third tubular body 17. The fourth body 16 has a seventh plate body 161 and an eighth plate body 162. The seventh and eighth plates 161 and 162 are combined to form a fourth chamber 163, and a sixth capillary structure 164 is disposed in the fourth chamber 163, and a sixth connection is formed in the seventh plate 161. a portion 1611; the third tube body 17 extends through the second and third bodies 12, 13 and is capillaryly connected to the first and fourth bodies 11, 16 , and a third stream is formed inside the third tube body 17 The channel 173 is provided with a seventh capillary structure 174 in the wall of the tube, and the third tube body 17 has a fifth end 171 and a sixth end 1 72. The fifth end 171 extends through the first, second, third, fourth, and fifth connecting portions 1121, 1211, 1221, and 1311, and passes through the second flow path 153 and abuts against the first plate. The inner side wall of the body 111, the sixth end 172 abuts the sixth connecting portion 1611 and abuts against the inner side wall of the eighth plate 162, and makes the seventh capillary structure 174 and the first and sixth capillary The first end 171 is connected to the first chamber 113, and the sixth end 172 defines at least one sixth through hole 1721 to communicate with the first end. a fourth chamber 163, wherein the third flow passage 173 communicates with the first and fourth chambers 113, 163 through the fifth and sixth through holes 1711, 1721; the tube of the third tube body 17 The diameter is smaller than the diameter of the second pipe body 15, and the diameters of the fifth and sixth connecting portions 1321, 1611 are smaller than the diameters of the third and fourth connecting portions 1221, 1311, and the fifth and sixth connections are The flanges are formed at the portions 1321, 1611 such that the fourth body 16 and the third tubular body 17 can be tightly coupled to the third body 13.

同樣地,當所述第一本體11接觸所述熱源3時,設置於該第一腔室113內的液態工作流體2遇熱會形成汽態工作流體2,一部份之工作流體2會如前述之第一實施例進行循環,而另部份之汽態工作流體2會經由該第一管體14之第一通孔1411通過該第三流道173流至第四腔室163內,且該汽態工作流體2於該第四腔室163內會冷凝轉化為液態工作流體2後,並藉由所述第六、七毛細結構164、174回流至第一腔室113內繼續循環,進而完成汽液循環之散熱作用而達成多重散熱之功效。 Similarly, when the first body 11 contacts the heat source 3, the liquid working fluid 2 disposed in the first chamber 113 will form a vapor working fluid 2 when heated, and a part of the working fluid 2 will be like The first embodiment of the foregoing is circulated, and a portion of the vaporous working fluid 2 flows through the first through hole 1411 of the first pipe body 14 through the third flow path 173 into the fourth chamber 163, and The vaporous working fluid 2 is condensed and converted into the liquid working fluid 2 in the fourth chamber 163, and is recirculated through the sixth and seventh capillary structures 164, 174 into the first chamber 113, thereby further circulating. Complete the heat dissipation of the vapor-liquid cycle to achieve multiple heat dissipation.

換言之,本發明的結構設計,並不侷限於前述第一、二實施例所限制,其可依照使用者的需求,進行所述本體及管體的數量調整(增加或減少),以達到最佳使用效果。 In other words, the structural design of the present invention is not limited to the foregoing first and second embodiments, and the number of the body and the tube can be adjusted (increase or decrease) according to the needs of the user to achieve the best. Effect.

請參閱第8圖,係為本發明散熱元件之第三實施例之俯視圖,所述散熱元件部份元件及元件間之相對應之關係與前述散熱元件相同,故在此不再贅述,惟本散熱元件與前述最主要之差異為,於所述第一、二管體14、15內壁上可形成複數凸肋18及複數溝槽19,且其係呈間隔或非間隔排列設置,並於所述第一、二管體14、15之凸肋18及溝槽19上分別設置所述第四、五毛細結構144、154,透過所述結構可增加所述第一、二管體14、15內壁之第四、五毛細結構144、154的面積,以令於管體內的液態工作流體回流的效果更佳;同理,前述之凸肋18及溝槽19的設置並不侷限於此,其係可依照使用者的需求於所需的管體上任意進行設置。 Please refer to FIG. 8 , which is a top view of a third embodiment of the heat dissipating component of the present invention. The corresponding relationship between the components of the heat dissipating component and the components is the same as that of the heat dissipating component, and therefore will not be further described herein. The main difference between the heat dissipating component and the foregoing is that a plurality of ribs 18 and a plurality of trenches 19 can be formed on the inner walls of the first and second tubular bodies 14 and 15 and are arranged at intervals or at intervals. The fourth and fifth capillary structures 144, 154 are respectively disposed on the ribs 18 and the grooves 19 of the first and second tubular bodies 14, 15 respectively, and the first and second tubular bodies 14 are added through the structure. The area of the fourth and fifth capillary structures 144, 154 of the inner wall is better for recirculating the liquid working fluid in the tube; for the same reason, the arrangement of the aforementioned rib 18 and the groove 19 is not limited thereto. It can be arbitrarily set on the required pipe body according to the needs of the user.

請參閱第9圖,係為本發明散熱元件之第四實施例之剖面圖,所述散熱元件部份元件及元件間之相對應之關係與前述散熱元件相同,故在此不再贅述,惟本散熱元件與前述最主要之差異為,所述第二管體15之第二流道153內更具有一支撐柱5,其兩端係分別抵頂至所述第一板體111及第六板體132之內側壁,該支撐柱5之外側設有一第八毛細結構51,其係可選擇為網目、纖維體、燒結粉末體、網目及燒結粉末組合或微溝槽等,本實施例透過支撐柱5的設置,其作用可大幅增加該散熱元件1內部液態工作流體2回流之速率,且具有支撐的功效。 FIG. 9 is a cross-sectional view showing a fourth embodiment of the heat dissipating component of the present invention. The corresponding relationship between the components of the heat dissipating component and the components is the same as that of the heat dissipating component, and therefore will not be further described herein. The main difference between the heat dissipating component and the foregoing is that the second flow channel 153 of the second pipe body 15 further has a support column 5, and the two ends thereof are respectively abutted to the first plate body 111 and the sixth The inner side wall of the plate body 132 is provided with an eighth capillary structure 51 on the outer side of the support column 5. The mesh structure, the fiber body, the sintered powder body, the mesh and the sintered powder combination or the micro-groove may be selected as the embodiment. The arrangement of the support column 5 can greatly increase the rate of return of the liquid working fluid 2 inside the heat dissipating member 1, and has the effect of supporting.

以上所述,本發明相較於習知具有下列優點:1.具有多重散熱效果;2.大幅提升熱交換效率;3.省去習知均溫板之支撐結構之成本及製造工時。 As described above, the present invention has the following advantages as compared with the prior art: 1. has multiple heat dissipation effects; 2. greatly improves heat exchange efficiency; 3. eliminates the cost and manufacturing man-hour of the support structure of the conventional temperature equalization plate.

以上已將本發明做一詳細說明,惟以上所述者,僅為本發明之一較佳實施例而已,當不能限定本發明實施之範圍。即凡依本發明申請範圍所作之均等變化與修飾等,皆應仍屬本發明之專利涵蓋範圍。 The present invention has been described in detail above, but the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention. That is, the equivalent changes and modifications made by the scope of the present application should remain within the scope of the patent of the present invention.

1‧‧‧散熱元件 1‧‧‧ Heat Dissipation Components

111‧‧‧第一板體 111‧‧‧ first board

112‧‧‧第二板體 112‧‧‧Second plate

113‧‧‧第一腔室 113‧‧‧First chamber

114‧‧‧第一毛細結構 114‧‧‧First capillary structure

121‧‧‧第三板體 121‧‧‧ Third plate

1211‧‧‧第二連接部 1211‧‧‧Second connection

122‧‧‧第四板體 122‧‧‧fourth plate

123‧‧‧第二腔室 123‧‧‧Second chamber

124‧‧‧第二毛細結構 124‧‧‧Second capillary structure

131‧‧‧第五板體 131‧‧‧ Fifth plate

1311‧‧‧第四連接部 1311‧‧‧fourth connection

132‧‧‧第六板體 132‧‧‧6th plate

133‧‧‧第三腔室 133‧‧‧ third chamber

134‧‧‧第三毛細結構 134‧‧‧ Third capillary structure

143‧‧‧第一流道 143‧‧‧First runner

144‧‧‧第四毛細結構 144‧‧‧Fourth capillary structure

153‧‧‧第二流道 153‧‧‧Second runner

154‧‧‧第五毛細結構 154‧‧‧Final capillary structure

Claims (11)

一種散熱元件,係包括:一第一本體,具有一第一板體及一第二板體,該第一、二板體對應蓋合並共同界定一第一腔室,該第二板體處開設一第一連接部;一第二本體,具有一第三板體及一第四板體,該第三、四板體對應蓋合並共同界定一第二腔室,該第三板體處開設一第二連接部,該第四板體處對應該第二連接部更開設一第三連接部;一第一管體,具有一第一端及一第二端及一第一流道,所述第一端對接所述第一連接部並抵頂至所述第一板體之內側壁,所述第二端對接所述第二連接部並抵頂至所述第四板體之內側壁,該第一端開設置少一第一通孔連通該第一腔室,該第二端開設至少一第二通孔連通該第二腔室,以令該第一流道透過所述第一、二通孔與所述第一、二腔室相連通;一第三本體,具有一第五板體及一第六板體,該第五、六板體對應蓋合並共同界定一第三腔室,該第五板體處開設一第四連接部;一第二管體,具有一第三端及一第四端及一第二流道所述第三端係貫設所述第一、二、三連接部並穿設該第一流道且抵頂至所述第一板體之內側壁,所述第四端對接所述第四連接部並抵頂至所述第六板體之內側壁,所述第二管體之第三端開設至少一第三通孔連通該第一腔室,所述第二管體之第四端開設至少一第四通孔連通該第三腔室,以令該第二流道透過所述第三、四通孔與所述第一、三腔室相連通;一工作流體,係填充於所述第一、二、三腔室內。 A heat dissipating component includes: a first body having a first plate body and a second plate body, wherein the first and second plate bodies jointly define a first chamber, and the second plate body is opened a first connecting portion; a second body having a third plate body and a fourth plate body, wherein the third and fourth plate bodies jointly define a second chamber, and the third plate body defines a second plate a second connecting portion, wherein the fourth connecting portion further defines a third connecting portion; a first tube body having a first end and a second end and a first flow path, the first One end of the first connecting portion abuts against the inner side wall of the first plate body, and the second end abuts the second connecting portion and abuts against an inner side wall of the fourth plate body, The first end opening is configured to have a first through hole communicating with the first chamber, and the second end is configured to open at least one second through hole to communicate with the second chamber, so that the first flow path passes through the first and second passages The hole is connected to the first and second chambers; a third body has a fifth plate body and a sixth plate body, and the fifth and sixth plates are corresponding to the cover And jointly defining a third chamber, the fifth plate body defines a fourth connecting portion; a second tube body having a third end and a fourth end and a second flow path The first, second, and third connecting portions are disposed and penetrate the first flow path and abut against the inner side wall of the first plate body, and the fourth end abuts the fourth connecting portion and abuts against the The third side of the second tube body has at least one third through hole communicating with the first chamber, and the fourth end of the second tube body is provided with at least one fourth through hole Connecting the third chamber to connect the second flow passage to the first and third chambers through the third and fourth through holes; a working fluid is filled in the first, second, third Inside the chamber. 如申請專利範圍第1項所述之散熱元件,其中所述第一腔室具有一第一毛細結構,該第二腔室具有一第二毛細結構,該第三腔室具有一第三毛細結構。 The heat dissipating component of claim 1, wherein the first chamber has a first capillary structure, the second chamber has a second capillary structure, and the third chamber has a third capillary structure . 如申請專利範圍第2項所述之散熱元件,其中所述第一管體內之管壁具有一第四毛細結構,該第二管體內之管壁具有一第五毛細結構。 The heat dissipating component of claim 2, wherein the tube wall of the first tube body has a fourth capillary structure, and the tube wall of the second tube body has a fifth capillary structure. 如申請專利範圍第3項所述之散熱元件,其中所述第四毛細結構與所述第一、二毛細結構相毛細連接。 The heat dissipating component of claim 3, wherein the fourth capillary structure is capillaryly connected to the first and second capillary structures. 如申請專利範圍第3項所述之散熱元件,其中所述第五毛細結構與所述第一、三毛細結構相毛細連接。 The heat dissipating component of claim 3, wherein the fifth capillary structure is capillaryly connected to the first and third capillary structures. 如申請專利範圍第1項所述之散熱元件,其中所述第二管體之管徑小於該第一管體之管徑。 The heat dissipating component of claim 1, wherein the pipe diameter of the second pipe body is smaller than the pipe diameter of the first pipe body. 如申請專利範圍第1項所述之散熱元件,其中於所述第六板體處對應該第四連接部更開設一第五連接部,所述散熱元件更具有一第四本體具有一第七板體及一第八板體,該第七、八板體對應蓋合並共同界定一第四腔室,於該第七板體處開設一第六連接部,一第三管體貫設所述第二、三本體並與所述第一、四本體相連接,該第三管體內部形成一第三流道,並該第三管體具有一第五端及一第六端,該第五端係貫穿所述第一、二、三、四、五連接部及第二流道並抵頂至所述第一板體之內側壁,該第六端對接所述第六連接部並抵頂至所述第八板體之內側壁,該第五端開設至少一第五通孔連通該第一腔室,該第六端開設至少一第六通孔連通該第四腔室,以令該第三流道與所述第一、四腔室相連通。 The heat dissipating component of claim 1, wherein a fifth connecting portion is further disposed at the sixth plate body corresponding to the fourth connecting portion, and the heat dissipating component further has a fourth body having a seventh a plate body and an eighth plate body, wherein the seventh and eighth plates correspond to the cover and jointly define a fourth chamber, and a sixth connecting portion is opened at the seventh plate body, and a third pipe body is disposed The second body and the third body are connected to the first and fourth bodies, the third pipe body defines a third flow path, and the third pipe body has a fifth end and a sixth end, the fifth The end portion penetrates the first, second, third, fourth, and fifth connecting portions and the second flow path and abuts against the inner side wall of the first plate body, and the sixth end abuts the sixth connecting portion and abuts the top The fifth end defines at least one fifth through hole to communicate with the first chamber, and the sixth end defines at least one sixth through hole to communicate with the fourth chamber. The third flow passage is in communication with the first and fourth chambers. 如申請專利範圍第7項所述之散熱元件,其中所述第四腔室具有 一第六毛細結構,所述第三管體之管壁具有一第七毛細結構,所述第七毛細結構與所述第一、六毛細結構相毛細連接。 The heat dissipating component of claim 7, wherein the fourth chamber has A sixth capillary structure, the tube wall of the third tube body has a seventh capillary structure, and the seventh capillary structure is capillaryly connected to the first and sixth capillary structures. 如申請專利範圍第8項所述之散熱元件,其中所述第三管體之管徑小於第二管體之管徑。 The heat dissipating component of claim 8, wherein the pipe diameter of the third pipe body is smaller than the pipe diameter of the second pipe body. 如申請專利範圍第3項所述之散熱元件,其中所述第一、二管體內壁上可形成複數凸肋及複數溝槽,且其呈間隔或非間隔排列設置,並於所述第一、二管體之凸肋及溝槽上分別設置所述第四、五毛細結構。 The heat dissipating component of claim 3, wherein the first and second tubes have a plurality of ribs and a plurality of grooves formed on the inner wall of the tube, and are arranged at intervals or at intervals, and are first The fourth and fifth capillary structures are respectively disposed on the ribs and the grooves of the two tubes. 如申請專利範圍第1項所述之散熱元件,其中所述第二流道內更具有一支撐柱,並該支撐柱兩端係分別抵頂至所述第一、六板體之內側壁,該支撐柱之外板體設有一第八毛細結構。 The heat dissipating component of claim 1, wherein the second flow channel further has a support column, and the two ends of the support column are respectively abutted to the inner side walls of the first and sixth plates. The outer body of the support column is provided with an eighth capillary structure.
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