TW202001177A - Vapor chamber structure - Google Patents

Abstract

A vapor chamber structure includes a main body. The main body has a first section, a second section, a capillary structure and a working fluid. The first section has a first chamber. The second section has a second chamber. The second section extends from one end of the first section in a direction away from the first section. The capillary structure is disposed on inner surfaces of the first and second chambers. The working fluid is filled in the first and second chambers. The vapor chamber structure has both heat spreading effect and remote end heat dissipation effect.

Description

Average temperature plate structure

A temperature equalizing plate structure, especially a temperature equalizing plate structure which has both flat temperature equalization and remote heat dissipation effects.

The current heat dissipation components commonly use heat dissipation components such as radiators, heat pipes, hot plates, and temperature equalization plates. Among them, the heat sink is mainly used as an auxiliary heat dissipation, and the heat pipes, heat plates, temperature equalization plates and other components are used as heat conduction because of their fast heat transfer rate. Components, heat conduction components are mainly used directly as the main components in contact with the heat source due to the high thermal conductivity, and in addition, a heat sink with a strong heat dissipation effect is used to increase the heat dissipation efficiency. As mentioned above, the temperature equalizing plate and the heat pipe are mainly components with better heat conduction effect, and need to be matched with other components with better heat dissipation effects such as heat dissipation fins or radiators to achieve better heat dissipation. The temperature equalizing plate is a large-area surface and surface Heat conduction, heat pipe is a kind of heat conduction and heat dissipation in the axial direction. The working principle of the temperature equalization plate and the heat pipe is the same, but the direction of heat conduction is different. Generally, the industry uses the temperature equalization plate and the heat pipe to overlap or overlap. Or heat conduction by welding, which has the effect of large-area heat conduction and remote heat conduction at the same time, but due to the gap between the temperature equalizing plate and the heat pipe through welding, it is bound to produce thermal resistance and reduce heat transfer efficiency. Therefore, how to integrate the functions of the temperature equalizing plate and the heat pipe or other heat dissipation elements without generating thermal resistance is the most important goal of the current industry.

Secondly, in order to solve the above-mentioned shortcomings of the conventional technology, the main purpose of the present invention is to provide a temperature-equalizing plate structure with large-area temperature-equalizing and remote heat conduction at the same time. To achieve the above purpose, the present invention provides a temperature-equalizing plate structure, which includes: a body composed of a first plate body and a second plate body superimposed on each other, the body having: a first part , A second part, a capillary structure, a working fluid; the first part has a first chamber; the second part has a second chamber, the second part is from one end (or side) of the first part The capillary structure is formed on the inner surface of the first and second chambers; the working fluid is filled in the first and second chambers. The temperature-equalizing plate structure of the present invention can provide the integrated effect of large-area temperature-equalizing and remote heat conduction and heat dissipation through the first part and the second part, respectively, and at the same time, no heat resistance phenomenon occurs, thereby achieving improved heat dissipation performance.

The above objects, structural and functional characteristics of the present invention will be described based on the preferred embodiments of the accompanying drawings. Please refer to FIG. 1, which is a perspective cross-sectional view of the first embodiment of the temperature equalizing plate structure of the present invention. As shown, the temperature equalizing plate structure of the present invention includes: a body 1; the body 1 is composed of a first The plate body 1a and a second plate body 1b are formed by overlapping each other. The body 1 has: a first part 11, a second part 12, a capillary structure 13, and a working fluid 14; the first part 11 has a first In a chamber 111, the first portion 11 is in the shape of a flat rectangular parallelepiped, and the first portion 11 is used for heat conduction in a large area. The second part 12 has a second chamber 121. The second part 12 is formed by one end (or one side) of the first part 11 extending away from the first part 11. The second part 12 is compared with the foregoing The external shape of the first part 11, the second part 12 is any one of a rectangular parallelepiped, a cylinder, or any geometry. The capillary structure 13 is provided on the inner surface of the first and second chambers 111 and 121, which means that the surface of the chamber inside the first and second parts 111 and 121 is provided with the capillary structure 13 and the working fluid 14 Then, the first and second chambers 111 and 121 are filled. The second part 12 can be extended everywhere according to the user's usage. The arrangement of the first and second parts 11 and 12 is mainly to conform to the structural integration that simultaneously has the effect of large area temperature equalization and remote heat conduction, so The first part 11 is configured as a flat rectangular parallelepiped to provide a large area and surface heat conduction temperature equalization effect, while the second part 12 is configured as a rectangular parallelepiped or cylinder or any geometric body, the main purpose It is to provide the heat transfer of the first part 11 to the remote for heat exchange and heat dissipation at the same time, so this design provides the advantages of integrating a large area of the temperature equalizing plate and the heat conduction at the far end of the heat pipe, which improves the conventional method of equalizing the temperature by overlapping or welding The combined use of the plate and the heat pipe creates a lack of thermal resistance. Please refer to Figures 2 and 2a, which is a perspective cross-sectional view of a second embodiment of a temperature equalizing plate structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as the foregoing first embodiment, so it will not be repeated here. However, the difference between this embodiment and the foregoing second embodiment is that a third portion 15 extends from one end of the first portion 11, the third portion 15 has a third chamber 151, and the capillary structure 13 also extends On the inner surface of the third chamber 151, a part of the working fluid 14 is filled in the third chamber 151, and the second and third parts 12, 15 and the first part 11 are not on the same horizontal plane. If there are obstacles with different heights, the second and third parts 12, 15 can be optionally installed to avoid the obstacles. Figure 2a is another embodiment of this embodiment. As shown in the figure, the second and third parts 12, 15 are located at the same horizontal plane but are at different levels from the first part 11, and the second and third parts 12, 15 are After extending outwards from the first portion 11, they extend toward the left, right, or both sides of the first portion 11. Please refer to FIG. 3, which is a perspective cross-sectional view of a third embodiment of the temperature equalizing plate structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the foregoing first embodiment, so it will not be repeated here. The embodiment is different from the foregoing second embodiment in that the second portion 12 is connected to a fourth portion 16, and the fourth portion 16 is in a long plate shape and is vertically connected to the second portion 12 to the The left and right sides of the two parts 12 extend. The fourth part 16 has a fourth chamber 161 and the capillary structure 13 extends on the inner wall surface of the fourth chamber 161. The third part 15 is connected A fifth portion 17, the fifth portion 17 is vertically connected to the third portion 15 in a long plate shape, and extends to the left and right sides of the third portion 15, and the fifth portion 17 has a fifth The chamber 171 and the capillary structure 13 extend on the inner wall surface of the fifth chamber 171, and the first, second, third, fourth, and fifth parts 11, 12, 15, 16, 17 are not located on the same horizontal plane (Difference in height). Please refer to Figures 4 and 4a, which is a perspective cross-sectional view of a fourth embodiment of the temperature-equalizing plate structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as the aforementioned first embodiment, so it will not be repeated here. However, this embodiment is different from the foregoing third embodiment in that the body 1 has a sixth portion 18, and the sixth portion 18 is elongated plate-shaped, and the two ends are respectively connected to the first portion 11 and the fourth portion 16 vertically connected, the sixth portion 18 has a sixth chamber 181 and the capillary structure 13 extends on the inner wall surface of the sixth chamber 181, the first to sixth chambers 111, 121, 141 , 151, 161, 171, 181 are interconnected. Figure 4a is another embodiment of this embodiment. As shown in the figure, the fourth part 16 is divided into two parts by the central part, and a part of the fourth part 16 is connected to the sixth part 18, the fourth The other part of the part 16 is connected to the second part 12, that is, the fourth part 16 of this embodiment is independently connected to the second and sixth parts 12, 18, respectively. The fourth portion 16 is vertically bent and extended near the end, and a plurality of heat dissipation fins 2 are serially connected to the portion. The fourth portion 16 and the fifth portion 17 of this embodiment have a height difference, which can be designed The position and height can be freely adjusted according to the space to be designed and the corresponding heat source. In this embodiment, the space generated by the height difference is additionally provided with heat dissipation fins 2 to be stringed outside the fourth and fifth parts 16, 17 And disposed on the other side of the first portion 11 that contacts the heat source part, the heat dissipation effect is increased by the arrangement of the heat dissipation fins 2, and since the direction of the heat dissipation fins 2 provided in each part is different, radiation radiation in different directions can be obtained The effect does not produce heat accumulation. The temperature-equalizing plate structure of the present invention sets the temperature-equating plate into two parts and simultaneously provides a large-area and remote heat conduction heat conduction structure to solve the thermal resistance phenomenon caused by the conventional temperature-regulating plate and the heat pipe by overlapping or welding. And the interconnection of the internal chambers in these parts can make the heat conduction efficiency faster, and in addition to providing large-area heat absorption and remotely guided heat conduction, it is also equipped with its heat dissipation elements (such as heat dissipation fins or heat sinks, etc.) ) It can also quickly and quickly transfer heat to the matching heat dissipation element to accelerate the heat dissipation efficiency.

1‧‧‧Body 1a‧‧‧First board 1b‧‧‧Second plate 11‧‧‧Part 1 111‧‧‧ First chamber 12‧‧‧Part 2 121‧‧‧ Second chamber 13‧‧‧Capillary structure 14‧‧‧Working fluid 15‧‧‧Part Three 151‧‧‧The third chamber 16‧‧‧Part 4 161‧‧‧ Fourth chamber 17‧‧‧Part 5 171‧‧‧Fifth chamber 18‧‧‧Part 6 181‧‧‧The sixth chamber 2‧‧‧cooling fins

Figure 1 is a perspective cross-sectional view of the first embodiment of the temperature equalizing plate structure of the present invention; Figure 2 is a perspective cross-sectional view of the second embodiment of the temperature equalizing plate structure of the present invention; Figure 2a is a temperature equalizing plate structure of the present invention The third embodiment is a perspective sectional view; FIG. 3 is a perspective sectional view of a third embodiment of the temperature equalizing plate structure of the present invention; FIG. 4 is a perspective sectional view of the fourth embodiment of the temperature equalizing plate structure of the present invention; A perspective cross-sectional view of a fourth embodiment of a temperature equalizing plate structure of the present invention.

1‧‧‧Body

1a‧‧‧First board

1b‧‧‧Second plate

11‧‧‧Part 1

111‧‧‧ First chamber

12‧‧‧Part 2

121‧‧‧ Second chamber

13‧‧‧Capillary structure

14‧‧‧Working fluid

Claims (10)

A temperature equalizing plate structure includes: a body composed of a first plate body and a second plate body superimposed on each other, the body having: a first part with a first chamber; a first Two parts, with a second chamber, the second part is formed by one end of the first part extending away from the first part; a capillary structure is provided on the inner surface of the first and second chambers; a working fluid, filled Inside the first and second chambers. The temperature equalizing plate structure as described in item 1 of the patent application scope, wherein one end of the first part extends a third part, the third part has a third chamber, and the capillary structure also extends on the third Inside the chamber, a part of the working fluid is filled in the third chamber. The temperature equalizing plate structure as described in item 2 of the patent application scope, wherein the second and third parts are not on the same horizontal plane as the first part. The temperature equalizing plate structure as described in item 2 of the patent application scope, wherein the first part is a flat rectangular parallelepiped, and the second part is a rectangular parallelepiped or a cylinder. The temperature equalizing plate structure as described in item 2 of the patent application scope, wherein the second part is connected to a fourth part, and the fourth part is elongated and vertically connected to the second part to the second part The left and right sides of the part extend. The fourth part has a fourth cavity and the capillary structure extends on the inner wall surface of the fourth cavity. The third part connects to a fifth part. The fifth part has a long plate shape and is vertically connected to the third part to extend to the left and right sides of the third part. The fifth part has a fifth chamber and the capillary structure extends on the fifth The inner wall surface of the chamber. The temperature-averaging plate structure as described in item 5 of the patent application scope, wherein the first, second, third, fourth and fifth parts are not located on the same horizontal plane. The temperature equalizing plate structure as described in item 5 of the patent application scope, wherein the body has a sixth part, and the sixth part is elongated plate-shaped, and two ends are respectively vertically connected to the first part and the fourth part, The sixth part has a sixth chamber and the capillary structure extends on the inner wall surface of the sixth chamber. The temperature equalizing plate structure as described in item 7 of the patent application scope, wherein the first to sixth chambers are in communication with each other. The temperature equalizing plate structure as described in item 7 of the patent application range, wherein the fourth part is vertically bent and extended near the end, and a plurality of heat dissipation fins are tandem connected to the part. The temperature equalizing plate structure as described in item 1 of the patent application scope, wherein a plurality of heat dissipation fins are provided on one side of the first portion.

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