TWI553455B - Thermal module - Google Patents

Description

Thermal module

A heat dissipation module, especially a heat dissipation module having a large area heat transfer and a remote heat transfer effect at the same time.

With the current gradual appeal of electronic devices, all components must be reduced in size, but the heat generated by the shrinking of electronic devices has become a major obstacle to the improvement of performance of electronic devices and systems. Regardless of the ever-shrinking size of semiconductors forming electronic components, there is a continuing demand for increased performance.

As semiconductors shrink in size, the resulting heat flux increases, and the increase in heat flux causes the challenge of cooling the product more than just the increase in total heat, as the increase in heat flux causes overheating at different times and lengths, possibly leading to electrons. Failure or damage.

Therefore, in order to solve the problem that the above-mentioned conventional technology has a small space for heat dissipation, a VC (Vapor chamber) heat sink (structure) is disposed above the chip (wafer/body) for heat dissipation, in order to increase the capillary limit in the VC. A capillary structure such as a copper column, a coating sintering, a sintered column, a foaming column, and a support having a hole (gap) is used as a support for the return flow, and the design of the support is mainly due to the thickness of the micro-average plate and the lower wall. Thinner (1.5mm or less application), if there is no support, the upper and lower walls may cause thermal expansion, resulting in disability.

The conventional uniform temperature plate is a uniform heat conduction between the surface and the surface, and the heat is uniformly transmitted from one side to the heat receiving surface of the heat source to the other side of the condensation surface, which has a large area of heat conduction, heat conduction speed and The effect of uniform temperature is fast, and the disadvantage is that heat cannot be transferred to the remote end. If the heat cannot be dissipated in time, it is easy to accumulate heat near the heat source. Therefore, the disadvantage is still It is the biggest disadvantage of the temperature equalization board.

The prior art also has a structure in which a heat pipe and a temperature equalizing plate are combined, but since the two are externally welded to each other, the external welding will cause the welding heat resistance to occur, and in addition, when the heat conduction is performed, the working fluid The vapor-liquid circulation in the uniform temperature plate is evaporated from the evaporation zone to the condensation zone, and the heat is transferred to the heat pipe which is welded to each other before the heat is applied to the temperature equalizing plate, so the effect is limited.

Therefore, in order to solve the above disadvantages of the prior art, the main object of the present invention is to provide a heat dissipation module capable of improving heat dissipation performance.

To achieve the above objective, the present invention provides a heat dissipation module comprising: a first heat transfer component and a second heat transfer component; the first heat transfer component has a first chamber, the first cavity a first capillary structure is provided; the second heat transfer element has a second chamber and a conductive portion, and the second chamber is provided with a second capillary structure, the conductive portion is accommodated in the first chamber, and The outer surface of the conducting portion is provided with a third capillary structure, and the first and second chambers are respectively filled with a working fluid.

The heat dissipation module of the present invention not only has a large-area heat transfer effect, but also has the effect of remote heat dissipation, and since the conductive portion is also provided with a third capillary structure, the heat transfer of the heat dissipation module as a whole is further greatly improved. Efficiency.

1‧‧‧ Thermal Module

11‧‧‧First heat transfer element

111‧‧‧First chamber

112‧‧‧First capillary structure

113‧‧‧heat side

114‧‧‧ Third capillary structure

12‧‧‧Second heat transfer element

121‧‧‧Second chamber

122‧‧‧Transmission Department

123‧‧‧Second capillary structure

124‧‧‧Evaporation area

2‧‧‧Working fluid

3‧‧‧Heat components

1 is a perspective view of a first embodiment of a heat dissipation module of the present invention; FIG. 2 is a cross-sectional view of a first embodiment of the heat dissipation module of the present invention; and FIG. 2a is a first embodiment of the heat dissipation module of the present invention 3 is a combined sectional view of a second embodiment of the heat dissipation module of the present invention; and FIG. 4 is a perspective combination view of a third embodiment of the heat dissipation module of the present invention; A cross-sectional view of a fourth embodiment of the heat dissipation module of the present invention; and a sixth sectional view of the fifth embodiment of the heat dissipation module of the present invention; Figure 7 is a perspective view of a sixth embodiment of the heat dissipation module of the present invention; Figure 8 is a perspective view of a seventh embodiment of the heat dissipation module of the present invention; and Figure 9 is a heat dissipation module of the present invention. A combined cross-sectional view of an eighth embodiment.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

The first embodiment of the heat dissipation module of the present invention is a perspective view, a combined cross-sectional view and a partial enlarged view. As shown in the figure, the heat dissipation module 1 includes: a first a heat transfer element 11, a second heat transfer element 12; The first heat transfer element 11 has a first chamber 111. The first chamber 111 is provided with a first capillary structure 112. The second heat transfer element 12 has a second chamber 121 and a conductive portion. 122. The second chamber 121 is provided with a second capillary structure 123. The conductive portion 122 is received in the first chamber 111, and a third capillary structure 114 is disposed on the outer surface of the conductive portion 122. The two chambers 111, 112 are respectively filled with a working fluid 2.

The first heat transfer element 11 has a heat absorbing side 113. The heat absorbing side 113 is disposed outside the first heat transfer element 11, and the heat absorbing side 113 is correspondingly disposed with at least one heat source (not shown). .

The first heat transfer element 11 is a temperature equalizing plate, and the second heat transfer element 12 is a heat pipe. The conductive portion 122 of the embodiment is disposed in the middle of the second heat transfer element 12, that is, The conductive portion 122 of the second heat transfer element 12 is received in the first chamber 111 of the first heat transfer element 11 . The first and third capillary structures 112 are the intermediate portions of the second heat transfer element 12 . The 114 series may be selected from the group consisting of a fibrous body and a sintered powder body and a groove, a hydrophilic coating layer and a mesh body. This embodiment is exemplified by a sintered powder, but is not limited thereto, and the second The capillary structure 123 may also be selected as a fiber body and a sintered powder body and a groove and a hydrophilic coating layer and a mesh body. Further, the third capillary structure 114 formed on the outer surface of the conductive portion 122 may be partially and/or All settings In the form of the presenter, the first and second chambers 111, 121 are each independently connected.

Referring to FIG. 3, it is a sectional view of a second embodiment of the heat dissipation module of the present invention. As shown in the figure, the partial structure and the connection relationship of the present embodiment are the same as those of the first embodiment, and therefore will not be used here. For example, the difference between the embodiment and the first embodiment is that the conductive portion 122 of the second heat transfer element 12 is disposed at two ends of the second heat transfer element 12, that is, the second heat transfer. The two ends of the element 12 are embedded in the first chamber 111 of the first heat transfer element 11, and the third capillary structure 114 is disposed on the outer side of the conductive portion 122.

Please refer to FIG. 4 , which is a perspective assembled view of a third embodiment of the heat dissipation module of the present invention. As shown in the figure, the partial structure and the connection relationship of the present embodiment are the same as those of the foregoing second embodiment, so Further, the difference between this embodiment and the foregoing second embodiment is that the second heat transfer element 12 is additionally connected to at least one heat dissipating component 3, and the heat dissipating component 3 can be selected as a heat sink and a heat sink. In the case of any of the fin sets, the heat sink is illustrated by way of example and not limitation.

Referring to FIG. 5, it is a sectional view of a fourth embodiment of the heat dissipation module of the present invention. As shown in the figure, the partial structure and the connection relationship of the present embodiment are the same as those of the foregoing second embodiment, and therefore will not be used here. For example, the difference between the embodiment and the second embodiment is that the conductive portion 122 of the second heat transfer element 12 is disposed at two ends of the second heat transfer element 12 and is inserted in the first In the first chamber 111 of the heat transfer element 11, the first and second heat transfer elements 11, 12 are disposed perpendicular to each other.

Please refer to FIG. 6 , which is a sectional view of a fifth embodiment of the heat dissipation module of the present invention. As shown in the figure, the partial structure and the connection relationship of the embodiment are the same as those of the first embodiment, and therefore will not be used here. For example, the difference between the embodiment and the first embodiment is that the conductive portion 122 is disposed between the two ends of the second heat transfer element 12 and is received by the first heat transfer element 11 In the chamber 111, the first and second heat transfer elements 11, 12 are vertically disposed with each other, and the conductive portion 122 is selectively contactable with or not with the wall surface of the first chamber 111. The wall of 111 meets In the embodiment, the present embodiment is not described as being in contact, but is not limited thereto.

Please refer to FIG. 7 , which is a perspective assembled view of a sixth embodiment of the heat dissipation module of the present invention. As shown in the figure, the partial structure and the connection relationship of the present embodiment are the same as those of the foregoing fourth embodiment, and therefore will not be herein. Further, the difference between this embodiment and the foregoing fourth embodiment is that the second heat transfer element 12 is connected to a heat dissipating component 3.

Please refer to FIG. 8 , which is a perspective assembled view of a seventh embodiment of the heat dissipation module of the present invention. As shown in the figure, the partial structure and the connection relationship of the present embodiment are the same as those of the foregoing fifth embodiment, and therefore will not be herein. Further, the difference between the present embodiment and the foregoing fifth embodiment is that the second heat transfer element 12 is connected to a heat dissipating component 3.

Referring to FIG. 9 , it is a sectional view of the eighth embodiment of the heat dissipation module of the present invention. As shown in the figure, the partial structure and the connection relationship of the embodiment are the same as those of the first embodiment, and therefore will not be used here. For example, the difference between the embodiment and the first embodiment is that the conductive portion 122 of the second heat transfer element 12 is partially attached to the wall surface of the first chamber 111 and defines an evaporation region 124. The working fluid 2 filled in the first chamber 111 completely immerses the evaporation region 124, and by this arrangement, the evaporation region 124 can be more uniformly heated, thereby achieving the effect of improving the overall temperature uniformity. The first and second heat transfer elements 11 and 12 may also be horizontally disposed to each other (as shown in FIGS. 2 and 3) and are not limited thereto.

The first capillary structure 112 disposed in the first chamber 111 and the third capillary structure 114 disposed on the conductive portion 122 in the first to eighth embodiments may be composed of a fibrous body and a sintered powder body, a groove and a hydrophilic The coating and the mesh are selected for use, but it is not limited to the same type of capillary structure, and may also be used for mashup.

1‧‧‧ Thermal Module

11‧‧‧First heat transfer element

111‧‧‧First chamber

112‧‧‧First capillary structure

113‧‧‧heat side

114‧‧‧ Third capillary structure

12‧‧‧Second heat transfer element

121‧‧‧Second chamber

122‧‧‧Transmission Department

123‧‧‧Second capillary structure

2‧‧‧Working fluid

Claims (13)

A heat dissipation module includes: a first heat transfer element, which is a temperature equalization plate, has a first chamber, the first chamber is provided with a first capillary structure; and a second heat transfer element is a heat pipe having a second chamber and a conducting portion, the second chamber being provided with a second capillary structure, the conducting portion being received in the first chamber, and a third portion being disposed outside the conducting portion In the capillary structure, the first and second chambers are respectively filled with a working fluid, and the first and second chambers are each independently connected to each other. The heat dissipation module of claim 1, wherein the first heat transfer element has a heat absorption side, and the heat absorption side is disposed outside the first heat transfer element. The heat dissipation module of claim 1, wherein the first, second, and third capillary structures are selected from the group consisting of a fibrous body and a sintered powder body, and a groove and a hydrophilic coating and a mesh body. . The heat dissipation module of claim 1, wherein the first heat transfer element is a temperature equalization plate. The heat dissipation module of claim 1, wherein the second heat transfer element is a heat pipe. The heat dissipation module of claim 1, wherein the conductive portion is disposed at both ends of the second heat transfer element. The heat dissipation module of claim 1, wherein the conductive portion is disposed between the two ends of the second heat transfer element. For example, the heat dissipation module described in claim 1 has a heat dissipation element. The device is connected to the second heat transfer component, and the heat dissipation component is selected as one of a heat sink and a heat sink fin set. The heat dissipation module of claim 1, wherein the first capillary structure disposed in the first chamber and the third capillary structure disposed on the conductive portion are made of a fibrous body and a sintered powder body and a groove The groove and the hydrophilic coating and the mesh body are selected for use, but it is not limited to the same type of capillary structure, and may also be used for mashup. The heat dissipation module of claim 1, wherein the conductive portion is disposed at two ends of the second heat transfer element and is inserted into the first chamber of the first heat transfer element, the first The first and second heat transfer elements are perpendicular to each other. The heat dissipation module of claim 1, wherein the conductive portion is disposed between the two ends of the second heat transfer element and is received in the first chamber of the first heat transfer element, The first and second heat transfer elements are vertically disposed to each other. The heat dissipation module according to claim 1, wherein the third capillary structure formed on the outer surface of the conductive portion is presented in a form of any one of partial and all. The heat dissipation module of claim 1, wherein the conductive portion of the second heat transfer element is partially attached to the wall surface of the first chamber, and together define an evaporation region, the first cavity The indoor filled workflow system completely soaks the evaporation zone.