TWM452329U - Improved structure of isothermal board - Google Patents

Description

Mean temperature plate structure improvement

The invention relates to a structure improvement of a uniform temperature plate, in particular to a structure of a uniform temperature plate with a large-area uniform temperature conduction heat source and a remote heat dissipation.

With the current gradual appeal of electronic devices, all components must be reduced in size, but the heat generated by the shrinking of electronic devices has become a major obstacle to the improvement of performance of electronic devices and systems. Regardless of the ever-shrinking size of semiconductors forming electronic components, there is a continuing demand for increased performance.
As semiconductors shrink in size, the resulting heat flux increases, and the increase in heat flux causes the challenge of cooling the product more than just the increase in total heat, as the increase in heat flux causes overheating at different times and lengths, possibly leading to electrons. Failure or damage.
Therefore, in order to solve the problem that the above-mentioned conventional technology has a small space for heat dissipation, a VC (Vapor chamber) heat sink (structure) is disposed above the chip (wafer/body) for heat dissipation, in order to increase the capillary limit in the VC. A capillary structure such as a copper column, a coating sintering, a sintered column, a foaming column, and a support having a hole (gap) is used as a support for the return flow, and the design of the support is mainly due to the thickness of the micro-average plate and the lower wall. Thinner (1.5mm or less application), if there is no support, the upper and lower walls may cause thermal expansion, resulting in disability.
The conventional uniform temperature plate is a uniform heat conduction between the surface and the surface, and the heat is uniformly transmitted from one side to the heat receiving surface of the heat source to the other side of the condensation surface, which has a large area of heat conduction and fast heat conduction. The advantages are that the heat cannot be transferred to the remote end to dissipate heat. If the heat cannot be dissipated in a timely manner, it is easy to accumulate heat near the heat source. Therefore, this disadvantage is still the biggest disadvantage of the uniform temperature plate.

Accordingly, in order to solve the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide an improvement in the structure of the uniform temperature plate which can improve the heat dissipation performance.
In order to achieve the above object, the present invention provides an improved structure of a uniform temperature plate, which comprises: a first body, a second body, and a working fluid;
The first body has a plurality of first channels and a plurality of second channels, the first and second channels are connected to each other, the second body has a third channel, the second body is connected to the first body, and the first body The three channels are in communication with the first and second channels, and the first, second and third channel wall masks have a capillary structure, and the workflow system is filled in the first and second bodies.
Through the creation system, the temperature equalizing plate can not only have a large heat transfer effect, but also has a function of remote heat transfer, thereby greatly improving the overall heat dissipation effect of the temperature equalizing plate.

Figure 1 is a perspective view of the first embodiment of the improved uniform temperature plate structure;
Figure 2 is a cross-sectional view showing the first embodiment of the improvement of the structure of the uniform temperature plate;
Figure 3 is a three-dimensional combination diagram of the second embodiment of the improved uniform temperature plate structure;
Fig. 4 is a perspective view of a third embodiment of the improvement of the structure of the uniform temperature plate.

11‧‧‧First Ontology
111‧‧‧First Passage
112‧‧‧second channel
113‧‧‧ first closed side
114‧‧‧Second closed side
12‧‧‧Second ontology
121‧‧‧ third channel
122‧‧‧ first end
123‧‧‧second end
124‧‧‧Transmission Department
2‧‧‧Working fluid
3‧‧‧Capillary structure
4‧‧‧ radiator

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
Please refer to FIG. 1 and FIG. 2 , which are a perspective view and a combined cross-sectional view of the first embodiment of the present invention, and the improved structure of the uniform temperature plate of the present embodiment includes: a first body 11 a second body 12, a working fluid 2;
The first body 11 has a plurality of first channels 111 and a plurality of second channels 112, and the first and second channels 111 and 112 communicate with each other.
The first and second channels 111 and 112 are vertically connected to each other. The first body 11 has a first closed side 113 and a second closed side 114. The first and second closed sides 113 and 114 are closed. One end of one channel 111.
The second body 12 has a third channel 121. The second body 12 is connected to the first body 11 and interconnects the third channel 121 and the first and second channels 111 and 112. The wall of the second and third channels 111, 112, and 121 has a capillary structure 3, the second body 12 is a heat pipe, and the second body 12 further has a first end 122 and a second end 123. The first end 122 is connected to the first body 11 , and the second end 123 extends in a direction opposite to the first end 122 . The capillary structure 3 is selected as a mesh body and a fiber body, and a sintered powder body and a groove. In any of the embodiments, the groove is taken as an illustrative embodiment, but is not limited thereto, and the working fluid 2 is filled in the first and second bodies 11 and 12.
The first body 11 is permeable to the extruded body, and simultaneously forms the first passage 111 inside the first body 11 and is formed on the wall surface of the first passage 111 when the first body 11 is extruded. A plurality of trenches 1111 are opened, and then the first body 11 is formed in a manner perpendicular to the first channel 111 by mechanical processing. Finally, the first channel 111 is opened. The two ends are closed, and the second body 12 is connected to the first body 12, and the first, second, and third channels 111, 112, and 121 are connected to each other. Finally, the first body 11 and the second body 12 are connected. Vacuuming and filling the working fluid 2 are performed.
Please refer to FIG. 3 , which is a perspective view of the second embodiment of the present invention. The present embodiment is identical to the foregoing first embodiment, and will not be described again herein. The difference between the embodiment and the first embodiment is that there is a heat sink 4, and the heat sink 4 is opposite to the second body 12 and is connected to one end of the first body 11 and through the second body 12. The absorbed heat is guided to the place where the heat sink 4 is connected through the internal working fluid, and then cooled by the heat sink 4.
Please refer to FIG. 4 , which is a three-dimensional combination diagram of the third embodiment of the present invention. The present embodiment is identical to the foregoing first embodiment, and will not be described again herein. The first embodiment of the first body 122 and the second end 123 of the second body 12 are simultaneously connected to the first body 11 and the first body 12 is first. The end 122 and the second end 123 further have a conducting portion 124 connected to a heat sink 4.
Through the first to third embodiments of the present invention, it is possible to improve the lack of accumulated heat of the conventional uniform temperature plate near the heat source, and effectively achieve the effect of transferring heat to the remote end.

11‧‧‧First Ontology

111‧‧‧First Passage

112‧‧‧second channel

113‧‧‧ first closed side

114‧‧‧Second closed side

12‧‧‧Second ontology

121‧‧‧ third channel

122‧‧‧ first end

123‧‧‧second end

2‧‧‧Working fluid

3‧‧‧Capillary structure

Claims (9)

An improved structure of a uniform temperature plate, comprising:
a first body having a plurality of first channels and a plurality of second channels, wherein the first and second channels are connected to each other;
a second body having a third channel, the second body connecting the first body, the third channel and the first and second channels communicating with each other, and the first, second and third channel wall masks have a capillary structure ;
A working fluid is filled in the first and second bodies. The structure of the uniform temperature plate according to claim 1, wherein the capillary structure is selected from the group consisting of a mesh body and a fiber body, and a sintered powder body and a groove. The structure of the uniform temperature plate according to claim 1, wherein the first and second channels are vertically staggered. The structure of the uniform temperature plate as described in claim 1 is wherein the first system is extruded. The uniform temperature plate structure improvement according to the first aspect of the patent application, wherein the second system is a heat pipe. The improved structure of the temperature equalizing plate according to claim 1, wherein the first body further has a first closed side and a second closed side for respectively closing the two ends of the first passage. The improved structure of the temperature equalizing plate according to claim 1, wherein the second body further has a first end and a second end, and the first end is connected to the first body, the second end It extends in the opposite direction to the first end. The structure of the uniform temperature plate according to claim 1 is further improved, wherein a heat sink is further disposed, and the heat sink is connected to one end of the first body opposite to the second body. The improved structure of the temperature equalizing plate according to claim 1, wherein the second body further has a first end and a second end, and the first end and the second end simultaneously and the first body And a conductive portion is further connected between the first end and the second end of the second body, and the conductive portion is connected to a heat sink.