KR101880533B1 - Sintered flat panel heat dissipation structure comprising Aluminum powder - Google Patents

Sintered flat panel heat dissipation structure comprising Aluminum powder Download PDF

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Publication number
KR101880533B1
KR101880533B1 KR1020150071205A KR20150071205A KR101880533B1 KR 101880533 B1 KR101880533 B1 KR 101880533B1 KR 1020150071205 A KR1020150071205 A KR 1020150071205A KR 20150071205 A KR20150071205 A KR 20150071205A KR 101880533 B1 KR101880533 B1 KR 101880533B1
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KR
South Korea
Prior art keywords
sintered
flat plate
heat dissipation
flow paths
heat sink
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Application number
KR1020150071205A
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Korean (ko)
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KR20160036470A (en
Inventor
문석환
고상춘
전치훈
김지연
박윤우
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한국전자통신연구원
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention provides a sintered flat plate heat dissipation element including an external fin. A sintered flat plate heat dissipation element including an outer fin includes a plurality of heat sink fins provided on a surface thereof and a flat plate shaped body portion provided with a plurality of flow paths for providing a space through which a working fluid flows therein, And squeeze wicks provided on one of the upper and lower surfaces of the flow paths and grooves of a concavo-convex shape provided on the other surface of the lower surface and the lower surface opposite to the one surface.

Description

[0001] The present invention relates to a sintered flat panel heat dissipation structure comprising an aluminum powder,

The present invention relates to a sintered flat plate heat dissipation element including an outer fin, and more particularly, to an aluminum powder sintered flat plate heat dissipation element including an outer fin provided with sintered wicks inside flow paths.

Chips and modules packaged in electronic systems are becoming increasingly highly integrated and miniaturized as semiconductor manufacturing technology is developed. Since the heat density of the components included in the electronic system is greatly increased in accordance with this trend, a cooling method for dissipating it effectively is required.

Conventional cooling devices that can be applied to small portable and stationary electronic systems include a heat sink, a fan, and a small heat dissipation device having a circular cross section with a diameter of 3 mm or more. Heat sinks have been widely used as a basic form of cooling means because they can be freely manufactured in size and thickness. A compact heat sink having a circular cross section having a diameter of 3 mm or more can be used by being compressed to suit the thin film structure. However, the small heat dissipating device having a circular cross section greatly reduces the heat transfer performance when it is compressed so as to be suitable for small-sized and thin-film electronic equipment. Therefore, it is required to develop a flat plate type heat dissipation element suitable for small and thin-film electronic appliances.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a sintered flat plate heat dissipation element including an outer fin having improved heat dissipation performance.

SUMMARY OF THE INVENTION The present invention provides a sintered flat plate heat dissipation element including an external fin having a heat dissipation element and heat sink fins formed integrally.

The present invention provides a sintered flat plate heat dissipation element including an external fin. A sintered flat plate heat dissipation element including an outer fin includes a plurality of heat sink fins provided on a surface thereof and a flat plate shaped body portion provided with a plurality of flow paths for providing a space through which a working fluid flows therein, And squeeze wicks provided on one of the upper and lower surfaces of the flow paths and grooves of a concavo-convex shape provided on the other surface of the lower surface and the lower surface opposite to the one surface.

According to one embodiment of the present invention, by manufacturing a sintered flat plate heat dissipation element including an external fin with heat sink fins attached thereto, it is possible to reduce the production cost and reduce the thermal resistance due to the heat sink installation.

According to an embodiment of the present invention, the sintered wick for improving the capillary force is provided in the sintered flat plate heat dissipation element including the outer fin, thereby improving the heat dissipation performance of the sintered flat plate heat dissipation element including the outer fin.

1 is a perspective view showing a sintered flat plate heat dissipation device including an external fin according to an embodiment of the present invention.
2 is an enlarged perspective view of the area A in Fig.
3 is a perspective view illustrating a sintered flat plate heat dissipation device including an external fin according to another embodiment of the present invention.
4 is a perspective view illustrating a sintered flat plate heat dissipation device including an external fin according to another embodiment of the present invention.
5 is a cross-sectional view of a sintered flat plate heat dissipation device including an external fin according to another embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and how to accomplish them, will become apparent by reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

In addition, the embodiments described herein will be described with reference to cross-sectional views and / or plan views, which are ideal illustrations of the present invention. In the drawings, the thicknesses of the films and regions are exaggerated for an effective description of the technical content. Thus, the shape of the illustrations may be modified by manufacturing techniques and / or tolerances. Therefore, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in the forms generated according to the manufacturing process. For example, the etched area shown at right angles may be rounded or may have a shape with a certain curvature. Thus, the regions illustrated in the figures have schematic attributes, and the shapes of the regions illustrated in the figures are intended to illustrate specific types of regions of the elements and are not intended to limit the scope of the invention.

FIG. 1 is a perspective view showing a sintered flat plate heat dissipation device including an outer fin according to an embodiment of the present invention, and FIG. 2 is an enlarged perspective view of a region A of FIG.

1 and 2, a sintered flat plate heat dissipation device 1 including an external fin may include a body portion 100 and a heat sink pin 200. The body part 100 may be a flat plate pipe through which a working fluid is transferred. For example, the body portion 100 may be manufactured by one extrusion process. The body portion 100 can be manufactured by a simple manufacturing process and thus can have a manufacturing competitive power. The body portion 100 may be made of a metal having excellent conductivity such as aluminum. The size and shape of the body part 100 may vary depending on the size of the electronic device to which the sintered flat plate heat-dissipating device 1 including the external fin is applied. Since the body part 100 is in the form of a flat plate, it can be easily coupled with an electronic device. The inside of the body part 100 may be in a vacuum state.

The body 100 may include a plurality of flow passages 120 that provide a space through which the working fluid flows therein. The flow paths 120 may be continuously provided in a first direction x and may extend in a second direction y that is perpendicular to the first direction x and that is the longitudinal direction of the flow paths 120. The plurality of flow paths 120 may be separated by the barrier ribs 130. A plurality of flow passages 120 may be required to secure the structural stability of the body portion 100 and a plurality of flow passages 120 may be provided through the partition walls 130. [ The cross-section of the flow paths 120 may be rectangular, but may not be limited in shape and size. Heat can be released through the liquid-vapor phase change of the working fluid flowing through the flow paths 120 while the inside of the flow paths 120 is maintained in a vacuum state

Sintered wicks 122 and grooves 124 may be provided within the flow paths 120. The sintered wick 122 is formed by sintering the aluminum particles and the sintered wick 122 may be provided on at least one of the upper surface and the lower surface inside the flow paths 120. The sintered wick 122 may be provided to extend in the second direction y.

The sintered wick 122 may provide a capillary force that can flow the working fluid. The sintered wick 122 may be made of the same material as the body 100. For example, the sintered wick 122 may be made of aluminum provided with pores. The working fluid flowing through the flow paths 120 by the heat input into the flow paths 120 moves to the side of the condenser section having relatively low temperature after vaporization and the condensed working fluid can return to the input section of the column have. At this time, the flow channels 120 having improved capillary force by the sintered wick 122 can easily flow the working fluid and can easily transmit the heat inside the flow channels 120 due to the phase change of the working fluid. have. In the sintered flat plate heat-radiating element 1 including the external fin according to the embodiment of the present invention, the condenser may be a portion where the grooves 124 are provided, and the input portion may be a portion where the sintered wick 122 is provided. The heat transmitted by the sintered wick 122 can be transferred to the grooves 124 by the flow of the phase change of the working fluid and can be transferred to the sintered wick 122 through the relatively low temperature grooves 124 Heat can be released as it returns. The heat transferred to the grooves 124 can be effectively dissipated through the heat sink fins 200.

The grooves 124 may be provided on one surface of the flow paths 120 on which the sintered wick 122 is not provided. In the sintered flat plate heat-dissipating device 1 including the outer fin according to an embodiment of the present invention, the grooves 124 may be provided on the upper surface of the flow paths 120. The grooves 124 may be spaced apart from one another at regular intervals. The grooves 124 may extend in a first direction x and a third direction z orthogonal to the second direction y. The grooves 124 may have a concave-convex section. However, the shape of the cross section of the grooves 124 may not be particularly limited. The grooves 124 can increase the cross-sectional area of the flow paths 120 to easily release the heat inside the flow paths 120. [

The heat sink fins 200 may be provided on the body portion 100. The heat sink fins 200 may protrude in the third direction z on the upper surface of the body 100 and may extend in the second direction y. The direction in which the heat sink pins 200 extend may be parallel to the direction in which the flow paths 124 extend. The heat sink fins 200 may be spaced apart from each other along the first direction x at regular intervals. The heat sink fins 200 may be made of the same metal as the body 100 (e.g., aluminum). An electronic device or the like may be disposed on one side of the body portion 100 where the heat sink pins 200 are not provided. The heat sink fins 200 can improve the heat transfer ability of the sintered flat plate heat dissipation elements 1 including external fins. The heat generated by the electronic device is transmitted to the sintered flat plate heat dissipation element 1 including the external fin through the lower surface of the body 100, and the transmitted heat can be discharged through the heat sink fins 200. The heat sink fins 200 may be integrally formed with the body 100 in a single extrusion process so that the thermal resistance at the interface between the heat sink fins 200 and the body 100 may be reduced or eliminated.

3 is a perspective view illustrating a sintered flat plate heat dissipation device including an external fin according to another embodiment of the present invention.

3, the sintered flat plate heat dissipation device 2 including the external fin includes a body portion 100 having flow paths 120 and heat sink fins 200 provided on the upper surface of the body portion 100 can do. Only the sintered wick 122 may be provided in the flow paths 120. [ The sintered wick 122 may be provided to cover both the top, bottom, and side surfaces of the flow paths 120. The sintered wick 122 may include pores and a capillary force may be generated by the pores of the sintered wick 122 to allow the working fluid to flow within the flow paths 120. As the working fluid flows, the heat of the sintered flat plate heat dissipation elements 2 including the external fin can be released to the outside.

4 is a perspective view illustrating a sintered flat plate heat dissipation device including an external fin according to another embodiment of the present invention.

4, the sintered flat plate heat dissipation device 3 including the external fin includes a body part 100 having flow paths 120 and heat sink fins 200 provided on the upper surface of the body part 100 can do. A sintered wick 122 provided on at least one side of the upper and lower surfaces of the flow paths 120 and a groove 124 provided on the other side where the sintered wick 122 is not provided may be included in the flow paths 120 . The heat sink fins 200 may extend discontinuously in the second direction y on the upper surface of the body portion 100. That is, the heat sink fins 200 may extend in the second direction y and may be disconnected. The disconnected portions of the heat sink fins 200 may be provided at various locations on the body portion 100. It is possible to provide the heat sink fins 200 in various positions and shapes so that the sealing of the sintered flat plate heat dissipation element 3 including the external fin 3 and the problem of processing as a product may not be caused. Since the sintered flat plate heat dissipation elements 3 including external fins may be used in various places where the heat sink fins 200 are disconnected, the sintered flat heat dissipation elements 3 including external fins can be easily manufactured can do.

5 is a cross-sectional view of a sintered flat plate heat dissipation device including an external fin according to another embodiment of the present invention.

5, the sintered flat plate heat dissipation device 4 including the external fin includes a body portion 100 having flow paths 120 and heat sink fins 200 provided on the upper and lower surfaces of the body portion 100. [ ). At this time, the electronic device can be disposed on the side of the body portion 100 where the heat sink pins 200 are not provided. The heat sink fins 200 may be disposed on the upper surface and the lower surface of the body 100 to improve heat dissipation characteristics of the sintered flat plate heat dissipation elements 4 including external fins.

Unlike the above-described example, the position of the sintered wick 122 inside the flow paths 120 may be unlimited. However, the sintered wick 122 must be provided on at least one of the upper and lower surfaces of the flow paths 120.

Claims (10)

A body having a flow path for providing a space through which a working fluid flows;
A plurality of heat sink fins protruding from the body portion on the body portion; And
And a sintered wick provided inside the flow path to provide a capillary force capable of flowing the working fluid,
Wherein the sintered wick is formed by sintering aluminum particles and includes pores, and covers the upper surface, lower surface, and side surfaces of the flow path.
delete delete delete delete The method according to claim 1,
Wherein the flow path is provided in a plurality of sintered flat plate heat dissipation elements.
The method according to claim 6,
Wherein the plurality of flow paths are disposed along a first direction and the plurality of heat sink fins extend along a second direction perpendicular to the first direction.
8. The method of claim 7,
And the plurality of flow paths each extend along the second direction.
8. The method of claim 7,
And the plurality of heat sink fins are discontinuously extended along the second direction.
The method according to claim 1,
Wherein the body portion is a flat plate-like sintered flat plate heat dissipating element.
KR1020150071205A 2014-09-24 2015-05-21 Sintered flat panel heat dissipation structure comprising Aluminum powder KR101880533B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20140127623 2014-09-24
KR1020140127623 2014-09-24

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KR101880533B1 true KR101880533B1 (en) 2018-07-24

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020073905A1 (en) * 2018-10-12 2020-04-16 广州力及热管理科技有限公司 Method for manufacturing ultrathin heat tube plate with printed capillary structure

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102049403B1 (en) * 2017-09-12 2019-11-28 한화시스템 주식회사 A vapor chamber array made of a 3D printer and an integral heat sink including the same
KR102409620B1 (en) * 2018-01-09 2022-06-17 한온시스템 주식회사 Cooling device and manufacturing method for thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120021703A (en) * 2010-08-13 2012-03-09 주식회사 세기하이텍 Flat heat spreader with secondary cooling body united in the side wall, and manufacturing method of the same
KR20120065569A (en) * 2010-12-13 2012-06-21 한국전자통신연구원 Thin plate heat pipe
KR20130050790A (en) * 2011-11-08 2013-05-16 한국전자통신연구원 Flat heat pipe and fabrication method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120021703A (en) * 2010-08-13 2012-03-09 주식회사 세기하이텍 Flat heat spreader with secondary cooling body united in the side wall, and manufacturing method of the same
KR20120065569A (en) * 2010-12-13 2012-06-21 한국전자통신연구원 Thin plate heat pipe
KR20130050790A (en) * 2011-11-08 2013-05-16 한국전자통신연구원 Flat heat pipe and fabrication method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020073905A1 (en) * 2018-10-12 2020-04-16 广州力及热管理科技有限公司 Method for manufacturing ultrathin heat tube plate with printed capillary structure

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