TW201331533A - Heat pipe structure - Google Patents

Abstract

A heat pipe structure includes a main body having a chamber. The chamber has a first side and a second side. A first capillary structure and a second capillary structure are respectively disposed on the first and second sides. A working fluid is filled in the chamber. The first capillary structure has a volume larger than a volume of the second capillary structure but smaller than one half of a circumference of inner wall face of the chamber. The first and second capillary structures are connected with each other. The first and second capillary structures and the inner wall face of the chamber together define at least one vapor passage. By means of the heat pipe structure, the amount of transferred heat is increased and the heat transfer efficiency is greatly enhanced.

Description

Heat pipe structure

A heat pipe structure, especially a heat pipe structure capable of reducing the heat resistance pressure and greatly increasing the vapor-liquid circulation inside the heat pipe to increase the heat transfer efficiency.

With the miniaturization and high performance of computers, smart electronic devices and other electrical devices, the heat transfer components and heat dissipating components used in the interior are also required to be designed in the direction of miniaturization and thinning. In order to meet the needs of users.
The heat pipe is a heat-conducting element with excellent heat conduction efficiency, and its heat transfer efficiency is several times or even several tens of times higher than that of metals such as copper and aluminum, and thus it is used as a cooling element in various heat-related equipment.
In terms of shape, the heat pipe is divided into a heat pipe having a circular tube shape, a heat pipe having a D-shaped cross section, a flat heat pipe, etc., and is mainly used for cooling the heat source in the electronic device, and is convenient for mounting to the cooled component and In order to obtain a larger area of the contact surface, the flat heat pipe is widely used at the present stage, and as the cooling mechanism is miniaturized and space-saving, the electronic device using the heat pipe as the heat conduction is also selected in the same amount. Flat heat pipe to apply.
The conventional heat pipe structure has various manufacturing methods, for example, a metal powder is filled in a hollow pipe body, and the metal powder is sintered to form a capillary structure layer on the inner wall of the hollow pipe, and thereafter The tube body is vacuum-filled into the working fluid to finally seal the tube, or the mesh body of the metal material is built in the hollow tube body, and the mesh-shaped capillary structure is unfolded and naturally extended outwardly to the The inner wall of the hollow tube forms a capillary structure layer, and then the tube body is vacuum-filled to fill the working fluid and finally sealed. However, due to the above-mentioned demand for miniaturization and thinning of the electronic equipment, the heat pipe is required. Made into a flat type.
Although the flat heat pipe can achieve the purpose of thinning, it extends another problem. Since the flat heat pipe sinters the metal powder on the inner wall surface of the heat pipe diameter body, the sintered body is completely covered. On the inner wall, when the flat heat pipe is pressurized, the capillary structure (ie, the sintered metal powder or the network capillary structure) on the two sides of the flat heat pipe is susceptible to crushing damage, and the plate is further The inner wall of the heat pipe is detached or deformed, so that the heat transfer efficiency of the thin heat pipe is greatly reduced or it is dissipated; in addition, although the flat heat pipe can achieve heat source conduction, since the flat heat pipe is thinned, it is thinned. The purpose is that the capillary force of the internal capillary structure is insufficient, so that the working fluid blocks the steam passage, and the flow passage area of the tube is reduced when the flat heat pipe is thinned, so that the capillary force is reduced, and the maximum heat transfer amount is also lowered. One of the main reasons is that the overall thinning of the flat heat pipe leads to a reduction in the internal volume of the flat heat pipe, and the other reason is that the flattened heat pipe is flattened after being flattened. After closing the recess blocks the steam path.
Therefore, in order to solve the above-mentioned conventional disadvantages, a person in the field inserts a mandrel into the inner chamber of the flat heat pipe, and the mandrel forms a specific slit shape along the axial direction, and the inner wall of the cavity is formed by the slit The formed space is filled with metal powder and sintered to form a capillary structure, and finally the mandrel is pulled out, and then the central portion of the chamber where the capillary structure is located is subjected to press processing to form a flat shape, and the capillary structure and the inner wall of the chamber are formed. The flat portion is in thermal contact, and a gap is provided on both sides of the capillary structure in the chamber as a steam passage to obtain a better vapor passage impedance, but the capillary section is narrow, so that the capillary force is reduced, resulting in anti-gravity thermal efficiency and heat transfer. The efficiency is extremely poor, and this shortcoming is the focus of the current improvement.

Accordingly, in order to solve the above disadvantages of the prior art, the main object of the present invention is to provide a heat pipe structure capable of improving heat conduction and heat transfer efficiency.
A secondary object of the present invention is to provide a heat pipe structure that reduces the thermal impedance pressure.
In order to achieve the above object, the present invention provides a heat pipe structure, comprising: a body having a chamber, the chamber having a first side and a second side, wherein the first and second sides are respectively provided with a first a capillary structure and a second capillary structure and a working fluid, the volume of the first capillary structure being larger than the second capillary structure but smaller than one half of the circumference of the inner wall of the chamber, and being connected to each other and being defined together with the chamber At least one steam passage.
The heat pipe structure of the present invention can greatly reduce the thermal impedance pressure inside the heat pipe and thereby improve the vapor-liquid circulation efficiency of the working fluid, so the present invention has the following advantages:
1. Unit area can withstand large thermal power impact;
2. It can improve the maximum heat transfer efficiency;
3. Excellent anti-gravity ability;
4. The interface thermal resistance is small.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
1 and 2 are a perspective view and a cross-sectional view of a first embodiment of a heat pipe structure according to the present invention. As shown, the heat pipe structure includes: a body 1;
The body 1 has a chamber 11 having a first side 111 and a second side 112. The first and second sides 111 and 112 are respectively provided with a first capillary structure 1121 and a second capillary. The structure 1122 and a working fluid 2, the volume of the first capillary structure 1121 is greater than the second capillary structure 1122 (generally the radial extension volume of the first capillary structure 1121 is greater than the radial extension of the second capillary structure 1122) The volume is smaller than one half of the circumference of the inner wall of the chamber 11 and is coupled to each other and together with the chamber 11 defines at least one steam passage 113.
The first and second capillary structures 1121 and 1122 are each a sintered powder body, a mesh body and a fiber body. The present embodiment is exemplified by a sintered powder body, but is not limited thereto; the chamber 11 is a smooth wall.
Referring to FIG. 3, it is a cross-sectional view of a second embodiment of the heat pipe structure of the present invention. As shown in the figure, the structure of the embodiment is the same as that of the first embodiment, and therefore will not be described herein again, but the implementation is omitted. The difference from the first embodiment is that a first extension portion 1123 extends from a side of the first capillary structure 1121, and the first extension portion 1123 is connected to the second capillary structure 1122.
Referring to FIG. 4, it is a cross-sectional view of a third embodiment of the heat pipe structure of the present invention. As shown in the figure, the partial structure of the present embodiment is the same as that of the first embodiment, and therefore will not be described herein again, but the implementation is omitted. The difference from the first embodiment is that a second extension portion 1124 extends from a side of the second capillary structure 1122, and the second extension portion 1124 is connected to the first capillary structure 1121.
Referring to FIG. 5, it is a cross-sectional view of a fourth embodiment of the heat pipe structure of the present invention. As shown in the figure, the partial structure of the present embodiment is the same as that of the first embodiment, and therefore will not be described herein again, but the implementation is not described herein. The difference from the foregoing first embodiment is that a third capillary structure 1125 is disposed on the wall surface of the chamber 11, and the first and second capillary structures 1121, 1122 are connected to the third capillary structure 1125. The third capillary structure 1125 is a sintered powder body, a mesh body, a fiber body, and a groove. The present embodiment is described by a groove, but is not limited thereto.
FIG. 6 and FIG. 7 are perspective and cross-sectional views showing an application embodiment of the heat pipe structure of the present invention. As shown, the exterior of the first side 111 of the body 1 is correspondingly disposed with at least one heat source 3, and the second The heat dissipating component 4 is disposed at the opposite end of the body 1 and the heat source 3, and the heat dissipating component 4 is a heat sink and a heat sink fin group. In any of the water-cooling devices, the present embodiment is described with a heat sink, but is not limited thereto.
The first capillary structure 1121 of the body 1 of the present embodiment has a larger overall volume than the second capillary structure 1122. The first capillary structure 1121 is disposed on the first side 111 of the body 1 corresponding to the heat source 3, and the second The capillary structure 1122 is disposed on the second side 112 corresponding to the first side 111. The heat generated by the heat source 3 causes the working fluid 2 in the first capillary structure 1121 to be evaporated by heat, and is converted by the liquid working fluid 22 into The vaporous working fluid 21 diffuses to the second capillary structure 1122 disposed on the second side 112 of the body 1. The vaporous working fluid 21 is cooled on the second side 112 to be condensed into a liquid working fluid 22, and then passed through gravity. Or the second capillary structure 1122 is returned to the first capillary structure 1121 to continue the vapor-liquid circulation, because the working fluid 2 is converted from a vapor state to a liquid system through the vapor channel 113 of the body 1 from the first capillary structure 1121 to the second capillary The structure 1122 is diffused. Since the volume of the second capillary structure 1122 is smaller than the volume of the first capillary structure 1121, the pressure resistance of the vaporous working fluid 21 during diffusion can be reduced, so that the arrangement of the present invention not only enhances the Radial heat transfer efficiency of the body 1, an axial thermal conduction efficiency of the body is also significantly improved, it is effective to increase the body 1 of the working fluid inside the vapor-liquid cycle efficiency by 2.

1. . . Ontology

11. . . Chamber

111. . . First side

112. . . Second side

113. . . Steam passage

1121. . . First capillary structure

1122. . . Second capillary structure

1123. . . First extension

1124. . . Second extension

1125. . . Third capillary structure

2. . . Working fluid

twenty one. . . Vapor working fluid

twenty two. . . Liquid working fluid

3. . . Heat source

4. . . Heat sink

1 is a perspective view of a first embodiment of a heat pipe structure of the present invention;
Figure 2 is a cross-sectional view along line AA of the first embodiment of the heat pipe structure of the present invention;
Figure 3 is a cross-sectional view showing a second embodiment of the heat pipe structure of the present invention;
Figure 4 is a cross-sectional view showing a third embodiment of the heat pipe structure of the present invention;
Figure 5 is a cross-sectional view showing a fourth embodiment of the heat pipe structure of the present invention;
Figure 6 is a perspective view showing an application embodiment of the heat pipe structure of the present invention;
Figure 7 is a cross-sectional view showing an application embodiment of the heat pipe structure of the present invention.

1. . . Ontology

11. . . Chamber

111. . . First side

112. . . Second side

113. . . Steam passage

1121. . . First capillary structure

1122. . . Second capillary structure

2. . . Working fluid

Claims (10)

A heat pipe structure comprising:
a body having a chamber having a first side and a second side, wherein the first and second sides are respectively provided with a first capillary structure and a second capillary structure and a working fluid, The volume of a capillary structure is greater than the volume of the second capillary structure and is interconnected and defines at least one vapor passageway with the chamber. The heat pipe structure of claim 1, wherein the first capillary structure has a volume smaller than one half of a circumference of the inner wall of the chamber. The heat pipe structure of claim 1 or 2, wherein the outer side of the first side of the chamber and the at least one heat source respectively conduct heat, and the outer side of the second side is correspondingly provided with at least one heat dissipating component, the heat dissipation The components are any one of a heat sink and a heat sink fin set and a water cooling device. The heat pipe structure according to claim 1 or 2, wherein the first and second capillary structures are a sintered powder body, and any one of a mesh body and a fiber body. The heat pipe structure of claim 1 or 2, wherein a first extension portion extends from one side of the first capillary structure, and the first extension portion is coupled to the second capillary structure. The heat pipe structure of claim 1 or 2, wherein a second extension portion extends from one side of the second capillary structure, and the second extension portion is coupled to the first capillary structure. The heat pipe structure of claim 1 or 2, wherein the chamber is formed into a smooth wall. The heat pipe structure according to claim 1 or 2, wherein the chamber wall surface is provided with a third capillary structure, and the first and second capillary structures are connected to the third capillary structure. The heat pipe structure according to claim 8, wherein the third capillary structure is a sintered powder body and a mesh body and a fiber body and a groove. The heat pipe structure of claim 1 or 2, wherein the radially extending volume of the first capillary structure is greater than the radially extending volume of the second capillary structure.