JP3175221U - Heat pipe structure - Google Patents

Abstract

A thin heat pipe structure for improving heat conduction efficiency is provided.
A main body 1 having a flat cross-sectional structure constitutes a chamber 11 having a first surface 111 in contact with a heat source and a second surface 112 serving as a heat radiating surface.
The chamber is filled with the hydraulic fluid 2, and the first surface 111 and the second surface 112 thereof have a first capillary structure 1111 and a second capillary structure 1121, respectively. The range extending in the flat width direction is equal to or greater than the width of the chamber 11, and the width of the second capillary structure 1121 is made smaller than the width of the chamber to form a vapor passage in the side chamber. The first capillary structure 1111 and the second capillary structure 1121 are connected to each other to define at least one vapor passage 113 in the chamber 11 on the side of the second capillary structure 1121.
[Selection] Figure 2

Description

  The present invention relates to a heat pipe structure, and more particularly, to a heat pipe structure that reduces heat resistance pressure, significantly improves gas-liquid circulation in the heat pipe, and increases heat conduction efficiency.

  The miniaturization and high performance of personal computers and electronic devices are progressing day by day. Along with this, miniaturization and thinning are also required for heat conduction devices and heat dissipation devices mounted inside.

  A heat pipe is a heat conduction device having a heat conduction efficiency several to several tens of times higher than that of a single metal structure such as copper or aluminum, and is widely used as a cooling device.

  The heat pipe has various types such as a tubular shape, a D shape, and a quadrilateral shape, and is used for heat conduction of the cooling mechanism. Among these, flat heat pipes are used in the widest range because they are easy to attach to a cooling site and have a large contact surface. In addition, in order to reduce the size of the cooling mechanism and save space, planar heat pipes are often selected for electronic devices using heat pipes.

  There are various conventional heat pipe manufacturing methods. For example, a hollow tube body is filled with metal powder, and a capillary structure is formed on the wall of the hollow tube body by sintering, and the tube body is evacuated. The working fluid is filled and sealed. Also, there is a type in which a mesh of a metal material is put into a hollow tube body to form a net-like thin tube structure on the wall of the hollow tube body. Recently, with the miniaturization of electronic devices, many are processed into flat heat pipes.

  Planar heat pipes have cleared the goal of thinning, but have derived new problems. Capillary structures on both sides of the part where the pressure is applied to the flat heat pipe are filled with metal powder and a capillary structure is formed on the wall of the pipe body by sintering. Was destroyed and could be removed from the inner wall. In this case, the heat conduction effect of the planar heat pipe is greatly reduced, and in some cases, it becomes inoperable. In addition, when the flat heat pipe is manufactured thin, the capillary force of the capillary structure is weakened, and the working fluid may block the vapor flow path. Since the distribution area in the flat heat pipe is small, the capillary force is weakened and the maximum heat transport amount is also reduced.

  In order to improve the above drawbacks, a method of forming a capillary structure by inserting a core rod into a chamber inside a planar heat pipe has been adopted. The core rod forms a specific cut shape in the axial direction, but a metal powder is filled between the cut and the inner wall of the chamber and sintered to form a capillary structure. The core rod is removed and pressure is applied to the central portion of the chamber to make it flat. Since the capillary structure and the inner wall of the chamber are in thermal contact and the gap on both sides of the capillary structure becomes a vapor passage, the hydraulic fluid is easy to circulate, but the capillary structure has a small cross section, so the capillary force is weak, and from the evaporation surface The gas-liquid circulation efficiency and heat conduction efficiency to the condensing surface were poor. The above drawbacks are major problems to be solved for the time being.

JP 2007-315745 A

A first object of the present invention is to provide a heat pipe structure that improves heat conduction efficiency.
The second object of the present invention is to provide a heat pipe structure that reduces the anti-gravity effect.

In order to achieve the above object, the present invention provides a heat pipe structure. The heat pipe structure of the present invention has a main body. The body includes a chamber having a first surface and a second surface. The first surface and the second surface have a hydraulic fluid, a first capillary structure, and a second capillary structure, respectively. The first capillary structure may have a radially extended range that is greater than and / or equal to half the inner wall circumference of the chamber. Moreover, it is larger than the range extended | stretched to the radial direction of the 2nd capillary structure simultaneously. The first capillary structure is interconnected on one side with the second capillary structure and defines at least one vapor passage with the chamber.

The heat pipe structure of the present invention can greatly improve the anti-gravity effect inside the heat pipe and improve the gas-liquid circulation of the working fluid. Therefore, it has the following four advantages. 1. The allowable heat load per unit area is large. 2. High heat conduction efficiency. 3. Gas-liquid circulation efficiency from the evaporation surface to the condensation surface is high. 4. Thermal resistance between connected devices is small.

1 is a perspective view showing a heat pipe structure according to a first embodiment of the present invention. 1 is a cross-sectional view showing a heat pipe structure according to a first embodiment of the present invention. It is sectional drawing which shows the heat pipe structure by the 2nd Embodiment of this invention. It is sectional drawing which shows the heat pipe structure by the 3rd Embodiment of this invention. It is sectional drawing which shows the heat pipe structure by the 4th Embodiment of this invention. It is sectional drawing which shows the heat pipe structure by the 5th Embodiment of this invention. It is a perspective view which shows the application example of the heat pipe structure of this invention. It is sectional drawing which shows the application example of the heat pipe structure of this invention.

Embodiments of the present invention will be described below with reference to the drawings.

  Please refer to FIG. 1 and FIG. FIG. 1 is a perspective view showing a heat pipe structure according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view showing a heat pipe structure according to the first embodiment of the present invention. As shown in FIGS. 1 and 2, the heat pipe structure of the present invention includes a main body 1.

  The main body 1 is provided with a chamber 11 having a first surface 111 and a second surface 112. The first surface 111 and the second surface 112 have the hydraulic fluid 2, the first capillary structure 1111 and the second capillary structure 1121, respectively. The first capillary structure 1111 may have a radially extended range that is greater than and / or equal to half the inner wall circumference of the chamber 11. Moreover, it is larger than the range extended | stretched to the radial direction of the 2nd capillary structure 1121 simultaneously. The first capillary structure 1111 is connected to the second capillary structure 1121 on one side and defines at least one vapor passage 113 together with the chamber 11.

  The first capillary structure 1111 and the second capillary structure 1121 are one of a powder sintered body, a mesh, a fiber body, and a porous structure. In the present embodiment, the powder sintered body is taken as an example. Although explanation is added, it is not limited to this. The chamber 11 has a smooth wall surface.

  Please refer to FIG. FIG. 3 is a cross-sectional view illustrating a heat pipe structure according to a second embodiment of the present invention. As shown in FIG. 3, the heat pipe structure of the present embodiment is partially the same as that of the first embodiment, and therefore only different parts will be described. The difference from the first embodiment is that the first capillary structure 1111 has a first extension part 1112 that extends to one side, and the first extension part 1112 is connected to the second capillary structure 1121. It is.

  Please refer to FIG. FIG. 4 is a cross-sectional view illustrating a heat pipe structure according to a third embodiment of the present invention. As shown in FIG. 4, the heat pipe structure of the present embodiment is partially the same as that of the first embodiment, and therefore only different parts will be described. The part different from the first embodiment is that the second capillary structure 1121 has a second extension part 1122 extended to one side, and the second extension part 1122 is connected to the first capillary structure 1111. It is.

  Please refer to FIG. FIG. 5 is a cross-sectional view showing a heat pipe structure according to a fourth embodiment of the present invention. As shown in FIG. 5, the heat pipe structure of the present embodiment is partially the same as that of the first embodiment, and therefore only the different parts will be described. A different part from the first embodiment is that a third capillary structure 114 connected to the first capillary structure 1111 and the second capillary structure 1121 is provided on the wall surface of the chamber 11. The third capillary structure 114 is one of a powder sintered body, a mesh, a fiber body, and a groove. In the present embodiment, the groove is taken as an example, but the present invention is not limited to this. .

  Please refer to FIG. FIG. 6 is a cross-sectional view illustrating a heat pipe structure according to a fifth embodiment of the present invention. As shown in FIG. 6, the heat pipe structure of the present embodiment is partially the same as that of the first embodiment, and therefore only different parts will be described. The difference from the first embodiment is that the chamber 11 further has a plating layer 3 on the wall surface. The plating layer 3 is provided between the wall surface of the chamber 11 and the first capillary structure 1111 and the second capillary structure 1121 and is either a hydrophilic plating layer or a hydrophobic plating layer. Partially hydrophilic plating layers and hydrophobic plating layers can also be used.

  Please refer to FIG. 7 and FIG. FIG. 7 is a perspective view showing an application example of the heat pipe structure of the present invention. FIG. 8 is a sectional view showing an application example of the heat pipe structure of the present invention. As shown in FIGS. 7 and 8, the main body 1 is provided with at least one heat source 4 corresponding to the first surface 111. A heat dissipation device 5 is provided on the main body 1 on the opposite side of the heat source 4. The heat dissipation device 5 is one of a radiator, a heat dissipation fin, and a water cooling device. In the present embodiment, a heat radiator will be described as an example, but the present invention is not limited to this.

  The first capillary structure 1111 on the body 1 may have a volume greater than that of the second capillary structure 1121 and the radially extended range may be greater than and / or equal to half the inner wall circumference of the chamber 11. The first capillary structure 1111 is provided on the first surface 111 with respect to the heat source 4 on the main body 1, and the second capillary structure 1121 is provided on the second surface 112 opposite to the first surface 111. Yes. The amount of heat generated by the heat source 4 evaporates the working fluid 2 in the first capillary structure 1111. The liquid hydraulic fluid 22 is converted into a gaseous hydraulic fluid 21 and diffuses into the second capillary structure 1121 on the second surface 112 of the main body 1. The gaseous hydraulic fluid 21 is cooled by the second surface 112 and converted into the liquid hydraulic fluid 22 and is circulated to the first capillary structure 1111 by gravity and / or the second capillary structure 1121 to repeat the gas-liquid circulation. . The working fluid 2 diffuses from the first capillary structure 1111 toward the second capillary structure 1121 on the vapor passage 113 of the main body 1 when converting from gas to liquid. Since the volume of the second capillary structure 1121 is smaller than that of the first capillary structure 1111, the pressure resistance when the gas hydraulic fluid 21 is diffused can be reduced, and the gas-liquid circulation efficiency of the hydraulic fluid 2 is effectively increased. . At the same time, the amount of heat is transmitted to a part away from the heat source 4 to release heat, and the heat source 4 does not accumulate the amount of heat. Not only the heat conduction efficiency in the radial direction of the main body 1 was accelerated, but also the heat conduction efficiency in the axial direction was greatly improved.

  Although the present invention discloses preferred embodiments as described above, these are not intended to limit the present invention in any way, and anyone skilled in the art is within the spirit and scope of the present invention. Various changes and modifications can be made. Therefore, the scope of protection of the present invention is based on the contents specified in the claims of the utility model.

DESCRIPTION OF SYMBOLS 1 Main body 2 Hydraulic fluid 3 Plating layer 4 Heat source 5 Thermal radiation device 11 Chamber 21 Gaseous hydraulic fluid 22 Liquid hydraulic fluid 111 1st surface 112 2nd surface 113 Vapor passage 114 3rd capillary structure 1111 1st capillary structure 1112 1st extending part 1121 2nd capillary structure 1122 2nd extending part

Claims (12)

In heat pipe structure,
In a chamber having a flat cross-sectional structure having a first surface in contact with the heat generation source and a second surface on the heat dissipation surface side, and filled with a working fluid,
The first surface and the second surface have a first capillary structure and a second capillary structure, respectively.
The first capillary structure is provided to extend in the flat width direction of the chamber over half of its inner circumference,
The second capillary structure is connected to the first capillary structure and has a width narrower than that of the first capillary structure to define at least one vapor passage in the side chamber. Characteristic heat pipe structure. In heat pipe structure,
In a chamber having a flat cross-sectional structure having a first surface in contact with the heat generation source and a second surface on the heat dissipation surface side, and filled with a working fluid,
The first surface and the second surface have a first capillary structure and a second capillary structure, respectively.
The first capillary structure is provided extending in the flat width direction of the chamber to the middle of its inner periphery,
The second capillary structure is connected to the first capillary structure and has a width narrower than that of the first capillary structure to define at least one vapor passage in the side chamber. Characteristic heat pipe structure.   The chamber is provided so that the first surface corresponds to at least one heat source, and the second surface is provided with at least one heat dissipation device, the heat dissipation device being a radiator, a heat dissipation fin, or a water cooling device. The heat pipe structure according to claim 1 or 2, wherein the heat pipe structure is one of the following.   The heat pipe according to claim 1 or 2, wherein the first capillary structure and the second capillary structure are one of a powder sintered body, a mesh, a fiber body, and a porous structure. Construction.   The first capillary structure has a first extending portion extending toward a second surface, and the first extending portion is connected to the second capillary structure. Item 3. The heat pipe structure according to Item 1 or 2.   The second capillary structure has a second extending portion extending toward the first surface, and the second extending portion is connected to the first capillary structure. Item 3. The heat pipe structure according to Item 1 or 2.   The heat pipe structure according to claim 1, wherein the chamber has a smooth wall surface.   The heat pipe according to claim 1 or 2, wherein the chamber 1 is provided with a third capillary structure between an inner wall surface thereof and the first capillary structure and the second capillary structure. Construction.   The heat pipe structure according to claim 8, wherein the third capillary structure is one of a powder sintered body, a mesh, a fiber body, and a groove.   The heat pipe structure according to claim 1, wherein the chamber further includes a plating layer between an inner wall surface thereof and the first capillary structure and the second capillary structure.   The heat pipe structure according to claim 10, wherein the plating layer is a hydrophilic plating layer.   The heat pipe structure according to claim 10, wherein the plating layer is a hydrophobic plating layer.

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