TWI564530B - Heat pipe heat dissipation structure - Google Patents

Description

Heat pipe heat dissipation structure

The invention relates to a heat pipe heat dissipation structure, in particular to a heat pipe heat dissipation structure which has better heat transfer efficiency and good anti-gravity capability, and further can achieve the effect of small interface thermal resistance.

With the miniaturization and high performance of computers, smart electronic devices and other electrical devices, the heat transfer components and heat dissipating components used in the interior are also required to be designed in the direction of miniaturization and thinning. In order to meet the needs of users.

The heat pipe is a heat-conducting element with excellent heat conduction efficiency, and its heat transfer efficiency is several times or even several tens of times higher than that of metals such as copper and aluminum, and thus it is used as a cooling element in various heat-related equipment.

In terms of shape, the heat pipe is divided into a heat pipe having a circular tube shape, a heat pipe having a D-shaped cross section, a flat heat pipe, etc., and is mainly used for cooling the heat source in the electronic device, and is convenient for mounting to the cooled component and In order to obtain a larger area of the contact surface, the flat heat pipe is widely used at the present stage, and as the cooling mechanism is miniaturized and space-saving, the electronic device using the heat pipe as the heat conduction is also selected in the same amount. Flat heat pipe to apply.

The conventional heat pipe structure has various manufacturing methods, for example, a metal powder is filled in a hollow pipe body, and the metal powder is sintered to form a capillary structure layer on the inner wall of the hollow pipe, and thereafter The tube body is vacuum-filled into the working fluid to finally seal the tube, or the mesh body of the metal material is built in the hollow tube body, and the mesh-shaped capillary structure is unfolded and naturally extended outwardly to the The inner wall of the hollow tube forms a capillary structure layer, and then the tube body is vacuum-filled to fill the working fluid and finally sealed. However, due to the micro-thinning requirements of the electronic equipment, the heat pipe needs to be made into a flat type.

Although the flat heat pipe can achieve the purpose of thinning, it extends another problem. Since the flat heat pipe sinters the metal powder on the inner wall surface of the heat pipe diameter, the sintered body is completely and completely covered on the wall surface. When the flat heat pipe is pressurized, the capillary structure (ie, the sintered metal powder or the network capillary structure) on the two sides of the flat heat pipe is susceptible to crushing damage, and is further included in the flat heat pipe. The wall is detached, so that the heat transfer efficiency of the thin heat pipe is greatly reduced or it is dissipated; in addition, although the flat heat pipe can achieve heat source conduction, since the flat heat pipe is thinned, the internal capillary is caused by thinning. The capillary force of the structure is insufficient, causing the working fluid to block the steam passage. Moreover, the area of the flow passage in the tube is reduced when the flat heat pipe is thinned, so that the capillary force is reduced, and the maximum heat transfer amount is also reduced. The overall thinning of the flat heat pipe leads to a reduction in the inner volume of the flat heat pipe, and the other reason is that the thinned flat heat pipe after the flattening causes the central recess to be closed. The plug steam passage.

Therefore, in order to solve the above-mentioned conventional disadvantages, a person in the field inserts a core rod into the inner chamber of the flat heat pipe, and the core rod forms a specific slit shape along the axial direction, and the inner wall of the chamber is formed by the slit. The formed space is filled with metal powder and sintered to form a capillary structure, and finally the mandrel is pulled out, and then the central portion of the chamber where the capillary structure is located is subjected to press processing to form a flat shape, and the capillary structure and the chamber are The flat portion of the wall is in thermal contact, and a gap is provided on both sides of the capillary structure in the chamber as a steam passage to obtain a better vapor passage impedance. However, due to the narrow capillary section, the capillary force is reduced, resulting in anti-gravity thermal efficiency and heat. If the transmission efficiency is poor, this shortcoming is the focus of the current improvement.

Accordingly, in order to effectively solve the above problems, the main object of the present invention is to provide a heat pipe heat dissipation structure having better heat transfer efficiency.

A secondary object of the present invention is to provide a heat pipe heat dissipation structure having an effect of achieving high anti-gravity capability and small interface thermal resistance.

A secondary object of the present invention is to provide a heat pipe heat dissipation structure having a unit area that can withstand a large thermal power impact.

In order to achieve the above object, the present invention provides a heat pipe heat dissipation structure including a body and at least one first capillary structure, the body having a first inner side, a second inner side opposite to the first inner side, and a third inner side. a fourth inner side and at least one chamber opposite to the third inner side, the chamber is filled with a working fluid; and the first capillary structure is disposed in the chamber, the first capillary structure is a sintered powder body, and has a first portion and a second portion, the first portion is formed on the first inner side, and the second portion is not in contact with the opposite second inner side, and the second portion is adjacent to the two sides of the first portion The third and fourth inner sides are formed, and the thickness of the first portion is greater than the thickness of the second portion; the first portion and the second portion are respectively formed on the inner sides of the first, third, and fourth sides of the body, thereby The vapor working fluid in the chamber is fully fluent, and thus effectively achieves excellent heat transfer efficiency, good anti-gravity capability, small pressure resistance, and large thermal power impact per unit area.

1‧‧‧ Ontology

11‧‧‧First inside

12‧‧‧ second inner side

121‧‧‧Capillary formation zone

122‧‧‧No capillary formation zone

13‧‧‧ third inside

14‧‧‧ fourth inner side

15‧‧‧ chamber

151‧‧‧First steam passage

152‧‧‧Second steam channel

16‧‧‧First capillary structure

161‧‧‧Part 1

162‧‧‧Part II

17‧‧‧Proliferation capillary

171‧‧‧Free end

18‧‧‧Second capillary structure

2‧‧‧Vapor working fluid

3‧‧‧Liquid working fluid

4‧‧‧heating components

5‧‧‧heating unit

1 is a schematic perspective view of a heat pipe heat dissipation structure of the present invention; FIG. 2 is a schematic cross-sectional view showing a first preferred embodiment of the present invention; FIG. 3A is a perspective view showing a second preferred embodiment of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 3C is a perspective view showing another embodiment of the second preferred embodiment of the present invention; FIG. 3D is a second preferred embodiment of the present invention. FIG. 4 is a cross-sectional view showing a third preferred embodiment of the present invention; FIG. 5 is a cross-sectional view showing a third preferred embodiment of the present invention; and FIG. 6 is a fourth embodiment of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS Fig. 7 is a schematic cross-sectional view showing a fifth preferred embodiment of the present invention.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

The present invention is a heat pipe heat dissipation structure. Please refer to FIGS. 1 and 2 for a perspective view of a first preferred embodiment of the present invention. The heat pipe heat dissipation structure includes a body 1 and at least a first capillary structure. 16 . The body 1 has a first inner side 11 , a second inner side 12 , a third inner side 13 , a fourth inner side 14 , and at least one chamber 15 . The first inner side 11 is opposite to the second inner side 12 . The third inner side 13 is opposite to the fourth inner side 14, and the first, second, third, and fourth inner sides 11, 12, 13, 14 collectively define the chamber 15, the chamber 15 is filled with a working fluid, the foregoing work The flow system may be any of pure water, inorganic compounds, alcohols, ketones, liquid metals, cold coal, and organic compounds. The wall surfaces (i.e., the first, second, third, and fourth inner sides 11, 12, 13, and 14) of the chamber 15 are formed into smooth walls.

In addition, the first capillary structure 16 is described as a sintered powder body in the preferred embodiment, but is not limited thereto. In the specific implementation, it may be selected as a mesh, a fiber body, a mesh, and a sintered powder combination and micro Any one of the structures; and the first capillary structure 16 is disposed in the chamber 15 and has a first portion 161 and a second portion 162 formed on the first inner side 11 And the second portion 162 is formed by extending from the two sides of the first portion 161 adjacent to the third and fourth inner sides 13, 14 and the thickness of the first portion 161 Greater than the thickness of the second portion 162, generally refers to the radially extending volume of the first portion 161 being greater than the radially extending volume of the second portion 162.

Therefore, the thickness of the first portion 161 on the first inner side 11 is greater than the thickness of the second portion 162 on the third and fourth inner sides 13, 14 so that the outer portion of the first inner portion 11 can withstand the heat corresponding to the larger power. The heat generated by the component, in other words, the unit area of the first capillary structure 16 is large, so that it can withstand a large thermal power impact, and the relative heat transfer amount is relatively large. And because the second inner side 12 is not provided with the first capillary structure 16 to reduce the pressure resistance flowing to the second inner side 12 of the vapor working fluid 2 (as shown in FIG. 3B) in the chamber 15, In order to effectively increase the efficiency of vapor-liquid circulation.

Therefore, the first and second portions 161 and 162 of the first capillary structure 16 of the present invention are respectively disposed on the first, third, and fourth inner sides 11, 13, and 14 in the chamber 15, and the design is integrated. The heat transfer efficiency is better and the pressure resistance is reduced, thereby effectively improving the vapor-liquid circulation efficiency.

3A and 3B are diagrams showing a perspective view of a second preferred embodiment of the present invention, and a schematic view of the second preferred embodiment, which is mainly referred to as the first preferred embodiment. The heat pipe heat dissipation structure of the embodiment is attached to the opposite at least one heat generating component 4 (such as a central processing unit, a drawing chip, a north-south bridge wafer or other processing wafer), that is, the exterior of the first inner side 11 of the body 1 and at least When a heating element 4 correspondingly conducts heat, the first and second portions 161, 162 of the first, third, and fourth inner sides 11, 13, 14 are rapidly adsorbed by the liquid working fluid 3 to be evaporated to be converted into steam. The working fluid 2 causes the vaporous working fluid 2 to cause the vaporous working fluid 2 to rapidly flow toward the opposite second inner side 12 due to the absence of the first capillary structure 16 on the second inner side 12, waiting for the vapor state After the working fluid 2 is cooled and condensed into the liquid working fluid 3 on the second inner side 12, the liquid working fluid 3 is returned by gravity to the first portion 161 and the third and fourth inner sides 13, 14 on the first inner side 11. The second part of the 162 continues the vapor-liquid cycle , In order to effectively achieve excellent cooling effect.

3C and 3D are another perspective view and a cross-sectional view of the preferred embodiment of the present invention; the external portion of the second inner side 12 of the body 1 is directly connected to at least one heat dissipating unit 5, wherein the heat dissipating unit The fifth system is a heat sink, a heat sink fin group and a water cooling device, and is used for accelerating cooling of the vapor working fluid 2 flowing to the second inner side 12 to be condensed and converted into a liquid working fluid 3 to effectively raise the vapor liquid. The cycle effect, in turn, achieves excellent heat dissipation.

Referring to FIG. 4, a cross-sectional view showing a third preferred embodiment of the present invention is shown. The structure and connection relationship of the preferred embodiment and its function are substantially the same as those of the first preferred embodiment. Therefore, the details are not described here. The difference between the two is that the body 1 is The second inner side 12 is divided into a capillary forming region 121 and at least one capillary-free forming region 122, wherein the non-capillary forming region 122 is a second inner side 12, and no capillary structure is formed on the region, and the The capillary formation region 122 is located on both sides of the capillary formation region 121, and is adjacent to the corresponding third and fourth inner sides 13, 14 respectively.

In addition, the body 1 further includes at least one hyperplastic capillary portion 17 which is a sintered powder body, but is not limited thereto, and may be selected as a mesh, a fiber, a mesh, and a sintered powder in a specific implementation. And a combination of the microstructure and the microstructured portion 17 is disposed on the capillary formation region 121 of the second inner side 12 and opposite to the first portion 161.

Further, the hyperplastic capillary portion 17 has a free end 171 extending from the capillary forming region 121 to extend over the first portion 161 of the opposing first capillary structure 16; in the hyperplastic capillary portion of the preferred embodiment The 17 series is generally hill-like, but is not limited thereto. In the specific implementation, it may be in a different shape state, such as a ladder shape, a rectangular shape or a cone shape.

Furthermore, the first capillary structure 16 and the hyperplastic capillary portion 17 and the vapor chamber 15 together define a first steam passage 151 and a second steam passage 152, wherein the first steam passage 151 is composed of the first, second and third portions. The inner side 11, 12, 13 is surrounded by the first capillary structure 16 and the hyperplastic capillary portion 172, and the second steam passage 152 is the first, second and fourth inner sides 11, 12, 14 and the first capillary structure 16 and The hyperplastic capillary 17 is surrounded by the formation.

Continuing to refer to FIGS. 4 and 5, when the outer portion of the first inner side 11 of the body 1 is attached to at least one of the heat generating components 4, and the heat generating component 4 generates heat, the first, third, and fourth inner sides are transmitted. The first and second portions 161, 162 of the 11, 13 and 14 liquid fuel 3 rapidly adsorbs heat to cause evaporation to be converted into the vapor working fluid 2, and is disposed in the first steam passage 151 and the second steam passage 152. The vapor working fluid 2 has no capillary formation zone on the corresponding second inner side 12 122, causing the vaporous working fluid 2 in the first and second steam passages 151, 152 to rapidly flow toward the opposite uncapped formation region 122, waiting for the vapor working in the first and second steam passages 151, 152 The fluid 2 is each cooled to the second inner side 12 without the capillary formation region 122 being cooled, and after the condensation is converted into the liquid working fluid 3, the liquid working fluid 3 in the first and second vapor passages 151, 152 is subjected to gravity or hyperplasia. The capillary force of the capillary portion 17 is returned to the first portion 161 on the first inner side 11 and the second portion 162 on the third and fourth inner sides 13 and 14 to continue the vapor-liquid circulation, thereby effectively achieving an excellent heat dissipation effect, thereby effectively achieving Better heat transfer efficiency and reduced pressure resistance.

FIG. 6 is a cross-sectional view showing a fourth preferred embodiment of the present invention; the structure and the connection relationship of the preferred embodiment and the effect thereof are substantially the same as those of the third preferred embodiment described above. In the embodiment, the hyperplastic capillary portion 17 of the third preferred embodiment is modified to be formed by extending the first portion 161 of the first capillary structure 16, that is, the preferred embodiment of the hyperplastic capillary portion 17 is The first portion 161 is opposite to the second inner side 12; in other words, the free end 171 of the hyperplastic capillary portion 17 extends from the first portion 161 to connect the opposing capillary forming regions 121.

FIG. 7 is a cross-sectional view showing a fifth preferred embodiment of the present invention; the structure and connection relationship of the preferred embodiment and its efficacy are substantially the same as those of the first preferred embodiment described above, and the difference therebetween The second capillary structure 18 is formed on the wall surface of the chamber 15 , and the second capillary structure 18 is formed on the first, second, third and fourth inner sides 11 , 12 , 13 , 14 of the body 1 , and The first capillary structure 16 is connected to each other; and the second capillary structure 18 is preferably described by a micro-groove, but is not limited thereto. In the actual implementation of the present invention, the mesh may also be selected. The fiber body, the sintered powder body, and the mesh and the sintered powder are combined in any combination. As described above, the present invention has the following advantages as compared with the prior art: 1. The maximum heat transfer efficiency can be improved; 2. The anti-gravity ability is good; 3. The thermal resistance of the interface is small; 4. Because the unit area of the first capillary structure is large, it can withstand a large thermal power impact, and the relative heat transfer amount is relatively large.

It is to be understood that the above-described methods, shapes, configurations, and devices of the present invention are intended to be included within the scope of the present invention.

1‧‧‧ Ontology

11‧‧‧First inside

12‧‧‧ second inner side

13‧‧‧ third inside

14‧‧‧ fourth inner side

15‧‧‧ chamber

16‧‧‧First capillary structure

161‧‧‧Part 1

162‧‧‧Part II

3‧‧‧Liquid working fluid

Claims (2)

A heat pipe heat dissipation structure includes: a body having a first inner side, a second inner side opposite to the first inner side, a third inner side, a fourth inner side opposite to the third inner side, a chamber, and at least a hyperplastic capillary portion filled with a working fluid, the second inner side having a capillary formation region and at least one capillary-free formation region, wherein the non-capillary formation region is located on both sides of the capillary formation region, and adjacent to each other Corresponding third and fourth inner sides, and the hyperplastic capillary portion is a sintered powder and disposed on the capillary forming region over a large area; and at least one first capillary structure is a sintered powder and is disposed in the chamber, and has a first portion and a second portion, the first portion is formed on the first inner side, and opposite to the hyperplastic capillary portion, the second portion is adjacent to the third and fourth inner sides from both sides of the first portion Extending the structure, and the thickness of the first portion is greater than the thickness of the second portion; wherein the hyperplastic capillary portion has a free end extending from the capillary formation region to connect the first portion The first part of the fine structure. The heat pipe heat dissipation structure according to claim 1, wherein the chamber and the first capillary structure and the hyperplastic capillary portion together define a first steam passage and a second steam passage, and the first steam passage is The inner sides of the first, second and third sides are surrounded by the first capillary structure and the hyperplastic capillary portion, and the second steam passage is formed by the inner side of the first, second and fourth sides and the first capillary structure and the hyperplastic capillary portion.