TWM429856U - Heat pipe structure - Google Patents

Heat pipe structure Download PDF

Info

Publication number
TWM429856U
TWM429856U TW101201257U TW101201257U TWM429856U TW M429856 U TWM429856 U TW M429856U TW 101201257 U TW101201257 U TW 101201257U TW 101201257 U TW101201257 U TW 101201257U TW M429856 U TWM429856 U TW M429856U
Authority
TW
Taiwan
Prior art keywords
heat pipe
capillary structure
capillary
heat
chamber
Prior art date
Application number
TW101201257U
Other languages
Chinese (zh)
Inventor
Chun-Ming Wu
Original Assignee
Asia Vital Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to TW101201257U priority Critical patent/TWM429856U/en
Publication of TWM429856U publication Critical patent/TWM429856U/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

M429856 五、新型說明: 【新型所屬之技術領域】 [0001] 一種熱管結構,尤指一種可降低熱阻壓力大幅提升熱管 内部之汽液循環進而增加熱傳效率的熱管結構。 【先前技術】 [0002] 隨著電腦、智慧電子裝置及其他電器設備之微小型化、 高性能化日趨顯著,此代表著用於其内部之熱傳元件及 散熱元件亦相同需配合朝微小型化及薄型化方向設計, 藉以符合使用者之需求。 熱管係為一種導熱效率極佳之導熱元件,其熱傳效率係 優於銅及鋁等金屬數倍乃至數十倍左右,因此於各種熱 關聯設備中用作冷卻用元件。 熱管就形狀而言,係區分有圓管形狀之熱管、截面積呈D 形狀之熱管、平板熱管等,主妻係被用於冷卻電子設備 t熱源之傳導,而由於為了便於安裝至被冷卻部件及為 了使接觸面能獲得較大之面積,故所述之平板熱管為現 階段被廣為使用,另外隨著冷卻機構之小型化、省空間 4匕,使用熱管來作為熱傳導之電子設備亦相同大量選擇 平板熱管來應用。 而傳統熱管結構其有多種的之製造方法,例如係於一中 空管體中填入金屬粉末,並將該金屬粉末透過燒結之方 式於該中空管體内壁形成一毛細結構層,其後對該管體 進行抽真空填入工作流體最後封管,又或於所述中空管 體内置入金屬材質之網狀體,該網狀毛細結構體會展開 並自然的向外伸張貼覆至該中空管體内壁以形成一毛細 10120125^編號 A〇101 第3頁/共15頁 1012003752-0 M429856 結構層,其後對該管體進行抽真空填入工作流體最後封 管,但因前述對電子設備之微小化、薄型化等多需求下 ,致需將熱管製作成平板型。 所述該平板熱管雖可達到薄型化之目的,但卻延伸出另 一問題,由於該平板熱管係將金屬粉末燒結於熱管管徑 身之内壁表面,令其燒結體得完整全面的彼覆於内壁上 ,致使對該平板熱管加壓時,該平板熱管内部位於加壓 面兩侧之毛細結構(即燒結之金屬粉末或網狀毛細結構 體)易受到擠壓破壞,進而由該平板熱管之内壁脫落或 變形,故令該薄型熱管之熱傳效能大幅降低或甚者失能 ;此外雖該平板熱管能達到熱源傳導,但由於平板熱管 其於製成薄型化後,因為薄化之目的造成内部毛細結構 之毛細力不足,致使工作流體阻塞蒸汽通道,再者,也 因平板熱管薄型化加工時管内流道面積減少,故使毛細 力降低,導致最大熱輸送量亦降低,其主要原因一者為 該平板熱管整體薄型化後導致平板熱管内容積減少,另 一原因越是薄型化經過壓扁後之平板熱管造成中央凹陷 後封閉阻塞該蒸汽通道。 故為解決前述習知缺點該項領域之業者係於該平板熱管 内部腔室中插入一芯棒,該芯棒沿著軸向形成一特定之 切口形狀,並由該切口與該腔室内壁所形成之空間填充 金屬粉末,並進行燒結形成毛細結構,最後拔出該芯棒 ,再針對該毛細結構所位於腔室之_央部位施以加壓加 工製成扁平狀,毛細結構與該腔室内壁平坦部分熱性接 觸,且於該腔室中毛細結構兩側設有空隙作為蒸汽通道 使用即可獲得較佳蒸氣通道阻抗,但因毛細截面狹小, 10120125^"單編號 A〇101 第4頁/共15頁 1012003752-0 M429856 故使毛細力降低,造成抗重力熱效率及熱傳效率極差, 則此項缺點則為現行極須改善之重點。 【新型内容】 [0003] 爰此,為解決上述習知技術之缺點,本創作之主要目的 ,係提供一種可提升導熱及熱傳效率的熱管結構。 本創作次要目的係提供一種可降低熱阻抗壓力的熱管結 構。M429856 V. New Description: [New Technology Field] [0001] A heat pipe structure, especially a heat pipe structure that can reduce the thermal resistance pressure and greatly increase the vapor-liquid circulation inside the heat pipe to increase the heat transfer efficiency. [Prior Art] [0002] With the miniaturization and high performance of computers, smart electronic devices and other electrical devices, the heat transfer components and heat dissipating components used in the interior are also required to be compact. Designed for thinning and thinning, to meet the needs of users. The heat pipe is a heat-conducting element with excellent heat conduction efficiency, and its heat transfer efficiency is several times or even several tens of times higher than that of metals such as copper and aluminum, and thus it is used as a cooling element in various heat-related equipment. In terms of shape, the heat pipe is divided into a heat pipe having a circular tube shape, a heat pipe having a D-shaped cross section, a flat heat pipe, and the like, and the wife is used to cool the conduction of the heat source of the electronic device, and is convenient for mounting to the cooled component. In order to obtain a larger area of the contact surface, the flat heat pipe is widely used at the present stage, and the electronic device using the heat pipe as the heat conduction is also the same as the cooling mechanism is miniaturized and space is saved. A large number of flat heat pipes are selected for application. The conventional heat pipe structure has various manufacturing methods, for example, a metal powder is filled in a hollow pipe body, and the metal powder is sintered to form a capillary structure layer on the inner wall of the hollow pipe, and thereafter The tube body is vacuum-filled into the working fluid to finally seal the tube, or the mesh body of the metal material is built in the hollow tube body, and the mesh-shaped capillary structure is unfolded and naturally extended outwardly to the The inner wall of the hollow tube is formed with a capillary 10120125^No. A 〇 101 page 3 / 15 pages 1012003752-0 M429856 structural layer, after which the tube is vacuum-filled into the working fluid and finally sealed, but because of the foregoing Under the demand for miniaturization and thinning of electronic equipment, it is necessary to make the heat pipe into a flat type. Although the flat heat pipe can achieve the purpose of thinning, it extends another problem. Since the flat heat pipe sinters the metal powder on the inner wall surface of the heat pipe diameter body, the sintered body is completely and completely covered. On the inner wall, when the flat heat pipe is pressurized, the capillary structure (ie, the sintered metal powder or the network capillary structure) on the two sides of the flat heat pipe is susceptible to crushing damage, and the flat heat pipe is further The inner wall is detached or deformed, so that the heat transfer efficiency of the thin heat pipe is greatly reduced or it is dissipated; in addition, although the flat heat pipe can achieve heat source conduction, since the flat heat pipe is thinned, it is thinned. The capillary force of the internal capillary structure is insufficient, causing the working fluid to block the steam passage. Moreover, the area of the flow passage in the tube is reduced when the flat heat pipe is thinned, so that the capillary force is reduced, and the maximum heat transfer amount is also lowered. The overall thinning of the flat heat pipe leads to a reduction in the inner volume of the flat heat pipe, and the other reason is that the flat plate heat after being flattened is thinner. After causing obstruction blocking the central depression steam passage. Therefore, in order to solve the above-mentioned conventional disadvantages, a person in the field inserts a mandrel into the inner chamber of the flat heat pipe, and the mandrel forms a specific slit shape along the axial direction, and the inner wall of the cavity is formed by the slit The formed space is filled with metal powder and sintered to form a capillary structure, and finally the mandrel is pulled out, and then the central portion of the chamber where the capillary structure is located is subjected to press processing to form a flat shape, and the capillary structure and the chamber are The flat portion of the wall is in thermal contact, and a gap is provided on both sides of the capillary structure in the chamber as a steam passage to obtain a better vapor passage impedance, but due to the narrow capillary section, 10120125^"single number A〇101第4页/ Total 15 pages 1012003752-0 M429856 Therefore, the capillary force is reduced, resulting in extremely poor anti-gravity thermal efficiency and heat transfer efficiency. This shortcoming is the focus of current improvement. [New Content] [0003] In order to solve the above shortcomings of the prior art, the main purpose of the present invention is to provide a heat pipe structure capable of improving heat conduction and heat transfer efficiency. The secondary objective of this creation is to provide a heat pipe structure that reduces the thermal impedance pressure.

為達上述之目的,本創作係提供一種熱管結構,係包含 :一本體具有一腔室,該腔室具有一第一側及一第二侧 ,所述第一、二側分別設有一第一毛細結構及一第二毛 細結構及一工作流體,所述第一毛細結構之體積係大於 該第二毛細結構,但小於該腔室内壁圓周之一半,並相 互連結,且與該腔室共同界定至少一蒸汽通道。 透過本創作熱管結構係可大幅降低熱管内部之熱阻抗壓 力進而提升工作流體之汽液循環效率,故本創作具有下 列優點:In order to achieve the above purpose, the present invention provides a heat pipe structure, comprising: a body having a chamber, the chamber having a first side and a second side, wherein the first and second sides are respectively provided with a first a capillary structure and a second capillary structure and a working fluid, the volume of the first capillary structure being larger than the second capillary structure but smaller than one half of the circumference of the inner wall of the chamber, and being connected to each other and being defined together with the chamber At least one steam passage. Through the creation of the heat pipe structure, the thermal impedance pressure inside the heat pipe can be greatly reduced to improve the vapor-liquid circulation efficiency of the working fluid, so the creation has the following advantages:

1. 單位面積能承受較大的熱功率衝擊; 2. 可提升最大熱傳效率; 3. 抗重力能力優; 4. 介面熱阻小。 【實施方式】 [0004] 本創作之上述目的及其結構與功能上的特性,將依據所 附圖式之較佳實施例予以說明。 請參閱第1、2圖,係為本創作之熱管結構第一實施例之 立體圖及A-A剖視圖,如圖所示,所述熱管結構,係包含 HH20125严織 A〇101 第5頁/共15頁 1012003752-0 M429856 :一本體l ; 所述本體1具有一腔室11,該腔室Π具有一第一側lu及 一第一側11 2,所述第一 '二側111 ' 112分別設有一第 一毛細結構1121及一第二毛細結構1122及一工作流體2 ’所述第一毛細結構1121之體積係大於該第二毛細結構 1122 (泛指該第一毛細結構1121之徑向延伸體積係大於 該第二毛細結構1122徑向延伸體積)但小於該腔室丨j内 壁圓周之一半,並相互連結,且與該腔室u共同界定至 少一蒸汽通道11 3。 所述第一、二毛細結構1121、1122係為燒結粉末體及網 格體及纖維體其中任一,本實施例係以燒結粉末體作為 說明,但並不引以為限;所述腔室丨丨係成光滑壁面。 請參閱第3圖,係為本創作之熱管結構第二實施例之剖視 圖,如圖所示,本實施例部分結構係與前述第一實施例 相同,故在此將不再贅述,惟本實施例與前述第一實施 例之不同處係為所述第—毛細結構丨〗2丨一側延伸有一第 一延伸部1123,所述第一延伸部1123係與前述第二毛細 結構1122連接》 請參閱第4圖’係為本創作之熱管結構第三實施例之剖視 圖,如圖所示’本實施例部分結構係與前述第一實施例 相同’故在此將不再贅述,惟本實施例與前述第一實施 例之不同處係為所述第二毛細結構1122一側延伸有一第 二延伸部1124 ’所述第二延伸部⑴彳係與前述第一毛細 結構1121連接。 請參閱第5圖,係為本創作之熱管結構第四實施例之剖視 圖’如圖所示’本實施例部分結構係與前述第—實施°例 10120125*^單编號靡1 第6頁/共15頁 1012003752-0 M429856 相同,故在此將不再贅述,惟本實施例與前述第一實施 例之不同處係為所述所述腔室丨丨壁面設有一第三毛細結 構1125,並該第一、二毛細結構1121、1122與該第三毛 細結構1125連接,所述第三毛細結構1125係為燒結粉末 體及網格體及纖維體及溝槽其中任一,本實施例係以溝 槽作為說明,但並不引以為限。 »月參閱第6、7圖,係為本創作熱管結構之應用實施例立 體及剖視圖,如圖所示,所述本體丨之第一側1U外部與 至少一熱源3對應組設,所述第二側112外部與至少一散 熱元件4對應組設,所述散熱元件4係設置於該本體丨與熱 . 源3對應组設相反之另一端,所述散熱元件4係為散熱器 及散熱鰭片組及水冷裝置其中任一,本實施例係以散熱 器作為說明’但並不引以為限。 本實施例之本體1之第一毛細結構丨丨21整體體積係大於第 一毛細結構1122 ,所述第一毛細結構1121係設於該本體 1與該熱源3相對應之第一側in,該第二毛細結構丨丨以 φ 係設置於與該第一側相對應之第二側112,該熱源3產 1012003752-0 生之熱量令於該第一毛細結構中之工作流體2受熱蒸 發,由液態之工作流體2 2轉換為汽態之工作流體21向設 置於該本體1之第二側112的第二毛細結構1122擴散,該 汽態之工作流體21於該第二側u 2冷卻冷凝成液態之工作 流體22,再透過重力又或者第二毛細結構1122回流至第 一毛細結構1121繼續汽液循環,因工作流體2由汽態轉換 為液態係透過該本體丨之蒸汽通道113由該第一毛細結構 11 21向該第二毛細結構n 22擴散,因所述第二毛細結構 1122之體積小於該第一毛細結構1121之體積,可減少該 101201^單编號AG1G1 第7頁/共15頁 料29856 汽態之工作流體21於擴散時之壓力阻抗,故本創作結構 此一設置不僅提升該本體1之徑向熱傳導效率,該本體1 之軸向熱傳導效率亦大幅提升,則有效增加該本體1内部 工作流體2之汽液循環效率者。 【圖式簡單說明】 [005] 第1圖係為本創作之熱管結構第一實施例之立體圖; 第2圖係為本創作之熱管結構第一實施例之A_A剖視圖; 第3圖係為本創作之熱管結構第二實施例之剖視圖; 第4圖係為本創作之熱管結構第三實_之剖視圖; 第5圖係為本創作之熱管結構第四實施例之剖視圖; 第6圖係為本創作熱管結構之應用實施例立體圖; 第7圖係為本創作熱管結構之應用實施例剖視圖。 【主要元件符號說明】 [0006] 本體 i 腔室11 第一側111 第二側112 蒸汽通道113 第一毛細結構1121 第二毛細結構1122 第—延伸部1123 第二延伸部1124 第三毛細結構1125 工作流體2 汽態之工作流體21 第8頁/共15頁 10120125产單编號 A0101 1012003752-0 M'429856 液態之工作流體22 熱源3 散熱元件4 10120125产單编號 A〇101 第9頁/共15頁 1012003752-01. The unit area can withstand large thermal power impact; 2. It can improve the maximum heat transfer efficiency; 3. Excellent anti-gravity ability; 4. The interface thermal resistance is small. [Embodiment] The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings. Please refer to the first and second figures, which are perspective views and AA cross-sectional views of the first embodiment of the heat pipe structure of the present invention. As shown in the figure, the heat pipe structure includes HH20125 Yan Weaving A〇101 Page 5 of 15 1012003752-0 M429856: a body l; the body 1 has a chamber 11 having a first side lu and a first side 11 2, and the first 'two sides 111 ' 112 are respectively provided with a The volume of the first capillary structure 1121 and a second capillary structure 1122 and the first capillary structure 1121 of the working fluid 2' is greater than the second capillary structure 1122 (generally refers to the radially extending volume of the first capillary structure 1121) It is larger than the radial extension of the second capillary structure 1122 but smaller than one half of the circumference of the inner wall of the chamber 丨j, and is connected to each other, and together with the chamber u defines at least one steam passage 113. The first and second capillary structures 1121 and 1122 are each a sintered powder body, a mesh body and a fiber body. The present embodiment is exemplified by a sintered powder body, but is not limited thereto; the chamber The enamel is made into a smooth wall. Referring to FIG. 3, it is a cross-sectional view of a second embodiment of the heat pipe structure of the present invention. As shown in the figure, the structure of the embodiment is the same as that of the first embodiment, and therefore will not be described herein again, but the implementation is not described herein. The difference from the first embodiment is that the first extension portion 1123 extends from one side of the first capillary structure, and the first extension portion 1123 is connected to the second capillary structure 1122. 4 is a cross-sectional view of a third embodiment of the heat pipe structure of the present invention. As shown in the figure, the "partial structure of the present embodiment is the same as that of the first embodiment", and thus will not be described herein again, but the embodiment is omitted. Different from the foregoing first embodiment, a second extension portion 1124 is formed on one side of the second capillary structure 1122. The second extension portion (1) is connected to the first capillary structure 1121. Please refer to Fig. 5, which is a cross-sectional view of the fourth embodiment of the heat pipe structure of the present invention. As shown in the figure, the partial structure of the present embodiment and the foregoing first embodiment are 10120125*^单号靡1 page 6/ A total of 15 pages 1012003752-0 M429856 are the same, so will not be described here, but the difference between this embodiment and the foregoing first embodiment is that the chamber wall surface is provided with a third capillary structure 1125, and The first and second capillary structures 1121, 1122 are connected to the third capillary structure 1125, and the third capillary structure 1125 is a sintered powder body and a mesh body, a fiber body and a groove, and the embodiment is Grooves are described, but are not limited. </ br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br> The heat dissipating component 4 is disposed on the opposite end of the body 丨 and the heat source 3 , and the heat dissipating component 4 is a heat sink and a heat sink fin. In the embodiment of the present invention, the heat sink is used as a description, but is not limited. The first capillary structure 丨丨 21 of the body 1 of the present embodiment has a larger overall volume than the first capillary structure 1122 , and the first capillary structure 1121 is disposed on the first side in the body 1 corresponding to the heat source 3 . The second capillary structure is disposed on the second side 112 corresponding to the first side by a φ system, and the heat generated by the heat source 3 is 1012003752-0, so that the working fluid 2 in the first capillary structure is evaporated by heat, The working fluid 21 in which the liquid working fluid 22 is converted into a vapor state is diffused toward the second capillary structure 1122 disposed on the second side 112 of the body 1. The vaporous working fluid 21 is cooled and condensed on the second side u 2 . The liquid working fluid 22 is recirculated by gravity or the second capillary structure 1122 to the first capillary structure 1121 to continue the vapor-liquid circulation. The working fluid 2 is converted from a vapor state to a liquid system through the vapor channel 113 of the body. A capillary structure 11 21 diffuses toward the second capillary structure n 22, since the volume of the second capillary structure 1122 is smaller than the volume of the first capillary structure 1121, the 101201^ single number AG1G1 can be reduced. Page 29856 Steam Flow Workflow 21 The pressure impedance during diffusion, so this arrangement of the creation structure not only improves the radial heat conduction efficiency of the body 1, but also increases the axial heat conduction efficiency of the body 1, thereby effectively increasing the steam of the working fluid 2 inside the body 1. Liquid circulation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS [005] Fig. 1 is a perspective view of a first embodiment of a heat pipe structure of the present invention; Fig. 2 is a cross-sectional view of the first embodiment of the heat pipe structure of the present invention; A cross-sectional view of a second embodiment of the heat pipe structure of the present invention; Fig. 4 is a cross-sectional view of the third embodiment of the heat pipe structure of the present invention; Fig. 5 is a cross-sectional view of the fourth embodiment of the heat pipe structure of the present invention; A perspective view of an application embodiment of the present heat pipe structure; Fig. 7 is a cross-sectional view showing an application embodiment of the heat pipe structure. [Main Element Symbol Description] [0006] Body i Chamber 11 First Side 111 Second Side 112 Steam Channel 113 First Capillary Structure 1121 Second Capillary Structure 1122 First Extension 1123 Second Extension 1124 Third Capillary Structure 1125 Working fluid 2 Vapor working fluid 21 Page 8 / Total 15 pages 10120125 Production order number A0101 1012003752-0 M'429856 Liquid working fluid 22 Heat source 3 Heat dissipating component 4 10120125 Production order number A〇101 Page 9 / Total 15 pages 1012003752-0

Claims (1)

M429856 六、申請專利範圍: 1 . 一種熱管結構,係包含: 一本體,具有一腔室,該腔室具有一第一侧及一第二側, 所述第一、二側分別設有一第一毛細結構及一第二毛細結 構及一工作流體,所述第一毛細結構之體積係大於該第二 毛細結構之體積,並相互連結,且與該腔室共同界定至少 一蒸汽通道。 2.如申請專利範圍第1項所述之熱管結構,其中所述第一毛 細結構之體積係小於該腔室内壁圓周之一半。 3 .如申請專利範圍第1或2項所述之熱管結構,其中所述腔室 之第一側外部與至少一熱源對應傳導熱量,所述第二側外 部對應設有至少一散熱元件,所述散熱元件係為散熱器及 散熱鰭片組及水冷裝置其中任一。 4 .如申請專利範圍第1或2項所述之熱管結構,其中所述第一 、二毛細結構係為燒結粉末體及網格體及纖維體其中任一 〇 5 .如申請專利範圍第1或2項所述之熱管結構,其中所述第一 毛細結構一側延伸有一第一延伸部,所述第一延伸部係與 前述第二毛細結構連接。 6 .如申請專利範圍第1或2項所述之熱管結構,其中所述第二 毛細結構一側延伸有一第二延伸部,所述第二延伸部係與 前述第一毛細結構連接。 7 .如申請專利範圍第1或2項所述,之熱管結構,其中所述腔室 係成光滑壁面。 8 .如申請專利範圍第1或2項所述之熱管結構,其中所述腔室 壁面設有一第三毛細結構,並該第一 '二毛細結構與該第 10120125^^^ A〇101 第10頁/共15頁 1012003752-0 M429856 三毛細結構連接。 9.如申請專利範圍第8項所述之熱管結構,其中所述第三毛 細結構係為燒結粉末體及網格體及纖維體及溝槽其中任一 〇 10 .如申請專利範圍第1或2項所述之熱管結構,其中所述第一 毛細結構之徑向延伸體積係大於該第二毛細結構徑向延伸 體積。 10120125^^ A〇101 第11頁/共15頁 1012003752-0M429856 VI. Patent Application Range: 1. A heat pipe structure comprising: a body having a chamber, the chamber having a first side and a second side, wherein the first and second sides are respectively provided with a first The capillary structure and a second capillary structure and a working fluid, the volume of the first capillary structure being larger than the volume of the second capillary structure and interconnected, and cooperating with the chamber to define at least one steam passage. 2. The heat pipe structure of claim 1, wherein the volume of the first capillary structure is less than one half of a circumference of the inner wall of the chamber. The heat pipe structure according to claim 1 or 2, wherein the first side of the chamber has a heat transfer corresponding to at least one heat source, and the second side of the second side is provided with at least one heat dissipating component. The heat dissipating component is any one of a heat sink, a heat sink fin set and a water cooling device. 4. The heat pipe structure according to claim 1 or 2, wherein the first and second capillary structures are a sintered powder body, and any one of a mesh body and a fiber body. 5 Or the heat pipe structure of claim 2, wherein a first extension portion is extended on one side of the first capillary structure, and the first extension portion is connected to the second capillary structure. 6. The heat pipe structure of claim 1 or 2, wherein the second capillary structure has a second extension extending to one side thereof, the second extension being coupled to the first capillary structure. 7. The heat pipe structure according to claim 1 or 2, wherein the chamber is formed into a smooth wall. 8. The heat pipe structure according to claim 1 or 2, wherein the chamber wall surface is provided with a third capillary structure, and the first 'two-capillary structure and the first 10120125^^^ A〇 101 number 10 Page / Total 15 pages 1012003752-0 M429856 Three capillary structure connection. 9. The heat pipe structure according to claim 8, wherein the third capillary structure is a sintered powder body and a mesh body and a fiber body and a groove. 10 of the patent application scope. The heat pipe structure of claim 2, wherein the radially extending volume of the first capillary structure is greater than the radially extending volume of the second capillary structure. 10120125^^ A〇101 Page 11 of 15 1012003752-0
TW101201257U 2012-01-19 2012-01-19 Heat pipe structure TWM429856U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW101201257U TWM429856U (en) 2012-01-19 2012-01-19 Heat pipe structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101201257U TWM429856U (en) 2012-01-19 2012-01-19 Heat pipe structure

Publications (1)

Publication Number Publication Date
TWM429856U true TWM429856U (en) 2012-05-21

Family

ID=46550995

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101201257U TWM429856U (en) 2012-01-19 2012-01-19 Heat pipe structure

Country Status (1)

Country Link
TW (1) TWM429856U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI733272B (en) * 2019-12-12 2021-07-11 國立清華大學 Vapor chamber device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI733272B (en) * 2019-12-12 2021-07-11 國立清華大學 Vapor chamber device
US11644250B2 (en) 2019-12-12 2023-05-09 National Tsing Hua University Vapor chamber device

Similar Documents

Publication Publication Date Title
US9506699B2 (en) Heat pipe structure
US20130213612A1 (en) Heat pipe heat dissipation structure
US20100263835A1 (en) Heat pipe
US8622117B2 (en) Heat pipe including a main wick structure and at least one auxiliary wick structure
CN205488104U (en) Ultra -thin heat conduction component and ultra -thin heat conduction component of buckling
US9802240B2 (en) Thin heat pipe structure and manufacturing method thereof
US20130213609A1 (en) Heat pipe structure
JP3175221U (en) Heat pipe structure
JP3175383U (en) Heat tube heat dissipation structure
TWM429856U (en) Heat pipe structure
US20120037344A1 (en) Flat heat pipe having swirl core
TWI510751B (en) Heat pipe structure
CN211400897U (en) Novel heat pipe structure
TW201331533A (en) Heat pipe structure
TWM429992U (en) Heat pipe heat-dissipating structure
TWI564530B (en) Heat pipe heat dissipation structure
TW201512625A (en) Heat pipe structure and manufacturing method thereof
TWM429993U (en) Structure improvement in heat pipe
JP3175037U (en) Heat pipe structure
CN202254998U (en) Heat pipe structure
US20130126133A1 (en) Heat pipe structure
US20150122460A1 (en) Heat pipe structure
CN220526901U (en) Heat dissipation module of electronic equipment and electronic equipment
TW201331534A (en) Heat pipe heat dissipation structure
TWM446489U (en) Heat conduction pipe structure

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees