TWM461300U - Heat-dissipating module - Google Patents

Description

Thermal module

This creation is a heat dissipation module, especially a heat pipe type heat dissipation module.

When the electronic device is in operation, a heating element such as a central processing unit (CPU) or a graphics processing unit (GPU) installed inside the electronic device generates high heat, so the temperature must be adjusted and lowered to ensure The electronic device operates normally and prevents the electronic device from being damaged due to excessive operating temperatures. Therefore, the heat dissipation performance of the heat sink is an element in which the temperature is adjusted. Due to the rapid development of technology products and the increase in the speed of multi-functionalization and processing, the thermal energy generated by the operation of electronic devices is also increased, so the efficiency of the heat sink needs to be increased.

The known heat sink is composed of a plurality of heat pipes in a side by side manner. The inside of the heat pipe is a vacuum space, and a fluid having a condensation function is disposed inside the heat pipe. The front and rear ends of the heat pipe are a heat absorption end and a heat dissipation end, and the heat absorption end is disposed on the electronic device. The heating element is configured to absorb thermal energy generated by the operation of the electronic device, and the thermal energy is gradually cooled by the condensed fluid being guided to the heat dissipating end. However, the above-mentioned heat dissipating device conducts heat conduction between the heat pipe and the heat pipe and between the heat pipe and the heat source through a point contact manner, and the contact area per unit area is small, so that the heat conduction performance is not good, and the heat sink device can The resulting heat dissipation is not ideal. However, if the contact area for heat conduction between the heat pipes is increased by increasing the number of heat pipes arranged side by side in the same horizontal direction, the heat dissipation area of the heat pipes is likely to be larger than the heat source area, resulting in the heat arranged at the outermost side. The tube cannot be in contact with the heat source and is suspended, so that it cannot provide effective heat dissipation to the heat source. In this way, the purpose of increasing the number of heat pipes to improve the heat dissipation performance is lost.

In view of this, the present invention proposes a heat dissipation module to effectively overcome the above problems in view of the above-mentioned shortcomings of the prior art. Therefore, the purpose of this creation is to effectively improve the heat dissipation performance of the heat dissipation module and avoid the waste of the manufacturing cost of the heat dissipation module.

In order to achieve the above purpose, the present invention proposes a heat dissipation module for adjusting the temperature of a heating element of an electronic device. The heat dissipation module includes a heat dissipation body having a groove and a plurality of grooves, and a plurality of grooves are disposed on a wall surface of the groove; a heat pipe assembly including a plurality of first heat pipes and a plurality of second heat pipes, plural The first heat pipes are arranged side by side in the groove, and the plurality of second heat pipes are stacked on the plurality of first heat pipes, and are correspondingly engaged in the plurality of grooves, wherein the inner wall surfaces of the first heat pipes and the respective second heat pipes are The inner wall surface is respectively provided with a capillary structure layer; and a heat conductive material is filled in the groove and covers the heat pipe assembly. The thermally conductive material has a contact surface that is exposed to the recess and the width of the contact surface matches the width of the heat generating component.

In the above heat dissipation module, the diameter of the first heat pipe is larger than the diameter of the second heat pipe.

The heat dissipation module as described above further includes a heat sink, wherein the plurality of first heat pipes and the plurality of second heat pipes are connected between the heat dissipation body and the heat sink, wherein the height of the heat sink corresponds to the second heat pipe, and the first The heat pipe has a height difference.

The effect of the creation is that the stacking of the first heat pipe with a larger diameter and the second heat pipe of a smaller pipe diameter can form a larger coverage on the heating element while cooperating with the hair. The arrangement of the fine structure layer and the use of the heat conductive material can shorten the heat transfer path between the first heat pipe and the second heat pipe, and accelerate the heat energy between the heat generating component, the first heat pipe, the second heat pipe and the fin. The transfer rate and the formation of a good heat conduction path can effectively utilize the heat transfer effect and the heat dissipation effect of the heat dissipation module, thereby greatly improving the heat dissipation performance of the heat dissipation module.

In the following, regarding the characteristics, implementation and efficacy of the present creation, the best embodiment will be described with reference to the drawings.

100‧‧‧ Thermal Module

110‧‧‧Solution body

111‧‧‧ Groove

112‧‧‧ trench

113‧‧‧Fins

114‧‧‧ Clips

120‧‧‧Heat pipe assembly

121‧‧‧First heat pipe

122‧‧‧second heat pipe

123‧‧‧Capillary structure

130‧‧‧thermal materials

131‧‧‧Contact surface

140‧‧‧heatsink

200‧‧‧heating components

FIG. 1 is a perspective view of a heat dissipation module according to a first embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view of the heat dissipation module of the first embodiment of the present invention.

FIG. 3 is a schematic view showing the state of use of the heat dissipation module of the first embodiment of the present invention.

Figure 4 is a side elevational view of the heat dissipation module of the second embodiment of the present invention.

Referring to FIG. 1 to FIG. 3 , the heat dissipation module 100 disclosed in the first embodiment of the present invention is suitable for being disposed in an electronic device for operating a central processing unit or a graphics processor of the electronic device. One of the heat generating elements 200 is generated to dissipate heat.

The heat dissipation module 100 of the present invention includes a heat dissipation body 110, a heat pipe assembly 120, and a heat conductive material 130. The heat dissipation body 110 has a groove 111 and a plurality of grooves 112. The plurality of grooves 112 are disposed on a wall surface of the groove 111. The heat dissipation body 110 may be a heat sink composed of a plurality of fins 113 and a plurality of clips 114 arranged in a staggered manner, or an aluminum extruded heat sink having a plurality of fins (the recesses and the fins are respectively disposed on the heat dissipation body) In the present embodiment, the former is exemplified, but not limited thereto. Wherein the fins 113 and The clips 114 are all made of a material with good heat transfer effect, such as iron, aluminum or copper, and the length of the fins 113 is greater than the length of the clips 114, so that a heat dissipation channel is formed between the fins 113 and the fins 114. In addition, each of the fins 113 and each of the clips 114 has a notch and a plurality of notches formed in the notch. Therefore, when the plurality of fins 113 are interdigitated with the plurality of clips 114, the notches and the recesses are formed. The ports respectively correspond to the grooves 111 and the grooves 112 formed on the heat dissipation body 110.

The heat pipe assembly 120 includes a plurality of first heat pipes 121 and a plurality of second heat pipes 122. The pipe diameter of the first heat pipe 121 is greater than or equal to the pipe diameter of the second heat pipe 122, and the pipe diameter of the second heat pipe 122 matches the heat dissipation body 110. The inner diameter of the groove 112 and the inner wall surface of the first heat pipe 121 and the inner wall surface of the second heat pipe 122 are respectively provided with a capillary structure layer 123. In addition, the materials of the first heat pipe 121 and the second heat pipe 122 may be, but not limited to, materials having good thermal conductivity such as stainless steel, nickel, titanium, iron, aluminum or copper, and in the first heat pipe 121 and the second heat pipe 122. The condensed fluid is set in the inside, the two-phase change of the liquid and gas through the continuous circulation of the condensed fluid, and the convection of the condensed fluid between the heat absorbing end and the heat releasing end, so that the surface of the heat pipe exhibits a rapid temperature uniformity and achieves the purpose of heat dissipation. The technical features that are not emphasized by this creation, therefore, the detailed structure and principle thereof will not be described here.

A plurality of first heat pipes 121 are arranged side by side in the same horizontal direction in the groove 111 of the heat dissipation body 110, and the outer surfaces of the two first heat pipes 121 on the opposite sides (ie, the outermost sides) of the plurality of first heat pipes 121 are abutted. Close to the opposite wall faces in the groove 111. A plurality of second heat pipes 122 are stacked on the plurality of first heat pipes 121, and the grooves 111 are correspondingly engaged in the plurality of grooves 112, so that the outer surfaces of the second heat pipes 122 and the inner wall surface of the heat dissipation body 110 are respectively The outer surfaces of the first heat pipe 121 are in contact with each other, thereby forming a large contact area between the heat dissipation body 110, the heat pipe assembly 120 and the heat conductive material 130, so as to greatly improve the heat of the heat dissipation module 100. Conductivity.

The thermally conductive material 130 can be, but is not limited to, a material having good thermal conductivity such as copper, aluminum or tin, which can be changed according to different usage requirements. The heat conductive material 130 is filled in the recess 111 of the heat dissipation body 110 and covers the heat pipe assembly 120. The heat conductive material 130 is mainly filled in the gap between the heat dissipation body 110 and the first heat pipe 121, and is attached to the plurality of sections. The opposite sides of the two heat pipes 122 are exposed on the surfaces of the two second heat pipes 122 of the groove 111. This configuration can increase the peripheral diameter of the first heat pipe 121, increase the contact surface between the first heat pipe 121 and the fins 113 and the clips 114, and help to improve the heat conduction and heat dissipation performance between each other.

In addition, a portion of the heat conductive material 130 is exposed outside the recess 111, and a flat contact surface 131 is formed outside the recess 111 for attaching to the heat generating component, and the width of the contact surface 131 is matched with the heat generating component 200. The width, or the area of the contact surface 131, is slightly greater than or equal to the area of the heat generating component 200.

Based on the above structure, in the application, the heat dissipation module 100 of the present invention is disposed on the heat generating component 200 through the contact surface 131 of the heat conductive material 130, so that the heat energy generated by the heat generating component 200 is first transmitted to the plurality of first heat pipes via the heat conductive material 130. 121. The plurality of second heat pipes 122 and the fins 113 and the fins 114 of the heat dissipation body 110, wherein most of the heat energy is transmitted to the plurality of second heat pipes 122 via the plurality of first heat pipes 121, and then transferred to the heat dissipation. The body 110 performs heat dissipation. During this process, the condensed fluid of the first heat pipe 121 forms a vapor after the capillary structure layer 123 absorbs heat energy from one side of the heat generating component 200, and the vapor rises from the inside of the pipe of the first heat pipe 121 to the capillary structure layer 123 close to the second. One side of the heat pipe 122. At this time, the vapor is absorbed by the capillary structure layer 123 to condense into a condensed fluid, and the thermal energy carried by the vapor is transmitted to the second heat pipe 122 through the capillary structure layer 123 in the first heat pipe 121, wherein the condensed fluid will flow back to the bottom of the pipe. (as indicated by the arrow in Figure 3), and a cooling cycle is formed in the tube body by phase change characteristics. Then, it is transmitted to the heat dissipation body 110 through the same heat conduction method to dissipate heat through the plurality of fins 113.

In addition, by covering the heat pipe assembly 120 with the heat conductive material 130, the density between the plurality of first heat pipes 121, the plurality of second heat pipes 122, and the heat dissipation body 110 can be further enhanced to further prevent air heat from hindering or interfering with heat conduction. occur. At the same time, since the heat pipe assembly is covered by the heat conductive material 130, the first heat pipe 121 and the second heat pipe 122 can be prevented from being subjected to the extrusion deformation, thereby ensuring that the performance of the heat pipe assembly 120 is not attenuated.

It should be noted that in the heat dissipation module 100 of the present invention, the number of the second heat pipes 122 may be correspondingly changed according to the heat dissipation requirement of the heat generating component 200.

Referring to FIG. 4, the second embodiment of the present disclosure is substantially the same as the first embodiment. The difference between the two is that the heat dissipation module 100 disclosed in the second embodiment further includes a heat sink 140. It may be, but is not limited to, an aluminum extruded heat sink having a plurality of heat sink fins or a heat sink form composed of fins and clips. A plurality of first heat pipes 121 and a plurality of second heat pipes 122 are respectively connected between the heat dissipation body 110 and the heat sink 140. The position of the heat sink 140 in the horizontal direction corresponds to the position of the plurality of second heat pipes 122, and thus There is a height difference between the first heat pipes 121. In the present invention, since the diameter of the second heat pipe 122 is smaller than the diameter of the first heat pipe 121, the second heat pipe 122 can be substantially avoided because the position of the second heat pipe 122 is high through the above arrangement. By being bent, it is possible to avoid the problem that the capillary structure layer 123 inside thereof is bent and cracked.

In addition, a plurality of heat dissipation fins may be disposed between the heat dissipation body 110 and the heat sink 140 on the first heat pipe 121 and the second heat pipe 122 to increase the heat dissipation surface of the heat dissipation module 100. Product, which helps to further improve heat dissipation.

Therefore, in the heat dissipation module 100 of the present invention, the heat dissipation mode of the heat dissipation module 100, the heat pipe assembly 120 and the heat conductive material 130 can form a large contact area, thereby effectively improving the overall heat dissipation performance of the heat dissipation module 100. And the plurality of first heat pipes 121, the plurality of second heat pipes 122, and the heat dissipation body 130 are closely combined by the heat conductive material 130 to protect the first heat pipe 121 and the second heat pipe 122 from extrusion deformation, thereby reducing air thermal resistance. Therefore, the heat dissipation performance of the heat dissipation module 100 is greatly increased. In addition, a heat sink or a plurality of heat dissipation fins may be disposed in the heat dissipation module 100 of the present invention to enhance heat conduction and heat dissipation performance according to different usage requirements.

Although the embodiments of the present invention are disclosed as described above, it is not intended to limit the present invention, and any person skilled in the art may, without departing from the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the quantity can be changed in a small amount, and therefore the scope of patent protection of this creation is subject to the definition of the scope of the patent application attached to this specification.

100‧‧‧ Thermal Module

110‧‧‧Solution body

111‧‧‧ Groove

112‧‧‧ trench

113‧‧‧Fins

114‧‧‧ Clips

120‧‧‧Heat pipe assembly

122‧‧‧second heat pipe

123‧‧‧Capillary structure

130‧‧‧thermal materials

Claims (7)

A heat dissipation module is disposed on a heating element of an electronic device, the heat dissipation module includes: a heat dissipation body having a groove and a plurality of grooves, wherein the grooves are disposed in the groove a heat pipe assembly comprising a plurality of first heat pipes and a plurality of second heat pipes, the first heat pipes being disposed side by side in the grooves, the second heat pipes being stacked on the first heat pipes, and corresponding cards In the groove, the inner wall surface of each of the first heat pipes and the inner wall surface of each of the second heat pipes are respectively provided with a capillary structure layer; and a heat conductive material is filled in the groove, and the heat pipe is covered The component, the thermally conductive material has a contact surface exposed to the recess, and the width of the contact surface matches the width of the heat generating component. The heat dissipation module of claim 1, wherein the diameter of the first heat pipes is larger than the diameters of the second heat pipes. The heat dissipation module of claim 1, wherein the heat dissipation body comprises a plurality of fins and a plurality of clips, the length of the fins being greater than the length of the clips, and each of the fins and the fins The clips each have a notch and a plurality of notches formed in the notch. The fins are staggered with the clips, and the notches and the notches respectively form the groove and the groove. The heat dissipation module of claim 1, wherein the heat dissipation body further has a plurality of heat dissipation fins, and the heat dissipation fins and the recesses are respectively disposed on opposite sides of the heat dissipation body. The heat dissipation module of claim 1, wherein the heat conductive material is copper, aluminum or tin. The heat dissipation module of claim 1, further comprising a heat sink, wherein the first heat pipe and the second heat pipe are connected between the heat dissipation body and the heat sink. The heat dissipation module of claim 6, wherein the heat sink corresponds to the second heat pipes and has a height difference from the first heat pipes.