1292691 九、發明說明： 【發明所屬之技術領域】 尤其指具有高效能熱 本發明係關於一種散熱模組， 管之散熱模組。 隨著技術的進步，電子元件單位面積上的電晶體數1292691 IX. Description of the invention: [Technical field to which the invention pertains] In particular, it relates to high-efficiency heat. The present invention relates to a heat dissipation module, a heat dissipation module for a tube. With the advancement of technology, the number of transistors per unit area of electronic components
量越來越多，造成其工作時發熱量的增办 電子元件的工作頻率也越來越高，電晶j 的寄命。為加強電子元件之散熱效果，現行的做法大多 為在熱源處以散熱器將熱導出，經由散熱器之鰭片 以自然或強制對流方式將熱散逸至環境中。 由於熱管（heat pipe)可在很小的截面積與溫度差 之下，將大量的熱傳送一段可觀的距離，且不需外加電 源=應即可運作，在無須動力提供和空間利用經濟性的 考量之下，各式熱管已是電子散熱產品中廣為應用的傳 ”、、元件之。凊參考第1圖，其為習知一種柱狀型熱管 之剖面示意圖。習知柱狀型之熱管10A係由其一端封閉 且其另一端開放之熱管本體12與一上蓋14a結合後所形 成之一密閉中空腔體。 熱官本體12係一體成型之罐體，且由側壁部122 以及底部124所組成。在熱管本體】2之内壁上（亦即是 侧壁部122之内表面以及底部124之内表面上）設置有 1292691 12焊接組合後’ 10A内部充填有 毛細結構16 ’且在上蓋14a及熱管本體 再從注水管18填入工作流體W，使熱管 工作流體W。 ' . 當柱狀型之熱管i〇A實際在使用時，係以底部124 ;直接與位於熱管1GA下方之熱源（未—）接觸，用以 將熱源所產生的熱直接導離熱源。柱狀型熱管ι〇Α之底 -部124 &蒸發端，而侧壁部122與上蓋14a則為冷凝端: - 在蒸發端的工作流體W因吸熱而蒸發成氣態，並在壓差 ⑩的影響下自，然流向冷凝#，然後於冷凝端處釋出潛孰 (latent heat)後轉變為液態之工作流體w。冷凝後之^ 作流體W再藉由毛細結構16之毛細力 此，一再循環達到散熱之效果。 細 • ^然而，由於柱狀型之熱管10A在上蓋14a之内表面 .處通常沒有設置毛細結構，使得凝結於上蓋Ua處的工 ^乍流體，法回流’造成上蓋14a處變成無效的冷凝端， _ 办響熱官10A内工作流體質量的變動，進影響管 φ之傳熱效率及整體熱阻。再者，在上蓋 作流體累積至—定量後，將受重力之影響而垂直直接往 I滴落至蒸發端處（即底部124及其上之毛細結構Μ ，，，往造成工作流體的兩相變化循環不順暢，且使得 蒸發端之蒸發效能不穩定，使蒸發端之溫度隨時間之變 ^大進而導致熱阻隨時間之變動過大，使得蒸發端 =蒸發效能不穩定，_低熱f 1〇A整體之散熱能力及穩 右要使上盍14a之内表面亦設置有毛細結構，則需 <用銅粉燒結或額外放置朗等方式，才能於上蓋… 1292691 f：椹二二…細結構。然而’若使用銅粉燒結的製 二错μ/ 口才料與製程成本’且要控制欲生成之毛細 二冓的形狀，當困難。若使用額外放置銅網之方式，則 :位於上蓋14a處之網狀毛細結構與位於侧壁部1 μ =?4上之毛細結構16並非同時製作，且因銅網本 垃w Γ 乂弱之材負特性，故於兩毛細結構接觸部分的連 =與接觸強度报差，使得王作流體無法靠毛細力從上 = 4a;f利流到側壁部122，因此造成熱管⑽之整體More and more, the operating frequency of the additional electronic components that cause heat during work is also getting higher and higher, and the life of the electric crystal j. In order to enhance the heat dissipation effect of electronic components, the current practice is mostly to use a heat sink to heat the heat source, and to dissipate the heat into the environment through the fins of the heat sink in a natural or forced convection manner. Since the heat pipe can transfer a large amount of heat over a small cross-sectional area and temperature difference, and can be operated without external power supply, it can be operated without power supply and space utilization. Under the considerations, all kinds of heat pipes have been widely used in electronic heat dissipation products, and components. 凊 Refer to Figure 1, which is a schematic cross-sectional view of a columnar heat pipe. The columnar heat pipe 10A is known. The heat pipe body 12, which is closed at one end and open at the other end, is combined with an upper cover 14a to form a closed hollow cavity. The thermal body 12 is an integrally formed can body and is composed of a side wall portion 122 and a bottom portion 124. On the inner wall of the heat pipe body 2 (that is, the inner surface of the side wall portion 122 and the inner surface of the bottom portion 124) is provided with a 1292691 12 welded combination, and the '10A is internally filled with the capillary structure 16' and is disposed on the upper cover 14a and the heat pipe body. Then, the working fluid W is filled from the water injection pipe 18 to make the heat pipe work fluid W. '. When the columnar heat pipe i〇A is actually in use, the bottom portion 124; directly with the heat source located under the heat pipe 1GA (not - Contact for directing heat generated by the heat source directly away from the heat source. The bottom of the columnar heat pipe ι〇Α 124 and the evaporation end, while the side wall portion 122 and the upper cover 14a are condensation ends: - at the evaporation end The working fluid W evaporates into a gaseous state due to heat absorption, and flows to the condensation # under the influence of the pressure difference 10, and then releases the latent heat at the condensation end to be converted into a liquid working fluid w. After condensation ^ The fluid W is further retracted by the capillary force of the capillary structure 16 to achieve the effect of heat dissipation. Finely, however, since the columnar heat pipe 10A is usually provided with a capillary structure at the inner surface of the upper cover 14a, condensation is caused. The working fluid at the upper cover Ua, the return of the method causes the upper cover 14a to become an ineffective condensing end, _ the change of the working fluid quality in the heat officer 10A, and the heat transfer efficiency and overall thermal resistance of the influence tube φ. After the upper cover is used for fluid accumulation to - quantification, it will be directly dropped directly to the evaporation end by the influence of gravity (ie, the bottom 124 and the capillary structure on the bottom), causing two-phase changes in the working fluid. The loop is not smooth and makes The evaporation performance of the evaporation end is unstable, so that the temperature of the evaporation end changes with time, and the thermal resistance changes too much with time, so that the evaporation end = evaporation efficiency is unstable, _ low heat f 1 〇 A overall heat dissipation capacity and stability To make the inner surface of the upper cymbal 14a also have a capillary structure, it is necessary to use the copper powder to sinter or additionally to place the granules on the upper cover... 1292691 f: 椹二二...fine structure. However, if copper powder is used It is difficult to control the shape of the sinter and the process cost and to control the shape of the capillary enthalpy to be formed. If an additional copper mesh is used, the reticular structure and the location at the upper cover 14a are located. The capillary structure 16 on the side wall portion 1 μ =?4 is not made at the same time, and because of the negative characteristics of the weakened material of the copper mesh, the connection between the contact portions of the two capillary structures and the contact strength is poor, so that the king The fluid cannot flow from the top = 4a; f to the side wall portion 122 by capillary force, thus causing the heat pipe (10) as a whole.
導熱特性變差。 一咕，第1B圖，其為習知另一種柱狀型熱管之剖 =不意，。為了改善第1A圖中之柱狀型熱管i〇a之缺 .，，占二第1B圖之柱狀型熱管1〇β採用使用類似鐘罩形狀之 5 14b ’可使凝結於上蓋14b之工作流體沿著弧形之 上盍14b而逐漸流至位於侧壁122之毛細結構16中。然 而’僅利用鐘罩形狀之上们4b來做導引之效果有限了 士此一類似鐘罩形狀之上蓋14b使得加裝於其外之注水 官18更加向外凸起，造成整體熱管⑽所佔之體積增 且若此柱狀型熱管⑽欲與散熱鰭片及風扇並用的 活在有限之空間限制之下，向外凸起之上蓋i 4b及注 水管18,勢必無法與散熱鰭片及風扇達成良好組裝。 【發明内容】 因此^為解決上述問題，本發明係提出一種散熱模 組及其熱管，具有有效降低熱阻之變動幅度的效果，使 兩相循環順暢，增加蒸發效率，進而增進 埶 力，使散熱穩定度增加。。 1292691 體。ΓίίίΓ的I的n種㈣，内含—工作流 以及-；：熱官本體、一上蓋、一第一毛細結構 $ —第一毛細結構。熱管本體具有—底部以及一環設 閉i:之：：：而上蓋則與熱管本體結合後形成-封 閉二間，且上盍係被一空心管體所貫穿，且空心 之内部。第一毛細結構係設置於熱管本體 侧壁部内表面上，而第二毛細結構與空 二毛細結構與第—毛細結構相接觸， J、上盍處秩是結之工作流體能夠 二毛細結構並流至第-毛細結構。 5體進入第 如上述之熱管，更包括一 ?設置於播止片上。擒止片係二:;=!：結構 或側壁部相接觸。再者，在 -毛細結構 壁部相接觸之一接觸處 毛細結構或側 具有其他等效之形狀， 有弧度之片狀物或是 細結構、粉末燒結毛細結毛包麵網式毛 或者，如上述之執:7溝槽式毛細結構。 部’且空心管體之伸入熱空，體係具有一彎折 或側壁部相接觸。第二。之端係與第—毛細結構 ，、溝槽式毛細結構或—是^結構為一粉末燒結毛細結 官體之表面並與第—毛❸毛細結構，且設置於空心 ，為'網狀毛細結構、，：二連接。或者’第二毛細 與空心管體及第-毛細結構=設置於熱管内部並同時 1292691 毛^#構與第二毛細結構之㈣包括選自塑 :一勹二：金、多孔性非金屬材料所組成之族群其中 充及t結構設置之方法係選自燒結、黏著、填 充及沈積所組成之族群其中之一或m :真The thermal conductivity is deteriorated. One, Figure 1B, which is a cross-section of another columnar heat pipe of the prior art = unintentional. In order to improve the lack of the columnar heat pipe i〇a in Fig. 1A, the columnar heat pipe 1〇β of Fig. 1B can be condensed on the upper cover 14b by using a bell jar shape like a bell shape. The fluid gradually flows into the capillary structure 16 located in the side wall 122 along the curved upper ridge 14b. However, the effect of using only the bell cover shape 4b to guide is limited. The cover 14b is similar to the bell cover shape, so that the water injection officer 18 attached to the outside is more outwardly convex, resulting in the overall heat pipe (10). If the columnar heat pipe (10) is to be used with the heat sink fins and the fan to live under a limited space limit, the cover i 4b and the water injection pipe 18 are outwardly convex, and the heat sink fins and the heat sink fins are inevitably The fan is well assembled. SUMMARY OF THE INVENTION Therefore, in order to solve the above problems, the present invention provides a heat dissipation module and a heat pipe thereof, which have the effects of effectively reducing the fluctuation range of the thermal resistance, smoothing the two-phase circulation, increasing the evaporation efficiency, and thereby increasing the force of the force. The heat dissipation stability increases. . 1292691 Body. nίίίΓ I n (four), containing - workflow and -;: hot body, a cover, a first capillary structure $ - first capillary structure. The heat pipe body has a bottom portion and a ring opening i:::: and the upper cover is combined with the heat pipe body to form and seal two spaces, and the upper jaw is penetrated by a hollow pipe body and is hollow inside. The first capillary structure is disposed on the inner surface of the side wall portion of the heat pipe body, and the second capillary structure is in contact with the first capillary structure and the first capillary structure, and the rank of the upper capillary is the working fluid of the junction capable of two capillary structures. To the first-capillary structure. The 5 body enters the heat pipe as described above, and further includes a set on the broadcast piece.擒止片系二:;=!: Structure or side wall contact. Furthermore, at the contact of one of the walls of the capillary structure, the capillary structure or the side has other equivalent shapes, a sheet having a curvature or a fine structure, a powder sintered capillary knotted mesh hair or, for example, The above implementation: 7 grooved capillary structure. And the hollow tube extends into the hot air, and the system has a bend or a side wall portion in contact. second. The end system and the first capillary structure, the grooved capillary structure or the structure are a powder sintered capillary embossed surface and the first bristles capillary structure, and is disposed in the hollow, is a 'mesh capillary structure ,,: Two connections. Or 'the second capillary and the hollow tube body and the first-capillary structure=disposed inside the heat pipe and at the same time the 1292691 hair structure and the second capillary structure (4) comprise a material selected from the group consisting of plastic: a bismuth: gold, porous non-metallic material The method of filling the t-structure is selected from one of the groups consisting of sintering, adhesion, filling and deposition or m: true
本體係以氬焊、高週波或電漿之加二W 銀、銘或其合全等等。^；、=材料’例如是係為銅、 醇類，類、液能1屬為無機化合物、純水、 之一。 心金屬冷媒、有機化合物或其混合物 = 康本發明的另一目的’提出一種散熱模 :m一散熱鰭片。熱管包括一熱管本體、一上 -晉減細結構以及—第二毛細結構。散妖钱片传 "設於底部之側壁部，而上蓋雜= 心管體之一二= =貫穿，且空 熱管本體之底部内表面與側壁部内表面：、、’“冓，設置於 結構與空心管體相連’且第二毛細結構倉第：c 使得於上蓋處凝結之工作制能Ur二 體進入弟一毛細結構並流至第一毛細結構。-s 散熱鰭片係以鋁擠成型、沖壓或其他加 作’且散熱鰭片係為水平間隔分佈 式t ^間隔分佈、放射狀分佈或其他分佈方式。斜 置於熱管外並與熱管相連接，且連接 片設 嵌合、卡m、黏著所組成之族群其:、、自嬋接、 鰭片與熱管係以熱鑲方式進行嵌合以及/或卡歹^如，散熱 1292691 散熱鰭片與熱管之間更具有一錫膏（s〇ldering paste)、一導熱膏（grease)，或一可充當導熱介面之材 料0 . 如上述之散熱模組，熱管可透過一基座或是直接與 .一熱源接觸’用以將熱源發散的熱直接傳導至散熱鰭 片。基座係一實心金屬塊體，且熱源係一發熱之電子元 件，如中央處理器、電晶體、伺服器、高階繪圖卡、硬 碟電源供應為、行車控制系統、多媒體電子機構、無 • 線通信基地台或高階遊戲機等。再者，上述之散熱模組 係與一風扇組接，用以促進由散熱模組所導出的熱更加 迅速逸散。 # 為讓本發明之上述和其他目的、特徵'和優點能更 ，明顯易懂，下文特舉一較佳實施例，並配合所附圖式， 作洋細說明如下： 【實施方式】 卩下將參照相關圖式，說明依本發明之散熱模組及 # 其熱管之實施例。 明參照第2圖，其為依照本發明較佳實施例之一種 柱狀型熱官之示意圖。在第2圖中，柱狀型熱管係包 ί =熱管本體22、一上蓋24、一第一毛細結構26a、一 w弟二勒毛細結構挪以及一充填於熱管20内部《工作流體 …、官本體22具有一底部224以及一環設於底部224 且側壁部222與底部224係一體成型於 …、吕體22上，或者，側壁部222以及底部224亦可為 兩相互h離的凡件，且係兩相互組合後而形成熱管本體 1292691 22。 在…官本體22之内壁上（亦即是側壁部222之内 表面以及底部224 <内表面上）設置有第—毛細結 26a’而第二毛細結構26b與—空心管體28相連，且第 一毛細結構26b與第一毛細結構26a =與：：士：22係利用如氬焊、高週波或電漿等加工方 式，將上盍24及熱管本體22焊接組合，使得社 成二封閉空間，且上蓋24係被一空心管體28戶^广 使知工作流體W能夠從空心管體μ卢會 、 内部充填有工作流體W。 28處填入，使熱管20 咖或侧壁部222相接觸。於空2/-毛:^構 内部之-端282之表面上設置有第伸入熱管20 如是一伞、古4士 卓一毛、、、田結構26b ’例 末構、溝槽式毛細結構或是網狀毛 接:構’且第二毛細結構，與第-毛細結構 當柱狀型之熱管20實際在使用 直接與位於熱管20下方之埶源 _係以底。卩224 熱:原以的熱直接導離熱源。柱二二： 似為蒸發端，而側壁部222與上蓋:、0之底邛 蒸發端的卫作流體w因吸熱而蒸發^能’、、、冷凝端。在 二：下自然流向冷凝端，然後凝：並：差= (^heat)後轉變為液態 =處釋出潛熱 -毛ΛΓί二毛細結構_與空心管! 8 “ 一毛細結構26b與第—毛細結構26μ== 1292691 if處之工作流體w，可沿著第2圖上所示之箭頭 =心管體28表面上之第二毛細結構枷， 端，曰如此擺^結^ —戶斤巧供之毛細力而流回至蒸發 辰不已地將熱持續帶離熱源，以達到散埶的 :因此，凝結於上蓋24處之工作流 二習 落至蒸發端處(即底部及其上 基發端ίί上工作流趙兩相變化循環不順暢，使得 變動過大，、、、ί效ί不穩定，且使蒸發端之溫度隨時間之 明導致熱阻隨時間變動過大之缺點。本發 上蓋24;至H處之工作流體W之回流方式’係順著 與ί f # 26b，且由於第二毛細結構26b nof . 、’’、、、°構26a相接觸，而能使位於第二毛细έ士構 26b處之工作流體w順利輸送至位於上二 -，結構26a而回到蒸發端。如此一來：g = ^能、阻之㈣幅度’使散熱穩定度增加，料增進^ 選自t 構268與第二毛細結構26b之材質包括 第、孔性非金屬材料所組成之族 積所組成之族群其中之—或其結合。 ^=或上蓋24係包括一高熱傳導材料，例如 :二二5七銀、鋁或其合金等等。工作流體W係為無機 合物或其混合物之」。類、液心屬、冷媒、有機化 夕*在，，而特別、/主意的是’帛2圖係以具有-折部281 =管㈣為例，然而，本發明並不限定於 ^3圖’其為依照本發明較佳實施例之另—種^型 …官之剖面不意圖。在第3圖中，柱狀型熱管30係包括 12 1292691 一熱官本體32、一上蓋34、一第一毛細結構36a、一第 二毛細結構36b以及一充填於熱管3〇内部之工作流體 W。熱官本體32具有一底部324以及一環設於底部324 :之，壁部322，且側壁部322與底部324係一體成型於 - 熱官本體32上，或者，側壁部322以及底部324亦可為 兩相互分離的兀件，且係兩相互組合後而形成熱管本體 32 〇 與第2圖之熱管20相似，在熱管本體32之内壁上 ⑩^亦即是側壁部322之内表面以及底部324之内表面上） 设置有第一毛細結構36a，而第二毛細結構36b與一空 心管體38相連，且第二毛細結構36b與第一毛細結構 36a相接觸。上蓋34則與熱管本體32係利用如氬焊、 ，高週波或電漿等加工方式，將上蓋34及熱管本體32焊 接組合，使得結合後形成一封閉空間，且上蓋34係被一 空心管體38所貫穿，使得工作流體w能夠從空心管體 38處填入，使熱管30内部充填有工作流體w。與第2 _ 圖之熱管20所不同的是，熱管30更包括一擔止片39, 且第二毛細結構36b係設置於擋止片39上，擋止片39 可為一扁平狀之片狀物或是一有弧度之片狀物。 擔止片39係套設於空心管體38之深入熱管30内 部之一端382處，且擋止片39與空心管體38以及第一 毛細結構36a或側壁部322相接觸。當柱狀型之熱管3〇 實際在使用時，係以底部324直接與位於熱管3〇下方之 熱源（未繪示）接觸，用以將熱源所產生的熱直接導離 熱源。柱狀型熱管30之底部324為蒸發端，而側壁部 322與上盍34則為冷凝端。在蒸發端的工作流體评因吸 13 1292691 熱而蒸發成氣態，並在麼差的 然後於冷凝端處釋出潛冷凝端， 之工作流體w。 heat)後轉變為液態 第二毛細結構36b，例如是一銅 末燒結毛細結構或是制式毛細^式毛細結構、粉 結構36b設置於擔止片39上° ’且由於f二毛細 一毛細結構·相接觸，使得冷凝;體38以及第 體W，可沿著第3圖上所示之方=34處之工作流 .而流向位於擋止片39上之 向！過空心管體38 其相連之第-毛細結構3 —，由與 發端，如此循環不已地將熱持^；;力而流回至蒸 的功效。另外，在擋止片39盥 「源，以達到散熱 部322相接觸之接觸處391，擒毛、==63或側壁 彎折，且其上仍備读楚-$ , 39較佳地可具有一 婵加第一车έ从卜一毛、，、田結構36b，如此一來，可 曰力弟一毛細結構36a與第二 了 與接觸強度，使工作⑼、、，°構36b的接觸面積 實施方法虚丄：:fnw的輸送效果更加順利。其他 因此凝=蓋二技術特徵，於此不再资述。 知妒亩垃7 、 处之工作流體W便不會如習 2直接在下滴落至蒸發端 蒸發端之蒸發效二^rB相變化循環不順暢’使得 變動過A，心疋 使療發端之溫度隨時間之 =於=熱阻隨時間變動過大之缺點。本發 用第二毛細結構36b盥第_毛細^ β 且利 使位於第二毛細走毛、、、°構36a相接觸，而能 、’、、”構36b處之工作流體w順利輸送至位 14 1292691 於側壁部322上之第一毛細結構36a而回到蒸發端。The system is argon-welded, high-frequency or plasma plus two W silver, Ming or its combination. ^; = = material ' For example, it is a copper, an alcohol, a class, a liquid energy, one genus is an inorganic compound, one of pure water. A metal-metal refrigerant, an organic compound or a mixture thereof = another object of Kangben's invention, proposes a heat-dissipating mold: m-heat-dissipating fin. The heat pipe comprises a heat pipe body, an upper-thinning structure and a second capillary structure. The diffuse demon money is transmitted on the side wall of the bottom, and the upper cover = one of the heart tube body = = through, and the inner surface of the bottom of the hollow heat pipe body and the inner surface of the side wall::, "", set in the structure Connected to the hollow tube body' and the second capillary structure chamber: c makes the work of coagulation at the upper cover to enter the second capillary structure and flow to the first capillary structure. -s The fins are extruded by aluminum , stamping or other additions and cooling fins are horizontally spaced distributed t ^ spacing distribution, radial distribution or other distribution. It is placed obliquely outside the heat pipe and connected to the heat pipe, and the connecting piece is fitted with a card, m The group consisting of: bonding, self-joining, fins and heat pipes are fitted by hot-stamping and/or jamming, such as heat dissipation, 1292691, there is a solder paste between the heat-dissipating fins and the heat pipe (s 〇ldering paste), a thermal grease, or a material that acts as a thermal interface. 0. For the thermal module described above, the heat pipe can be passed through a pedestal or directly in contact with a heat source to dissipate Heat is conducted directly to the fins. A solid metal block, and the heat source is a heating electronic component, such as a central processing unit, a transistor, a servo, a high-order graphics card, a hard disk power supply, a driving control system, a multimedia electronic mechanism, and a wireless communication base station. Or a high-end game machine, etc. Further, the heat dissipation module is connected to a fan to promote the heat released by the heat dissipation module to be more quickly dissipated. # The above and other objects and features of the present invention are made. The advantages and advantages are obvious and obvious. The following is a detailed description of the preferred embodiment, and the following is a detailed description of the following: [Embodiment] The heat dissipation mode according to the present invention will be described with reference to the related drawings. Embodiments of the heat pipe are shown in Fig. 2, which is a schematic view of a columnar type heat officer according to a preferred embodiment of the present invention. In Fig. 2, a column type heat pipe package ί = heat pipe body 22, an upper cover 24, a first capillary structure 26a, a w di keel structure and a filling inside the heat pipe 20 "working fluid ..., the body 22 has a bottom 224 and a ring is provided at the bottom 224 and the side wall portion 222 The bottom portion 224 is integrally formed on the body 22, or the side wall portion 222 and the bottom portion 224 may be two mutually separated pieces, and the two are combined with each other to form the heat pipe body 1292691 22. The inner wall (i.e., the inner surface of the side wall portion 222 and the bottom portion 224 < inner surface) is provided with a first capillary junction 26a' and the second capillary structure 26b is connected to the hollow tubular body 28, and the first capillary structure 26b And the first capillary structure 26a = and::: 22 system using a processing method such as argon welding, high frequency or plasma, the upper jaw 24 and the heat pipe body 22 are welded and combined, so that the two closed spaces and the upper cover 24 It is known that the working fluid W can be filled with the working fluid W from the hollow tubular body by a hollow tubular body. Fill in at 28 places to bring the heat pipe 20 or the side wall portion 222 into contact. On the surface of the inner 2 end of the hollow 2/-hair: the inner end of the end 282 is provided with a first extension heat pipe 20, such as an umbrella, an ancient 4 Shizhuo Yimao, a Tiantian structure 26b 'the end structure, a grooved capillary structure Or the reticular bristle: the second capillary structure, and the first capillary structure, when the columnar heat pipe 20 is actually used directly below the heat pipe 20 is bottomed.卩 224 Heat: The original heat is directly directed away from the heat source. Column 22: It seems to be the evaporation end, and the side wall portion 222 and the upper cover: the bottom of the bottom 邛 The evaporation fluid at the evaporation end w evaporates due to heat absorption, and the condensation end. In the second: the natural flow to the condensation end, then condense: and: difference = (^heat) after the conversion to liquid = release of latent heat - hair ΛΓ 二 two capillary structure _ and hollow tube! 8 " a capillary structure 26b and the first capillary Structure 26μ== 1292691 If the working fluid w at the if, can be along the arrow shown on the second figure = the second capillary structure on the surface of the heart tube body 28, the end, the 摆 摆 ^ ^ ^ ^ ^ ^ ^ The capillary force flows back to the evaporation and the heat is continuously carried away from the heat source to achieve the divergence: therefore, the workflow condensed on the upper cover 24 falls to the evaporation end (ie, the bottom and the base of the base ίί The upper two-phase change cycle of the workflow Zhao is not smooth, so that the change is too large, and the efficiency of the evaporation end is unstable, and the temperature of the evaporation end is caused by the time limit, so that the thermal resistance changes excessively with time. The reflow mode of the working fluid W at H is followed by ί f # 26b, and due to the contact of the second capillary structure 26b nof . , '', , , ° 26a, can be located in the second capillary gentleman structure The working fluid w at 26b is smoothly transported to the upper second-, structure 26a and returned to the evaporation end. In this case, g = ^ can, and the resistance (4) amplitude increases the heat dissipation stability, and the material is improved. The material selected from the t-structure 268 and the second capillary structure 26b includes a group consisting of a first and a porous non-metallic material. Among the groups - or a combination thereof. ^ = or the upper cover 24 includes a high heat conductive material, such as: 225 silver, aluminum or its alloy, etc. The working fluid W is an inorganic compound or a mixture thereof. , liquid core, refrigerant, organic chemistry, and special, / idea is that the '帛 2 diagram has a - fold 281 = tube (four) as an example, however, the invention is not limited to ^ 3 map ' It is not intended to be in accordance with the preferred embodiment of the present invention. In the third figure, the columnar heat pipe 30 includes 12 1292691 a thermal body 32, an upper cover 34, and a first The capillary structure 36a, a second capillary structure 36b, and a working fluid W filled inside the heat pipe 3. The heat main body 32 has a bottom portion 324 and a ring portion 324: a wall portion 322, and the side wall portion 322 and the bottom portion The 324 series is integrally formed on the heat main body 32, or the side wall portion 322 and the bottom portion 324 It can be two separate pieces, and the two are combined to form the heat pipe body 32. Similar to the heat pipe 20 of FIG. 2, the inner wall of the heat pipe body 32 is the inner surface and the bottom of the side wall portion 322. A first capillary structure 36a is disposed on the inner surface of the 324, and the second capillary structure 36b is coupled to a hollow tubular body 38, and the second capillary structure 36b is in contact with the first capillary structure 36a. The upper cover 34 is welded to the heat pipe body 32 by means of argon welding, high frequency or plasma processing, and the upper cover 34 and the heat pipe body 32 are welded and combined to form a closed space, and the upper cover 34 is a hollow pipe body. 38 is penetrated so that the working fluid w can be filled from the hollow pipe body 38, and the inside of the heat pipe 30 is filled with the working fluid w. Different from the heat pipe 20 of FIG. 2, the heat pipe 30 further includes a supporting piece 39, and the second capillary structure 36b is disposed on the stopping piece 39, and the stopping piece 39 can be a flat piece. The object is either a curved piece. The retaining piece 39 is sleeved at one end 382 of the hollow tube body 38 deep inside the heat pipe 30, and the stop piece 39 is in contact with the hollow tube body 38 and the first capillary structure 36a or the side wall portion 322. When the columnar heat pipe 3 is actually in use, the bottom portion 324 is directly in contact with a heat source (not shown) located below the heat pipe 3〇 to directly guide the heat generated by the heat source away from the heat source. The bottom portion 324 of the columnar heat pipe 30 is an evaporation end, and the side wall portion 322 and the upper crucible 34 are condensation ends. The working fluid at the evaporation end evaporates into a gaseous state due to the heat of the heat, and then releases the working fluid w at the condensation end at the condensation end. Heat) is converted into a liquid second capillary structure 36b, for example, a copper-end sintered capillary structure or a standard capillary capillary structure, and the powder structure 36b is disposed on the supporting piece 39° and due to f-two capillary-capillary structure· The contact is made to cause condensation; the body 38 and the first body W can flow along the working flow at the square = 34 shown in Fig. 3, and flow toward the stop piece 39! Through the hollow tube body 38, the connected first capillary structure 3, by the end, and so on, will continue to heat up to the effect of steaming. In addition, in the blocking piece 39 盥 "source, to reach the contact portion 391 where the heat dissipating portion 322 is in contact, the bristles, == 63 or the side walls are bent, and the reading thereon is still possible. One 婵 第一 第一 第一 第一 第一 έ 卜 卜 卜 卜 , , 卜 卜 卜 卜 卜 卜 卜 卜 卜 卜 卜 卜 卜 卜 卜 卜 卜 卜 卜 卜 卜 卜 卜 卜 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 The implementation method is vain:: The conveying effect of fnw is smoother. Others are therefore technical features of condensing = cover two, which are no longer described here. Knowing the mud of the mud, the working fluid W will not drop directly as in the 2 The evaporating effect to the evaporation end of the evaporation end is not smooth, and the cycle is not smooth, so that the temperature is changed over A, and the temperature of the treatment is over time = the thermal resistance changes excessively with time. The second capillary of the hair is used. The structure 36b is 盥 _ capillary ^ β and is located in the second capillary hair, , the structure 36a is in contact, and the working fluid of the energy, ', , and the structure 36b is smoothly transported to the position 14 1292691 in the side wall portion 322 The first capillary structure 36a is returned to the evaporation end.
请參照第4圖’其為第U圖與第3圖之兩柱狀型 熱管之熱阻值變化比較圖。第3圖之熱管3〇(即本笋明 之熱阻值隨著時間的變動，雖仍然亦產生週期性x的 降，然與第1A圖之熱管10A(即習知技術）相較，此一埶 阻值隨時間之變動明顯降低，本發明之熱阻值僅在介二 0.100CC/W)與G.mrC/W)之間變動，其變化量僅為 〇.〇〇2(°C/W)，然習知的熱阻值卻在〇.〇93(^)盘 〇.l〇5(°C/W)之間劇烈變動，其變化量高達〇 〇i ^ :)變動因巾 可證明本發明確㈣ Ϊ Λ Λ 果，且有效降低在熱管散熱運作 =其熱#體32與熱源相接觸面（即蒸發端處）之溫度 Mease)之㈣幅度’使最大值與最小值之溫度差在〇 2 ^内，使兩相（氣相與液相）循環，可增加基發效 率’進而增進整體之散熱能力，使散熱穩定度增力 另外，請同時參照第5A圖與第卯圖，其 圖之柱狀型熱管應用於二散熱模組立/、、 i::、50B係可應用於:熱源(未繪示)上?且熱t熱:ί 是藉由一位於熱管下方並位於熱源上、 =硬】晶體，器、高階 …：ί 應益、行車控制系統、多媒體電 熱模組㈣5=二^^ 組5。…導出的熱更:戶:^ 於第5A圖中’散熱模組5〇A包括一熱管3〇以及至 15 1292691 少-散熱鰭片52a。熱管30係可與第3圖之 有=之技術特徵’於此不再贅述。散熱鰭片“ 鋁擠成型、沖壓或其他加工方式製作，且妹^ 設置於熱管30外並盥埶管3〇相遠放π."、9片52a 與川夕、击拉+ / 相連。散熱鰭片52a與熱 L群Λ 自焊接1合、卡固、黏著所組成 Ξ二：ί/Τ广散熱鰭片與熱管係以熱鑲方式 。另外’散熱轉片如與熱管3〇 之間更塗佈有-錫貧（SQldering陶⑻、—導敎暮 (grease)，或一可充當導熱介面之材料。 ’、用 盥埶其Hi籍片他係呈放射狀分佈於熱管30外並 者Hf/30係被套設於多個散熱鰭片他 平一示’多個散熱轉片咖係以水 +間&刀佈之方式套設於熱f 3〇外，且多 52b之間彼此平行。然散熱鰭片如丨52b之分^方 =舉例，本發明並不限制於此’散熱鰭; 他分佈方式。疋=直間“斜向間隔分佈或其Please refer to Fig. 4' for a comparison of the thermal resistance values of the two columnar heat pipes of the U and Fig. 3. The heat pipe of Figure 3 (ie, the heat resistance value of this bamboo shoots changes with time, although it still produces a periodic x drop, compared with the heat pipe 10A of Figure 1A (ie, the conventional technology), this one The resistance value of 埶 is significantly reduced with time. The thermal resistance of the present invention varies only between 0.100 CC/W and G.mrC/W), and the variation is only 〇.〇〇2 (°C/ W), however, the conventional thermal resistance value varies drastically between 〇.〇93(^) 〇.l〇5(°C/W), and the amount of change is as high as 〇〇i ^ :) It is proved that the present invention (4) Ϊ Λ , , , , , , , , , , , , , , , , , , = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = The difference is within ^2 ^, so that the two phases (gas phase and liquid phase) are circulated, which can increase the efficiency of the base light, thereby increasing the overall heat dissipation capacity, and increasing the heat dissipation stability. Please also refer to Figure 5A and Figure 同时The columnar heat pipe of the figure is applied to the second heat dissipation module, /, i::, 50B can be applied to: a heat source (not shown), and the heat t: ί is located under a heat pipe Located on the heat source , = hard] crystal, device, high-order ...: ί Ying, driving control system, multimedia electric heating module (four) 5 = two ^ ^ group 5. ...Exported heat: Household: ^ In Figure 5A, 'heat dissipation module 5〇A includes a heat pipe 3〇 and to 15 1292691 less-heat dissipation fins 52a. The heat pipe 30 can be combined with the technical features of Fig. 3, and will not be described again. The heat-dissipating fins are made by aluminum extrusion, stamping or other processing methods, and the sisters are placed outside the heat pipe 30 and the 盥埶 tube is placed at a distance of π.", 9 pieces of 52a are connected with Chuanxi, pull-up + /. The heat dissipating fins 52a and the heat L group Λ are composed of a welding, a clamping, and an adhesive. The second: ί/Τ 散热 散热 散热 与 热 热 热 热 热 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 It is coated with -SQldering (8), -grease, or a material that acts as a thermal interface. ', with its Hi film, it is radially distributed outside the heat pipe 30. The Hf/30 system is sleeved on a plurality of heat-dissipating fins. The other one shows that the plurality of heat-dissipating fins are sleeved outside the heat f 3 in the form of water + room & knife cloth, and the plurality 52b are parallel to each other. However, the heat sink fins such as 丨52b are exemplified, and the present invention is not limited to this 'heat sink fin; his distribution mode. 疋=straight interval' oblique spacing distribution or
承上所述，本發明之散熱模組及其熱管，由於 :毛細結構26b、36b與空心管體28、38相第一 r:，6b、36b與第一毛細結構心、 ：T 吏::冷疑於上蓋24、34處之工作流體w， ===心管體28、38與第二毛細結構2此二4, 並進而能夠順利被輸送至位於側壁部⑽他 ，細結構2 6 a、3 6 a而回到蒸發端。如 $ ;，結於上蓋處之工作流體直接往下滴落至4端：： 問通。因此，本發明之散熱模組及其熱管具有有= 16 1292691As described above, the heat dissipation module and the heat pipe of the present invention have the first r:, 6b, 36b and the first capillary structure core, as the capillary structure 26b, 36b and the hollow pipe body 28, 38 are: T 吏:: It is cold to suspect that the working fluid w at the upper cover 24, 34, === the core tube 28, 38 and the second capillary structure 2, and can be smoothly transported to the side wall portion (10), the fine structure 2 6 a , 3 6 a and return to the evaporation end. For example, the working fluid attached to the upper cover drops directly to the 4th end:: Ask. Therefore, the heat dissipation module of the present invention and the heat pipe thereof have = 16 1292691
使散熱穩定度增加。 ，而非為限制性者。任何未脫 而對其進行之等效修改或變 熱阻之變動幅度的效果， 率，進而增進整體之散熱 以上所述僅為舉例性，而 離本發明之精神與範疇，而I 更，均應包含於後附之申請專利範圍中。 【圖式簡單說明】 ，1A圖為習知一種柱狀型熱管之剖面示意圖。 ，1B圖為習知另一種柱狀型熱管之剖面示意圖。 第2圖為依照本發明較佳實施例之一種柱狀型熱管 之剖面示意圖。 ”、、 第3圖為依照本發明較佳實施例之另一種柱狀型敎 管之剖面示意圖。 …、 第4圖為第ία圖與第3圖之兩柱狀型熱管之熱阻 值變化比較圖。 ’ 第5A圖與第5B圖為將第3圖之柱狀型熱管應用於 二散熱模組之示意圖。 【主要元件符號說明】 l〇A、10B、20、30 :熱管 12、22、32 :熱管本體 122、222、322 :側壁部 124、224、324 :底部 14a、14b、24、34 :上蓋 16 :毛細結構 里 18 :注水管 26a、36a :第一毛細結構 26b、36b ·第二毛細結構 28、38 :空心管體 17 1292691 281 :彎折部 282、382 : —端 39 :擋止片 391 :接觸處 50A、50B :散熱模組 52a、52b :散熱鰭片 W :工作流體Increase heat dissipation stability. , not a restrictive one. The effect of any equivalent modification or variable thermal resistance change rate, and thus the overall heat dissipation, is merely exemplary, and is far from the spirit and scope of the present invention, and It should be included in the scope of the patent application attached. [Simple description of the drawing], Fig. 1A is a schematic cross-sectional view of a columnar heat pipe. FIG. 1B is a schematic cross-sectional view of another columnar heat pipe of the prior art. Fig. 2 is a schematic cross-sectional view showing a columnar heat pipe in accordance with a preferred embodiment of the present invention. Fig. 3 is a schematic cross-sectional view showing another columnar type manifold according to a preferred embodiment of the present invention. Fig. 4 is a diagram showing changes in thermal resistance values of the columnar heat pipes of Fig. 3 and Fig. 3. Comparison diagram. '5A and 5B are schematic diagrams of applying the columnar heat pipe of Fig. 3 to the two heat dissipation modules. [Main component symbol description] l〇A, 10B, 20, 30: heat pipes 12, 22 32: heat pipe body 122, 222, 322: side wall portions 124, 224, 324: bottom portion 14a, 14b, 24, 34: upper cover 16: capillary structure 18: water injection pipe 26a, 36a: first capillary structure 26b, 36b Second capillary structure 28, 38: hollow tubular body 17 1292691 281: bent portion 282, 382: - end 39: stop piece 391: contact 50A, 50B: heat dissipation module 52a, 52b: heat sink fin W: work fluid