1295553 九、發明說明： 【發明所屬之技術領域】 本發明係關於-種散熱裝置，特別係關於一種 於電子元件上進行散熱之熱管散熱裝置。 又 【先前技術】 隨著電子產業不斷發展，電子元件（特別 =運行速度及整體性能在不斷提升。然而:、它的二 ，罝亦鼓之增加，另一方面體積越來越小，發熱亦 3丄使得業界單純使用金屬實體傳熱之散熱裝置心 滿足尚端電子元件之散熱需求。 、 界開始使用具依靠相變化原理傳熱之元件 彤官P的散熱裝置。熱管係主要由真空密封的管 丄二Ϊ、八内壁上設置之毛細結構（如粉末燒結物、溝 =、、口、、絲，結構等）及其内適量裝入之工作液體（如 精、氟里昂、丙酮等）組成。熱管係通過工作液 勃又…、後進行液汽兩相變化而吸收、釋放熱量以達到傳 的，由於熱管的傳熱速度快且傳熱距離長而得到廣 泛應用。 〃 、、拖腺# i專利公告第cn 2514397 γ號公開了一種使用 '’、、…的，熱裝置，其包括外形為太陽花形之散熱 二絲，散熱器包括—空心柱體及柱體向外延伸之複數螺 旦二’該空心柱體底部與熱源接觸，其内部密封有適 :二作液體’該散熱器上方安裝-軸流風扇。當熱源 ^ ^時’該柱體内部的工作液體通過相變化使熱量傳送 動鍺?外壁ΐ，該柱體外壁再將熱量傳遞至外壁上之複 =’該複數韓片與風扇的強制氣流換熱而將熱量散 χ周圍空間’以達到散熱目的。但，這種太陽花形散 1295553 :千 /! ΰ仿1文..)止本 熱器的熱1主要集中在柱體及靠近柱體之鰭片根部，此 處面積小熱密度大，整個散熱器的熱量分佈從柱體周向 向外逐漸遞減，遠離柱體的鰭片末端的熱量較少，而軸 流風扇的氣流量從中心部分向周緣方向逐漸遞增，從而 風扇的強氣流對應的係散熱器的熱量分佈較低的邱 分，而風扇弱氣流對應的係散熱器的面積小熱密度大^ 部分，風扇和散熱器的配合明顯不對應，未能充分利用 風扇的強制換熱作用。還有，由於氣流由上而下逐漸向 外分散式流散而遠離柱體，散熱器靠近熱源的溫度較高 部位的氣流量小，而致使熱量不能及時向外散發。 【發明内容】 ^有鑒於此，有必要提供一種散熱器與氣流的換熱率 高、散熱性能好的熱管散熱裝置。 一種熱管散熱裝置，其包括一基板、至少一連接至 基板的熱管及一與熱管連接的散熱體。該散熱體具有一 傳熱筒壁及由該筒壁内表面延伸的複數散熱鰭片，上述 熱管與該傳熱筒壁連接。 與習知技術相較本發明熱管散熱裝置具有如下優 點：由於該散熱裝置可通過熱管將熱量快速傳遞至散熱 體的筒壁上，該筒壁再將熱量傳遞至各散熱鰭片上，其 熱量分佈主要集中在筒壁及靠近筒壁的散熱鰭片^ 部，熱量分佈面積大，降低熱密度而利於熱量的散發， 當散熱體上方安裝一風扇時，其強氣流對應該筒壁内表 面及罪近同壁的散熱鰭片之間向下流動，使散熱體的高 熱處與風扇強氣流對應，熱交換率提高，充分利用風扇 的強制換熱作用；還有，風扇的氣流由於慣性向外分散 式流動時被筒壁攏住並向下導引，而對筒體充分的散1295553 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat pipe heat dissipating device for dissipating heat on an electronic component. [Prior Art] With the continuous development of the electronics industry, electronic components (especially = running speed and overall performance are constantly improving. However, its second, 罝 also increased, on the other hand, the volume is getting smaller and smaller, and the heat is also 3丄 enables the industry to simply use the metal body heat transfer heat sink to meet the heat dissipation requirements of the electronic components of the end. The boundary begins to use a heat sink with a component that relies on the phase change principle to transfer heat. The heat pipe is mainly vacuum sealed. The capillary structure (such as powder sinter, groove =, port, wire, structure, etc.) disposed on the inner wall of the tube and the inner wall of the tube, and the working liquid (such as fine, freon, acetone, etc.) The heat pipe system absorbs and releases heat through the working fluid and then changes the liquid and vapor two phases, and is widely used due to the heat transfer speed of the heat pipe and the long heat transfer distance. 〃 , ,拖腺# i Patent Publication No. cn 2514397 γ discloses a thermal device using '',, ..., which includes a heat-dissipating two wire in the shape of a sun flower, and the heat sink includes a hollow cylinder and a cylinder The bottom of the hollow cylinder is in contact with the heat source, and the inside of the hollow cylinder is sealed with the following: two liquids are installed. The upper side of the radiator is mounted with an axial flow fan. When the heat source is ^ ^, the inside of the cylinder is working. The liquid passes through the phase change to transfer the heat to the outer wall, and the outer wall of the column transfers heat to the outer wall. The heat is exchanged between the plurality of Korean films and the forced airflow of the fan to dissipate heat into the surrounding space to achieve heat dissipation. Purpose. However, this kind of sun flower shape scattered 1295555: thousand /! ΰ 1 1 text..) The heat of the heat exchanger 1 is mainly concentrated in the column and the root of the fin near the cylinder, where the area is small and the heat density is large. The heat distribution of the entire radiator gradually decreases from the circumferential direction of the cylinder, and the heat away from the fin end of the cylinder is less, and the air flow of the axial fan gradually increases from the central portion to the peripheral direction, so that the strong airflow of the fan corresponds. The heat distribution of the heat sink is lower, and the area of the heat sink corresponding to the weak airflow of the fan has a small heat density. The fan and the heat sink do not correspond obviously, and the forced heat transfer of the fan is not fully utilized. effectFurther, since the airflow is gradually dispersed outwardly from the top to the bottom and away from the cylinder, the airflow of the radiator at a higher temperature near the heat source is small, so that the heat cannot be dissipated in time. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat pipe heat dissipating device having a high heat exchange rate between a radiator and a gas flow and a good heat dissipation performance. A heat pipe heat dissipating device includes a substrate, at least one heat pipe connected to the substrate, and a heat sink connected to the heat pipe. The heat sink has a heat transfer cylinder wall and a plurality of heat dissipation fins extending from the inner surface of the cylinder wall, and the heat pipe is connected to the heat transfer cylinder wall. Compared with the prior art, the heat pipe heat dissipating device of the present invention has the following advantages: since the heat dissipating device can quickly transfer heat to the wall of the heat dissipating body through the heat pipe, the tube wall transfers heat to the heat dissipating fins, and the heat distribution thereof It mainly concentrates on the wall of the tube and the fins near the wall of the tube. The heat distribution area is large, which reduces the heat density and facilitates the heat dissipation. When a fan is installed above the radiator, the strong airflow corresponds to the inner surface of the tube wall and the crime. The heat dissipation fins of the same wall flow downward, so that the high heat of the heat sink corresponds to the strong airflow of the fan, the heat exchange rate is increased, and the forced heat transfer effect of the fan is fully utilized; and the airflow of the fan is dispersed due to inertia. When the flow is carried, it is caught by the wall of the tube and guided downward, and the cylinder is fully dispersed.
熱，散熱性能大幅提$二_ 【實施方式】 本發明熱管散熱裝置係用以安裝於中央處理器（圖 未示）等發熱電子元件上進行散熱。請參閱第一圖及第 二圖，本發明熱管散熱裝置的第一實施例包括一基板 10、二貼設於該基板10而其兩端垂直向上延伸的熱管20 及一連接于熱管20上的筒狀散熱體30。 該基板10大致呈矩形，其四角設有固定腳12,該固 定腳12上預組裝有螺釘及彈簧等用以固定帶散熱裝置 的固定件14，該基板10上設有沿中部延伸至兩邊緣的大 致平行二凹槽16。 該熱管20大致呈立體U形，其具有一容設於基板10 凹槽16内的蒸發部22、由該蒸發部22兩端斜向外向上延 伸的傾斜部24及該傾斜部24繼續向上彎折延伸的冷凝 部26。 該筒狀散熱體30包括一直立筒壁32及筒壁32内表 面向内延伸的複數散熱鰭片34，每一散熱鰭片34的由根 部向端部逐漸變薄，這些散熱鰭片34末端緣相離一定距 離從而在散熱體30中心處圍成一具有一定直徑的中心 腔室36，該筒壁32上均勻間隔的沿軸向延伸設有數個容 設熱管20 —冷凝部26的通道38,由於熱管20的彎折而散 熱體30的底部與基板10具有一定距離。該筒狀散熱體30 係由四個一體形成（如鋁擠等）的分散熱器300組合而 成，該等分散熱器300對接面上分別沿轴向延伸設有凹 槽302，該四個分散熱器300組合時其對應的凹槽302組 合形成上述通道38。該熱管20冷凝部26與散熱體30的結 合係通過將該等分散熱器300從熱管20兩侧夾設的方式 I II ______ιι II ·ι· ' ΙΙΜ· 一-一 k! — 一1‘ 故池‘ 1295553 舞.Ί)时(更)正本 一_.一———1— 一一 一^— 結合並且通過錫焊等方式焊接。 在上述散熱體30的上方安裝一軸流風扇4〇。 從上述結構可知，熱源發熱時該散熱裝置通過基板 1〇吸收進而熱管20將熱量快速傳遞至散熱體30的筒壁 上，該筒壁32再將熱量傳遞至各散熱鰭片34上，熱量 分佈主要集中在筒壁32及靠近筒壁32的散熱鰭片34根 部，熱量分佈面積大，降低熱密度而利於熱量的外散。 而風扇40的強氣流對應該筒壁32内表面及靠近筒壁32 的散熱鰭片34根部之間向下流動，使散熱體3〇的高熱處 與風扇40強氣流對應，熱交換率提高，充分利用了風扇 40的強制換熱作用。還有，散熱體30的中心係空的，此 處風扇40的氣流損失小，且散熱體3〇的底部與基板1〇具 一定距離，氣流由於慣性向外分散式流動時被筒壁32擋 住並向下導引，故氣流充分的流向散熱體30的靠近基板 10的部位，使散熱體30的散熱均勻，提高散熱效率。另 外’由於熱管2〇5凝部26與散熱體3〇的結合係通過將分 散熱器300從熱管20兩側夾設的方式結合，即相鄰二分 散熱器300的對應二凹槽3〇2夾設熱管2〇的方式結合，故 焊料塗布容易並均句，沒有熱管2〇的插入而刮擦焊料等 問題’結合緊密度好，有利於熱量由熱管20向散熱體3〇 傳遞。 請參閲第三圖，係本發明第二實施例，其與第一實 施例的區別在於’該筒狀散熱體係由二半筒狀散熱器 300’對接組合形成’該半筒狀散熱器300，内表面中部上 還形成一凹槽304’。該凹槽3〇4，單獨容設一熱管2〇的一 冷凝部2 6。 請參閱第四圖，係本發明第三實施例，其與第一實 施例的區別在於’熱管2〇,大致呈U形，其具有一與基板The heat and heat dissipation performance is greatly increased by $2. [Embodiment] The heat pipe heat dissipation device of the present invention is mounted on a heat-generating electronic component such as a central processing unit (not shown) for heat dissipation. Referring to the first and second figures, the first embodiment of the heat pipe heat dissipating device of the present invention comprises a substrate 10, two heat pipes 20 attached to the substrate 10 and extending vertically upwards at both ends thereof, and a heat pipe 20 connected to the heat pipe 20 The cylindrical heat sink 30. The substrate 10 has a substantially rectangular shape, and four corners are provided with fixing legs 12, and the fixing legs 12 are pre-assembled with screws and springs for fixing the fixing member 14 with a heat dissipating device. The substrate 10 is provided with a middle portion extending to the two edges. The substantially parallel two grooves 16 are. The heat pipe 20 has a substantially U-shaped shape, and has an evaporation portion 22 accommodated in the groove 16 of the substrate 10, an inclined portion 24 extending obliquely outward from the both ends of the evaporation portion 22, and the inclined portion 24 continues to bend upward. The extended condensation portion 26 is folded. The cylindrical heat dissipating body 30 includes a plurality of fins 34 extending inwardly from the inner wall of the vertical cylinder wall 32 and the inner wall of the cylinder wall 32. The fins 34 are gradually thinned from the root to the end, and the fins 34 are end-endped. The edge is separated from the center of the heat sink 30 to form a central chamber 36 having a diameter, and the tube wall 32 is evenly spaced and axially extending to provide a plurality of channels 38 for accommodating the heat pipe 20 - the condensation portion 26 The bottom of the heat sink 30 has a certain distance from the substrate 10 due to the bending of the heat pipe 20. The cylindrical heat dissipating body 30 is formed by combining four sub-heatsinks 300 integrally formed (such as aluminum extrusion), and the abutting surface of the aliquoting heat sink 300 is respectively provided with a groove 302 extending in the axial direction. When the sub-heat sinks 300 are combined, their corresponding grooves 302 combine to form the above-described passages 38. The combination of the heat pipe 20 condensing portion 26 and the heat sink 30 is a method of sandwiching the aliquot heat sink 300 from both sides of the heat pipe 20, I II ______ιι II · ι· ' ΙΙΜ · one-one k! — 1' Pool '1295553 dance. Ί) time (more) original one _. one - - 1 - one by one ^ - combined and welded by soldering. An axial fan 4 is mounted above the heat sink 30. It can be seen from the above structure that when the heat source generates heat, the heat sink is absorbed by the substrate 1 and the heat pipe 20 transfers the heat to the wall of the heat sink 30, and the wall 32 transfers heat to the heat sink fins 34, and the heat is distributed. Mainly concentrated in the tube wall 32 and the root of the heat dissipation fin 34 near the barrel wall 32, the heat distribution area is large, and the heat density is lowered to facilitate the heat dissipation. The strong airflow of the fan 40 flows downward between the inner surface of the cylinder wall 32 and the root of the heat dissipation fin 34 near the cylinder wall 32, so that the high heat of the heat sink 3〇 corresponds to the strong airflow of the fan 40, and the heat exchange rate is improved. The forced heat transfer of the fan 40 is fully utilized. Further, the center of the heat dissipating body 30 is empty, where the airflow loss of the fan 40 is small, and the bottom of the heat dissipating body 3 is at a certain distance from the substrate 1 , and the airflow is blocked by the cylinder wall 32 when it flows outward due to inertia. The airflow is directed downward, so that the airflow sufficiently flows to the portion of the heat sink 30 close to the substrate 10, so that the heat dissipation of the heat sink 30 is uniform, and the heat dissipation efficiency is improved. In addition, the combination of the heat pipe 2〇5 condensing portion 26 and the heat dissipating body 3〇 is combined by sandwiching the sub-heatsink 300 from both sides of the heat pipe 20, that is, the corresponding two grooves 3〇2 of the adjacent two-divided radiator 300 The method of arranging the heat pipes 2 结合 is combined, so that the solder coating is easy and uniform, and there is no problem that the heat pipe 2 〇 is inserted and the solder is scraped. 'The combination tightness is good, and the heat is transferred from the heat pipe 20 to the heat sink 3 。. Please refer to the third embodiment, which is a second embodiment of the present invention, which differs from the first embodiment in that the tubular heat dissipation system is butt-joined by two semi-cylindrical heat sinks 300' to form the semi-cylindrical heat sink 300. A groove 304' is also formed in the middle of the inner surface. The groove 3〇4 separately accommodates a condensation portion 26 of a heat pipe 2〇. Referring to the fourth embodiment, a third embodiment of the present invention differs from the first embodiment in that the 'heat pipe 2' is substantially U-shaped and has a substrate and a substrate.
1295553 10’接觸的平直蒸發部22’及由該蒸發部22,兩端向上垂 直彎折延伸的二冷凝部26’。該熱管20,由一圓形熱管彎 折而成，惟，該蒸發部22’四面被壓成平面狀以增加與基 板10’之接觸面積。該基板10’上表面設有垂直交叉的二 凹槽16,，其中一凹槽16’的深度大於另一凹槽16，，從 而^一熱官20的蒸發部22 ’父叉結合於基板;[〇 ’。由於熱 管20’的蒸發部22’形成扁平結構，使其與基板1〇，結合^ 積大，以利於熱量由基板10,向熱管20,更快的傳遞。 請參閱第五圖’係本發明第四實施例，其與第三實 施例的區別在於，該筒狀散熱體由二半筒狀散熱器3〇〇, 組成。 可以理解地，上述各實施例中的散熱體亦可通過如 鋁擠等方式一體成型，該散熱體的筒壁上形成凹槽或通 道，而此時熱管可直接穿入散熱體筒壁的凹槽或通道 内。 綜上所述，本發明確已符合發明專利之要件，遂依 法提出專利申請。惟，以上所述者僅為本發明之較佳實 施例’自不能以此限制本案之申請專利範圍。舉凡熟悉 本案技藝之人士援依本發明之精神所作之等效修飾或 、菱化，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 第一圖係本發明熱管散熱裝置第一實施例之立體 組裝圖。 第二圖係本發明熱管散熱裝置第一實施例之立體 分解圖。 第二圖係本發明熱管散熱裝置第二實施例之立體 的年I月I丨日修(更)正本 1295553 分解圖。 第四圖係本發明熱管散熱裝置第三實施例之立體分解1295553 A flat evaporating portion 22' that is in contact with 10' and a two-condensing portion 26' which is bent upwardly from both ends by the evaporating portion 22. The heat pipe 20 is formed by bending a circular heat pipe. However, the evaporation portion 22' is pressed into a planar shape to increase the contact area with the substrate 10'. The upper surface of the substrate 10' is provided with two vertically intersecting grooves 16, wherein a groove 16' is deeper than the other groove 16, so that the evaporation portion 22' of the heat member 20' is bonded to the substrate; [〇'. Since the evaporation portion 22' of the heat pipe 20' is formed into a flat structure, it is combined with the substrate 1 to be large in order to facilitate heat transfer from the substrate 10 to the heat pipe 20. Referring to Fig. 5, a fourth embodiment of the present invention is different from the third embodiment in that the cylindrical heat sink is composed of two semi-cylindrical heat sinks. It can be understood that the heat dissipating body in the above embodiments can also be integrally formed by a method such as aluminum extrusion, and a groove or a channel is formed in the wall of the heat dissipating body, and the heat pipe can directly penetrate into the concave wall of the heat dissipating body wall. Inside the slot or channel. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application in accordance with the law. However, the above description is only a preferred embodiment of the present invention, and the scope of the patent application of the present invention is not limited thereto. Equivalent modifications or simplifications made by those skilled in the art in light of the spirit of the present invention are intended to be included in the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a perspective assembled view of a first embodiment of a heat pipe heat dissipating device of the present invention. The second drawing is a perspective exploded view of the first embodiment of the heat pipe heat dissipating device of the present invention. The second figure is an exploded view of the three-dimensional one-year repair (more) original 1295553 of the second embodiment of the heat pipe heat dissipating device of the present invention. The fourth figure is a three-dimensional decomposition of the third embodiment of the heat pipe heat dissipation device of the present invention
第五圖係本發明熱管散熱裝置第四實施例之立體分解 【主要元件符號說明】 基板 10 、 10, 固定腳 12 固定件 14 凹槽 16 、16 302、304 熱管 20 ^ 20? 蒸發部 22 ^ 2V 傾斜部 24 冷凝部 26 、 26? 筒狀散熱體 30 筒壁 32 散熱鰭片 34 中心腔室 36 通道 38 分散熱器 300 半筒狀散熱器 300? 風扇 40Fig. 5 is a perspective exploded view of a fourth embodiment of the heat pipe heat dissipating device of the present invention. [Main component symbol description] Substrate 10, 10, fixing leg 12 fixing member 14 Groove 16, 16, 302, 304 Heat pipe 20 ^ 20? Evaporating portion 22 ^ 2V inclined portion 24 Condensing portion 26, 26? Cylindrical heat sink 30 Tube wall 32 Heat sink fin 34 Center chamber 36 Channel 38 Partial heat sink 300 Semi-cylindrical heat sink 300? Fan 40
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