CN108156791A - A kind of flat-plate heat pipe circuit and its radiating module - Google Patents
A kind of flat-plate heat pipe circuit and its radiating module Download PDFInfo
- Publication number
- CN108156791A CN108156791A CN201711081756.3A CN201711081756A CN108156791A CN 108156791 A CN108156791 A CN 108156791A CN 201711081756 A CN201711081756 A CN 201711081756A CN 108156791 A CN108156791 A CN 108156791A
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- Prior art keywords
- flat
- heat pipe
- plate heat
- plate
- pipe circuit
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
Abstract
The present invention discloses a kind of flat-plate heat pipe circuit and the radiating module using this flat-plate heat pipe circuit.Wherein flat-plate heat pipe loop structure, including upper cover metallic plate, lower cover metallic plate, capillary structure and working fluid.The intermediate corresponding polygonal ring shape structure hollowed out, and the polygon loop structure at least one unequal width is all presented in the intermediate position of upper and lower cover metallic plate.And the flat-plate heat pipe circuit radiating module, it polygonal flat panel heat pipe circuit and radiating fin including at least a unequal width and is fixed on circuit board, also assists to radiate using fan.Flat-plate heat pipe circuit radiating module, the side with wider width provides the larger thermic load that dissipates, and the side of narrower width provides the smaller thermic load that dissipates.In addition flat-plate heat pipe circuit of the invention has self-control cooling mechanism.
Description
Technical field
It is particularly relevant a kind of with self-control circuit the present invention relates to the radiator and radiating module for belonging to heat pipe
Radiator and using the device related cooling module.
Background technology
Computer room at data center, base station center possesses several or dozens of rack and pendulum has server, industry thereon
Computer and the electronic components that largely generate heat.Between past many decades, although the air-conditioning that there are various ways and intelligent dissipating
Thermal design, but can only solve a part heat-sinking capability, for the electronic components that regional area largely generates heat still need into
The space of one step improvement.The e-machine equipment of the higher higher power dissipation of the power consumptions such as server, industrial computer, usually there is a shell
Body encases it, and enclosure interior is also equipped with ventilation equipment, also is provided with heat pipe and appropriate heat dissipation equipment, but because heat pipe institute in itself
The thermal Finite that can be taken away, and set branched heat pipe can be so that cost increases, it is therefore necessary to introduce new cooling facilities.
Heat pipe circuit (heat pipe loop, hereinafter referred to as HPL) is a kind of completely passive heat transfer unit (HTU), but it has both
There is the advantages of function of both heat transfer unit (HTU)s of heat pipe and loop heat pipe (loop heat pipe).The evaporator of HPL is like
The evaporator of one heat pipe, there are one capillary structures on inner wall for tool, and working fluid is inputted by the heat on capillary structure surface to be steamed
Hair becomes steam, and due to the fully on forming circuit of steam channel, steam transmits it in addition to being transmitted to the condensation part of tool radiating fin
Outside, while by the remaining heat source of this loop-type enclosed construction guiding the axis of this loop-type radiating part is balanced in a manner of self-control
To the other positions for transmitting so far loop-type radiating part.Evaporator capillary structure is again drawn the working fluid of condensation back with complete
Into the fluid circulation in HPL.HPL is still yet another advantage is that it will not generate sensitivity, that is, hardly by gravity shadow to gravity
It rings, its heat transfer property will not be influenced because of gravity.
HPL and heat pipe be not the difference lies in it there are two end, therefore it is to allow work by the conducting space of loop-type
Make the phase transformation circulate operation of the continuous vapor-liquid-steam of fluid to radiate.And HPL and loop hot-pipe (loop heat
Pipe) the difference lies in it not to have compensated chamber, and be with capillary structure, by the heat of capillary structure inside HPL
The temperature difference evaporates working fluid, equally also supplements working fluid by capillary structure.
Invention content
For large area layout chip group and part electronic component such as CPU, GPU on circuit board to be solved or other electricity
The heat dissipation problem of hot spot produced by sub- spare part (hot spot) influences the performance of whole circuit board, a heat pipe circuit
The heat dissipation problem for taking into account most electronic components is needed still to have shortcoming, the present invention proposes a tablet for not having to pump
Heat pipe circuit (Plate Heat Pipe Loop, hereinafter referred to as PHPL) solution solves the above problems, and method is as follows:
A kind of PHPL is included：
One upper cover metallic plate, intermediate position are in the polygon ring-type plate body structure hollowed out, and at least more than one
The polygonal ring shape plate body of unequal width, the upper cover metallic plate have outer surface and inner surface, the flat state in outer surface,
Inner surface is equipped at least two or more the annular recess along (commonly referred to as axial) cutting of length of side direction or etching；
One lower cover metallic plate, intermediate position are in the polygon ring-type plate body structure hollowed out, corresponding to upper cover metallic plate, are had
Inner surface and outer surface, outer surface is in smooth shape, inner surface groove annular in shape
Working fluid；And
Capillary structure is formed on the interior surface annular recess of lower cover metallic plate；
Wherein, the frame of the frame of the inner surface of the upper cover metallic plate system and the inner surface of the lower cover metallic plate
System engages fixation in a manner of diffusion interlinked, forms the circuit housing of annular polygonal closing, the working fluid is described
Enclosure, the loop structure of this polygonal ring shape has self-control cooling mechanism.
Capillary structure as described above, can be copper powder sintering, liquid-sucking core, foam metal (metalfoam), metal mesh,
Mesh grid or metal fibre agglomerate etc..
Capillary structure as described above is formed inside the inner surface recesses of the lower cover metallic plate.
The plural groove of upper cover metallic plate as described above, provides the PHPL steam channels.
As described above in order to increase the steam channel of PHPL further by the axially cutting of original upper cover plate or etching
More upper plural item cuts or etches the short column for forming a plurality of matrix arrangements perpendicular to axial direction except groove.
Slightly bigger hem width degree design as described above is exactly a kind of knot for being similar to soaking plate (vapor chamber)
Structure, effect are but an advantage over the design of soaking plate, this is because steam channel is to form a kind of relationship of loop.
A kind of PHPL as described above, shape is the tablet enclosed structure of polygonal ring shape unequal width, described
Plate body width system designs according to radiating requirements, the side of wider width provide that dissipation footprint area is larger or heat flow density compared with
The thermic load of high chip group, the side of narrower width provide the smaller thermic load that dissipates.
The content of PHPL radiating modules first embodiment of the present invention is：
A kind of PHPL radiating modules, comprising：
One circuit board has the chip group of at least more than one；
One PHPL has the polygonal ring shape loop structure of at least more than one unequal width；
, there are a plurality of fins at least one radiating fin portion thereon, attaches and is fixed on the PHPL surfaces；
The wherein described PHPL is attached at least one chip group of circuit board, wherein the hem width of the PHPL is wider
Side be attached at the chip group that footprint area is larger on the circuit board or heat flow density is larger and dissipated a large amount of heat with profit
Load.
The PHPL radiating modules are finally fixed (being typically to be lockked to fix with screw) in circuit board and are typically
It is attached in the chip group of circuit board, and the radiating fin of the PHPL radiating modules makes near this chip group
It is optimization that is shortest, and reaching heat dissipation to obtain entire heat dissipation path.
The content of PHPL radiating modules second embodiment of the present invention includes：
One PHPL has the polygonal ring shape loop structure of at least more than one unequal width；
A plurality of screws；
One bottom plate, the shape cooperation PHPL and slightly wider than the width of PHPL, there is the side of protrusion in edge
Frame has a plurality of drillings above the frame, and the frame is framed the PHPL and fixes；And
, there are a plurality of fins at least one radiating fin portion thereon, and bottom margin has the drilling for corresponding to circuit board；
The PHPL clamps with bottom plate in wherein described radiating fin portion, and uses screw locking radiating fin portion and bottom plate,
And secure the above PHPL.
The bottom plate of the PHPL radiating modules is finally the chip group for locking in circuit board and being directly attached to circuit board
In group, and the radiating fin of the PHPL radiating modules is near this chip group so that entire heat dissipation path is most short
, and reach the optimization of heat dissipation.
Such as the slight variation of front second embodiment, the third embodiment of the present invention is that one is set between bottom plate and PHPL
Circuit board has a plurality of chips on the circuit board, and the circuit board is sandwiched between bottom plate and PHPL, when practical operation,
Heat caused by chip on circuit board is directly passed to PHPL, then contacts the heat to radiating fin portion, and by fin periphery
Convected air the torrid zone is walked.
A kind of PHPL of polygonal ring shape unequal width as described above, the width system of the polygonal ring shape plate body according to
It is designed according to radiating requirements, the side of wider width provides that dissipation footprint area is larger or the higher chip group of heat flow density
Thermic load, the side of narrower width provide the smaller thermic load that dissipates.
As described above first to 3rd embodiment a kind of PHPL radiating modules, fan component also can be used to increase highest
Up to 30% heat radiation power.
Compared with the prior art, advantage of the invention is that：
Only about 40-50 watts of the heat-sinking capability of general flat plate type heat tube, PHPL of the present invention can carry heat-sinking capability about 200
Watt or more.
Though general loop hot-pipe can carry about 100-200 watts of heat-sinking capability, since meeting is affected by gravity,
The mode placed is caused to influence heat-sinking capability once changing, the significant drawback of another loop hot-pipe is exactly that low-power can not
Start heat dissipation.PHPL of the present invention can not substantially not started by gravity or low-power to be influenced.
PHPL and its radiating module of the present invention, can be according to requirements such as the position of a plurality of chips, size and shapes, using simultaneously
The hem width degree of adjustment PHPL carrys out layout designs and solves radiating requirements.
PHPL of the present invention, since return passage is all conducting state, the function of having self-control can reach bulk temperature
The heat dissipation effect of poor very little；And plant according to this radiating modules of PHPL designs more can quickly speed reach PHPL bulk temperature it is uniform
The effect of distribution.
PHPL of the present invention can be used according to soaking plate, due to polygon loop structure, bootable delayed heat
The position that source is delivered to other sides in a manner of self-control helps balanced heat dissipation, and effect is better than soaking plate.
Persond having ordinary knowledge in the technical field of the present invention, after reading this manual, it will be appreciated that of the invention
Other purposes and advantage.
Description of the drawings
Description disclosed in this invention by refer to the attached drawing, shows the important embodiment of the present invention, and is incorporated to this explanation
In book as reference, wherein：
Fig. 1 is the exploded view of PHPL of the present invention；
Fig. 2 is the constitutional diagram of PHPL of the present invention；
Fig. 3 is the C-C ' sectional structure charts of PHPL Fig. 2 of the present invention；
Fig. 4 is the 2nd surface texture schematic diagram of PHPL upper covers metallic plate of the present invention；
Fig. 5 is the B-B ' sectional structure charts of PHPL Fig. 4 of the present invention；
Fig. 6 is the inner surface structure schematic diagram of PHPL lower covers metallic plate of the present invention；
Fig. 7 is the A-A ' sectional structure charts of PHPL Fig. 6 of the present invention；
The steam flow direction and condensed fluid reflux schematic diagram that Fig. 8 is PHPL of the present invention；
Fig. 9 is PHPL radiating modules schematic diagram of the present invention；
Figure 10 implements to divide for PHPL radiating modules first of the present invention illustrates figure；
Figure 11 implements to divide for PHPL radiating modules second of the present invention illustrates figure；
Figure 12 is PHPL radiating modules 3rd embodiment exploded view of the present invention.
1 bottom plate, 2 PHPL
21 lower cover metallic plate, 211 lower cover welds frame
212 groove, 22 upper cover metallic plate
221 upper covers weld 222 pillar of frame
223 support column, 224 steam channel
23 capillary structure, 24 liquid injection pipe
3 fin, 4 fan
5 chip contact position, 6 screw
7 HPL radiating modules, 8 circuit board
81 circuit board, 9 chip
10 frame w, x, y, z hem widths
Specific embodiment
It will be elaborated hereinafter with reference to icon and element numbers according to embodiments of the present invention.So that the present invention is general
Practitioner can implement according to this after detailed reader description of the invention.
According to an embodiment of the invention, Fig. 1 shows the three-dimensional exploded view of PHPL of the present invention.As shown in Figure 1, a PHPL includes
Upper cover metallic plate 22, capillary structure 23, lower cover metallic plate 21 and liquid injection pipe 24.These are formed in after diffusion interlinked
The closed cavity of Fig. 2 PHPL 2, the function of liquid injection pipe 24 is that working fluid (not shown) enters this envelope after closed cavity is formed
The pipeline of closed chamber body, the working fluid of sufficient amount to be inserted later can completely enclose the mode of this spot welding of liquid injection pipe 24.
Fig. 2 is the schematic diagram of PHPL of the present invention, and the lengthwise of entire PHPL is about 30cm, horizontally long about 25cm, and PHPL
Thickness is about 3mm, w, x, and y, z are respectively the width value on 4 sides of PHPL, respectively w=39mm, x=22mm, y=66mm, with
And z=24mm, PHPL of the invention are the unequal values of width on 4 sides, but in the visual actual chips group of actual design
Depending on occupied area distributions shape or the situation of the power consumption demand of heat flow density size, and multilateral shape also not necessarily only
Be defined in 4 sides, can be 3 while or at 5, and more than, this is completely depending on actual demand design.And the size of hem width
Depending on needing by being actually attached at the thermic load to be transmitted of circuit board chip group (heat load), smaller thermic load
Hem width degree, which then compares, does not need to be designed be very wide, and the larger side of thermic load then needs wider hem width degree, and described herein
Thermic load represents the chip group on circuit board, within the unit interval, generated heat.
Fig. 3 is the sectional structure chart of the C-C ' lines of Fig. 2, can learn that upper cover metallic plate can be groove from the section of Fig. 3
Face or other shapes, design of the invention mainly allows this groove to become steam channel 223, and lower cover metallic plate is designed
As a big groove, be equipped with above metal mesh, metal net, copper powder sintered wicks or other, but with copper powder
The effect of sintering is best.The embodiment of the present invention is sintered at the groove 212 of lower cover metallic plate with the copper powder of 50-200 mesh.When
Working fluid just flashes to steam at capillary structure 23 during heat, because walking the road of steam channel 223 by diffusion
Diameter.But just it is condensed into drop to the cold when steam goes to condensation segment, and siphoned away by capillary structure 23, since PHPL of the present invention is
One loop structure, therefore evaporator section is revert to as supplement liquid by capillary force, it is thusly-formed cycle in cycles
Change and the PHPL of the present invention is allowed to become good design.
Schematic diagrames (outer surface be smooth) of the Fig. 4 for the 22 metallic plate inner surface of upper cover of PHPL of the present invention, the shell of upper cover
Body thickness is about 1.5mm, and inner surface is arranged there are many small convex pillar 222 in array mode, and small convex pillar 222, which is next to, to be sunken
, this is by optics or chemical etching or CNC toolroom machines cutting delineation as a result, its effect is mainly as the steaming of PHPL
Gas channel 223, in addition periphery is then upper cover plate welding frame 221.Fig. 5 is the sectional structure chart of the B-B ' lines of Fig. 4, and function is such as
It is upper described.
Schematic diagrames (outer surface be smooth) of the Fig. 6 for the 21 metallic plate inner surface of lower cover of PHPL of the present invention, the shell of lower cover
Body thickness is about 1.5mm, is that groove-like is presented in lower cover groove 212 among inner surface, the height of groove is about 1.0mm, at this
The implementation example of invention is the copper metal powder of 50-200 mesh to be inserted as the capillary structure of sintering or laying 200-400
Purpose metal mesh, and convex is then presented at periphery, it is lower cover welding frame 211, effect is to prepare and upper cover metallic plate
Upper cover welding 221 soldering and sealing of frame.In addition it is to prepare to receive liquid injection pipe 24 there are a drilling at a unfilled corner of lower-left Angle Position,
Place as the closed cavity injection liquid after upper and lower metallic plate soldering and sealing.Fig. 7 is the sectional structure chart of the A-A ' lines of Fig. 6,
Its function is as described above.
PHPL radiator structures of the present invention have sets the loop-type heat dissipation comprising primary Ioops formula radiating part with a pair of
The condensation part in portion, wherein the loop-type radiating part has primary Ioops formula enclosed construction, and the loop-type condensation part is
Attach what a plurality of radiating fins were formed, to being set on the loop-type radiating part；The wherein described loop-type radiating part into
One step has a cryosurface and a pair of evaporating surface for being set on the cryosurface, and the cryosurface is described cold to be attached
Solidifying portion, and the evaporating surface is to contact an at least heat source, by the evaporating surface described in the parallel correspondence of cryosurface, with
The part of heat energy of the evaporating surface is delivered to the axial direction perpendicular to the loop-type radiating part on the cryosurface
Condensation part radiating fin, it is while parallel in a manner of self-control by the described remaining heat source of loop-type enclosed construction guiding
The other positions of the loop-type radiating part are delivered in the axial direction of the loop-type radiating part, therefore can be rapidly reached
Temp effect.
Figure 10 is the exploded view of the first embodiment of PHPL radiating modules of the present invention, and the present embodiment does not use bottom plate, and
Directly to be in direct contact PHPL 2 with the group of chip 9 generated heat on circuit board, and PHPL 2 periphery design into just
In PHPL 2 to be fixed to (be typically with screw lock) in the design of circuit board 81, and radiating fin 3 is to design and fixed
On PHPL 2, and so that the group apart from chip 9 is nearest, so that hot caused by the group of chip 9
Amount is transmitted to radiating fin 3 with shortest path, is finally walked the torrid zone by the thermal convection current of surrounding enviroment.If along with fan is used
4 can increase to up to 30% or so heat-sinking capability.
Fig. 9 is the structure chart of PHPL radiating modules of the present invention, and second that Figure 11 is PHPL radiating modules of the present invention is implemented
The exploded view of example.It can allow this field practitioner that can be better understood upon the present invention the two diagrams together explanation.Such as
Shown in Figure 11, the shape cooperation of bottom plate 1 (being typically based on the bottom plate formed with metals such as aluminum soleplate or copper soleplates) is described
There are the frame 10 of protrusion in PHPL and slightly wider than the width of PHPL, edge, and the frame 10 has a plurality of drillings above,
The frame 10 is just framed the PHPL 2 and fix, and frame 10 has a plurality of drillings above, and heat radiating fin
PHPL 2 is just clamped fixation by piece portion 3 and bottom plate 1, then can be lockable by screw or be fixed with other fixed forms
On circuit board 81, attached to by the PHPL radiating modules above higher chip group of consuming energy, and the side of wider width
There is provided that dissipation footprint area is larger or the thermic load of the higher chip group of heat flow density, the side of narrower width provide dissipate it is smaller
Thermic load.In practical operation, the heat penetration as caused by the group of chip 9 crosses bottom plate 1 and passes to PHPL 2, and PHPL 2 is again
Radiating fin portion 3 is contacted the heat to, is finally walked the torrid zone by the convected air of surrounding enviroment.It is although but good due to so having
Heat-sinking capability, but also shortcoming, just must take into consideration and use fan 4.
Figure 12 is the exploded view of the 3rd embodiment of PHPL radiating modules of the present invention, with reference to Fig. 9 later by the two schemas
Explanation can allow this field practitioner that can be better understood upon this embodiment of the invention together.As shown in figure 12, bottom
Its periphery of plate 1 is equipped with frame 10, and frame 10 is designed to the PHPL 2 for just framing circuit board 8 and the present invention, makes to be unlikely to shake
Dynamic, circuit board 8 is clipped in the middle by bottom plate 1 and PHPL 2, and frame 10 has a plurality of drillings above, and radiating fin portion 3 and bottom plate 1
Just the PHPL 2 of handle and circuit board 8 are fixed, and the group for having a plurality of chips 9 on circuit board is welded in above.Again by spiral shell
Adjusting screw can be locked in or be otherwise secured on circuit board 81, by the PHPL radiating modules attach to energy consumption compared with
Above high electronic components, the side of wider width provides that dissipation footprint area is larger or the higher chip group of heat flow density
Thermic load, the side of narrower width provide the smaller thermic load that dissipates.Compared with Figure 11, the frame 10 of the bottom plate 1 of the present embodiment is high
Degree will at least increase the thickness that circuit board 8 adds chip 9.In practical operation, the heat penetration mistake as caused by the group of chip 9
Bottom plate 1 passes to PHPL 2, and PHPL 2 contacts the heat to radiating fin portion 3 again, finally will by the convected air of surrounding enviroment
It walks in the torrid zone.Although but due to so having good heat-sinking capability, if also shortcoming, it just must take into consideration and use wind
Fan 4, and fan can about increase by up to 30% or so heat-sinking capability.
The steam trend and the reflux of condensed working fluid body that Fig. 8 is PHPL of the present invention move towards display figure.Sentence according to normal common sense
Break from the left side of Fig. 8 as starting point, because of the width that the hem width of this side comes than the hem width of the horizontal edge up and down on figure, foundation
The embodiment of the present invention, this part need to bear some thermic loads, and heat is passed to capillary knot by the external world in practical example operation
Structure 23, therefore working fluid heat here starts to evaporate, heat steam is just up diffused into horizontal edge above and along here
Steam channel reach the right and locate, since the hem width on the right of this is most wide, the thermic load born also is the largest, therefore
The complicated differentiation for just starting constantly to radiate and heat must be contacted with radiating fin portion herein, is drilled due to such at the lower right corner
Become and also enter coda, so being that the proportion to radiate is higher, therefore the condensed fluid just having more than comparison is gradually assembled, therefore work
Liquid flows back into the starting point on the left side via the pipeline of lower section.So in cycles constantly cycle, also drive the present invention it is superior
Property.And the enclosed construction of the loop-type due to PHPL 2 of the present invention, the aqueous vapor evaporation at heat source is can be toward left or right both sides
Diffusion, therefore the steam of remaining heat source can also be guided to be spread toward other direction other than above-mentioned heat transfer type, here it is
The axial other positions for conveying so far loop-type radiating part of this loop-type radiating part are balanced in a manner of self-control.This also with
General so-called loop hot-pipe (loop heat pipe) difference.
Way according to the present invention is learnt in the case of without using to fan greatly by a series of experiment and simulation
It can about radiate at 200 watts or more, if rejecting heat to 250 watts or more along with the present invention can more increase about the design of fan.
The above is only the embodiment of the present invention and its exemplary applications, when unavailable with the enforceable model of the restriction present invention
It encloses, and the various improvement and variation that this any known skill general technology person can be done according to present disclosure, it is regarded as not
It is detached from substantive content of the present invention and is covered by person in hereafter institute's claim.It is every using present disclosure and institute's accompanying drawings and
The equivalent structure reached whether directly or indirectly is applied to this skill or other correlative technology fields, is regarded as belonging to this
In the claim of invention.
Claims (10)
1. a kind of flat-plate heat pipe circuit, it is characterised in that：Comprising：
One upper cover metallic plate, intermediate position are in the polygon cyclic structure that intermediate position hollows out, and at least more than one
The polygonal ring shape plate body of different in width, the upper cover metallic plate have outer surface and inner surface, the flat state in outer surface,
Inner surface is equipped at least two or more the annular recess for cutting or etching along length of side axial direction；
One lower cover metallic plate, intermediate position are in the polygon ring-type plate body structure that hollows out of intermediate position, corresponding to upper cover metallic plate,
With inner surface and outer surface, the flat state in outer surface, inner surface then groove-like annular in shape；
Working fluid；And
Capillary structure is formed in the inner surface recesses position of lower cover metallic plate；
Wherein, the frame of the frame of the inner surface of the upper cover metallic plate and the inner surface of the lower cover metallic plate is to spread
Bonding pattern engagement is fixed, and forms the circuit housing of a polygon Shape closed, the working fluid is in the closing housing
Portion, the loop structure of this polygon Shape closed have self-control cooling mechanism.
2. flat-plate heat pipe circuit according to claim 1, it is characterised in that：The upper cover metallic plate is in addition to along the length of side
Outside the groove in direction, more increase plural item and cut or etch the pillar for forming matrix arrangement perpendicular to length of side direction.
3. flat-plate heat pipe circuit according to claim 1, it is characterised in that：The groove of the lower cover metallic plate is above it
Copper powder sintering portion or metal mesh containing a thin layer are as the capillary structure in the flat-plate heat pipe circuit.
4. flat-plate heat pipe circuit according to claim 1, it is characterised in that：The plate body width system is according to radiating requirements
And design, the side of wider width provides the larger thermic load that dissipates, and the side of narrower width then provides the smaller thermic load that dissipates.
5. a kind of flat-plate heat pipe circuit radiating module, it is characterised in that：Comprising：
One circuit board has the chip group of at least more than one；
A kind of flat-plate heat pipe circuit has the polygonal ring shape loop structure of at least more than one unequal width, described
Polygonal ring shape loop structure has the self-control cooling mechanism of heat dissipation；
, there are a plurality of radiating fins at least one radiating fin portion thereon, attaches and is fixed on the flat-plate heat pipe loop table
On face；
The wherein described flat-plate heat pipe circuit is attached at least one chip group of circuit board, and the flat-plate heat pipe
Circuit radiating module system is fixed on the circuit board.
6. flat-plate heat pipe circuit according to claim 5 radiating module, it is characterised in that：The wherein wider side of hem width attaches
In the chip group that footprint area is larger on the circuit board or heat flow density is larger with a large amount of thermic load that dissipates.
7. a kind of flat-plate heat pipe circuit radiating module, it is characterised in that：Comprising：
One circuit board has the chip group of at least more than one；
One flat-plate heat pipe circuit has the polygonal ring shape loop structure of at least more than one unequal width, and described is more
Side shape cyclic loop structure has the self-control cooling mechanism of heat dissipation；
One bottom plate, the shape cooperation flat-plate heat pipe circuit, and, edge slightly wider than the width in flat-plate heat pipe circuit
There is the frame of protrusion at place, and the frame fixes the flat-plate heat pipe circuit frame；And
, there are a plurality of fins at least one radiating fin portion thereon；
The flat-plate heat pipe circuit is clamped with bottom plate by wherein described radiating fin portion, and uses screw locking radiating fin portion and bottom
Plate, and the chip group on the flat-plate heat pipe circuit secured the above, wherein contacts baseplate to the circuit board and fixation
In the circuit board.
8. flat-plate heat pipe circuit according to claim 7 radiating module, it is characterised in that：The larger side of the baseplate width
The chip group that contact area is larger or heat flow density is larger.
9. flat-plate heat pipe circuit according to claim 7 radiating module, it is characterised in that：The bottom plate with it is described
Can also increase by a circuit board between flat-plate heat pipe circuit, circuit board top include a plurality of chips it is combined into chip group
Group so that a second circuit board circuit board and its chip group above are clipped between bottom plate and the flat-plate heat pipe circuit,
And a plurality of chips of the second circuit board are directly attached to the flat-plate heat pipe circuit.
10. the flat-plate heat pipe circuit radiating module according to claim 5 or 7, it is characterised in that：More increase fan to increase
Heat dissipation effect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711081756.3A CN108156791A (en) | 2017-11-07 | 2017-11-07 | A kind of flat-plate heat pipe circuit and its radiating module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711081756.3A CN108156791A (en) | 2017-11-07 | 2017-11-07 | A kind of flat-plate heat pipe circuit and its radiating module |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI652444B (en) | 2018-06-29 | 2019-03-01 | 奇鋐科技股份有限公司 | Vapor chamber structure |
| US11143460B2 (en) | 2018-07-11 | 2021-10-12 | Asia Vital Components Co., Ltd. | Vapor chamber structure |
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| TWI652444B (en) | 2018-06-29 | 2019-03-01 | 奇鋐科技股份有限公司 | Vapor chamber structure |
| US11143460B2 (en) | 2018-07-11 | 2021-10-12 | Asia Vital Components Co., Ltd. | Vapor chamber structure |
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Application publication date: 20180612 |