CN105021073A - Loop type temperature equalizing plate - Google Patents
Loop type temperature equalizing plate Download PDFInfo
- Publication number
- CN105021073A CN105021073A CN201410158164.7A CN201410158164A CN105021073A CN 105021073 A CN105021073 A CN 105021073A CN 201410158164 A CN201410158164 A CN 201410158164A CN 105021073 A CN105021073 A CN 105021073A
- Authority
- CN
- China
- Prior art keywords
- annular groove
- type temperature
- loop
- plate
- separating part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The invention discloses a loop type temperature equalizing plate. The loop type temperature equalizing plate comprises two plate bodies, and ring grooves formed between the two plate bodies, wherein a separation part is arranged in each ring groove; ring grooves at the two ends of each separation part are only communicated through a fine channel on the separation part; a working fluid is arranged in the ring grooves; heat sources correspond to one ends of the separation parts of the ring grooves, so that the working fluid at the ends is evaporated into gas due to being heated, and the working fluid at the other ends is still liquid; the two ends of each separation part have a temperature difference and a pressure difference, so that the gas moves around the ring grooves for a circle, and in the process of moving around the ring grooves, the gas dissipates heat to all portions of the plate bodies and thus is cooled into liquid to arrive at the other end of the separation part and finally is returned to a starting end through the fine channel; and the heat moving speed of the working fluid is far quicker than self heat conduction speed of materials, so that the heat conduction speed can be effectively accelerated.
Description
Technical field
The present invention relates to a kind of heat-transfer device of electronic product, the loop-type temperature-uniforming plate of espespecially a kind of computer, communication products.
Background technology
In the electronic product of prior art, the heat come out in order to avoid various elements such as processors concentrates on certain and excessively boiling hot, feels under the weather, therefore often arrange a temperature-uniforming plate to be come by hot Transmit evenly when allowing user touch; The temperature-uniforming plate of prior art is a sheet metal, wherein close to side place contact thermal source, and by the thermal conduction characteristic of own material by the heat trnasfer of thermal source on whole temperature-uniforming plate, to reach the object heat of thermal source evenly transmitted.
But making rapid progress along with science and technology, the heat that the elements such as the processor in electronic product distribute gets more and more, and the temperature-uniforming plate of prior art is by means of only the mode of own material heat conduction, the speed of its heat conduction has been not enough to deal with the elements such as novel high-power processor, therefore needs to be improved.
Summary of the invention
Because the shortcoming of aforementioned prior art and deficiency, the invention provides a kind of loop-type temperature-uniforming plate, it effectively can promote the speed of heat conduction.
For reaching above-mentioned goal of the invention, the technology used in the present invention means, for providing a kind of loop-type temperature-uniforming plate, wherein comprise:
Two plate bodys, it fits fixing up and down, and each plate body includes a medial surface and a lateral surface, and the medial surface of two plate bodys fits;
At least one annular groove, it forms between two plate bodys, is provided with a separating part in each annular groove, separating part runs through and has at least one fine road, and the annular groove being positioned at separating part two ends communicates by means of only these fine roads; Working fluid is provided with in each annular groove.
When the present invention uses, the position of thermal source is made to correspond to one end of the separating part of each annular groove, the working fluid at this end place just can be heated and flash to gas thus, and the working fluid at separating part other end place is not directly heated and still for liquid, therefore the two ends of separating part are caused temperature difference and produce different saturated vapour pressures, this pressure differential just orders about gas for moving to liquid place, but the fine road due to separating part produces the effect of capillary pressure, make gas can not enter fine road, and the other end of separating part can be arrived around a circle along annular groove, heat distributes simultaneously causes plate body everywhere by gas in the process be rotated around, and be therefore cooled to liquid and come the other end of separating part, at this moment the fine road of separating part produces capillary pressure effect again, the initiating terminal making liquid be backfilled to separating part by fine road is subject to thermal evaporation, the present invention is flowed by working fluid cycles whereby and is moved heat and even heat transmission come, and working fluid moves fast next far beyond material self heat conduction of the speed of heat, therefore can reach the goal of the invention promoting heat-transfer rate.
Furthermore, described loop-type temperature-uniforming plate, wherein the bottom surface of each annular groove protrudes from the lateral surface of corresponding plate body.Make annular groove have larger space whereby, maybe can allow the position slimming of plate body except annular groove.
Accompanying drawing explanation
Fig. 1 is the three-dimensional appearance schematic diagram of the first embodiment of the present invention;
Fig. 2 is the components broken down schematic diagram of the first embodiment of the present invention;
Fig. 3 be the first embodiment of the present invention face generalized section;
Fig. 4 be the second embodiment of the present invention face generalized section;
Fig. 5 be the third embodiment of the present invention face generalized section;
Fig. 6 be the fourth embodiment of the present invention face generalized section;
Fig. 7 is the three-dimensional appearance schematic diagram of the fifth embodiment of the present invention;
Fig. 8 is the schematic top plan view of the annular groove of the sixth embodiment of the present invention;
Fig. 9 is the schematic top plan view of the annular groove of the seventh embodiment of the present invention;
Figure 10 is the schematic top plan view of the annular groove of the eighth embodiment of the present invention;
Figure 11 is the schematic top plan view of the annular groove of the ninth embodiment of the present invention.
Symbol description:
10 plate bodys 11 are bored a hole
20 annular groove 30 separating parts
31 fine roads
10A plate body 20A annular groove
10B plate body 20B annular groove
10C plate body 20C annular groove
10D plate body
10E plate body 20E annular groove
21E bending section
10F plate body 20F annular groove
30F separating part 40F communication chamber
20G annular groove
10H plate body 20H annular groove
22H common sections 30H separating part
Detailed description of the invention
Below coordinating preferred embodiment graphic and of the present invention, setting forth the technological means that the present invention takes for reaching predetermined goal of the invention further.
Referring to shown in Fig. 1 to Fig. 3, is below the first embodiment of loop-type temperature-uniforming plate of the present invention, and it includes two plate body 10 and annular grooves 20.
Aforesaid two plate bodys about 10 are fitted fixing, and each plate body 10 includes a medial surface and a lateral surface, and the medial surface of two plate bodys 10 fits; Each plate body 10 is all rectangle, but not as limit.
Aforesaid annular groove 20 forms between two plate bodys 10, annular groove 20 indent forms in the medial surface of two plate bodys 10, and the bottom surface of annular groove 20 protrudes from the lateral surface of two plate bodys 10, annular groove 20 is so made to have larger space, maybe can allow the position slimming of plate body 10 except annular groove 20, but the shape of annular groove 20 is not as limit; Such as, refer to shown in Fig. 4, it is the second embodiment of the present invention, and wherein the bottom surface of annular groove 20A does not protrude from the lateral surface of two plate body 10A; Or refer to shown in Fig. 5, it is the third embodiment of the present invention, wherein annular groove 20B only indent take shape in the medial surface of a wherein plate body 10B, and the bottom surface of this annular groove 20B protrudes from the lateral surface of this plate body 10B; Or refer to shown in Fig. 6, it is the fourth embodiment of the present invention, wherein annular groove 20C only indent take shape in the medial surface of a wherein plate body 10C, and the bottom surface of this annular groove 20C does not protrude from the lateral surface of this plate body 10C.
Refer to shown in Fig. 1 to Fig. 3, get back to the first embodiment, annular groove 20 along rectangular panel body 10 circumference around, and be similarly rectangle, but not as limit, and though annular groove 20 also can plate body 10 profile and be other shapes.
Be provided with a separating part 30 in annular groove 20, separating part 30 run through and has multiple fine road 31, the annular groove 20 being positioned at separating part 30 two ends communicates by means of only these fine roads 31, in the present embodiment, separating part 30 is low heat-conducting, and furthermore separating part 30 be thermal conductivity factor lower than 100 material, but not as limit, in addition, in the present embodiment, separating part 30 is capillary structure, separating part 30 can be the block being always installed with multiple beeline channel specifically, as shown in Figure 2, or, separating part 30 also can for the block be made up of porous material, its irregular hole can be used as fine road equally and uses, so there is the function of capillary structure equally, also or the metal of low heat conduction directly can be welded between two plate bodys 10, so can be used as separating part 30 equally to use, and the hole formed after this metal solder is just fine road, so there is the function of capillary structure equally, be provided with working fluid in each annular groove 20, working fluid can be water or refrigerant.
When the present invention uses, the position of thermal source corresponds to one end of the separating part 30 of annular groove 20, this end is such as made to be resisted against on thermal source, the working fluid at this end place just can be heated and flash to gas thus, and the working fluid at separating part 30 other end place is not directly heated and still for liquid, therefore the two ends of separating part 30 are caused temperature difference and produce different saturated vapour pressures, this pressure differential just orders about gaseous working fluid for moving to gaseous working fluid place, but the fine road 31 due to separating part 30 produces the effect of capillary pressure, make the gaseous working fluid of HTHP cannot enter fine road 31, and can along annular groove 20 around a circle, heat can be distributed to plate body 10 everywhere by gaseous working fluid in the process be rotated around simultaneously, and come the other end of separating part 30 with being therefore cooled to liquid, at this moment the fine road 31 of separating part 30 produces capillary pressure effect again, the initiating terminal making gaseous working fluid be backfilled to separating part 30 by fine road 31 comes again by thermal evaporation, the present invention is flowed by working fluid cycles whereby and is moved heat and even heat transmission come, and the speed that working fluid moves heat far beyond plate body 10 by own material heat conduction come fast, therefore can reach the goal of the invention promoting heat-transfer rate.
In addition, in the present embodiment, the center of two plate bodys 10 is run through up and down a perforation 11, and makes two plate bodys 10 become ring-type, and shape, the size of two perforation 11 are all identical, and the position of two perforation 11 is also corresponding; Effectively can reduce the space shared by the present invention thus, and other various elements that just can to arrange in 11 in electronic product of boring a hole; But refer to shown in Fig. 7, it is the fifth embodiment of the present invention, and plate body 10D itself also has certain heat conduction function, if therefore without the demand of keeping away position, then also this perforation can not be arranged, and allow the heat of thermal source also can be passed to plate body 10D central authorities.
Moreover, plate body central authorities are effectively transferred heat to if want, then refer to shown in Fig. 8, it is the sixth embodiment of the present invention, wherein annular groove 20E is still rectangle haply, but annular groove 20E includes multiple bending section 21E, these bending sections 21E is interconnected, each bending section 21E bending extends into annular groove 20E and surrounds part, then bend again and extend out, and connect next bending section 21E, external to hold more Multi-workflow except path effectively can be lengthened whereby, the heat of thermal source more can be made by working fluid to be passed to the center of plate body 10E fast, and then make heat conduction more even.
Except the above-mentioned mode with bending section transfers heat to except plate body center, also can arrange multiple annular groove to reach similar effect, the 7th such as following embodiment, refers to shown in Fig. 9, it includes three annular groove 20F, and includes two communication chamber 40F further; Concentrically mode ground is mutually sheathed for these annular grooves 20F; Each communication chamber 40F is connected between two adjacent annular groove 20F, and is connected with two adjacent annular groove 20F; And the separating part 30F of each annular groove 20F extends into communication chamber 40F, can be interconnected integral to make the separating part 30F of each annular groove 20F; The heat of thermal source also can be moved to by communication chamber 40F in different annular groove 20F thus, and and then can be delivered to plate body 10F everywhere, to reach the object of uniformly transfer heat.
In addition, if the communication chamber of the 7th embodiment taken away, refer to shown in Figure 10, it is the eighth embodiment of the present invention, and three annular groove 20G like this just can be used in three thermals source respectively, and respectively by the hot Transmit evenly of three thermals source out.
Finally, when thermal source is positioned at plate body 10 centre, refer to shown in Figure 11, it is the ninth embodiment of the present invention, wherein has two annular groove 20H, and this two annular groove 20H is connected and communicates, and there is the common sections 22H that is positioned at central authorities, common sections 22H is for this two annular groove 20H jointly; This two annular groove 20H has a separating part 30H altogether, and separating part 30H is positioned at common sections 22H and for this two annular groove 20H jointly, so just the heat of plate body 10H centre outwards can be transmitted out.
The above is only preferred embodiment of the present invention, not any pro forma restriction is done to the present invention, although the present invention discloses as above with preferred embodiment, but and be not used to limit the present invention, have in any art and usually know the knowledgeable, not departing from the scope of technical solution of the present invention, make a little change when the technology contents of above-mentioned announcement can be utilized or be modified to the Equivalent embodiments of equivalent variations, in every case be the content not departing from technical solution of the present invention, according to any simple modification that technical spirit of the present invention is done above embodiment, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (10)
1. a loop-type temperature-uniforming plate, is characterized in that, described loop-type temperature-uniforming plate comprises:
Two plate bodys, it fits fixing up and down, and each plate body includes a medial surface and a lateral surface, and the medial surface of two plate bodys fits;
At least one annular groove, it forms between two plate bodys, is provided with a separating part in each annular groove, this separating part runs through and has at least one fine road, and the annular groove being positioned at these separating part two ends communicates by means of only described fine road; Working fluid is provided with in each annular groove.
2. loop-type temperature-uniforming plate as claimed in claim 1, it is characterized in that, each annular groove indent forms in the medial surface of two plate bodys.
3. loop-type temperature-uniforming plate as claimed in claim 1, it is characterized in that, each annular groove only indent forms in the medial surface of a wherein plate body.
4. loop-type temperature-uniforming plate as claimed any one in claims 1 to 3, it is characterized in that, the bottom surface of each annular groove protrudes from the lateral surface of corresponding plate body.
5. loop-type temperature-uniforming plate as claimed any one in claims 1 to 3, it is characterized in that, described loop-type temperature-uniforming plate includes multiple annular groove, and concentrically mode ground is mutually sheathed for described multiple annular groove.
6. loop-type temperature-uniforming plate as claimed in claim 5, it is characterized in that, described loop-type temperature-uniforming plate includes at least one communication chamber further, and each communication chamber is connected between two adjacent annular grooves, and is connected with two adjacent annular grooves; The separating part of each annular groove extends into communication chamber, and the separating part of each annular groove is interconnected.
7. loop-type temperature-uniforming plate as claimed any one in claims 1 to 3, it is characterized in that, described loop-type temperature-uniforming plate includes two annular grooves, this two annular groove is connected and communicates, and there is a common sections, this two annular groove has a separating part altogether, and this separating part had altogether is positioned at this common sections.
8. loop-type temperature-uniforming plate as claimed any one in claims 1 to 3, it is characterized in that, described annular groove includes multiple bending section, and described bending section is interconnected, and each bending section bending extends into annular groove and surrounds part, and then bending extends out again.
9. loop-type temperature-uniforming plate as claimed any one in claims 1 to 3, it is characterized in that, the center of described two plate bodys is run through up and down a perforation.
10. loop-type temperature-uniforming plate as claimed any one in claims 1 to 3, it is characterized in that, described separating part is capillary structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410158164.7A CN105021073A (en) | 2014-04-18 | 2014-04-18 | Loop type temperature equalizing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410158164.7A CN105021073A (en) | 2014-04-18 | 2014-04-18 | Loop type temperature equalizing plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105021073A true CN105021073A (en) | 2015-11-04 |
Family
ID=54411229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410158164.7A Pending CN105021073A (en) | 2014-04-18 | 2014-04-18 | Loop type temperature equalizing plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105021073A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105865245A (en) * | 2016-06-16 | 2016-08-17 | 洛阳文森科技有限公司 | Double-layer pulsation heat-conducting plate strip and process |
| CN108156791A (en) * | 2017-11-07 | 2018-06-12 | 金湖芯磊电子有限公司 | A kind of flat-plate heat pipe circuit and its radiating module |
| CN110248521A (en) * | 2016-11-18 | 2019-09-17 | 双鸿科技股份有限公司 | Has the heat dissipation element of thermal resistance mechanism |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200416519A (en) * | 2003-02-27 | 2004-09-01 | Shwin-Chung Wong | Microchannel heat pipe spreaders and microchannel loop heat pipes housed in a metal case and embodiments of the same |
| CN2774091Y (en) * | 2005-01-06 | 2006-04-19 | 珍通科技股份有限公司 | Supporter structure of soaking plate |
| CN201805671U (en) * | 2010-09-29 | 2011-04-20 | 游明郎 | Uniform temperature plate having capillary structure |
| CN202103040U (en) * | 2011-04-11 | 2012-01-04 | 锘威科技(深圳)有限公司 | Circulation heat radiation device and assembly thereof |
| US20130126132A1 (en) * | 2011-11-18 | 2013-05-23 | Chih-peng Chen | Vapor chamber with integrally formed wick structure and method of manufacturing same |
| CN202974002U (en) * | 2012-11-28 | 2013-06-05 | 双鸿科技股份有限公司 | Ultra-thin uniform-temperature plate |
| CN203443443U (en) * | 2013-07-25 | 2014-02-19 | 讯强电子(惠州)有限公司 | Ring type temperature equalizing board structure |
| CN203811001U (en) * | 2014-04-18 | 2014-09-03 | 双鸿科技股份有限公司 | Loop type temperature evening plate |
-
2014
- 2014-04-18 CN CN201410158164.7A patent/CN105021073A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200416519A (en) * | 2003-02-27 | 2004-09-01 | Shwin-Chung Wong | Microchannel heat pipe spreaders and microchannel loop heat pipes housed in a metal case and embodiments of the same |
| CN2774091Y (en) * | 2005-01-06 | 2006-04-19 | 珍通科技股份有限公司 | Supporter structure of soaking plate |
| CN201805671U (en) * | 2010-09-29 | 2011-04-20 | 游明郎 | Uniform temperature plate having capillary structure |
| CN202103040U (en) * | 2011-04-11 | 2012-01-04 | 锘威科技(深圳)有限公司 | Circulation heat radiation device and assembly thereof |
| US20130126132A1 (en) * | 2011-11-18 | 2013-05-23 | Chih-peng Chen | Vapor chamber with integrally formed wick structure and method of manufacturing same |
| CN202974002U (en) * | 2012-11-28 | 2013-06-05 | 双鸿科技股份有限公司 | Ultra-thin uniform-temperature plate |
| CN203443443U (en) * | 2013-07-25 | 2014-02-19 | 讯强电子(惠州)有限公司 | Ring type temperature equalizing board structure |
| CN203811001U (en) * | 2014-04-18 | 2014-09-03 | 双鸿科技股份有限公司 | Loop type temperature evening plate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105865245A (en) * | 2016-06-16 | 2016-08-17 | 洛阳文森科技有限公司 | Double-layer pulsation heat-conducting plate strip and process |
| CN110248521A (en) * | 2016-11-18 | 2019-09-17 | 双鸿科技股份有限公司 | Has the heat dissipation element of thermal resistance mechanism |
| CN108156791A (en) * | 2017-11-07 | 2018-06-12 | 金湖芯磊电子有限公司 | A kind of flat-plate heat pipe circuit and its radiating module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105021073A (en) | Loop type temperature equalizing plate | |
| CN204904105U (en) | Electronic equipment constant temperature equipment | |
| CN203811001U (en) | Loop type temperature evening plate | |
| CN203704740U (en) | Extremely thin heat conduction device | |
| WO2012064607A3 (en) | Apparatus and method for rapid thermal cycling using two-phase heat transfer to convert heat to electricity and for other uses | |
| CN203761742U (en) | Liquid-gas divided-flow type heat exchange cavity | |
| WO2014011277A3 (en) | Gaseous flow sensor and related method thereof | |
| TW201622546A (en) | Thin vapor chamber and wick structures thereof | |
| MY193412A (en) | Heat exchanger, heat exchange method using heat exchanger, heat transport system using heat exchanger, and heat transport method using heat transport system | |
| CN106288891B (en) | Three-dimensional conductive structure and its preparation method | |
| CN203980977U (en) | Interior tubular type temperature-uniforming plate | |
| CN201892459U (en) | Thermal conducting device with capillary microstructure | |
| US20190191589A1 (en) | Three-Dimensional Electronic Structure with Integrated Phase-Change Cooling | |
| CN203369041U (en) | Heat-dissipating module | |
| CN105333759A (en) | Etching temperature uniformization board | |
| MX2018009756A (en) | Thermoelectric cooling apparatus. | |
| CN205319502U (en) | Improve packaging hardware of wide temperature range of laser instrument | |
| CN203443443U (en) | Ring type temperature equalizing board structure | |
| CN203520294U (en) | Efficient computer radiator | |
| CN104619156A (en) | Cooling device and communication product | |
| CN202648505U (en) | Supporting structure and plate type heat-exchanger using the same | |
| CN104323657A (en) | Novel vacuum cup | |
| CN204555768U (en) | Temperature-uniforming plate | |
| CN206973927U (en) | Temperature balancing device | |
| WO2015056252A3 (en) | Heat evaporator suitable for aromatherapy with heater and heat transfer means |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20160414 Address after: 215300, No. 3, No. 68 Taoyuan Road, Kunshan, Jiangsu, Suzhou Applicant after: Auras Electronic Science and Technology Industrial (Kunshan) Co., Ltd. Address before: Chinese Taiwan New Taipei City Applicant before: Shuanghong Science and Technology Co., Ltd. |
|
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151104 |