CN110248521A - Has the heat dissipation element of thermal resistance mechanism - Google Patents
Has the heat dissipation element of thermal resistance mechanism Download PDFInfo
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- CN110248521A CN110248521A CN201910456113.5A CN201910456113A CN110248521A CN 110248521 A CN110248521 A CN 110248521A CN 201910456113 A CN201910456113 A CN 201910456113A CN 110248521 A CN110248521 A CN 110248521A
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- China
- Prior art keywords
- heat
- pipe
- dissipation element
- portable electric
- electric device
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/02—Tubular elements of cross-section which is non-circular
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2270/00—Thermal insulation; Thermal decoupling
Abstract
The present invention provides a kind of heat dissipation element with thermal resistance mechanism.Heat dissipation element can be heat pipe, loop hot-pipe or temperature-uniforming plate etc..The present invention is inside heat dissipation element or peripheral, is suitably provided with heat resistant layer, thermal energy is avoided to influence the feel temperature of portable electric device in transmittance process when applied to portable electric device.
Description
The application is application No. is 201711050449.9, and the applying date is on October 31st, 2017, and invention and created name is
The divisional application of the application for a patent for invention of " heat dissipation element of tool thermal resistance mechanism ".
Technical field
The present invention is about a kind of heat dissipation element, especially with regard to a kind of heat dissipation element with thermal resistance design.
Background technique
The portable electric devices such as mobile phone, tablet computer or small-sized notebook computer, often by built-in heat pipe, circuit
The heat dissipation element of two phase change such as formula heat pipe or temperature-uniforming plate, generated heat when the electronic components such as chip or memory are operated
Immediately it takes away, to maintain it normally to operate.
Such heat dissipation element operated by two phase changes, working principle is mostly identical, is existed using working media
Liquid gas gas liquid achievees the effect that heat absorption or release thermal energy during converting.It is hand-held to be mounted on one shown in Figure 1A and Figure 1B
In formula electronic device 1 ' for common heat dissipation element heat pipe 2 ', heat pipe 2 ' has a closed tube body 21 ', sets in tube body 21 '
Be equipped with capillary structure 22 ' and fill working media (not shown), and tube body 21 ' itself at least distinguish have evaporating region (inhale
Hot-zone) 21A ' and condensation section (heat release zone) 21B '.Electronic component (example in the evaporating region 21A ' and fever of heat pipe 2 '
Such as chip or memory) 11 ' contact when, working media can absorb heat and from liquid transition be steam, and in the driving of pressure difference
It is lower mobile toward condensation section 21B '；Working media can discharge thermal energy in condensation section 21B ' later, return liquid from devaporation.And
It can finally be returned by the effect of capillary structure 22 ' from condensation section 21B ' in the working media that liquid is presented in condensation section 21B '
It is flow to evaporating region 21A ', to carry out liquid gas shift next time.
But, since the tube body of heat dissipation element is mostly as made by metal material, heat is absorbed from evaporating region 21A '
During capable of and being transferred to condensation section 21B ', thermal energy still can be released by conduction and outward, and hand-held electronic is caused to fill
It sets the environment temperature in 1 ' near heat dissipation element to greatly improve, or is transferred to the shell of portable electric device 1 ' and influences
Feel temperature when user holds.
Industry is the framework or close directly in portable electric device by the way of solving above-mentioned missing at present
The place of shell directly pastes thermal insulation layer, but due in portable electric device remaining space it is few, it is non-to apply degree of difficulty
Normal height, therefore, industry need other effective solution schemes at present.
Summary of the invention
The technical problem to be solved in the present invention is that In view of the above shortcomings of the prior art, providing a kind of with resistance
The heat dissipation element of heat engine is heat pipe, loop hot-pipe or temperature-uniforming plate, when can improve applied in portable electric device,
Heat dissipation element ambient temperature is excessively high or excessively concentrates, and influences the missing of nearby electron element normal operation, while also changing
The problem that kind portable electric device shell causes feel temperature excessively high because of heat dissipation element.
The technical solution adopted by the present invention to solve the technical problems is to provide a kind of heat pipe, including tube body, capillary structure
And heat resistant layer.Tube body includes an evaporating region, an a condensation section and thermal resistance section, thermal resistance section be located at evaporating region and
It condenses between section.Capillary structure is set in tube body.Heat resistant layer is set in tube body and is located at thermal resistance section.
Preferably, capillary structure is arranged between tube body and heat resistant layer.
Preferably, capillary structure is fibre bundle.
Preferably, capillary structure is fibre bundle, heat resistant layer is set to by fibre bundle, and the two is not overlapped.
The present invention also provides a kind of heat pipes, to contact with a heat-generating electronic elements.Heat pipe include tube body, capillary structure with
And heat resistant layer.Tube body includes an evaporating region and a condensation section.Capillary structure is set in tube body.Heat resistant layer is set to pipe
In vivo far from the side of heat-generating electronic elements.
Preferably, heat resistant layer is set to the internal layer of capillary structure.
Preferably, heat resistant layer is set to the evaporating region or condensation section of tube body.
The present invention also provides a kind of loop hot-pipes, to contact with a heat-generating electronic elements.Loop hot-pipe includes upper
Laminate and lower plywood, lower plywood with heat-generating electronic elements to contact.Top plate and lower plywood are stacked mutually and form one and steam
Send out section, a steam channel, a condensation section and a fluid passage.Wherein, the coefficient of heat conduction of lower plywood is than top plate
The coefficient of heat conduction is high.
The present invention also provides a kind of loop hot-pipes, to contact with a heat-generating electronic elements.Loop hot-pipe includes upper
Laminate, lower plywood, steam channel and fluid passage, lower plywood with heat-generating electronic elements to contact.Top plate and lower plywood
It is stacked mutually and forms an evaporating region and a condensation section, wherein heat transfer of the coefficient of heat conduction of lower plywood than top plate
Coefficient is high.Steam channel connects evaporating region and condensation section, fluid passage connection condensation section and evaporating region.
The present invention also provides a kind of temperature-uniforming plates, to contact with a heat-generating electronic elements.Temperature-uniforming plate include upper thin sheet and
Lower thin sheet, for lower thin sheet to contact with heat-generating electronic elements, the coefficient of heat conduction of lower thin sheet is higher than the coefficient of heat conduction of upper thin sheet.
The present invention also provides a kind of temperature-uniforming plates, to contact with a heat-generating electronic elements.Temperature-uniforming plate include upper thin sheet, under it is thin
Plate and heat resistant layer.For lower thin sheet to contact with heat-generating electronic elements, heat resistant layer is set to the inside of upper thin sheet.
The present invention directly sets about from heat dissipation element (heat pipe, loop hot-pipe or temperature-uniforming plate) in itself, provides effective thermal resistance
Mechanism reduces or avoids it to release thermal energy during transmitting, can not only reduce the environment temperature around heat dissipation element,
Feel temperature when user holds the portable electric device for applying the heat dissipation element is not interfered with, can be effectively improved
The feel temperature of environment temperature and the portable electric device shell when applied to portable electric device around heat dissipation element.
Further, since thermal resistance mechanism of the invention is directly formed on heat dissipation element, there is no need to as existing way, after needing
The system manufacturer at end is processed, thus more can increase the wish that brand manufacturers purchases this heat dissipation element.
Detailed description of the invention
Figure 1A is the stereoscopic schematic diagram of heat pipe and the electronic component of fever inside existing portable electric device.
Figure 1B is the diagrammatic cross-section inside the existing portable electric device that 1B ' -1B ' hatching obtains along Figure 1A.
Fig. 2A is the heat dissipation element (heat pipe) and be applied to this heat dissipation element that the first embodiment of the present invention is proposed
Stereoscopic schematic diagram when in portable electric device.
Fig. 2 B is the diagrammatic cross-section inside the portable electric device that 2B-2B hatching obtains along Fig. 2A.
Fig. 3 A to Fig. 3 E is that the heat dissipation element (heat pipe) that the first embodiment of the present invention is proposed is applied to hand-held electronic
The diagrammatic cross-section of various change aspect when in device.
Fig. 4 A is the heat dissipation element (heat pipe) and be applied to this heat dissipation element that the second embodiment of the present invention is proposed
Stereoscopic schematic diagram when in portable electric device.
Fig. 4 B is the diagrammatic cross-section inside the portable electric device that 4B-4B hatching obtains along Fig. 4 A.
Fig. 4 C to Fig. 4 D is that the heat dissipation element (heat pipe) that the second embodiment of the present invention is proposed is applied to hand-held electronic
The diagrammatic cross-section of various change aspect when in device.
Fig. 5 A is the heat dissipation element (loop hot-pipe) that the third embodiment of the present invention is proposed and by this heat dissipation element
Stereoscopic schematic diagram when applied in portable electric device.
Fig. 5 B is the diagrammatic cross-section inside the portable electric device that 5B-5B hatching obtains along Fig. 5 A.
Fig. 6 A is the heat dissipation element (loop hot-pipe) that the fourth embodiment of the present invention is proposed and by this heat dissipation element
Stereoscopic schematic diagram when applied in portable electric device.
Fig. 6 B is the diagrammatic cross-section inside the portable electric device that 6B-6B hatching obtains along Fig. 6 A.
Fig. 7 A is the heat dissipation element (loop hot-pipe) that the fifth embodiment of the present invention is proposed and by this heat dissipation element
Stereoscopic schematic diagram when applied in portable electric device.
Fig. 7 B is the diagrammatic cross-section inside the portable electric device that 7B-7B hatching obtains along Fig. 7 A.
Fig. 7 C is the variation aspect for another heat dissipation element (loop hot-pipe) that the fifth embodiment of the present invention is proposed
Stereoscopic schematic diagram.
Fig. 8 A is the heat dissipation element (temperature-uniforming plate) that the sixth embodiment of the present invention is proposed and by this heat dissipation element application
Stereoscopic schematic diagram when in portable electric device.
Fig. 8 B is the diagrammatic cross-section inside the portable electric device that 8B-8B hatching obtains along Fig. 8 A.
Fig. 8 C to Fig. 8 D is that the heat dissipation element (temperature-uniforming plate) that the sixth embodiment of the present invention is proposed is applied to hand-held electricity
The diagrammatic cross-section of various change aspect when in sub-device.
Specific embodiment
Referring to Fig. 2A and Fig. 2 B, Fig. 2A be heat dissipation element that the first embodiment of the present invention is proposed and by this
Stereoscopic schematic diagram when heat dissipation element is applied in portable electric device, Fig. 2 B is then that 2B-2B hatching obtains along Fig. 2A
Portable electric device 1 inside diagrammatic cross-section.The first embodiment of the present invention is to provide a kind of heat pipe 2, belongs to one kind
Heat dissipation element.There is an accommodating space, generally by back side 1A, side 1B and front 1C institute inside portable electric device 1
Define the range come.Heat pipe 2 includes a closed tube body 21, and capillary structure 22 is provided in tube body 21 and is situated between filled with work
Matter (not shown), and tube body 21 itself is at least distinguished evaporating region (heat absorption area) 21A, thermal resistance section 21C and condensing zone
Section (heat release zone) 21B, when electronic component (such as the core in the evaporating region 21A and portable electric device 1 of heat pipe 2 in fever
Piece or memory etc.) 11 contact when, working media can absorb thermal energy and from liquid transition be steam, and under the driving of pressure difference
It is mobile toward condensation section 21B by thermal resistance section 21C.And due to the condensation section 21B of heat pipe 2 can individually or again with other
Cooling mechanism cooperation, such as in figure cooling fin 3 link, help take away thermal energy, allow working media condensation section 21B from
Liquid is returned in devaporation.Finally, the working media that liquid is presented then can be under the action of capillary structure 22, from condensation section 21B
It is back to evaporating region 21A, to carry out liquid gas shift next time.
The heat pipe 2 that the present embodiment is proposed, it is characterised in that the thermal resistance area between evaporating region 21A and condensation section 21B
21 periphery section 21C, Yu Guanti forms a heat resistant layer 23.In this way, which the working media in heat pipe 2 is passed by evaporating region 21A
During being handed to condensation section 21B, though thermal energy can be transferred to tube body 21, but as heat resistant layer 23 outside tube body 21 and
It can not radially transmit, and be brought to mobile toward the condensation section 21B of axial direction again.And because there is this layer of heat resistant layer
23 presence, originally adjacent to the electronic component 12 of 2 thermal resistance section 21C of heat pipe, environment temperature would not be mentioned because of heat pipe 2
Height remains to maintain normally to operate.Furthermore if heat pipe 2 provided by the present embodiment is as shown in Figure 2 B, setting is in hand-held electricity
In sub-device 1 when the back side 1A of neighbouring shell, the back side 1A that also can avoid shell allows feel temperature because of heat dissipation element
Raising is concentrated in degree part.
Heat resistant layer provided by first embodiment other than it heat resistant layer 23 can be arranged in the periphery of 2 tube body 21 of heat pipe,
Heat resistant layer 23 can also be arranged inside tube body 21.A to Fig. 3 E referring to figure 3., since heat pipe 2 is provided with capillary in tube body 21
Structure 22, thus heat resistant layer 23 and capillary structure 22 between the two in formation sequence, relative position and structure also there are many
A possibility that different, the present embodiment are not limited.For example, capillary structure 22 can be first formed in 2 tube body 21 of heat pipe
Afterwards, heat resistant layer 23 is formed in capillary structure 22, is formed as shown in Figure 3A, heat pipe 2 is sequentially tube body 21, capillary from outside to inside
The three-decker of structure 22 and heat resistant layer 23.Or as shown in Figure 3B, after first forming heat resistant layer 23 in 2 tube body 21 of heat pipe,
Capillary structure 22 is formed in heat resistant layer 23, at this point, heat pipe 2 is sequentially tube body 21, heat resistant layer 23 and capillary from outside to inside
The three-decker of structure 22.Further, since other than sintered type, also there is plough groove type, net there are many kinds of the types of capillary structure
Mesh formula, fiber type etc., therefore, when capillary structure does not need to take whole circle tube body in radial directions, between heat resistant layer
May not just there be clearly and completely three-decker.For example, if heat pipe 2 uses fibre bundle 22A as capillary structure, resistance
Thermosphere 23 can be as shown in Figure 3 C, is arranged in beside the fibre bundle 22A in 2 tube body 21 of heat pipe, the two is not overlapped；Or such as Fig. 3 D
It is shown, heat resistant layer 23 is first formed in 2 tube body 21 of heat pipe, and fibre bundle 22A is placed in inside heat resistant layer 23 again later.
In addition, in structure, heat resistant layer is not necessarily two different objects from capillary structure, and the two can also be combined into
One or the structure for having both the two function simultaneously is formed, such as the capillary structure with low heat conduction coefficient material can be directly selected
It is used as heat resistant layer, or allows heat resistant layer also while there is capillary structure, for example, can as shown in FIGURE 3 E, first in heat
Heat resistant layer 23 is formed in 2 tube body 21 of pipe, is directly processed on heat resistant layer 23 later and is formed with groove in its surface such as internal layer
The structure of 22B allows heat resistant layer other than it can reach thermal resistance effect, while also having both the structure and function of capillary.
Above-mentioned first embodiment provides the design that heat resistant layer is arranged in heat pipe thermal resistance section, but, provided by the present invention
Thermal resistance design, however it is not limited to have to the thermal resistance section that heat pipe is set, thermal resistance can also be arranged in the evaporation of heat pipe
Section or the condensation section for being formed in heat pipe, as long as the normal heat absorption for not influencing normal evaporating region and condensation section are just
Often heat dissipation.
Referring to Fig. 4 A and Fig. 4 B, be heat dissipation element (heat pipe) that the second embodiment of the present invention is proposed and
Stereoscopic schematic diagram and diagrammatic cross-section when this heat dissipation element is applied in portable electric device 1.It is provided by the present invention
Second embodiment, be to provide a kind of heat pipe 2 for belonging to heat dissipation element, and heat pipe 2 provided by this second embodiment is hand-held
The relationship and above-mentioned first between configuration and heat pipe 2 and other adjacent electronic elements 11,12 in formula electronic device 1 is implemented
Example is roughly the same, therefore this part repeats no more.Then illustrate heat pipe 2 provided by second embodiment below, heat resistant layer 23 is set
Set the design in the evaporating region 21A or condensation section 21B of heat pipe 2.
In order to avoid in the evaporating region of heat pipe, after the one side of tube body absorbs thermal energy, just directly from tube body it is another towards
Outer transmitting causes the raising of hand-held temperature or the missing of concentrations Mr. Yu's a part of portable electric device shell, the present invention
The way for proposing a kind of evaporating region that heat resistant layer is arranged in heat pipe in a second embodiment, must be in heat pipe but with limiting
Tube body does the region other than directly thermally contacting with heat-generating electronic elements and is just formed with heat resistant layer, does not just interfere with heat pipe so
Normal heat absorption.A and Fig. 4 B referring to figure 4., the present embodiment are in 21 periphery of tube body of 2 evaporating region 21A of heat pipe, in far from fever
The side of electronic component 11 is provided with heat resistant layer 23, and level cladding region can be as shown in Figure 4 A, and heat pipe 2 is located to the area of the side
Domain partly coats and exposes sealing end, or the side is all optionally coated (coating sealing end).And vertical direction
On cladding mode, can be as shown in Fig. 4 B, the side from heat pipe 2 far from heat-generating electronic elements 11 coats downwards, but does not extend
To the bottom surface of heat pipe 2, thermally contacting for heat pipe 2 and electronic component is not just interfered with so.By above-mentioned design, heat pipe 2 exists
After evaporating region 21A absorbs thermal energy, just it can be reduced or avoid to direct out and transfer heat energy to 1 outer housing of portable electric device
The back side 1A of portable electric device 1 (such as in schema), so that portable electric device 1 is located at outside 2 evaporating region 21A of heat pipe
The feel temperature of shell will not be greatly improved or concentrations.
Tube body 21 periphery of the heat resistant layer 23 provided by second embodiment in addition to may be provided at 2 evaporating region 21A of heat pipe,
Heat resistant layer 23 can be arranged in inside the tube body 21 of evaporating region 21A, and also away from heat-generating electronic elements 11.For example,
Can be as shown in Figure 4 C, the side internal layer after heat pipe 2 first can be formed with capillary structure 22 in tube body 21, in capillary structure 22
Heat resistant layer 23 is formed, or as shown in Figure 4 D, first the side in 2 tube body 21 of heat pipe is formed with heat resistant layer 23 and then in resistance
Capillary structure 22 is arranged with the internal layer of tube body 21 in thermosphere 23.And two kinds of above-mentioned designs, it can only allow heat resistant layer 23 to be arranged in heat pipe 2
The side of interior separate heat-generating electronic elements 11, avoids the normal heat absorption for influencing heat pipe 2.Certainly, provided by second embodiment
Capillary structure 22, can also as above-mentioned first embodiment, using other kinds of capillary structure such as fibre bundle or groove etc.,
It can be embodied using the thermal resistance concept that above-mentioned first embodiment is proposed.
And other than the evaporating region 21A in heat pipe 2 is provided with heat resistant layer 23, second embodiment is it is also proposed that can be in heat pipe
The design of 2 condensation section 21B setting heat resistant layer 23, and the cladding region of heat resistant layer 23 or thermal resistance is formed inside and outside heat pipe 2
Layer 23 way, with it is above-mentioned 2 evaporating region 21A of heat pipe formed the way of heat resistant layer 23 it is identical, in the horizontal direction can part
Ground fully gets up condenser zone cladding, and the cladding or setting principle in vertical direction will also avoid condensing zone
The one side that section 21B is thermally contacted with cooling fin 3, does not just interfere with heat pipe so and normally radiates.And if the evaporating area of heat pipe 2
Section 21A, thermal resistance section 21C, it is wrapped by heat resistant layer 23 with condensation section 21B in the side close to 1 shell of portable electric device
It covers, is just more avoided that thermal energy is transferred to the shell of portable electric device 1, and can be by 1 shell of portable electric device
Feel temperature controls in more appropriate range.
Design concept proposed by the invention, equally can also apply to other heat dissipation elements, for example, loop hot-pipe or
Temperature-uniforming plate etc..It please refer to Fig. 5 A and Fig. 5 B, be heat dissipation element (the loop-type heat that the third embodiment of the present invention is proposed
Pipe) and by this heat dissipation element be applied to portable electric device in when stereoscopic schematic diagram and diagrammatic cross-section.
Loop hot-pipe 4 provided by the present embodiment, working principle is close with heat pipe, but the two in appearance obvious
Difference is that working media can recycle endlessly in flowing along a unidirectional loop in loop hot-pipe 4.Loop-type heat
Pipe 4 includes evaporating region 4A, steam channel 4B, condensation section 4C and fluid passage 4D, and the provided application of the present embodiment
It is that heat resistant layer 41 is arranged in outside the pipeline of steam channel 4B or in channel in the thermal resistance mechanism of loop hot-pipe 4.Such as it can be such as
Shown in Fig. 5 A and Fig. 5 B, heat resistant layer 41 is formed in the periphery of steam channel 4B, prevents thermal energy in the mistake for being transferred to condensation section 4C
Cheng Zhong, releases and influences the electronic component 12 of neighbouring steam channel in portable electric device 1, or avoids to unofficial biography
It is handed to the shell of portable electric device 1 and influences feel temperature.It remarks additionally, circuit provided by 3rd embodiment
Formula heat pipe 4 can also follow the mode of first and second aforementioned embodiment, form heat resistant layer in the channel interior of steam channel 4B.
Above-mentioned 3rd embodiment is to provide the heat resistant layer setting for loop hot-pipe steam channel outside or inside is arranged in
Meter, but, evaporating region, the condensation of loop hot-pipe can also be arranged in thermal resistance by thermal resistance design provided by the present invention
Section is even outside fluid passage, as long as not influencing the normal heat absorption of evaporating region and condensing the proper heat reduction of section i.e.
It can.
It is heat dissipation element (the loop-type heat that the fourth embodiment of the present invention is proposed referring to Fig. 6 A and Fig. 6 B
Pipe) and by this heat dissipation element be applied to portable electric device in when stereoscopic schematic diagram and diagrammatic cross-section.In order to keep away
Exempt from loop hot-pipe and just directly face out transmitting from another after one side absorption thermal energy in its evaporating region, causes hand-held electric
The hand-held temperature of sub-device shell improves or the missing of concentrations Mr. Yu's a part, the present invention propose one in the fourth embodiment
The way of the evaporating region of loop hot-pipe is arranged in heat resistant layer by kind, must be in loop hot-pipe and heating electric but with limiting
The region that subcomponent does other than directly thermo-contact forms heat resistant layer, does not just interfere with the normal heat absorption of loop hot-pipe so.
Fig. 6 A and Fig. 6 B is please referred to, the present embodiment is in the periphery of 4 evaporating region 4A of loop hot-pipe, in far from heat-generating electronic elements 11
Side, be provided with heat resistant layer 41, the region coated in horizontal direction can be as shown in Figure 6A, and loop hot-pipe 4 is located at the side
Region partly coat, or by the side all coat, as long as evaporating region is not interfered normally to absorb heat.By above-mentioned
Design, loop hot-pipe 4 evaporating region 4A absorb thermal energy after, can because heat resistant layer 41 presence and be reduced or avoided directly
It connects and transfers heat energy to 1 outer housing of portable electric device the back side 1A of portable electric device 1 (such as in schema) outward, so that
The feel temperature that portable electric device 1 is located at the shell outside 4 evaporating region 4A of loop hot-pipe will not be greatly improved or mistake
Degree is concentrated.
And in addition to other than heat resistant layer 41 is arranged in the evaporating region 4A of loop hot-pipe 4, fourth embodiment is it is also proposed that can be
The design of the condensation section 4C setting heat resistant layer 41 of loop hot-pipe 4, equally can also in the horizontal direction, partially or completely
Ground by condense section 4C cladding get up, as long as avoid condensation section be used to radiate or with other heat dissipation elements such as (cooling fin
3) region contacted, would not so influence loop hot-pipe and normally radiate.And if the evaporation of loop hot-pipe 4
Section 4A, steam channel 4B, condensation section 4C even fluid passage 4D are equal in the side close to 1 shell of portable electric device
Got up by the cladding of heat resistant layer 41, is just more avoided that thermal energy is transferred to the shell of portable electric device 1, and can be by hand-held electronic
The feel temperature of 1 shell of device controls in more appropriate range.
Above-mentioned third and fourth embodiment provide an additional increased thermal resistance mechanism on loop hot-pipe, but,
Invention also provides a kind of inherently with the loop hot-pipe of thermal resistance mechanism.Fig. 7 A and Fig. 7 B are please referred to, is of the invention
Heat dissipation element (loop hot-pipe) that five embodiments are proposed and when this heat dissipation element is applied in portable electric device
Stereoscopic schematic diagram and diagrammatic cross-section.In order to avoid loop hot-pipe is after one side absorption thermal energy, just directly from another side
Transmitting outward causes the raising of hand-held temperature or the missing of concentrations Mr. Yu's a part of portable electric device shell, this hair
It is bright to propose a kind of structure as composed by top plate 42 and lower plywood 43 of loop hot-pipe 4 in the 5th embodiment, and use
The coefficient of heat conduction of lower plywood 43 is higher than the coefficient of heat conduction of top plate 42, or allows top plate 42 by compared with low heat conduction coefficient
Material made by design.In the present embodiment, the lower plywood 43 directly contacted with heat-generating electronic elements 11 is in evaporating region
After absorbing thermal energy, since the coefficient of heat conduction of top plate 42 is lower, heat is not easy to be transferred to hand again outward through top plate 42
The shell (such as back side 1A shown in figure) for holding formula electronic device, so can be by portable electric device 1 adjacent to evaporating area
The feel temperature at the position of section is controlled in range appropriate.Further, since loop hot-pipe 4 is in steam channel 4B with condensing section
4C similarly has the lower top plate 42 of the coefficient of heat conduction to exist, therefore is not easy to be transferred to outside portable electric device 1 in thermal energy
In the case where shell (such as back side 1A shown in figure), portable electric device 1 will not be equally improved significantly and is steamed neighbouring
Feel temperature of the vapour channel 4B with condenser zone 4C region portion.It illustrates herein, the circuit that the present embodiment is proposed
Formula heat pipe, condensation section 4C still be able to normally radiate, such as by thermal energy toward horizontal direction transmit or and other
Cooling mechanism for example lower section cooling fin 3 cooperate.
Loop hot-pipe 4 provided in the present embodiment, in addition to as shown in Fig. 7 A and Fig. 7 B, by top plate 42 and lower plywood
43 are stacked mutually and are formed except evaporating region, steam channel, condensation section and fluid passage, can also select as seen in figure 7 c
It selects and is only made of in evaporating region 4A top plate 4A1 and lower plywood 4A2, and/or selection is condensing section 4C by top plate 4C1
With loop hot-pipe composed by lower plywood 4C2 design, and connect evaporating region 4A and condense section 4C steam channel 4B, with
And the fluid passage 4D of connection condensation section 4C and evaporating region 4A, then there is not the structure of layering, is only by identical material institute group
At pipeline structure.At this point, the lower plywood that contact with heat-generating electronic elements 11 in evaporating region 4A in the arrangement of material
4A2, the coefficient of heat conduction are still higher than the coefficient of heat conduction of top plate 4A1, or allow the coefficient of heat conduction of lower plywood 4A2
Equally exceed in the coefficient of heat conduction of steam channel 4B, in this way, equally can also directly to connect with heat-generating electronic elements 11
The lower plywood 4A2 of touching is after evaporating region 4A absorbs thermal energy, because the coefficient of heat conduction of top plate 4A1 is lower or steam channel
The lower reason of the coefficient of heat conduction of 4B, heat are not easy to be transferred to again outward hand-held through top plate 4A1 or steam channel 4B
The shell (such as back side 1A shown in figure) of formula electronic device.In addition, the present embodiment also may be selected to allow condensation section 4C be by
Top plate 4C1 is with structure composed by lower plywood 4C2, similarly, in the arrangement of material, the coefficient of heat conduction of lower plywood 4C2
It is higher than the coefficient of heat conduction of top plate 4C1, or the coefficient of heat conduction of lower plywood 4C2 is allowed also to exceed in the heat of fluid passage 4D
The coefficient of conductivity, in this way, which also controllable heating capacity is not easy to be transferred to again outward hand-held through top plate 4C1 or fluid passage 4D
The shell (such as back side 1A shown in figure) of formula electronic device, achievees the effect that thermal resistance.
Other than aforementioned mentioned heat pipe and loop hot-pipe, thermal resistance mechanism proposed by the invention is equally applicable to
On warm such heat dissipation element of plate and it is mounted in portable electric device.It please also refer to Fig. 8 A to Fig. 8 D, be of the invention
Heat dissipation element (temperature-uniforming plate) that sixth embodiment is proposed and when this heat dissipation element is applied in portable electric device
Stereoscopic schematic diagram and diagrammatic cross-section.
Temperature-uniforming plate 5 provided by the present embodiment, working principle is close with heat pipe, and the main difference of the two is heat pipe
The thermally conductive transmitting online for one-dimensional square, temperature-uniforming plate is then the transmitting above two-dimensional directional.Temperature-uniforming plate 5 is main in structure
It is made of upper thin sheet 51 and lower thin sheet 52, and lower thin sheet 52 is contacted with the electronic component 11 of heat source such as fever.This hair
It is bright that the thermal resistance mechanism applied in temperature-uniforming plate 5 is provided, comprising there are many aspect, the first aspect is as shown in Figure 8 B, temperature-uniforming plate 5 by
Upper thin sheet 51 is formed with lower thin sheet 52, and using the coefficient of heat conduction of lower thin sheet 52 than the coefficient of heat conduction of upper thin sheet 51
Height, or directly allow the design as made by the material compared with low heat conduction coefficient of upper thin sheet 51, in this way, which thermal energy would not be
During transmitting and release, the upper thin sheet 51 of temperature-uniforming plate 5 or the center of upper thin sheet 51 are concentrated on, and can be more uniformly toward horizontal
To movement.And it is located at the housing region of neighbouring upper thin sheet 51 in the environment temperature outside upper thin sheet 51 or portable electric device 1
The feel temperature of (such as back side 1A in icon), also can because thermal resistance proposed by the invention design and be improved or
Control.In addition, the present embodiment can also be by aforementioned applications in heat pipe other than upper thin sheet uses the different coefficients of heat conduction from lower thin sheet
And the thermal resistance design of loop hot-pipe is applied on temperature-uniforming plate, for example, can be as shown in Figure 8 C, temperature-uniforming plate 5 is by upper thin sheet 51
It is formed with lower thin sheet 52, and in the periphery of upper thin sheet 51, heat resistant layer is arranged in the region of neighbouring 1 shell of portable electric device
53, or as in fig. 8d, the inside of upper thin sheet 51 is provided with heat resistant layer 53 in 5 inside of temperature-uniforming plate, in this way, also all
It avoids thermal energy during transmitting is with release, is transferred to portable electric device shell outward by upper thin sheet 51, thus
Feel temperature can be controlled in range appropriate.
Heat resistant layer provided by the present invention can be selected from the lower material of the coefficient of heat conduction, for example, aluminium, glass fibre, ceramics,
Rubber, asbestos, rock wool, aeroge, stainless steel, ceramic coating, aeroge coating, insulation resin coating and silicate paint
Deng, and the generation type of heat resistant layer need not also limit, such as using coating (coating), sputter (sputtering), steaming
Plate (deposition), sintering, etching, anode processing, plating (Electroplating), electroless plating (Electroless
Plating), the modes such as paste to be formed, or be socketed on tube body of heat pipe again after forming a hollow sleeve.
Electronic component in heat dissipation element and portable electric device proposed by the invention, the two are the contact of heat, and
It and include therefore the aspects such as direct contact or mediate contact are folded between heat dissipation element and electronic component in structure
Heat-conducting cream, thermally conductive sheet or heat-conducting block etc. equally need not also be limited among design scope proposed by the invention.
In the embodiment provided by aforementioned present invention and correlative type, shell and heat dissipation for portable electric device
Element relative position between the two and heat dissipation element are installed on the position in portable electric device, it is merely illustrative rather than
The changeless configuration of the present invention, those of ordinary skill in the art can be according to actual demand, by resistance proposed by the invention
Thermal design concept is applied on each product and makes corresponding modification.For example, when installing this hair in portable electric device
When the space of heat dissipation element provided by bright is close to the position of the frame of two sides 1B, portable electric device two can be solved
The excessively high problem of side frame feel temperature, similarly, top margin frame, boundary frame area or front 1C (screen) institute of portable electric device
The excessively high problem of feel temperature is faced, can also be resolved certainly according to design concept proposed by the invention.
The above description is only an embodiment of the present invention, is not intended to limit the invention, therefore all other without departing from the present invention
The lower equivalent change or modification completed of revealed spirit, is intended to be limited solely by concept of the invention of the invention.
Claims (3)
1. a kind of temperature-uniforming plate, to be contacted with a heat-generating electronic elements, which is characterized in that the temperature-uniforming plate includes:
Upper thin sheet；And
Lower thin sheet, to be contacted with the heat-generating electronic elements, the heat transfer system of the coefficient of heat conduction of the lower thin sheet than the upper thin sheet
Number is high.
2. a kind of loop hot-pipe, to be contacted with a heat-generating electronic elements, which is characterized in that the loop hot-pipe includes:
Top plate；And
Lower plywood, to contact with the heat-generating electronic elements, the top plate and the lower plywood are stacked mutually and form an evaporating area
Section, a steam channel, a condensation section and a fluid passage；Wherein, the coefficient of heat conduction of the lower plywood is than the top plate
The coefficient of heat conduction is high.
3. a kind of loop hot-pipe, to be contacted with a heat-generating electronic elements, which is characterized in that the loop hot-pipe includes:
Top plate；
Lower plywood, to contact with the heat-generating electronic elements, the top plate and the lower plywood are stacked mutually and form an evaporating area
Section and a condensation section, wherein the coefficient of heat conduction of the lower plywood is higher than the coefficient of heat conduction of the top plate；
Steam channel connects the evaporating region and the condensation section；And
Fluid passage connects the condensation section and the evaporating region.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662424012P | 2016-11-18 | 2016-11-18 | |
| US62/424,012 | 2016-11-18 | ||
| CN201711050449.9A CN108076614A (en) | 2016-11-18 | 2017-10-31 | Has the heat dissipation element of thermal resistance mechanism |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711050449.9A Division CN108076614A (en) | 2016-11-18 | 2017-10-31 | Has the heat dissipation element of thermal resistance mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110248521A true CN110248521A (en) | 2019-09-17 |
Family
ID=62147517
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711050449.9A Pending CN108076614A (en) | 2016-11-18 | 2017-10-31 | Has the heat dissipation element of thermal resistance mechanism |
| CN201910456113.5A Pending CN110248521A (en) | 2016-11-18 | 2017-10-31 | Has the heat dissipation element of thermal resistance mechanism |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711050449.9A Pending CN108076614A (en) | 2016-11-18 | 2017-10-31 | Has the heat dissipation element of thermal resistance mechanism |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20180142961A1 (en) |
| CN (2) | CN108076614A (en) |
| TW (1) | TWI641796B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI680273B (en) * | 2018-06-28 | 2019-12-21 | 泰碩電子股份有限公司 | Using capillary structure and bumps to form a temperature equalizing plate for liquid-vapor channels |
| US10685900B2 (en) * | 2018-10-22 | 2020-06-16 | Deere & Company | Packaging of a semiconductor device with phase-change material for thermal performance |
| CN113056157B (en) * | 2019-12-27 | 2022-08-26 | 广州力及热管理科技有限公司 | Thin thermal management assembly |
| CN212627982U (en) * | 2020-07-10 | 2021-02-26 | 瑞声科技(新加坡)有限公司 | Mobile terminal |
| CN217061435U (en) * | 2021-05-14 | 2022-07-26 | 上海宝存信息科技有限公司 | Storage device |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN108076614A (en) | 2018-05-25 |
| TW201819840A (en) | 2018-06-01 |
| TWI641796B (en) | 2018-11-21 |
| US20180142961A1 (en) | 2018-05-24 |
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Application publication date: 20190917 |
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