CN103269573B - Temperature equalization superconductive heat radiator - Google Patents
Temperature equalization superconductive heat radiator Download PDFInfo
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- CN103269573B CN103269573B CN201310221782.7A CN201310221782A CN103269573B CN 103269573 B CN103269573 B CN 103269573B CN 201310221782 A CN201310221782 A CN 201310221782A CN 103269573 B CN103269573 B CN 103269573B
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Abstract
The present invention relates to a kind of temperature equalization superconductive heat radiator, it includes horizontally disposed first temperature-uniforming plate and the second temperature-uniforming plate, is connected by the 3rd temperature-uniforming plate between described first temperature-uniforming plate and the second temperature-uniforming plate.Described 3rd temperature-uniforming plate is multiple, and multiple 3rd temperature-uniforming plates are arranged at intervals between described first temperature-uniforming plate and the second temperature-uniforming plate；The upper end of each 3rd temperature-uniforming plate connects with described first temperature-uniforming plate, and lower end connects with described second temperature-uniforming plate, is provided with radiating fin between adjacent two the 3rd temperature-uniforming plates.It provides the benefit that: the temperature equalization superconductive heat radiator of the present invention, first temperature-uniforming plate and the second temperature-uniforming plate are connected and form heat conduction loop by the 3rd temperature-uniforming plate, its good heat dissipation effect, it is applicable to bigger equipment cooling, additionally, its simple in construction, easy to install and use, directly pyrotoxin is attached at the optional position on its surface, it is to avoid traditional heat sinks needs with heat-dissipation aluminum sectional material and pyrotoxin, heat pipe is connected the processes such as installation.
Description
Technical field
The present invention relates to heat radiation and heat conduction equipment, particularly to a kind of temperature equalization superconductive heat radiator.
Background technology
Along with the development of science and technology, electronic equipment is widely used in every field, and electronic equipment is in work
During, the pyrotoxin such as its internal process chip produces substantial amounts of heat, if this heat can not be timely
Conduction to outside, then easily cause process chip and burns out or fault etc., therefore, in electronic equipment one
As all must configure radiator, for less electronic equipment, radiator typically uses directly at cores such as CPU
Heat-dissipation aluminum sectional material etc. is installed on sheet, then coordinates radiator fan to dispel the heat, and for bigger equipment, typically
The elements such as heat pipe are then utilized to coordinate realization heat radiation, this radiating mode, a side with heat-dissipation aluminum sectional material and fan
Face is less owing to heat pipe is connected, with pyrotoxin or heat-dissipation aluminum sectional material, the contact area, and heat transmission is relatively slow,
The most simple dependence one or several heat pipes carry out heat transmission, and its radiating effect is effective, for greatly
Type pyrotoxin, it is impossible to meet its radiating effect, another further aspect, utilizes heat pipe etc. and heat-dissipation aluminum sectional material, sends out
Thermal source connects the thermal dissipating path of composition, and it connects installs complexity, maintenance inconvenience.
Summary of the invention
Present invention is primarily targeted at, for above-mentioned deficiency of the prior art, it is provided that a kind of samming surpasses
Conduction heat radiator, this radiator can directly carry pyrotoxin, outside being directly quickly transferred to by the heat of pyrotoxin
Portion, its good heat dissipation effect, easy to install and use.
The present invention solves prior art problem and be the technical scheme is that a kind of temperature equalization superconductive heat radiator,
It includes horizontally disposed first temperature-uniforming plate and the second temperature-uniforming plate, described first temperature-uniforming plate and the second temperature-uniforming plate
Between by the 3rd temperature-uniforming plate connect.
Below technique scheme is further elaborated:
Further, described 3rd temperature-uniforming plate is multiple, and multiple 3rd temperature-uniforming plates are arranged at intervals at described
Between one temperature-uniforming plate and the second temperature-uniforming plate；The upper end of each 3rd temperature-uniforming plate connects with described first temperature-uniforming plate,
Lower end connects with described second temperature-uniforming plate, is provided with radiating fin between adjacent two the 3rd temperature-uniforming plates.
Further, described first temperature-uniforming plate includes the first hollow heat-conducting plate and is filled in described first hollow
The first implant within heat-conducting plate, the lower surface of described first hollow heat-conducting plate is provided with the first connecting hole；
Described second temperature-uniforming plate includes the second hollow heat-conducting plate and is filled in inside described second hollow heat-conducting plate
The second implant, the upper surface of described second hollow heat-conducting plate is provided with the second connecting hole；
Described 3rd temperature-uniforming plate includes the 3rd hollow heat-conducting plate and is filled in inside described 3rd hollow heat-conducting plate
The 3rd implant, upper end and the lower end of described 3rd hollow heat-conducting plate are uncovered；
Uncovered and described first connecting hole of described 3rd temperature-uniforming plate upper end is tightly connected, described 3rd samming
Uncovered and described second connecting hole of plate lower end is tightly connected, so that the 3rd temperature-uniforming plate and described first samming
Plate and the second temperature-uniforming plate communicate with each other to be formed and seal cavity, are loaded with working media in described annular seal space body.
Further, during the first hollow heat-conducting plate in described first temperature-uniforming plate includes the first of both ends open
Empty heat conduction plate body and be connected to first end cover at described first hollow heat conduction plate body two ends.
Further, during the second hollow heat-conducting plate in described second temperature-uniforming plate includes the second of both ends open
Empty heat conduction plate body and be connected to second end cover at described second hollow heat conduction plate body two ends.
Further, described first implant, the second implant and the 3rd implant are foam metal or gold
Belong to fiber sintering felt serving.
Further, described 3rd temperature-uniforming plate is vertical with described first temperature-uniforming plate and the second temperature-uniforming plate.
Further, the material of described foam metal and metallic fiber sintered felt is copper, nickel, aluminum, stainless
One or more in steel, carbon steel, titanium and alloy.
Further, described working media be water, ammonia, acetone, methanol, ethylene glycol, Dowtherm, hydrargyrum,
One or more in potassium, sodium, Biphenyl Ether, nitrogen and methane.
The invention has the beneficial effects as follows: one, the temperature equalization superconductive heat radiator of the present invention, the 3rd temperature-uniforming plate will
First temperature-uniforming plate and the connection of the second temperature-uniforming plate form heat conduction loop, in use, are mounted directly by pyrotoxin
On the 3rd temperature-uniforming plate of the second temperature-uniforming plate or both sides, the heat conduction loop of connection is subnormal ambient, inside it
The boiling point of working media relatively low, therefore, after the heat absorbing pyrotoxin, the gasification of its working media is
Steam state, by rise in the second temperature-uniforming plate of lower section top the first temperature-uniforming plate in, the steam state work of high-temperature
Transferring heat to the first temperature-uniforming plate as medium, the first temperature-uniforming plate is under the auxiliary of outside radiator fan, very
Soon the heat of himself is transferred to outside, so, fast between working media and first temperature-uniforming plate of high temperature
After speed heat exchange, regelation becomes liquid and falls to the second temperature-uniforming plate of lower section, so circulates, it is achieved fast
Speed heat radiation, its good heat dissipation effect, it is applicable to bigger equipment cooling, additionally, set between the 3rd temperature-uniforming plate
The radiating fin put can increase the area of dissipation between adjacent two the 3rd temperature-uniforming plates, improves its heat radiation further
Effect；Three, the temperature equalization superconductive heat radiator of the present invention, its simple in construction, easy to install and use, directly
Pyrotoxin installed invest the optional position on its surface, it is to avoid traditional heat sinks need heat pipe and
Heat-dissipation aluminum sectional material and pyrotoxin connect the processes such as installation.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of the embodiment of the present invention；
Fig. 2 is the explosive view of the embodiment of the present invention；
Fig. 3 is the structural representation of the first temperature-uniforming plate in the embodiment of the present invention；
Fig. 4 is the structural representation of the 3rd temperature-uniforming plate in the embodiment of the present invention；
Fig. 5 is the structural representation of radiating fin in the embodiment of the present invention；
In figure: the first temperature-uniforming plate 1；First hollow heat-conducting plate 11；First connecting hole 111；First is close
End-blocking lid 12；Second temperature-uniforming plate 2；Second hollow heat-conducting plate 21；Second connecting hole 211；Second
End cover 22；3rd temperature-uniforming plate 3；3rd hollow heat-conducting plate 31；Uncovered 311；Radiating fin
4。
The realization of the object of the invention, functional characteristics and advantage will in conjunction with the embodiments, do referring to the drawings further
Explanation.
Detailed description of the invention
Technical scheme is described in detail below with reference to drawings and the specific embodiments, in order to become apparent from,
Understand the invention essence of the present invention intuitively.
Referring to figs. 1 through shown in Fig. 5, the invention provides a kind of temperature equalization superconductive heat radiator, it includes level
The first temperature-uniforming plate 1 and the second temperature-uniforming plate 2 arranged, described first temperature-uniforming plate 1 and the second temperature-uniforming plate 2 it
Between connected by the 3rd temperature-uniforming plate 3, first temperature-uniforming plate the 1, second temperature-uniforming plate 2 and the 3rd after connection is equal
Temperature plate 3 forms heat conduction loop, and heat can be at the first temperature-uniforming plate the 1, second temperature-uniforming plate 2 and the 3rd temperature-uniforming plate 3
Between transmit.
As better embodiment, described 3rd temperature-uniforming plate 3 is multiple, and multiple 3rd temperature-uniforming plates 3 are spaced
It is arranged between described first temperature-uniforming plate 1 and the second temperature-uniforming plate 2, in the present embodiment, the 3rd temperature-uniforming plate 3
Vertical with described first temperature-uniforming plate 1 and the second temperature-uniforming plate 2, it is to be understood that the 3rd temperature-uniforming plate 3 is also
Can be obliquely installed as required between the first temperature-uniforming plate 1 and the second temperature-uniforming plate 2；Each 3rd temperature-uniforming plate
The upper end of 3 connects with described first temperature-uniforming plate 1, and lower end connects with described second temperature-uniforming plate 2, and adjacent two
It is provided with radiating fin 4, to increase dissipating between adjacent two the 3rd temperature-uniforming plates 3 between 3rd temperature-uniforming plate 3
Hot side amasss, and beneficially heat transmits between each the 3rd temperature-uniforming plate 3.
In the present embodiment, the structure of first temperature-uniforming plate the 1, second temperature-uniforming plate 2 and the 3rd temperature-uniforming plate 3 is basic
Similar, arrange according only to it and the relation of installation, its slightly different configuration, wherein, described first temperature-uniforming plate
1 includes the first hollow heat-conducting plate 11 and is filled in the first filling within described first hollow heat-conducting plate 11
Thing (not shown), the lower surface of described first hollow heat-conducting plate 11 is provided with the first connecting hole 111, and this is first years old
Connecting hole 111 is bar hole, suitable with the width of the 3rd temperature-uniforming plate 3, in order to the 3rd temperature-uniforming plate 3
Upper end and the connection of the first connecting hole 111.Described second temperature-uniforming plate 2 includes the second hollow heat-conducting plate 21
And it is filled in the second implant (not shown) within described second hollow heat-conducting plate 21, in described second
The upper surface of empty heat-conducting plate 21 is provided with the second connecting hole 211, and equally, this second connecting hole 211 is bar shaped
Hole, suitable with the width of the 3rd temperature-uniforming plate 3, in order to the 3rd temperature-uniforming plate 3 lower end and the first connecting hole
The connection of 111；Described 3rd temperature-uniforming plate 3 includes the 3rd hollow heat-conducting plate 31 and is filled in the described 3rd
Empty the 3rd implant (not shown) within heat-conducting plate 31, the upper end of described 3rd hollow heat-conducting plate 31 and
Lower end is uncovered 311.Uncovered and described first connecting hole 111 of the 3rd temperature-uniforming plate 3 upper end is tightly connected,
Uncovered and described second connecting hole 211 of the 3rd temperature-uniforming plate 3 lower end is tightly connected, so that the 3rd temperature-uniforming plate
3 communicate with each other with described first temperature-uniforming plate 1 and the second temperature-uniforming plate 2, are formed and seal cavity, in described close
Being loaded with working media (not shown) in envelope cavity, this working media evaporates after absorbing heat and rises to
First temperature-uniforming plate 1 of side, condenses into liquid and falls after rise after heat and the first temperature-uniforming plate 1 are carried out heat exchange
To the second temperature-uniforming plate 2 and the 3rd temperature-uniforming plate 3 in.It should be noted that the 3rd temperature-uniforming plate 3 upper end
Uncovered and described first connecting hole 111 between connection, and the uncovered and institute of the 3rd temperature-uniforming plate 3 lower end
State the connection between the second connecting hole 211 and can use welding, the any-mode such as bonding, it is achieved the first samming
Plate the 1, second temperature-uniforming plate 2 and the 3rd temperature-uniforming plate 3 are tightly connected.
It is understood that in the first implant in the first temperature-uniforming plate 1, the second temperature-uniforming plate 2 second
The effect of the 3rd implant in implant and the 3rd temperature-uniforming plate 3 is uniform pickup heat, makes internal work
Medium is heated rapid evaporation, therefore, can use the similar structures of phase same-action replace described in the first filling
Thing, the second implant, the 3rd implant, be explained using two kinds of structures as example, structure one below:
Directly at the first hollow heat-conducting plate the 11, second hollow heat-conducting plate 21 and inwall of the 3rd hollow heat-conducting plate 31
Offer some grooves, then form projection, this projection and groove between adjacent trenches and can increase working media
With connecing of first corresponding hollow heat-conducting plate the 11, second hollow heat-conducting plate 21 and the 3rd hollow heat-conducting plate 31
Contacting surface is amassed, and so, reaches the purpose of uniform heated fast evaporation；Structure two: due to the first hollow heat conduction
Plate the 11, second hollow heat-conducting plate 21 and the 3rd hollow heat-conducting plate 31 are generally adopted by metal heat-conducting material,
Therefore, can be directly at the first hollow heat-conducting plate the 11, second hollow heat-conducting plate 21 and the 3rd hollow heat-conducting plate
31 inwalls form network structure or fiber etc. or by metal dust or tinsel by technique sintering such as sintering
Net is sintered on inwall, so, can play and the first implant, the second implant, the 3rd implant phase
Same effect.
Concrete, the first hollow heat-conducting plate 11 in the first temperature-uniforming plate 1 includes the first hollow of both ends open
Heat conduction plate body and be connected to first end cover 12 at described first hollow heat conduction plate body two ends, described second
The second hollow heat-conducting plate 21 in temperature-uniforming plate 2 includes the second hollow heat conduction plate body of both ends open and is connected to
Second end cover 22 at described second hollow heat conduction plate body two ends, the 3rd temperature-uniforming plate 3 and the first temperature-uniforming plate
1 and second temperature-uniforming plate 2 connect after, can by the first hollow heat-conducting plate 11 two ends to the first temperature-uniforming plate 1,
Second temperature-uniforming plate 2 and the 3rd temperature-uniforming plate 3 intralaminar part add working media, then by the first end cover 12
And second end cover 22 seal after evacuation.
It should be noted that the first implant, the second implant and the 3rd implant are foam metal, gold
Belong to fiber sintering felt serving or other packing materials, typically can use identical material, such as copper, nickel, aluminum, no
One or more wire mesh structure etc. made in rust steel, carbon steel, cast iron, titanium and alloy, certainly,
Unlike material can also be used；Equally, first hollow heat-conducting plate the 11, second hollow heat-conducting plate 21 and
Three hollow heat-conducting plates 31 all can use in copper, nickel, aluminum, rustless steel, carbon steel, cast iron, titanium and alloy
One or more or other Heat Conduction Materials are made.Described working media can be water, ammonia, acetone, methanol,
One or more in ethylene glycol, Dowtherm, hydrargyrum, potassium, sodium, Biphenyl Ether, nitrogen and methane.
Time specifically used, pyrotoxin can be directly installed on the 3rd temperature-uniforming plate of the second temperature-uniforming plate 2 or both sides
On 3 or other optional positions, due to the temperature equalization superconductive heat radiator of the present invention, the 3rd temperature-uniforming plate 3 is by first
Temperature-uniforming plate 1 connects formation heat conduction loop with the second temperature-uniforming plate 2, and the heat conduction loop of connection is subnormal ambient,
The boiling point of its internal working media is relatively low, therefore, after the heat absorbing pyrotoxin, and its working media
It is evaporated to steam state, equal by rise to top in the second temperature-uniforming plate 2 of lower section and the 3rd temperature-uniforming plate 3 first
In temperature plate 1, the steam state working media of high-temperature transfers heat to the first temperature-uniforming plate 1, the first temperature-uniforming plate 1
Under the auxiliary of outside radiator fan, quickly the heat of himself is transferred to outside, so, high temperature
Between working media and the first temperature-uniforming plate 1, after Rapid Thermal exchange, regelation becomes liquid to fall to the of lower section
Two temperature-uniforming plates and the 3rd temperature-uniforming plate 3, so circulate, it is achieved quick heat radiating, and its good heat dissipation effect can be fitted
For bigger equipment cooling, additionally, the radiating fin arranged between the 3rd temperature-uniforming plate 3 can increase adjacent two
Area of dissipation between 3rd temperature-uniforming plate 3, improves its radiating effect further；In addition, the present invention
Temperature equalization superconductive heat radiator, its simple in construction, easy to install and use, directly by pyrotoxin install invest it
The optional position on surface, it is to avoid traditional heat sinks needs heat pipe and heat-dissipation aluminum sectional material and pyrotoxin
Connect the processes such as installation.
The foregoing is only the preferred embodiments of the present invention, not thereby limit its scope of the claims, every profit
The equivalent structure made by description of the invention and accompanying drawing content or equivalence flow process conversion, directly or indirectly transport
It is used in other relevant technical fields, is the most in like manner included in the scope of patent protection of the present invention.
Claims (8)
1. a temperature equalization superconductive heat radiator, it is characterised in that it includes horizontally disposed first temperature-uniforming plate
And second temperature-uniforming plate, connected by the 3rd temperature-uniforming plate between described first temperature-uniforming plate and the second temperature-uniforming plate；
Described first temperature-uniforming plate includes the first hollow heat-conducting plate and is filled in inside described first hollow heat-conducting plate
The first implant, the lower surface of described first hollow heat-conducting plate is provided with the first connecting hole；
Described second temperature-uniforming plate includes the second hollow heat-conducting plate and is filled in inside described second hollow heat-conducting plate
The second implant, the upper surface of described second hollow heat-conducting plate is provided with the second connecting hole；
Described 3rd temperature-uniforming plate includes the 3rd hollow heat-conducting plate and is filled in inside described 3rd hollow heat-conducting plate
The 3rd implant, upper end and the lower end of described 3rd hollow heat-conducting plate are uncovered；
Uncovered and described first connecting hole of described 3rd temperature-uniforming plate upper end is tightly connected, described 3rd samming
Uncovered and described second connecting hole of plate lower end is tightly connected, so that the 3rd temperature-uniforming plate and described first samming
Plate and the second temperature-uniforming plate communicate with each other to be formed and seal cavity, are loaded with working media in described annular seal space body.
Temperature equalization superconductive heat radiator the most according to claim 1, it is characterised in that: described 3rd temperature-uniforming plate
For multiple, multiple 3rd temperature-uniforming plates are arranged at intervals between described first temperature-uniforming plate and the second temperature-uniforming plate；Often
The upper end of individual 3rd temperature-uniforming plate connects with described first temperature-uniforming plate, and lower end connects with described second temperature-uniforming plate,
It is provided with radiating fin between adjacent two the 3rd temperature-uniforming plates.
Temperature equalization superconductive heat radiator the most according to claim 1, it is characterised in that: described first samming
The first hollow heat-conducting plate in plate includes the first hollow heat conduction plate body of both ends open and is connected to described first
First end cover at hollow heat conduction plate body two ends.
Temperature equalization superconductive heat radiator the most according to claim 1, it is characterised in that: described second samming
The second hollow heat-conducting plate in plate includes the second hollow heat conduction plate body of both ends open and is connected to described second
Second end cover at hollow heat conduction plate body two ends.
Temperature equalization superconductive heat radiator the most according to claim 1, it is characterised in that: described first fills
Thing, the second implant and the 3rd implant are foam metal or metallic fiber sintered felt.
Temperature equalization superconductive heat radiator the most according to claim 1, it is characterised in that: described 3rd samming
Plate is vertical with described first temperature-uniforming plate and the second temperature-uniforming plate.
Temperature equalization superconductive heat radiator the most according to claim 5, it is characterised in that: described foam metal
And the material of metallic fiber sintered felt is in copper, nickel, aluminum, rustless steel, carbon steel, cast iron, titanium and alloy
One or more.
Temperature equalization superconductive heat radiator the most according to claim 1, it is characterised in that: described working media
For water, ammonia, acetone, methanol, ethylene glycol, Dowtherm, hydrargyrum, potassium, sodium, Biphenyl Ether, nitrogen and methane
In one or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310221782.7A CN103269573B (en) | 2013-06-05 | 2013-06-05 | Temperature equalization superconductive heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310221782.7A CN103269573B (en) | 2013-06-05 | 2013-06-05 | Temperature equalization superconductive heat radiator |
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| Publication Number | Publication Date |
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| CN103269573A CN103269573A (en) | 2013-08-28 |
| CN103269573B true CN103269573B (en) | 2016-11-16 |
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| CN201310221782.7A Expired - Fee Related CN103269573B (en) | 2013-06-05 | 2013-06-05 | Temperature equalization superconductive heat radiator |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103575144B (en) * | 2013-11-13 | 2017-06-16 | 四川九洲电器集团有限责任公司 | A kind of flat plate heat tube of array microchannel |
| CN107202509A (en) * | 2017-06-08 | 2017-09-26 | 无锡来德电子有限公司 | A kind of temperature-uniforming plate composite foam metal radiator |
| CN109246984B (en) * | 2018-09-21 | 2024-01-02 | 浙江嘉熙科技股份有限公司 | High-power heat superconducting plate-fin combined radiator for rail transit |
| CN109552589A (en) * | 2019-01-10 | 2019-04-02 | 中国海洋大学 | A kind of underwater sealing cabin piston heat-exchanger rig |
| CN111442675A (en) * | 2020-03-27 | 2020-07-24 | 奇鋐科技股份有限公司 | Composite heat radiation structure |
| US11598584B2 (en) | 2020-04-15 | 2023-03-07 | Asia Vital Components Co., Ltd. | Dual heat transfer structure |
| CN112087925B (en) * | 2020-09-07 | 2023-03-03 | 上海船舶电子设备研究所(中国船舶重工集团公司第七二六研究所) | Underwater equipment heat radiation structure based on three-dimensional temperature-uniforming plate and underwater equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN203423164U (en) * | 2013-06-05 | 2014-02-05 | 张剑锋 | Temperature equalization superconductive heat radiator |
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| JP2000346568A (en) * | 1999-05-31 | 2000-12-15 | Mitsubishi Heavy Ind Ltd | Heat exchanger |
| CN2727966Y (en) * | 2004-03-17 | 2005-09-21 | 杨洪武 | Outboard diversion integrated heat pipe radiator |
| CN2864987Y (en) * | 2005-12-09 | 2007-01-31 | 万在工业股份有限公司 | Heat radiator |
| SE534306C2 (en) * | 2008-06-17 | 2011-07-05 | Alfa Laval Corp Ab | Heat exchanger plate and plate heat exchanger |
| CN101738101A (en) * | 2008-11-17 | 2010-06-16 | 北京卫星环境工程研究所 | Heat flow blocking cold plate system in vacuum low-temperature environment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN203423164U (en) * | 2013-06-05 | 2014-02-05 | 张剑锋 | Temperature equalization superconductive heat radiator |
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