CN112702899A - Ultrathin soaking plate based on self-wetting fluid as working solution and application - Google Patents
Ultrathin soaking plate based on self-wetting fluid as working solution and application Download PDFInfo
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- CN112702899A CN112702899A CN202110176647.XA CN202110176647A CN112702899A CN 112702899 A CN112702899 A CN 112702899A CN 202110176647 A CN202110176647 A CN 202110176647A CN 112702899 A CN112702899 A CN 112702899A
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- 239000012530 fluid Substances 0.000 title claims abstract description 113
- 238000009736 wetting Methods 0.000 title claims abstract description 90
- 238000002791 soaking Methods 0.000 title claims abstract description 75
- 239000012224 working solution Substances 0.000 title claims description 24
- 239000007788 liquid Substances 0.000 claims abstract description 55
- 238000011049 filling Methods 0.000 claims abstract description 32
- 238000001704 evaporation Methods 0.000 claims abstract description 28
- 238000009833 condensation Methods 0.000 claims abstract description 26
- 230000005494 condensation Effects 0.000 claims abstract description 26
- 230000008020 evaporation Effects 0.000 claims abstract description 26
- 238000012546 transfer Methods 0.000 claims abstract description 18
- 238000003860 storage Methods 0.000 claims description 29
- 238000003466 welding Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 12
- 230000008569 process Effects 0.000 abstract description 11
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 238000001035 drying Methods 0.000 abstract description 3
- 238000010992 reflux Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000009835 boiling Methods 0.000 description 10
- 230000008859 change Effects 0.000 description 8
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- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
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- 238000009792 diffusion process Methods 0.000 description 1
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- 238000010030 laminating Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Signal Processing (AREA)
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- General Engineering & Computer Science (AREA)
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses an ultrathin vapor chamber based on self-wetting fluid as working liquid and application thereof, and belongs to the technical field of vapor chamber electronic heat dissipation. The ultrathin soaking plate is divided into a capillary core-free structure and a capillary core-containing structure according to the heat transfer direction, the liquid filling rate of the working medium is 100 percent, the working medium is completely filled, and other gaps such as air and the like are not reserved. Self-wetting fluids cause a difference in surface tension at different temperatures due to their characteristic surface tension properties. Therefore, for the soaking plate which conducts heat transfer along the thickness direction, the steps of vacuumizing and manufacturing the capillary core process of the soaking plate are simplified, and the evaporation and condensation circulation in the ultrathin soaking plate can be ensured. For the soaking plate which carries out heat transfer along the radial direction, the reflux resistance of the condensate is reduced, the circulation speed of evaporation and condensation is improved, and the drying limit is improved.
Description
Technical Field
The invention relates to the technical field of electronic heat dissipation, in particular to an ultrathin soaking plate based on self-wetting fluid as working liquid.
Background
At present, with the development of microelectronic technology and information communication technology, electronic components are developing in the direction of integration and miniaturization, and meanwhile, the heat flux density of electronic chips is greatly increased due to the improvement of the performance and power consumption of the electronic chips. The heat build-up of the electronic chip can degrade the performance and reliability of the electronic components when the electronic chip is operated in a high temperature environment. Therefore, it is one of the important research points in the field of electronic heat dissipation to explore efficient and fast heat dissipation means to deal with the improvement of the heat flux density of electronic components.
The soaking plate is a radiator with wide application, and has the main advantages of effectively increasing the condensation area, good isothermal performance and high equivalent heat conductivity coefficient. The conventional vapor chamber is a closed cavity formed by welding an upper cover and a lower cover with liquid absorption cores, the cavity is vacuumized and filled with working liquid, the heat of an electronic element can be quickly transferred to a heat sink of a condensation surface through the phase change process of the internal working liquid, and the capillary force provided by the internal liquid absorption cores overcomes the flow resistance to bring the condensate back to an evaporation surface to form the working cycle inside the vapor chamber. Therefore, the performance of the vapor chamber directly determines the surface temperature of the electronic component, and the performance of the vapor chamber is also affected by the internal wick structure and the working medium.
As the thickness of the vapor chamber decreases, the vapor chimney height inside the vapor chamber and the thickness of the wick structure also decrease accordingly. At such a micro scale, the viscosity and the friction resistance of the steam occupy more and more specific gravity, and the flow and the diffusion of the steam are further influenced along with the reduction of the height of the air passage; the reduction in thickness of the wick structure may not provide sufficient capillary pressure and thus insufficient reflux force of the condensed liquid. Therefore, under the trend of ultrathin vapor chamber, the improvement of the liquid absorption core structure and the strengthening of the working medium circulation of the ultrathin vapor chamber become important research points.
Disclosure of Invention
In view of the above, the present invention is directed to the disadvantages of the prior art, and an object of the present invention is to provide an ultra-thin soaking plate based on a self-wetting fluid as a working fluid for heat transfer in the thickness direction. The other purpose is to provide another ultra-thin soaking plate based on self-wetting fluid as working fluid for heat transfer along the radial direction. The purpose is to provide an application of the soaking plate. The invention can realize the ultra-thinness of the soaking plate, improve the liquid absorbing core structure, strengthen the working medium circulation of the ultra-thin soaking plate and ensure the heat convection and temperature uniformity of the ultra-thin soaking plate.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides an ultra-thin soaking plate based on from wetting fluid is working solution, is a soaking plate of heat transfer along thickness direction, includes upper cover, lower cover and from wetting fluid, the edge department of upper cover and lower cover is through welding closely laminating sealed, in inside formation working solution storage chamber, the marginal position of one of them department reserves the liquid filling mouth, the liquid filling mouth is used for linking to each other with liquid filling column in order to pour into this working solution storage chamber from wetting fluid into to 100% is from wetting fluid in this working solution storage chamber's the space, is full of after from wetting fluid the liquid filling mouth seals.
An ultrathin soaking plate based on a self-wetting fluid as a working solution is a soaking plate for transferring heat along the radial direction and comprises an upper cover, a lower cover, a capillary core and a self-wetting fluid; the capillary core is arranged in the working liquid storage chamber, a liquid filling port is reserved at the edge of one position of the capillary core, the liquid filling port is used for being connected with a liquid filling column so as to fill self-wetting fluid into the working liquid storage chamber, 100% of the space of the working liquid storage chamber is filled with the self-wetting fluid, and the liquid filling port is closed after the self-wetting fluid is filled.
The application of the ultrathin soaking plate based on the self-wetting fluid as the working solution is used for electronic products, the electronic products are mobile phones or tablet computers, the ultrathin soaking plate based on the self-wetting fluid as the working solution is in contact with electronic elements of the electronic products, and heat exchange of the electronic elements is realized through evaporation and condensation of the self-wetting fluid.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and particularly, as can be seen from the technical scheme,
the ultrathin soaking plate based on the self-wetting fluid as the working liquid transfers heat in the thickness direction, and the working liquid storage chamber does not need to be vacuumized and does not need a capillary core, so that the process manufacturing steps of the soaking plate are simplified. And because the self-wetting fluid is full in the working fluid storage chamber, namely 100 percent of the self-wetting fluid is the self-wetting fluid, no air exists, no other substances such as a capillary core exist, the gas-liquid conversion process that the liquid of the traditional soaking plate is evaporated at high temperature to become gas and is converted into liquid after being cooled is not needed, and the heat transfer characteristic of the soaking plate can be ensured based on the surface tension and the temperature change characteristic of the self-wetting fluid.
Secondly, another ultra-thin soaking plate based on the self-wetting fluid as the working fluid is a soaking plate for transferring heat along the radial direction, and because the self-wetting fluid is filled in the working fluid storage chamber, namely 100% of the self-wetting fluid is the self-wetting fluid, and similarly, the soaking plate for transferring heat along the radial direction does not have a gas-liquid conversion process, the heat transfer efficiency is effectively reduced and improved. The vapor chamber of the invention is provided with the capillary core in the working solution storage chamber, which is mainly used for increasing the area of the boiling point of the working solution storage chamber, thereby increasing the heat exchange area, and is different from the traditional vapor chamber, the filling amount of the working medium in the vapor chamber in the traditional pulse-free mode is generally only 10%, the filling amount of the working medium in the vapor chamber in the pulse mode is generally 40%, and at most is not more than 50%. However, since the inside of the capillary wick is completely self-wetting fluid, the process of gas-liquid conversion does not exist, the main function of the capillary wick is no longer the function of backflow, but the capillary wick can increase the area of a boiling point.
Furthermore, the filling amount of the self-wetting fluid is 100%, so that the problem of limited use caused by the fact that the working medium is below and the air is above due to the gravity problem is solved. The vapor chamber, which is filled with the wetting fluid and allows heat transfer in the thickness direction, may not have a condensation surface and an evaporation surface defined but may be arbitrarily selected depending on the use environment, that is, the condensation surface and the evaporation surface may be exchanged with each other. Similarly, the condensation end and the evaporation end of the soaking plate for heat transfer in the radial direction can be exchanged, so that the effect of resisting the gravity of the whole soaking plate is achieved.
In particular, the self-wetting fluid is used as the working fluid, and the self-wetting fluid can spontaneously wet a high-temperature region due to the change characteristics of the surface tension and the temperature and the concentration gradient generated by using the non-azeotropic solution. On the basis, the boiling of the evaporation area of the soaking plate is strengthened, after the liquid in the high-temperature area is subjected to phase change, the surrounding working medium can be spontaneously and rapidly supplemented to the evaporation area, the occurrence of a dry burning phenomenon is prevented, and the dry burning limit of the soaking plate is improved.
In addition, in the phase change process of the self-wetting fluid, Marangoni convection effect is generated due to the surface tension characteristic, and the separation of bubbles is further accelerated while the high-temperature area is wetted by the liquid, so that the boiling rate of micro-bubbles is increased. For a soaking plate (technical scheme I) conducting heat in the thickness direction, a large amount of micro bubbles are generated, so that the boiling heat exchange area is increased, and the heat exchange efficiency is enhanced. Sufficient turbulence is also created during the detachment process and spontaneous convection from the wetting fluid causes the bubbles to rapidly disperse over a large condensation surface for the heat exchange process. For the soaking plate (technical scheme II) conducting heat along the radial direction, the boiling and the quick separation of the micro bubbles can enhance the heat conduction effect of the evaporation area, the relatively small static contact angle ensures the wettability of the phase-change working medium, and the Young equation is combined, so that the reflux resistance of the working medium in the capillary area is small, and the evaporation and condensation circulation of self-wetting fluid in the ultrathin soaking plate is facilitated. Because the inner wall of the working liquid storage cavity is provided with the capillary core structure, liquid at the condensation end flows back to the evaporation end through capillary pressure, and due to the surface tension characteristic of the self-wetting fluid, the self-wetting property of the working medium in a high-temperature area strengthens boiling, improves the drying limit, and simultaneously reduces the backflow resistance of the condensate.
To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Drawings
Fig. 1 is a schematic perspective view of a heat spreader (coreless) for heat transfer in the thickness direction according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view of a first embodiment of the present invention showing a heat transfer ultra-thin soaking plate (coreless) in the thickness direction.
Fig. 3 is a perspective view of a vapor chamber (cored) in the radial direction according to a second embodiment of the present invention.
Fig. 4 is a sectional view of a soaking plate (cored) in the radial direction of the second embodiment of the present invention.
The attached drawings indicate the following:
10. upper cover 11, rim
101. Working fluid storage chamber 102 and fluid charging port
103. Condensation surface 104, condensation end
105. Evaporation surface 106, evaporation end
20. Lower cover 30, self-wetting fluid
40. Capillary core 50, liquid filled column.
Detailed Description
Example 1
Referring to fig. 1 and 2, a first embodiment of the present invention is shown, which is an ultra-thin soaking plate based on a self-wetting fluid as a working fluid, for heat transfer in the thickness direction.
The soaking plate structurally comprises an upper cover 10, a lower cover 20 and self-wetting fluid 30, wherein the edges 11 of the upper cover 10 and the lower cover 20 are tightly sealed in a fitting manner through welding, a working fluid storage chamber 101 is formed inside, a fluid filling port 102 is reserved at one edge 11, the fluid filling port 102 is used for being connected with a fluid filling column to inject the self-wetting fluid 30 into the working fluid storage chamber 101, 100% of the working fluid storage chamber 101 is the self-wetting fluid 30, and the fluid filling port 102 is closed after the self-wetting fluid 30 is filled. The self-wetting fluid 30 evaporates and condenses within the working fluid storage chamber 101 to effect heat exchange.
The upper cover 10 and the lower cover 20 are made of metal sheets by stamping, etching and welding. The plate material can be punched at one time by adopting a punching mode, so that the efficiency is high and the yield is high. As one of the most common connection modes, welding can realize automatic operation, and has high efficiency and good stability after welding. In this embodiment, the ultra-thin soaking plate is rectangular with a thickness, the upper cover 10 has a flat middle portion and a welding edge 11 with a concave periphery, the lower cover 20 is a flat plate, the welding edge 11 and the lower cover 20 are overlapped and welded to be integrated, one of the upper and lower surfaces of the soaking plate is a condensation surface 103, and the other surface of the soaking plate is an evaporation surface 105. Of course, other molding methods, such as integral die casting, etc., may be used.
The upper cover 10 and the lower cover 20 are both made of copper materials, the heat conductivity of the copper materials is better, the copper materials are common metals, the price is low, the copper materials are easy to obtain, the problems of rusting and the like do not exist, and the copper materials are very durable. The liquid filling port 102 is sealed in a welding mode, the welding of the liquid filling port and the welding of the upper cover 10 and the lower cover 20 are in the same connecting mode, the fact that no mark is left on the edge 11 of the soaking plate after the sealing is guaranteed, and the liquid filling port 102 is completely plugged after the welding.
The whole thickness of the ultrathin soaking plate is 0.3-0.35mm, and compared with the thickness of the traditional soaking plate which is more than 0.5 mm, the ultrathin soaking plate is more suitable for ultrathin electronic products, such as ultrathin mobile phones, ultrathin tablet computers and the like which are popular at present.
When the soaking plate works, the evaporation surface 105 generates a superheat degree due to the application of a heat source, the internal self-wetting fluid 30 is subjected to phase change, the surface tension of the self-wetting fluid 30 is related to the temperature, and along with the change of the temperature, a surface tension gradient is generated in the self-wetting fluid 30, so that the liquid with small surface tension flows towards the direction with large surface tension, namely the surface tension of a high-temperature area is larger than that of a low-temperature area, the self-wetting fluid 30 is replenished in a self-wetting high-temperature area, and the drying limit of the soaking plate is improved. In addition, the backflow from the wetting fluid 30 increases the thickness of the liquid film between the bubbles and the wall surface of the evaporation surface 105, accelerates the detachment speed of the bubbles, reduces the detachment diameter of the bubbles, generates micro-bubble boiling, and further increases the boiling heat exchange area.
Due to the generation of a large amount of micro-bubbles and the action of surface tension gradient, pressure difference and concentration difference of the self-wetting fluid 30, the generated disturbance force enables non-aggregated micro-bubbles to diffuse to the condensation surface 103, condensation heat exchange occurs on the condensation surface 103, and heat is transferred to a heat sink through the condensation surface 103 to realize circulation of evaporation and condensation.
Example 2
Referring to fig. 3 and 4, a second embodiment of the present invention is shown, which is an ultra-thin soaking plate based on self-wetting fluid as working fluid for heat transfer in radial direction.
The structure of the soaking plate comprises an upper cover 10, a lower cover 20, a capillary core 40 and a self-wetting fluid 30; the edges 11 of the upper cover 10 and the lower cover 20 are tightly sealed by welding to form a working liquid storage chamber 101 inside, the capillary wick 40 is arranged in the working liquid storage chamber 101, a liquid filling port 102 is reserved at one edge 11, the liquid filling port 102 is used for being connected with a liquid filling column to inject the self-wetting fluid 30 into the working liquid storage chamber 101, 100% of the space of the working liquid storage chamber 101 is the self-wetting fluid 30, and the liquid filling port 102 is closed after the self-wetting fluid 30 is filled.
The upper cover 10 and the lower cover 20 are made of metal sheets by stamping, etching and welding. The upper cover 10 and the lower cover 20 are both made of copper materials. The liquid filling port 102 is closed by welding. The whole thickness of the ultrathin soaking plate is 0.3-0.35 mm. Since these structures and advantageous effects are the same as those of the first embodiment, they will not be described in detail herein.
In this embodiment, the ultra-thin vapor chamber is rectangular in shape with a thickness, having a condensing end 104 and an evaporating end 106, the condensing end 104 and the evaporating end 106 running in a radial direction along which the self-wetting fluid 30 transfers heat. And the working fluid storage chamber 101 is vacuumized and filled with the self-wetting fluid 30, and the self-wetting fluid 30 is evaporated and condensed in the cavity to realize heat exchange.
When the soaking plate works, the evaporation end 106 is boiled, and when boiling heat exchange is carried out on the self-wetting fluid 30, the separation frequency of bubbles is high, and the separation diameter is small. Condensation heat exchange is carried out at the condensation end 104 to form condensate, and the condensate is returned to the evaporation area through the capillary pressure of the capillary wick 40.
Because the working medium is the self-wetting fluid 30, the self-wetting property of the working medium can reduce the backflow resistance in the backflow process of the condensate, in addition, because the change of the temperature of the working medium in the backflow process of the self-wetting fluid 30 can generate a thermal capillary force, another additional condensate backflow power is added, the condensate can be quickly fed back to the evaporation end 106 through the capillary core 40, the circulation speed of the soaking plate is improved, and meanwhile, the dry-out limit of the soaking plate is improved.
Example 3
The invention also applies the ultrathin soaking plate based on the self-wetting fluid 30 as the working solution to the electronic product, the electronic product is a mobile phone or a tablet personal computer, the ultrathin soaking plate in the embodiment 1 or the embodiment 2 is contacted with the electronic element of the electronic product, the heat exchange of the electronic element is realized by the evaporation and condensation of the self-wetting fluid 30, and the heat dissipation effect of the electronic element is realized.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention are within the technical scope of the present invention.
Claims (10)
1. The utility model provides an ultra-thin soaking plate based on from wetting fluid is working solution which characterized in that: the soaking plate capable of conducting heat along the thickness direction comprises an upper cover (10), a lower cover (20) and self-wetting fluid (30), wherein the edges (11) of the upper cover and the lower cover are tightly attached and sealed through welding, a working fluid storage chamber (101) is formed inside the upper cover and the lower cover, a fluid filling port (102) is reserved at one edge position and is used for being connected with a fluid filling column to inject the self-wetting fluid (30) into the working fluid storage chamber, 100% of the working fluid storage chamber (101) is the self-wetting fluid (30), and the fluid filling port (102) is closed after the self-wetting fluid (30) is filled.
2. The utility model provides an ultra-thin soaking plate based on from wetting fluid is working solution which characterized in that: the soaking plate for heat transfer in the radial direction comprises an upper cover (10), a lower cover (20), a capillary core (40) and a self-wetting fluid (30); the capillary core (40) is arranged in the working liquid storage chamber (101), a liquid filling port (102) is reserved at the edge of one position of the capillary core, the liquid filling port is used for being connected with a liquid filling column to inject self-wetting fluid (30) into the working liquid storage chamber, 100% of the working liquid storage chamber (101) is the self-wetting fluid (30), and the liquid filling port (102) is closed after the self-wetting fluid is filled.
3. The ultra-thin soaking plate based on self-wetting fluid as working solution according to claim 1 or 2, wherein: the upper cover (10) and the lower cover (20) are formed by punching, etching and welding metal sheets.
4. The ultra-thin soaking plate based on self-wetting fluid as working solution according to claim 1 or 2, wherein: the upper cover (10) and the lower cover (20) are both made of copper materials.
5. The ultra-thin soaking plate based on self-wetting fluid as working solution according to claim 1 or 2, wherein: the liquid filling port (102) is closed by welding.
6. The ultra-thin soaking plate based on self-wetting fluid as working solution according to claim 1 or 2, wherein: the whole thickness of the ultrathin soaking plate is 0.3-0.35 mm.
7. The ultra-thin soaking plate based on self-wetting fluid as working solution according to claim 1, wherein: the ultrathin soaking plate is in a rectangular shape with thickness, an upper cover (10) is provided with a flat middle part and a welding edge (11) with concave peripheries, a lower cover (20) is a flat plate, the welding edge (11) and the lower cover (20) are overlapped and welded into a whole, one of the upper surface and the lower surface of the soaking plate is a condensation surface (103), and the other surface of the soaking plate is an evaporation surface (105).
8. The ultra-thin soaking plate based on self-wetting fluid as working solution according to claim 2, wherein: the ultra-thin soaking plate is in a rectangular shape with thickness and is provided with a condensation end (104) and an evaporation end (106), the trend of the condensation end (104) and the evaporation end (106) forms a radial direction, and the self-wetting fluid (30) transfers heat along the radial direction.
9. The ultra-thin soaking plate based on self-wetting fluid as working solution according to claim 2, wherein: the working fluid storage chamber (101) is evacuated and filled with a self-wetting fluid (30).
10. The application of the ultrathin soaking plate based on the self-wetting fluid as the working solution is characterized in that: the ultra-thin soaking plate based on the self-wetting fluid as the working solution in claim 1 or 2 is used for an electronic product, the electronic product is a mobile phone or a tablet personal computer, the ultra-thin soaking plate based on the self-wetting fluid as the working solution is in contact with an electronic element of the electronic product, and the heat exchange of the electronic element is realized by the evaporation and condensation of the self-wetting fluid (30).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110176647.XA CN112702899B (en) | 2021-02-07 | 2021-02-07 | Ultrathin vapor chamber based on self-wetting fluid as working fluid and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110176647.XA CN112702899B (en) | 2021-02-07 | 2021-02-07 | Ultrathin vapor chamber based on self-wetting fluid as working fluid and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112702899A true CN112702899A (en) | 2021-04-23 |
| CN112702899B CN112702899B (en) | 2024-04-05 |
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| CN202110176647.XA Active CN112702899B (en) | 2021-02-07 | 2021-02-07 | Ultrathin vapor chamber based on self-wetting fluid as working fluid and application thereof |
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| CN (1) | CN112702899B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113701536A (en) * | 2021-08-26 | 2021-11-26 | 华南理工大学 | Ultrathin soaking plate radiator with liquid storage core and using method thereof |
| CN115549394A (en) * | 2022-10-14 | 2022-12-30 | 广东畅能达科技发展有限公司 | Heat dissipation device based on embedded soaking plate type U-shaped linear motor |
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| CN106604607A (en) * | 2016-11-25 | 2017-04-26 | 江苏大学 | No-wick ultrathin heat pipe device |
| CN109579584A (en) * | 2018-11-30 | 2019-04-05 | 华南理工大学 | A kind of ultra-thin loop soaking plate |
| CN212458063U (en) * | 2020-05-29 | 2021-02-02 | 武汉大学 | Self-wetting fluid coupling composite liquid absorption core soaking plate |
| CN214177905U (en) * | 2021-02-07 | 2021-09-10 | 广东省华创热控科技有限公司 | Ultrathin soaking plate based on self-wetting fluid as working solution |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106604607A (en) * | 2016-11-25 | 2017-04-26 | 江苏大学 | No-wick ultrathin heat pipe device |
| CN109579584A (en) * | 2018-11-30 | 2019-04-05 | 华南理工大学 | A kind of ultra-thin loop soaking plate |
| CN212458063U (en) * | 2020-05-29 | 2021-02-02 | 武汉大学 | Self-wetting fluid coupling composite liquid absorption core soaking plate |
| CN214177905U (en) * | 2021-02-07 | 2021-09-10 | 广东省华创热控科技有限公司 | Ultrathin soaking plate based on self-wetting fluid as working solution |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113701536A (en) * | 2021-08-26 | 2021-11-26 | 华南理工大学 | Ultrathin soaking plate radiator with liquid storage core and using method thereof |
| CN115549394A (en) * | 2022-10-14 | 2022-12-30 | 广东畅能达科技发展有限公司 | Heat dissipation device based on embedded soaking plate type U-shaped linear motor |
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| CN112702899B (en) | 2024-04-05 |
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Denomination of invention: Ultra thin homogenizing plate based on self wetting fluid as working fluid and its application Granted publication date: 20240405 Pledgee: Bank of China Co.,Ltd. Dongguan Branch Pledgor: Guangdong Huachuang Thermal Control Technology Co.,Ltd. Registration number: Y2024980025109 |
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