CN102853701A - Evaporator for loop heat pipe and application of evaporator - Google Patents
Evaporator for loop heat pipe and application of evaporator Download PDFInfo
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- CN102853701A CN102853701A CN2012103703118A CN201210370311A CN102853701A CN 102853701 A CN102853701 A CN 102853701A CN 2012103703118 A CN2012103703118 A CN 2012103703118A CN 201210370311 A CN201210370311 A CN 201210370311A CN 102853701 A CN102853701 A CN 102853701A
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Abstract
The invention relates to an evaporator for a loop heat pipe, and the evaporator comprises a soleplate and an upper cover plate, wherein the soleplate is in welding connection with the upper cover plate; the evaporator is a flat-type evaporator; a copper and nickel dual-layer sintered liquid absorption core is arranged on the upper part of the soleplate; and the liquid absorption core is a copper and nickel dual-layer sintered liquid absorption core, a finished product is divided into an upper layer and a lower layer, and the upper layer is a nickel layer. The evaporator has characteristics of simplicity in design and manufacturing, compactness in structure, low cost and the like; the cooling capacity of the loop heat pipe is enhanced by strengthening the heat conduction and controlling the heat leakage; and the evaporator is applicable to the cooling of an electronic chip with high wasted power.
Description
[technical field]
The present invention relates to the vaporizer technology field, specifically, is a kind of loop circuit heat pipe evaporimeter and application thereof.
[background technology]
Along with the development of electricity in technology, it is particularly outstanding that the heat dissipation problem of chip has seemed.At present, the forced convertion air cooling system that is formed by fin and fan the most commonly used in the conditional electronic chip cooling.The ability of this type of cooling is extremely limited, and maximum only can provide 1W/cm
2Heat-transfer capability, and the dissipated power of current nearly 200W has reached the limit of wind-cooling heat dissipating.For job stability, the reliability that guarantees chip, reduce and calculate error rate, make chip operation in a desirable temperature range, be study hotspot and the difficult problem in chip thermal design field always.Loop circuit heat pipe has that compact conformation is simple, heat-sinking capability is strong, safety and stability and the advantage such as cheap, it has been inherited conventional heat pipe and has utilized the suction force of liquid-sucking core to realize this advantage of automatic cycle of cooling medium, does not therefore need additionally to add armored pump and keeps the cooling medium circulation.
The greatest problem that is perplexing at present the loop circuit heat pipe development still concentrates on choosing of the design of loop circuit heat pipe evaporimeter internal structure and liquid-sucking core material.
At first, the evaporating area steam inside is discharged the distribution design problem of groove and bossing.During design, wish the drag losses when obtaining wider steam discharges groove with the discharge of reduction steam, wish that also the bossing area is more greatly to conduct to the liquid-sucking core surface with the base plate heat fast simultaneously.But in the practical application, be limited by the size in space, both can not take into account.In order to address this problem, the steam of evaporating area discharges groove and bossing distribution design between the two must obtain the projected area coupling of an optimum, conducts to the speed on liquid-sucking core surface and the efficient that steam is discharged thereby obtain more excellent heat from base plate.
Secondly, choosing of liquid-sucking core material exists great contradiction.Adopt the high material of thermal conductivity factor to make the heat transfer property that liquid-sucking core can obtain lower thermal resistance lifting evaporating area, but increased the heat leakage in liquid storage district, reduced toggle speed and limit heat power.Otherwise, adopt the low material of thermal conductivity factor to make the heat leakage that liquid-sucking core can suppress the liquid storage district, make the liquid-sucking core both sides obtain the higher temperature difference, realization starts fast, but has but increased the thermal resistance of evaporating area, has reduced the heat transfer property of evaporating area.Therefore how in the high and low material of thermal conductivity factor, to select appropriate materials to make liquid-sucking core and perplexing the designer always.In order to address this problem, proposed separately that the controlled double-deck slug type liquid-sucking core of copper and mickel of thickness solves this contradiction, copper imbibition sandwich layer is placed on evaporimeter one side, nickel imbibition sandwich layer is placed on liquid storage district one side, both can obtain to evaporate efficiently and strengthened heat transfer, can suppress heat leak again.As for the ratio of the suitable thickness between the two-layer liquid-sucking core, can obtain by experiment a desirable result.
In addition, liquid-sucking core cooperates also with evaporimeter heat dispersion is had a great impact.Liquid-sucking core and evaporimeter base plate will be realized integral sintering, reduce as far as possible thermal contact resistance between the two, to closely cooperate between liquid-sucking core and the evaporimeter upper cover plate simultaneously, prevent the fit clearance of high steam by between the two and directly be back to reservoir inside.
This evaporimeter is by three new designs of above-mentioned proposition, and obviously the heat transfer property in enhanced water evaporation district suppresses heat leak simultaneously significantly, whole loop heat pipe radiator performance has been had significantly promote.
[summary of the invention]
The object of the invention is to overcome the deficiencies in the prior art, a kind of loop circuit heat pipe evaporimeter and preparation method thereof is provided.
The objective of the invention is to be achieved through the following technical solutions:
A kind of loop circuit heat pipe evaporimeter comprises base plate and upper cover plate, and base plate and upper cover plate are welded to connect; It is characterized in that described evaporimeter is plate evaporator; The double-deck slug type liquid-sucking core of described copper and mickel is arranged on base plate top.
The material of described heatable soleplate adopts the higher red copper of the capacity of heat transmission, to reduce thermal resistance, makes the heat of base plate conduct to fast the liquid-sucking core surface;
The material of described upper cover plate adopts brass, to reduce the heat leak of evaporimeter wall, simultaneously base plate and upper cover plate is welded to connect;
Cut out steam on the described base plate and discharge groove, making the gross area of steam discharge groove and the gross area ratio of bossing is 1: 1 o'clock, can guarantee that heat in time is delivered to the liquid-sucking core bottom, has again enough spaces and makes things convenient for steam to discharge;
The double-deck slug type liquid-sucking core of described copper and mickel is arranged on base plate top, adopt the integral type sintering with base plate, play and reduce the effect that thermal resistance improves the evaporating area heat transfer efficiency, the double-deck slug type liquid-sucking core of copper and mickel sintering in stainless steel mould forms, for conveniently stripped, mold side is provided with the pattern draft of 1 degree, so the liquid-sucking core side equally also has the gradient of 1 degree.It is the liquid-sucking core that 1 inclined plane of spending cooperates manufacturing that upper cover plate is made gradient with the liquid-sucking core cooperation place, to prevent the appearance of the phenomenon that high steam refluxes.
Liquid-sucking core is the double-deck slug type liquid-sucking core of copper and mickel, finished product is divided into two-layer up and down, and thickness separately can be controlled respectively, the upper strata is nickel dam, hole less (5～10 μ m) is played the control heat leak and the effect of the higher capillary pressure limit is provided, and lower floor is the copper layer, the hole is large (18～20 μ m), and the porosity of whole liquid-sucking core is about 60%.Lecture experiment confirms that when the Thickness Ratio of copper layer and nickel dam was 2: 3, evaporimeter can reach optimum toggle speed and the highest power limit.
A kind of loop circuit heat pipe passes through vapour-discharge tube road and liquid backflow pipeline and finned cooler with evaporimeter and forms a loop.
Compared with prior art, good effect of the present invention is:
The present invention relates to a kind of loop circuit heat pipe evaporimeter, this evaporimeter has and manufactures and designs simple, compact conformation, the characteristics such as with low cost, promote the cooling capacity of loop circuit heat pipe by augmentation of heat transfer and control heat leak, be applicable to the cooling of the electronic chip of high dissipated power.
[description of drawings]
Fig. 1 is the structural representation that loop circuit heat pipe is used evaporimeter;
Fig. 2 A is the top view of heatable soleplate;
Fig. 2 B is the side view of heatable soleplate;
Fig. 3 is the evaporimeter installation diagram;
Fig. 4 is whole loop circuit heat pipe system diagram.
Wherein, 1 heatable soleplate, 2 steam drain tanks, the double-deck slug type liquid-sucking core of 3 copper and mickels, 4 evaporimeter steam (vapor) outlets, 5 upper cover plates, 6 evaporator condensation liquid inlets, 7 little O type circles, 8 vapour-discharge tube roads, 9 liquid backflow pipelines, 10 finned coolers.
[specific embodiment]
The specific embodiment of loop circuit heat pipe of the present invention with evaporimeter and application thereof below is provided.
With being installed, the complete loop circuit heat pipe of welding passes through vapour-discharge tube road and liquid backflow pipeline and loop of finned cooler formation with evaporimeter.
Namely form the loop circuit heat pipe cooling system and carried out performance test.
This evaporimeter heatable soleplate adopts red copper, produces the heatable soleplate that the gross area of 5 grooves and bossing gross area ratio are respectively 1: 1,2: 1,1: 2,3: 1 and 1: 3 before the implementation.Test and find that in the situation of the groove gross area greater than the protruding gross area, the temperature of heatable soleplate is more other three kinds of situation height (under the prerequisite of identical heating power) obviously, this is owing to the heat bulk deposition forms at the area of heating surface.Otherwise, in the situation of the protruding gross area greater than the groove gross area, under higher heating power, fluctuation by a relatively large margin appears in the temperature of the area of heating surface, especially when Area Ratio is 3: 1, local resistance loss under this explanation high power in the evaporimeter is excessive, and it is not smooth to cause steam to discharge, and causes temperature to fluctuate widely.Comprehensive above-mentioned 5 kinds of situations, the gross area and the bossing gross area ratio that draw groove were respectively 1: 1 o'clock, and temperature fluctuation is minimum, and cooling capacity is the strongest.
In addition, also having made 5 different slug type liquid-sucking cores (the liquid-sucking core gross thickness is 5 millimeters), is respectively that nickel layer thickness is 5 millimeters, 4 millimeters, 3 millimeters, 2 millimeters and 1 millimeter.Correspondingly, copper layer thickness is 0 millimeter, 1 millimeter, 2 millimeters, 3 millimeters and 4 millimeters.Test and find, nickel layer thickness is respectively in the situation of 4 millimeters and 3 millimeters, it is 5 millimeters liquid-sucking core that their baseplate temp all is lower than nickel layer thickness, this is because the copper layer has been strengthened the heat transfer property of evaporating area, and nickel dam is in the situation of 2 millimeters and 1 millimeter, heat leak is still more serious, and limit heating power all is lower than other three kinds of situations.In addition, nickel layer thickness is that 3 millimeters combination properties are best.Therefore, when the thickness proportion of copper and mickel layer was 2: 3, the evaporimeter radiating efficiency reached the highest.
In the practical application, the size of whole loop circuit heat pipe cooling system can be made amendment according to the actual size of electronic chip.Provide by reference to the accompanying drawings working of an invention example of the present invention, to describe technical scheme of the present invention in detail.
With shown in the evaporimeter, evaporimeter mainly is comprised of heatable soleplate 1, the double-deck liquid-sucking core 3 of copper nickel and upper cover plate 5 three parts such as Fig. 1 loop circuit heat pipe.Be provided with steam in evaporimeter inside and discharge groove, conveniently discharge from evaporimeter steam (vapor) outlet 4, also placed copper and nickel thickness proportion and be 2: 3 double-deck slug type liquid-sucking core, liquid-sucking core and heatable soleplate have been carried out integral sintering with the lower thermal resistance of acquisition in addition.
Such as Fig. 2 A, shown in the 2B evaporimeter heatable soleplate, in order to discharge behind the convenient steam that forms, heatable soleplate is reached the standard grade and is cut many parallel steam grooves 2, outstanding part supports liquid-sucking core and heat is conducted to liquid-sucking core copper surface, and groove then provides passage for the discharge of steam.Floor below inside is provided with the step of a ladder, and this is in order to reduce the wall thickness of base of evaporator, to make electronic chip more press close to evaporating area.In evaporator condensation liquid inlet, the upper end of upper cover plate 6.
Shown in Fig. 3 evaporimeter installation diagram, liquid-sucking core is fixed on (liquid-sucking core copper one side is to heatable soleplate and integral type sintering, and place to the liquid storage district nickel one side) between upper cover plate and the heatable soleplate.The steam of distinguishing high pressure in order to avoid evaporating is back in the liquid storage district by the gap between liquid-sucking core and the upper cover plate, upper cover plate and liquid-sucking core cooperation place all have the gradient of 1 degree, guarantee that both gaps reach minimum, moreover being provided with little O type circle 7 above the liquid-sucking core, it can successfully intercept evaporating area and liquid storage district.In addition, the height of the steam groove on the heatable soleplate is mutually concordant with the evaporimeter steam (vapor) outlet, and high steam can be discharged rapidly.
As shown in Figure 4, the loop circuit heat pipe cooling system is mainly by evaporimeter, fin condenser 10 be connected this two-part vapour-discharge tube road 8 and form with liquid backflow pipeline 9.And the core component evaporimeter mainly is welded by heatable soleplate and upper cover plate.
Before the loop circuit heat pipe cooling system puts into operation, whole device to be pumped into first high by positive empty (6.6 * 10
-5Pa), pour into subsequently the deionized water of having removed incoagulable gas, the volume of filling liquid can be controlled by graduated cylinder.Be that whole loop circuit heat pipe cooling system has been finished all preparation.Afterwards, the heatable soleplate with cooling system is fixed on the electronic chip.The power supply of unlocking electronic chip can be tested the heat-sinking capability of cooling system.
In the actual test, during take water as cooling fluid, this evaporimeter start-up time only is 40 seconds, and cooling power can reach 230W, and this moment, the maximum heat current density surpassed 20W/cm
2, and the chip surface temperature maintains 85 ℃.This cooling capacity can satisfy the maximum 200W dissipated power of the Duo TM i5-750 of middle-end.Moreover native system compact conformation, size are little, lightweight, and both the meeting spatial requirement for restriction did not consume again extra power.This evaporimeter can successfully solve the contradiction in the selection of liquid-sucking core material, has guaranteed the efficient heat transfer of evaporating area and the evaporation of working media also to have reduced on the other hand the heat leak in liquid storage district on the one hand.This measure has improved toggle speed and the limit heating power of loop circuit heat pipe cooling system simultaneously, makes it have very strong cooling capacity.In addition, the matching design of evaporimeter and liquid-sucking core has guaranteed the stable operation of loop circuit heat pipe cooling system under high power, avoids occurring the phenomenon that high steam refluxes.Cooling medium in this evaporimeter can also adopt various liquid, comprises methyl alcohol, ethanol and ammoniacal liquor etc.
The above only is preferred embodiment of the present invention; should be pointed out that for those skilled in the art, without departing from the inventive concept of the premise; can also make some improvements and modifications, these improvements and modifications also should be considered within the scope of protection of the present invention.
Claims (8)
1. a loop circuit heat pipe evaporimeter comprises base plate and upper cover plate, and base plate and upper cover plate are welded to connect; It is characterized in that described evaporimeter is plate evaporator; The double-deck slug type liquid-sucking core of described copper and mickel is arranged on base plate top.
2. a kind of loop circuit heat pipe evaporimeter as claimed in claim 1 is characterized in that, the material of described heatable soleplate adopts the higher red copper of the capacity of heat transmission.
3. a kind of loop circuit heat pipe evaporimeter as claimed in claim 1 is characterized in that, the material of described upper cover plate adopts brass.
4. a kind of loop circuit heat pipe evaporimeter as claimed in claim 1 is characterized in that, cuts out steam on the described base plate and discharges groove, and making the gross area of steam discharge groove and the gross area ratio of bossing is 1: 1.
5. a kind of loop circuit heat pipe evaporimeter as claimed in claim 1 is characterized in that, the double-deck slug type liquid-sucking core of described copper and mickel is arranged on base plate top, adopts the integral type sintering with base plate.
6. a kind of loop circuit heat pipe evaporimeter as claimed in claim 1 is characterized in that, described liquid-sucking core is the double-deck slug type liquid-sucking core of copper and mickel, and finished product is divided into two-layer up and down, and the upper strata is nickel dam, and the hole is 5～10 μ m, and lower floor is the copper layer, and the hole is 18～20 μ m.
7. a kind of loop circuit heat pipe evaporimeter as claimed in claim 6 is characterized in that, the Thickness Ratio of described copper layer and nickel dam is 2: 3.
8. the application of a loop circuit heat pipe usefulness evaporimeter is characterized in that, it is by vapour-discharge tube road and liquid backflow pipeline and loop of finned cooler formation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210370311.8A CN102853701B (en) | 2012-09-27 | 2012-09-27 | Evaporator for loop heat pipe and application of evaporator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210370311.8A CN102853701B (en) | 2012-09-27 | 2012-09-27 | Evaporator for loop heat pipe and application of evaporator |
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| CN102853701A true CN102853701A (en) | 2013-01-02 |
| CN102853701B CN102853701B (en) | 2014-06-25 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105066756A (en) * | 2015-08-13 | 2015-11-18 | 袁竹 | Device for changing energy by using loop heat pipe |
| CN105352993A (en) * | 2015-11-23 | 2016-02-24 | 上海卫星装备研究所 | Performance testing apparatus and method for flat-plate LHP capillary core |
| CN108278917A (en) * | 2018-03-12 | 2018-07-13 | 上海利正卫星应用技术有限公司 | Plate evaporator and flat type loop heat pipe |
| CN109813010A (en) * | 2019-01-14 | 2019-05-28 | 合肥美的电冰箱有限公司 | Evaporator and refrigerator |
| CN110010995A (en) * | 2019-04-09 | 2019-07-12 | 华南理工大学 | A kind of battery pack thermal management system and its working method based on flat-plate heat pipe |
| CN111238277A (en) * | 2020-01-09 | 2020-06-05 | 广东工业大学 | Flat heat pipe with composite liquid absorption core structure |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105066756A (en) * | 2015-08-13 | 2015-11-18 | 袁竹 | Device for changing energy by using loop heat pipe |
| CN105352993A (en) * | 2015-11-23 | 2016-02-24 | 上海卫星装备研究所 | Performance testing apparatus and method for flat-plate LHP capillary core |
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| CN108278917B (en) * | 2018-03-12 | 2024-03-26 | 上海利正卫星应用技术有限公司 | Flat plate type evaporator and flat plate type loop heat pipe |
| CN109813010A (en) * | 2019-01-14 | 2019-05-28 | 合肥美的电冰箱有限公司 | Evaporator and refrigerator |
| CN109813010B (en) * | 2019-01-14 | 2021-08-10 | 合肥美的电冰箱有限公司 | Evaporator and refrigerator |
| CN110010995A (en) * | 2019-04-09 | 2019-07-12 | 华南理工大学 | A kind of battery pack thermal management system and its working method based on flat-plate heat pipe |
| CN111238277A (en) * | 2020-01-09 | 2020-06-05 | 广东工业大学 | Flat heat pipe with composite liquid absorption core structure |
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| CN102853701B (en) | 2014-06-25 |
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